CN108400145A - A kind of flexible display and preparation method thereof, electronic equipment - Google Patents
A kind of flexible display and preparation method thereof, electronic equipment Download PDFInfo
- Publication number
- CN108400145A CN108400145A CN201810055178.4A CN201810055178A CN108400145A CN 108400145 A CN108400145 A CN 108400145A CN 201810055178 A CN201810055178 A CN 201810055178A CN 108400145 A CN108400145 A CN 108400145A
- Authority
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- China
- Prior art keywords
- flexible display
- flexible
- support device
- base board
- binding region
- Prior art date
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Links
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 230000004888 barrier function Effects 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims 9
- 239000011229 interlayer Substances 0.000 claims 1
- 239000012528 membrane Substances 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 7
- 239000010408 film Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000000231 atomic layer deposition Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910004205 SiNX Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a kind of flexible display and preparation method thereof, electronic equipment, the flexible display includes flexible display screen, driving chip and support device;The flexible display screen includes flexible base board, and the flexible base board includes display area and binding region;The driving chip is bound to the binding region;The support device covers the flexible base board, and the support device at the binding region position is equipped with opening.Flexible display disclosed by the invention and preparation method thereof, electronic equipment, by the way that support device is covered entire flexible base board, increase bonding field strength, to prevent from occurring when stripping signal thread breakage, the problem that causes flexible screen body function bad, reduce support membrane attachment process, while flexible display may make to become thinner.
Description
Technical field
The present invention relates to display technology field more particularly to a kind of flexible display and preparation method thereof, electronic equipments.
Background technology
Flexible display screen has the advantages that significant dough deformation, can be bent and be folded with wide-angle, using the type screen
Curtain can effectively improve the portability of equipment.As flexible display technologies are more and more ripe, flexible display screen also gradually incorporates
Such as mobile phone, tablet mobile device become the main tool that we live.
Existing flexible display screen generally includes the glass substrate combined successively, flexible screen body and driving chip circuit.
For the flexible screen body that image is shown include the intensive pixel unit being laid on flexible screen body and be laid in pixel unit periphery,
And in the signal wire of flexible screen body edge cabling.Driving chip circuit for generating control signal or power signal uses FPC
(Flexible Printed Circuit, flexible PCB) carries the integrated circuit modules of surface mount elements and cure package.With
The glass substrate with elasticity and rigidity can be used in the glass substrate for supporting and being formed by curing flexible screen body.It may also include power supply
Circuit, including the battery core of semi-solid preparation and the larger power component of volume.
Existing flexible display screen, when glass substrate and flexible screen body are removed, since the material of flexible screen body is more soft
Soft and thick degree is relatively thin, and signal thread breakage easily occurs at the position of driving chip circuit, causes flexible screen body function bad.
Invention content
It is a primary object of the present invention to propose a kind of flexible display and preparation method thereof, electronic equipment, it is intended to solve
Problem of the existing technology.
To achieve the above object, first aspect of the embodiment of the present invention provides a kind of flexible display, the flexible display
Including flexible display screen, driving chip and support device;
The flexible display screen includes flexible base board, and the flexible base board includes display area and binding region;
The driving chip is bound to the binding region;The support device covers the flexible base board, and is located at institute
It states the support device at binding region position and is equipped with opening.
Optionally, the support device at the connecting position of the display area and the binding region is equipped with discontinuous perforation
Gap.
Optionally, the support device includes polaroid or organic film.
Optionally, the flexible display further includes the display device layer positioned at the display area.
Optionally, the display device layer includes buffer layer, tft array and light-emitting component;
The buffer layer is arranged on the display area, and the tft array is arranged on the buffer layer, described to shine
Element is made on the tft array.
Optionally, the flexible display further includes water oxygen barrier layer, and the water oxygen barrier layer is arranged in the luminous member
On part layer.
In addition, to achieve the above object, second aspect of the embodiment of the present invention provides a kind of production method of flexible display,
The method includes the steps:
Set one end of the flexible base board of flexible display to binding region, the other end is set as display area;
Support device is covered into the flexible base board, and is opened in the support device setting at the binding region position
Mouthful;
Driving chip is bound in the binding region.
Optionally, described further includes step after the binding region binds driving chip:
Remove the carrier substrate being combined with the flexible base board.
Optionally, the support device includes polaroid or organic film.
Furthermore to achieve the above object, the third aspect of the embodiment of the present invention provides a kind of electronic equipment, the electronic equipment
Including the flexible display described in first aspect.
Flexible display provided in an embodiment of the present invention and preparation method thereof, electronic equipment, by covering support device
Entire flexible base board increases bonding field strength, prevents that signal thread breakage occurs when stripping, causes flexible screen body function bad
The problem of, reduce support membrane attachment process, while flexible display may make to become thinner.
Description of the drawings
Fig. 1 is the flexible display structural schematic diagram of the embodiment of the present invention;
Fig. 2 is the flexible base board structural schematic diagram in the flexible display of the embodiment of the present invention;
Fig. 3 is the OLED display device schematic diagram of a layer structure in the flexible display of the embodiment of the present invention;
Fig. 4 is the production method flow diagram of the flexible display of the embodiment of the present invention;
Fig. 5 is the electronic devices structure schematic diagram of the embodiment of the present invention.
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific implementation mode
Hereinafter reference will be made to the drawings comprehensively to describe the present invention, wherein attached drawing shows the preferred embodiment of the present invention.So
And the present invention can also be realized by many different forms, and it is not intended to be limited to embodiment cited herein.
On the contrary, these embodiments are provided, it is open thoroughly and complete to make, and fully communicate this hair to those skilled in the art
Bright thought.Entire description always, identical reference label indicates identical element.
For convenience of description, herein may use such as " ... under ", " ... below ", " below ", " ...
Spatial relationship term above " and " above " etc., to describe an element as illustrated in the drawing or mechanism and another element
Or the relationship of mechanism.It should be appreciated that other than orientation shown in figure, spatial relationship term will also include in using or operating
Device various different directions.For example, if device shown in flipchart, it is described as be in other elements or mechanism
" following " or " under " element will be positioned in " above " of other elements or mechanism.Therefore, exemplary term " ...
It is included in orientation above and below below ".Device can be positioned and (is rotated by 90 ° or in other orientation) in other ways, and
And it is interpreted accordingly by spatial relation description as used herein symbol.
Context is violated unless the context indicates otherwise or obviously, in the context describing the invention (especially subsequent
Claim in) term that uses "one", " this " and similar deictic words include odd number and plural number.Unless otherwise note
It releases, term "comprising", " having ", " comprising " and " containing " can be construed to expansible term.
First embodiment
As shown in Figure 1, first embodiment of the invention provides a kind of flexible display, the flexible display includes flexible aobvious
Display screen, driving chip 131 and support device 13;
Understand incorporated by reference to Fig. 2, the flexible display screen includes flexible base board 12, and the one side of the flexible base board 12 includes
Display area 122 and binding region 121, the another side of the flexible base board 12, which is provided with, mutually to be shelled with the flexible base board 12
From carrier substrate 11;
In the present embodiment, PI (Polyimide, polyimides) material may be used in the material of the flexible base board 12,
Other any flexible and transparent membrane materials can also be used, this is not restricted for the present embodiment.
In the present embodiment, the rigid support plate such as 11 optional silicon chip of carrier substrate, metal, glass.
The driving chip 131 is bound to the binding region 121;The support device 13 covers the flexible base board
12, and the support device 13 at 121 position of the binding region is equipped with opening (attached drawing is not shown).
It should be noted that this is not restricted for the shape of opening, opening of different shapes can be arranged as required to.
In the present embodiment, support device 13 can prevent external ambient light from entering inside flexible display, and from flexibility
What display interior reflected away, and then the contrast of flexible display is had an impact;Support device 13 can also prevent from showing
The heat radiation in region 122.
In one embodiment, at the connecting position of the display area 122 and the binding region 121 123 branch
Support arrangement 13 is equipped with discontinuous perforation gap, and reflexed technique is carried out convenient for the binding region 121.
In the present embodiment, the support device 13 can be polaroid or organic film.The organic film can be
The organic film being individually vaporized at binding region 121 can also be the organic film of any one of display area 122 film layer
Layer.By the organic film of display area 122 or by polaroid or it is directly arranged at the organic film of binding region, Ke Yi
While increasing bonding field strength, to prevent from occurring when stripping signal thread breakage, the problem that causes flexible screen body function bad,
Also, reduces support membrane attachment process, while flexible display may make to become thinner.
In the present embodiment, the flexible display further includes having display device layer 132, and the display device layer 132 is set
It is placed in the display area 122.
Shown in please referring to Fig.3, in one embodiment, the display device layer 132 include buffer layer 1321, TFT gusts
Row 1322 and light-emitting component 1323;
The buffer layer 1321 is arranged on the display area 122, and the tft array 1322 is arranged in the buffer layer
On 1321, the light-emitting component 1323 is made on the tft array 1322.
In another embodiment, the flexible display further includes water oxygen barrier layer 133, the water oxygen barrier layer
133 are arranged on the light emitting element layer.Water oxygen barrier layer is organic and/or inorganic thin film, wherein inorganic thin film SiNx,
SiO2 etc. plays water oxygen iris action, and atomic layer deposition (Atomic layer deposition, ALD) mode system can be used
Make.Organic film in the water oxygen barrier layer can be covered to binding region, play the role of increasing bonding field strength.
Flexible display provided in an embodiment of the present invention increases nation by the way that support device is covered entire flexible base board
Determine field strength, to prevent from occurring when stripping signal thread breakage, the problem that causes flexible screen body function bad, reduces support membrane patch
Attached technique, while flexible display may make to become thinner.
Second embodiment
As shown in figure 4, second embodiment of the invention provides a kind of production method of flexible display, flexible display can join
Examine content described in first embodiment.
The method includes the steps:
21, one end of the flexible base board of flexible display is set to binding region, the other end is set as display area;
22, support device is covered into the flexible base board, and is set in the support device at the binding region position
Set opening;
23, driving chip is bound in the binding region.
It refer again to shown in Fig. 4, further, described further includes step after the binding region binds driving chip
Suddenly:
24, the carrier substrate being combined with the flexible base board is removed.
Specifically, the carrier substrate being combined with the flexible base board using laser lift-off.
The production method of the flexible display of the present embodiment can be complete using the collimation and high energy adjustable feature of laser
At accurate interlaminar separation, surfacing is detached.
The production method of flexible display provided in an embodiment of the present invention increases bonding field strength, when preventing stripping
To occur signal thread breakage, the problem that causes flexible screen body function bad, reduces support membrane attachment process, while may make flexibility
Display becomes thinner.
3rd embodiment
With reference to Fig. 5, Fig. 5 a kind of electronic equipment is provided for third embodiment of the invention.Electronic equipment 30 includes aforementioned any
The flexible display that embodiment is provided can be any flexible or curved surface or plane or rollable, or can roll over
Folded flexible display.Including but not limited to following types of electronic equipment:Rollable or folding mobile phone, wrist-watch, hand
Ring, TV or other wearables are shown or touch-controlled electronic devices and smart mobile phone flexible, tablet computer, notebook electricity
Brain, desktop displays, television set, intelligent glasses, smartwatch, ATM machine, digital camera, Vehicular display device, medical treatment display,
Industry control shows, electric paper book, electro phoretic display device, game machine, transparent display, display with double faces, bore hole 3D display device, and minute surface is aobvious
Show that equipment, half-reflection and half-transmission type show equipment etc..
Electronic equipment provided in an embodiment of the present invention increases bonding by the way that support device is covered entire flexible base board
Field strength, to prevent from occurring when stripping signal thread breakage, the problem that causes flexible screen body function bad, reduces support membrane attaching
Technique, while flexible display may make to become thinner.
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also include other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
As described above according to the embodiment of the present invention, there is no all details of detailed descriptionthe for these embodiments, also not
Limit the specific embodiment that the invention is only described.Obviously, as described above, can make many modifications and variations.This explanation
These embodiments are chosen and specifically described to book, is in order to preferably explain the principle of the present invention and practical application, belonging to making
Technical field technical staff can utilize modification of the invention and on the basis of the present invention to use well.The present invention is only by right
The limitation of claim and its full scope and equivalent.
Claims (10)
1. a kind of flexible display, which is characterized in that the flexible display includes flexible display screen, driving chip and support dress
It sets;
The flexible display screen includes flexible base board, and the flexible base board includes display area and binding region;
The driving chip is bound to the binding region;The support device covers the flexible base board, and is tied up positioned at described
Determine the support device at regional location and is equipped with opening.
2. a kind of flexible display according to claim 1, which is characterized in that the display area and the binding region
Connecting position at support device be equipped with discontinuous perforation gap.
3. a kind of flexible display according to claim 1, which is characterized in that the support device includes polaroid or has
Machine film layer.
4. a kind of flexible display according to claim 1, which is characterized in that the flexible display further includes being located at institute
State the display device layer of display area.
5. a kind of flexible display according to claim 4, which is characterized in that the display device layer include buffer layer,
Tft array and light-emitting component;
The buffer layer is arranged on the display area, and the tft array is arranged on the buffer layer, the light-emitting component
It is made on the tft array.
6. a kind of flexible display according to claim 4, which is characterized in that the flexible display further includes water oxygen resistance
Interlayer, the water oxygen barrier layer are arranged on the light emitting element layer.
7. a kind of production method of flexible display, the method includes the steps:
Set one end of the flexible base board of flexible display to binding region, the other end is set as display area;
Support device is covered into the flexible base board, and opening is set in the support device at the binding region position;
Driving chip is bound in the binding region.
8. a kind of production method of flexible display according to claim 7, which is characterized in that described in the binding area
Domain further includes step after binding driving chip:
Remove the carrier substrate being combined with the flexible base board.
9. a kind of flexible display according to claim 7, which is characterized in that the support device includes polaroid or has
Machine film layer.
10. a kind of electronic equipment, which is characterized in that the electronic equipment includes any Flexible Displays of claim 1-6
Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810055178.4A CN108400145B (en) | 2018-01-19 | 2018-01-19 | Flexible display, manufacturing method thereof and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810055178.4A CN108400145B (en) | 2018-01-19 | 2018-01-19 | Flexible display, manufacturing method thereof and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108400145A true CN108400145A (en) | 2018-08-14 |
| CN108400145B CN108400145B (en) | 2021-05-28 |
Family
ID=63094068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810055178.4A Active CN108400145B (en) | 2018-01-19 | 2018-01-19 | Flexible display, manufacturing method thereof and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108400145B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109147564A (en) * | 2018-09-29 | 2019-01-04 | 上海天马微电子有限公司 | Display panel, display device and display panel manufacturing method |
| CN110164874A (en) * | 2019-06-04 | 2019-08-23 | 上海天马微电子有限公司 | Flexible display module, display device and manufacturing method of flexible display module |
| CN110782776A (en) * | 2019-01-10 | 2020-02-11 | 云谷(固安)科技有限公司 | Display panel, manufacturing method thereof and display device |
| WO2020192556A1 (en) * | 2019-03-26 | 2020-10-01 | 京东方科技集团股份有限公司 | Flexible display substrate, display panel, display device and fabrication method |
| CN112086374A (en) * | 2020-09-29 | 2020-12-15 | 武汉天马微电子有限公司 | A display device, its preparation method, and electronic equipment |
| TWI725873B (en) * | 2019-07-02 | 2021-04-21 | 友達光電股份有限公司 | Bendable flexible active matrix display panel and portable device |
| CN113257122A (en) * | 2021-04-07 | 2021-08-13 | 合肥维信诺科技有限公司 | Supporting layer group for display module, display module and preparation method of display module |
| CN115207260A (en) * | 2022-07-15 | 2022-10-18 | 武汉华星光电半导体显示技术有限公司 | Preparation method of flexible display panel and flexible display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109147564A (en) * | 2018-09-29 | 2019-01-04 | 上海天马微电子有限公司 | Display panel, display device and display panel manufacturing method |
| CN109147564B (en) * | 2018-09-29 | 2021-07-09 | 上海天马微电子有限公司 | Display panel, display device and display panel manufacturing method |
| CN110782776A (en) * | 2019-01-10 | 2020-02-11 | 云谷(固安)科技有限公司 | Display panel, manufacturing method thereof and display device |
| WO2020192556A1 (en) * | 2019-03-26 | 2020-10-01 | 京东方科技集团股份有限公司 | Flexible display substrate, display panel, display device and fabrication method |
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| CN110164874A (en) * | 2019-06-04 | 2019-08-23 | 上海天马微电子有限公司 | Flexible display module, display device and manufacturing method of flexible display module |
| TWI725873B (en) * | 2019-07-02 | 2021-04-21 | 友達光電股份有限公司 | Bendable flexible active matrix display panel and portable device |
| CN112086374A (en) * | 2020-09-29 | 2020-12-15 | 武汉天马微电子有限公司 | A display device, its preparation method, and electronic equipment |
| CN113257122A (en) * | 2021-04-07 | 2021-08-13 | 合肥维信诺科技有限公司 | Supporting layer group for display module, display module and preparation method of display module |
| CN115207260A (en) * | 2022-07-15 | 2022-10-18 | 武汉华星光电半导体显示技术有限公司 | Preparation method of flexible display panel and flexible display panel |
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| Publication number | Publication date |
|---|---|
| CN108400145B (en) | 2021-05-28 |
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