CN108810328A - Camera module and its photosensory assembly - Google Patents

Abstract

The invention relates to a camera module and its photosensitive component. The photosensitive component includes a flexible circuit board, a photosensitive element, a reinforcing plate and a package body. The flexible circuit board includes a first surface and a second surface that are oppositely arranged. One surface is electrically connected to the flexible circuit board, and the package body is packaged and molded on the first surface of the flexible circuit board around the photosensitive element. Therefore, the molded package body is firmly connected with the flexible circuit board, and it is almost impossible to disassemble from the flexible circuit board. The molded package itself has a certain strength, so the size of the reinforcement plate can be set to be larger than the size of the photosensitive element and smaller than the size of the flexible circuit board. The orthographic projection of the photosensitive element on the plane where the reinforcement plate is located is located at the reinforcement Within the scope of the board, the sum of the strength of the package body and the reinforcing plate can meet the requirements for carrying the optical part, and compared with the camera module formed by the traditional COB method, the size of the entire camera module is reduced.

Description

Camera module and its photosensitive components

technical field

The invention relates to the field of camera technology, in particular to a camera module and a photosensitive component thereof.

Background technique

In recent years, camera modules used to acquire images have become more and more widely used in personal electronics, automotive, and medical fields. For example, camera modules have become the standard for portable electronic devices such as smartphones and tablet computers. One of the accessories. A camera module applied to a portable electronic device can not only acquire images, but also help the portable electronic device realize functions such as instant video calls. With the development trend of portable electronic devices becoming thinner and lighter and users' requirements for imaging quality of camera modules are getting higher and higher, more stringent requirements are put forward for the overall size of the camera module and the imaging capability of the camera module. That is to say, the development trend of portable electronic devices requires the camera module to further improve and strengthen the imaging capability on the basis of reducing the size.

The commonly used camera module packaging process is the COB (Chip On Board) packaging process, that is, the circuit board, photosensitive element, and bracket of the camera module are made separately, and then the passive electronic components, photosensitive elements, and bracket are sequentially assembled Packaged on the circuit board. However, the size of the camera module formed by this packaging method is relatively large, which cannot meet the trend of decreasing size.

Contents of the invention

Based on this, it is necessary to provide a camera module and a photosensitive component thereof that can effectively reduce the size to address the above technical problems.

A photosensitive component, comprising:

A flexible circuit board, including a first surface and a second surface opposite to each other;

a photosensitive element disposed on the first surface of the flexible circuit board and electrically connected to the flexible circuit board;

A reinforcement plate is arranged on the second surface of the flexible circuit board, the size of the reinforcement plate is larger than the size of the photosensitive element and smaller than the size of the flexible circuit board, and the photosensitive element is placed on the reinforcement the orthographic projection on the plane on which the panel lies lies within the bounds of the reinforcing panel; and

The packaging body is packaged and molded on the first surface of the flexible circuit board around the photosensitive element.

In one of the embodiments, the central line of the reinforcing plate coincides with the central line of the photosensitive element.

In one of the embodiments, the photosensitive element includes a photosensitive surface and a non-photosensitive surface disposed away from the photosensitive surface, the photosensitive surface has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, the The non-photosensitive area is completely embedded in the package.

In one of the embodiments, the photosensitive element includes a photosensitive surface and a non-photosensitive surface disposed away from the photosensitive surface, the photosensitive surface has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, the The non-photosensitive area is partially embedded in the packaging body.

In one of the embodiments, the photosensitive element is electrically connected to the flexible circuit board through a conductive connection wire.

In one embodiment, the conductive connection wires are completely embedded in the package.

In one embodiment, the photosensitive element is electrically connected to the flexible circuit board through a conductive connecting wire, and the conductive connecting wire is partially embedded in the package.

In one embodiment, the photosensitive element is electrically connected to the flexible circuit board through a conductive bump provided on the non-photosensitive surface of the photosensitive element.

In one embodiment, one end of the flexible circuit board is electrically connected to a substrate, and the electronic components are arranged on the substrate.

A camera module, comprising:

A photosensitive component as described in any one of the above.

The above-mentioned camera module and its photosensitive component have at least the following advantages:

The flexible circuit board includes a first surface and a second surface opposite to each other. The photosensitive element is arranged on the first surface and is electrically connected to the flexible circuit board. The package is firmly connected to the flexible circuit board, and it is almost impossible to disassemble it from the flexible circuit board. The package itself after packaging and molding has a certain strength, so the size of the reinforcing plate can be set to be larger than the size of the photosensitive element and smaller than the flexible circuit. The size of the board, the orthographic projection of the photosensitive element on the plane where the reinforcement board is located is within the range of the reinforcement board, and the sum of the strength of the package and the reinforcement board can meet the requirements for carrying the optical part, and compared with the traditional COB method The formed camera module reduces the size of the whole camera module.

Description of drawings

Fig. 1 is a sectional view of the camera module in the first embodiment;

Fig. 2 is a sectional view of the camera module in the second embodiment;

FIG. 3 is a cross-sectional view of the camera module in the third embodiment.

Detailed ways

In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

Please refer to FIG. 1 , which is a camera module 100 in a first embodiment. The camera module 100 includes a photosensitive element 110 and an optical part 120 . Specifically, the photosensitive component 110 includes a flexible circuit board 111 , a photosensitive element 112 , a reinforcing plate 113 and a packaging body 114 . The optical unit 120 includes a lens barrel 121 and a lens 122 .

Specifically in the first embodiment, the optical part 120 further includes a voice coil motor 123, the voice coil motor 123 is arranged on the package body 114, the lens barrel 121 is arranged in the voice coil motor 123, the lens 122 is arranged in the lens barrel 121, and the lens 122 includes a plurality of lenses. The camera module 100 further includes a filter 130 located above the photosensitive element 112 . That is, in the first embodiment, the camera module 100 is a zoom camera module.

Of course, in other implementations, the optical part 120 includes a mirror base, and the voice coil motor 123 is replaced by the mirror base. The lens base is disposed on the package body 114 , the lens barrel 121 is disposed on the lens base, the lens 122 is disposed in the lens barrel 121 , and the lens 122 includes a plurality of lenses. That is, in other embodiments, the camera module 100 is a fixed-focus camera module.

Specifically, in the first embodiment, the flexible circuit board 111 includes a first surface 1111 and a second surface 1112 oppositely disposed. The photosensitive element 112 is disposed on the first surface 1111 of the flexible circuit board 111 and is electrically connected to the flexible circuit board 111 . Specifically, the photosensitive element 112 may be a CCD (Charge-coupled Device, charge-coupled device) or a CMOS (Complementary Metal Oxide Semiconductor, metal oxide semiconductor element). The photosensitive element 112 is generally rectangular, square or circular. For example, specifically in the first embodiment, the photosensitive element 112 is rectangular.

The photosensitive element 112 includes a photosensitive surface 112 a and a non-photosensitive surface 112 b facing away from the photosensitive surface 112 a. The non-photosensitive surface 112 b is disposed on the first surface 1111 of the flexible circuit board 111 through an adhesive layer. The photosensitive surface 112 a includes a photosensitive area 1121 and a non-photosensitive area 1122 , the photosensitive area 1121 is located in the middle, and the non-photosensitive area 1122 is arranged around the photosensitive area 1121 . Certainly, in other implementation manners, the non-photosensitive region 1122 may also be located only at the side of the photosensitive region 1121 . The light is incident from the lens 122 and reaches the photosensitive surface 112a. The photosensitive surface 112a converts the light signal into an electrical signal, and transmits it to the connector through the flexible circuit board 111.

Specifically in the first embodiment, the photosensitive element 112 is electrically connected to the flexible circuit board 111 through the conductive connecting wire 115 . The conductive connecting wire 115 can be gold wire, copper wire, aluminum wire or silver wire and so on. The two ends of the conductive connecting wire 115 are electrically connected to the photosensitive element 112 and the flexible circuit board 111 respectively, and the conductive connecting wire 115 can be formed by normal punching: use a wire bonding tool to bond from the flexible circuit board 111 to the direction of the photosensitive element 112. The conductive connection line 115 can also be formed by reverse bonding: using a bonding tool to bond from the photosensitive element 112 to the direction of the flexible circuit board 111 . The arc height of the conductive connection lines 115 formed by reverse drilling is smaller than that of the conductive connection lines 115 formed by normal drilling.

Of course, please refer to FIG. 2 , which shows the camera module 200 in the second embodiment. In the second embodiment, the photosensitive element 112 and the flexible circuit board 111 may be electrically connected through the conductive bump 116 by disposing the conductive bump 116 on the non-photosensitive surface 112 b of the photosensitive element 112 . When electrically connecting the photosensitive element 112 and the flexible circuit board 111 by providing the conductive protrusion 116 , there is no need to set a safety distance around the photosensitive element 112 , which can further reduce the size of the entire camera module 100 in the XY axis direction. Moreover, the arc height of the conductive protrusion 116 is shorter than that of the conductive connecting wire 115 , which can reduce the size of the entire camera module 100 in the Z-axis direction.

Specifically, in the first embodiment, the encapsulation body 114 is packaged and molded on the first surface 1111 of the flexible circuit board 111 around the photosensitive element 112 . The package body 114 includes an inner wall close to the photosensitive element 112 and an outer wall far away from the photosensitive element 112 , and the package body 114 is roughly a quadrangular structure.

The package body 114 can be formed on the first surface 1111 of the flexible circuit board 111 by molding. For example, an injection molding machine is used to mold the circuit board after SMT (Surface Mount Technology) process to form the package body 114 through an insert molding process, or the package body 114 is formed by a molding process commonly used in semiconductor packaging. The method of forming the package body 114 can be selected from injection molding process or molding process and so on. The molded package body 114 is firmly connected to the flexible circuit board 111 . Compared with the conventional mirror mounts bonded through the adhesive layer, the bonding force between the package body 114 and the flexible circuit board 111 is much stronger.

The material of the package body 114 formed by the injection molding process may be nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene, polypropylene), etc., and the material of the package body 114 formed by the molding process may be epoxy resin. It should be understood by those skilled in the art that the foregoing optional manufacturing methods and optional materials are only used as examples to illustrate possible implementation methods of the present invention, and are not limitations of the present invention.

The reinforcing plate 113 is arranged on the second surface 1112 of the flexible circuit board 111, the size of the reinforcing plate 113 is larger than the size of the photosensitive element 112, and the size of the reinforcing plate 113 is smaller than the size of the flexible circuit board 111, the photosensitive element 112 is reinforcing The orthographic projection on the plane where the plate 113 is located lies within the range of the reinforcing plate 113 . That is, in the first embodiment, the reinforcing plate 113 is not provided on the entire surface of the flexible circuit board 111, but the reinforcing plate 113 is provided in the area corresponding to the photosensitive element 112, so as to strengthen the flexible circuit in the area of the photosensitive element 112. The strength of the plate 111. Therefore, not only can the material of the reinforcing board 113 be saved, but also the strength of the reinforcing board 113 combined with the strength of the package body 114 is enough to bear the optical part 120 and prevent the flexible circuit board 111 from being deformed.

Specifically, the reinforcing plate 113 can be made of a strong material to provide sufficient supporting force for the photosensitive element 112 and the flexible circuit board 111 and prevent the flexible circuit board 111 from deforming. In this embodiment, the reinforcing plate 113 may be a metal plate. Certainly, in other implementation manners, the reinforcement board 113 may be a stronger ceramic board or plastic board.

Specifically, in the first embodiment, the central line of the reinforcing plate 113 coincides with the central line of the photosensitive element 112 . More preferably, the center line of the photosensitive element 112 coincides with the optical axis of the lens 122, so the center line of the reinforcing plate 113, the center line of the photosensitive element 112, and the optical axis of the lens 122 coincide (as shown in Figure 1 The dotted line A) in the figure can ensure that the force distribution of the optical part 120 , the photosensitive element 112 and the package body 114 on the reinforcing plate 113 is uniform.

Certainly, in other embodiments, the central line of the reinforcing plate 113 and the central line of the photosensitive element 112 may not be coincidently arranged, as long as the orthographic projection of the photosensitive element 112 on the plane where the reinforcing plate 113 is located is in the position of the reinforcing plate. The range of 113 is enough, which is beneficial to reduce the difficulty of operation and improve work efficiency.

Please refer to Fig. 1, the non-photosensitive region 1122 of the photosensitive element 112 is embedded in the package body 114, therefore, the periphery of the photosensitive element 112 will be embedded in the package body 114, the intensity of the photosensitive element 112 itself, the intensity of the package body 114 itself, the photosensitive element The component 112 embedded in the package body 114 and the strength of the structure formed by the package body 114 work together to further ensure the strength of the flexible circuit board and the entire camera module.

The conductive connecting wire 115 is also completely embedded in the package body 114 . Therefore, the conductive connecting wire 115 will not be directly exposed to the external space, so that when the camera module 100 is assembled, the conductive connecting wire 115 will not be damaged by any contact, and at the same time reduce the influence of environmental factors on the conductive connecting wire 115, such as The temperature makes the electrical connection between the photosensitive element 112 and the flexible circuit board 111 more stable. Moreover, it is beneficial to further reduce the size of the entire camera module 100 .

Certainly, in other embodiments, the non-photosensitive region 1122 of the photosensitive element 112 may also be partially embedded in the package body 114 , and the conductive connection wire 115 is completely embedded in the package body 114 . Compared with the embodiment shown in FIG. 1 , the requirements for processing accuracy are lowered, the difficulty of operation can be reduced, and the work efficiency can be improved.

Of course, please refer to FIG. 3 , which is the camera module 300 in the third embodiment. In the third embodiment, the photosensitive element 112 is electrically connected to the flexible circuit board 111 through the conductive connection wire 115 , and the conductive connection wire 115 is partially embedded in the package body 114 and partially exposed to the package body 114 , which simplifies the process steps.

Please refer to FIG. 1 , FIG. 2 and FIG. 3 , in the first, second and third embodiments, the camera module 100 further includes an electronic component 116 , the electronic component 116 is electrically connected to the flexible circuit board 111 and is located outside the package body 114 , so the heat dissipation performance of the electronic component 116 is better. Specifically, the electronic component 116 may be a resistor, a capacitor, a diode, a triode, a potentiometer, a relay or a driver.

One end of the flexible circuit board 111 is provided with a substrate 117 . The electronic components 116 are disposed on the substrate 117 , therefore, the size of the package body 114 can be further reduced, thereby reducing the size of the entire camera module 100 .

The aforementioned camera module 100 and its photosensitive component 110 with the flexible circuit board 111 have at least the following advantages:

The flexible circuit board 111 includes a first surface 1111 and a second surface 1112 opposite to each other. The photosensitive element 112 is arranged on the first surface 1111 and is electrically connected to the flexible circuit board 111. The package body 114 wraps around the photosensitive element 112 and encapsulates the flexible circuit board. 111 of the first surface 1111, so the molded package 114 is firmly connected to the flexible circuit board 111, and it is almost impossible to disassemble from the flexible circuit board 111. The molded package 114 itself has a certain strength, so the reinforcement can be The size of the plate 113 is set to be larger than the size of the photosensitive element 112 and smaller than the size of the flexible circuit board 111, the orthographic projection of the photosensitive element 112 on the plane where the reinforcing plate 113 is located is within the range of the reinforcing plate 113, the package body 114 and the reinforcing plate 113 The sum of the strength of the strong plate 113 can meet the requirement of carrying the optical part 120 , and compared with the camera module 100 formed by the traditional COB method, the size of the whole camera module 100 is reduced.

The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (10)

1. A photosensitive assembly, characterized in that, comprising: A flexible circuit board, including a first surface and a second surface opposite to each other; a photosensitive element disposed on the first surface of the flexible circuit board and electrically connected to the flexible circuit board; A reinforcement plate is arranged on the second surface of the flexible circuit board, the size of the reinforcement plate is larger than the size of the photosensitive element and smaller than the size of the flexible circuit board, and the photosensitive element is placed on the reinforcement the orthographic projection on the plane on which the panel lies lies within the bounds of the reinforcing panel; and The packaging body wraps around the photosensitive element and is molded on the first surface of the flexible circuit board. 2 . The photosensitive assembly according to claim 1 , wherein the central line of the reinforcing plate coincides with the central line of the photosensitive element. 3 . 3. The photosensitive component according to claim 1, wherein the photosensitive element comprises a photosensitive surface and a non-photosensitive surface disposed away from the photosensitive surface, the photosensitive surface has a photosensitive area and is wound around the The non-photosensitive area of the photosensitive area is completely embedded in the packaging body. 4. The photosensitive component according to claim 1, wherein the photosensitive element comprises a photosensitive surface and a non-photosensitive surface disposed away from the photosensitive surface, the photosensitive surface has a photosensitive area and is wound around the The non-photosensitive area of the photosensitive area is partially embedded in the packaging body. 5. The photosensitive component according to claim 3 or 4, wherein the photosensitive element is electrically connected to the flexible circuit board through a conductive connection wire. 6 . The photosensitive component according to claim 5 , wherein the conductive connecting wire is completely embedded in the packaging body. 7 . 7 . The photosensitive component according to claim 1 , wherein the photosensitive element is electrically connected to the flexible circuit board through a conductive connecting wire, and the conductive connecting wire is partially embedded in the package. 8. The photosensitive component according to claim 3 or 4, wherein the photosensitive element is electrically connected to the flexible circuit board through a conductive bump provided on a non-photosensitive surface of the photosensitive element. 9 . The photosensitive assembly according to claim 1 , wherein one end of the flexible circuit board is electrically connected to a substrate, and the electronic components are disposed on the substrate. 10. A camera module, characterized in that it comprises: The photosensitive component as claimed in any one of claims 1-9.