CN108281574B - Organic light-emitting display panel and preparation method thereof - Google Patents

Abstract

The embodiment of the invention discloses an organic light-emitting display panel and a preparation method thereof, wherein the preparation method of the organic light-emitting display panel comprises the following steps: providing a substrate base plate; preparing a plurality of first sub-electrodes which are independently arranged and non-conductive layers positioned between two adjacent first sub-electrodes on one side of a substrate, wherein the non-conductive layers comprise a first non-conductive layer and a second non-conductive layer, and at least one first non-conductive layer is arranged between two adjacent second non-conductive layers; preparing pixel defining layers at the second non-conductive layer, and forming an organic light emitting display region between two adjacent pixel defining layers; preparing the same type of organic light emitting layer in an organic light emitting display area; and preparing a second electrode on the side of the organic light-emitting layer and the pixel defining layer far away from the substrate. In summary, under the condition that the preparation process of the organic light emitting layer in the existing organic light emitting display panel is not changed, the pixel resolution of the organic light emitting display panel is improved.

Description

An organic light-emitting display panel and its preparation method

technical field

Embodiments of the present invention relate to the technical field of semiconductor displays, and in particular, to an organic light-emitting display panel and a method for fabricating the same.

Background technique

Organic Light-Emitting Diode (OLED) display device has self-luminescence, low driving voltage, high luminous efficiency, short response time, high definition and contrast ratio, nearly 180° viewing angle, and wide operating temperature range, which can realize flexible display With many advantages of large-area full-color display lamps, it is recognized as the most promising display device in the industry.

At this stage, OLED display devices prepared based on vacuum process have been mass-produced. However, this technology has high equipment investment and maintenance costs, serious waste of materials, and it is difficult to achieve a larger area, and the cost remains high. The preparation of OLED displays by inkjet printing technology has the advantages of low cost, large area technology and products, and can also achieve precise positioning of printing, has pattern making capabilities, saves materials, and is compatible with almost all types of substrates. , an essential technology for full-color printed displays.

The inkjet printing process is to spray tens of trillionths of a liter (picoliter) of solution (usually between one picoliter to tens of picoliters) on a specific OLED display at a frequency of hundreds of times per second. In the pixel, the solvent is then removed to form a film-forming process technology that forms a dry film. This requires the equipment to have good alignment and movement accuracy, to ensure that each drop of inkjet printed ink can be placed in the designated pixel pit, and also to ensure that the ink printed each time is within the specified picoliter volume range. All put forward precise requirements for the equipment. At this stage, it is generally believed that the inkjet printing process is only suitable for preparing large-size TVs, because large-size TVs do not require high display resolution (generally pixel density < 100PPI). The rate of development towards 8K technology (pixel density > 150PPI), which will require inkjet printing equipment to have higher alignment and movement accuracy, smaller and more precise control of printing ink volume, which will inevitably increase printing costs.

SUMMARY OF THE INVENTION

In view of this, embodiments of the present invention provide an organic light emitting display panel and a method for fabricating the same, so as to solve the technical problem that pixel resolution and inkjet printing accuracy cannot be taken into account in the organic light emitting display panel in the prior art.

In a first aspect, an embodiment of the present invention provides a method for preparing an organic light-emitting display panel, including:

providing a base substrate;

A plurality of independently arranged first sub-electrodes and a non-conductive layer located between two adjacent first sub-electrodes are prepared on one side of the base substrate; the non-conductive layer includes a first non-conductive layer and a second non-conductive layer. Two non-conductive layers, including at least one of the first non-conductive layers between two adjacent second non-conductive layers;

A pixel definition layer is prepared at the second non-conductive layer, and an organic light emitting display area is formed between two adjacent pixel definition layers;

preparing the same type of organic light-emitting layer in the organic light-emitting display area;

A second electrode is prepared on a side of the organic light-emitting layer and the pixel definition layer away from the base substrate.

Optionally, preparing a plurality of independently arranged first sub-electrodes and a non-conductive layer between two adjacent first sub-electrodes on one side of the base substrate, including:

A non-conductive material layer is prepared on one side of the base substrate, and the non-conductive material layer covers the base substrate;

Perform ion implantation on the non-conductive material layer in the non-conductive material layer corresponding to the location where the first sub-electrode is arranged to form a conductive layer and a non-conductive layer arranged at intervals, and the conductive layer corresponds to a plurality of independently arranged The first sub-electrode, the non-conductive layer corresponds to the non-conductive layer between two adjacent first sub-electrodes.

Optionally, ion implantation is performed on the non-conductive material layer in the non-conductive material layer corresponding to the location where the first sub-electrode is arranged to form a conductive layer and a non-conductive layer arranged at intervals, and the conductive layers correspond to multiple layers. independent first sub-electrodes, the non-conductive layer corresponds to the non-conductive layer between two adjacent first sub-electrodes, including:

preparing a photoresist layer on the side of the non-conductive material layer away from the base substrate;

The photoresist layer is patterned to obtain a photoresist retention area and a photoresist peeling area, and the photoresist peeling area exposes the non-conductive material layer corresponding to the setting position of the first sub-electrode ;

Perform ion implantation on the non-conductive material layer corresponding to the photoresist exposed area, and remove the photoresist layer left in the photoresist reserved area to form a conductive layer and a non-conductive layer arranged at intervals. The conductive layer corresponds to a plurality of independently arranged first sub-electrodes, and the non-conductive layer corresponds to the non-conductive layer between two adjacent first sub-electrodes.

Optionally, preparing a pixel definition layer at the second non-conductive layer, including:

etching the second non-conductive layer;

A pixel definition layer is prepared at the position corresponding to the second non-conductive layer.

Optionally, the non-conductive material layer includes an inorganic thin film or a polymer thin film.

Optionally, the ions to be implanted include at least one of Cr, Cu, Ag, Ti, Mo and Ni metal ions, or at least one of K+, N+, Ga+, Ar+, Li+ and Ne+ ions.

Optionally, the ion implantation dose during ion implantation is greater than or equal to 5*10 ¹⁵ /cm ² .

Optionally, preparing the same type of organic light-emitting layer in the organic light-emitting display area, including:

The same type of organic light-emitting layer is prepared in the organic light-emitting display area by means of inkjet printing.

Optionally, an organic light-emitting layer of the same type is prepared in the organic light-emitting display area by means of inkjet printing, including:

preparing a hole injection layer in the organic light emitting display region;

preparing a hole transport layer on the side of the hole injection layer away from the first sub-electrode;

By means of inkjet printing, the same type of organic light-emitting material layer is prepared on the side of the hole transport layer away from the hole injection layer;

preparing an electron transport layer on the side of the organic light-emitting material layer away from the hole transport layer;

An electron injection layer is prepared on the side of the electron transport layer away from the organic light emitting material layer.

In a second aspect, an embodiment of the present invention further provides an organic light-emitting display panel, which is prepared by using the method for preparing an organic light-emitting display panel described in the first aspect, including:

substrate substrate;

a plurality of independently arranged first sub-electrodes located on one side of the base substrate and a non-conductive layer located between two connected first sub-electrodes, the non-conductive layer comprising a first non-conductive layer and a second non-conductive layer a non-conductive layer, including at least one of the first non-conductive layers between two adjacent second non-conductive layers;

a pixel definition layer located at the second non-conductive layer, an organic light-emitting display area is formed between two adjacent pixel definition layers;

an organic light-emitting layer of the same type located in the organic light-emitting display region;

a second electrode located on a side of the organic light-emitting layer and the pixel definition layer away from the base substrate.

In the organic light-emitting display panel and the method for manufacturing the same provided by the embodiments of the present invention, a plurality of independently arranged first sub-electrodes and a non-conductive layer located between two adjacent first sub-electrodes are prepared on one side of the base substrate. The conductive layer includes a first non-conductive layer and a second non-conductive layer, at least one first non-conductive layer is included between two adjacent second non-conductive layers, a pixel definition layer is prepared at the second non-conductive layer, and two adjacent second non-conductive layers are formed. An organic light-emitting display area is formed between the pixel definition layers, and the same type of organic light-emitting layer is prepared in the organic light-emitting display area, and each organic light-emitting layer of the same type corresponds to at least two first sub-electrodes. At least two organic light-emitting display units ensure that the pixel resolution of the organic light-emitting display panel can be improved under the condition that the existing organic light-emitting layer preparation process remains unchanged.

Description of drawings

In order to illustrate the technical solutions of the exemplary embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in describing the embodiments. Obviously, the introduced drawings are only a part of the drawings of the embodiments to be described in the present invention, rather than all drawings. For those of ordinary skill in the art, without creative work, they can also obtain the drawings according to these drawings. Additional drawings.

FIG. 1 is a schematic flowchart of a method for manufacturing an organic light-emitting display panel according to an embodiment of the present invention;

2 is a schematic structural diagram of a base substrate provided by an embodiment of the present invention;

3 is a schematic structural diagram of preparing a plurality of independently arranged first sub-electrodes and a non-conductive layer between two adjacent first sub-electrodes on one side of a substrate substrate according to an embodiment of the present invention;

4 is a schematic structural diagram of preparing a pixel definition layer at the second non-conductive layer provided by an embodiment of the present invention;

5 is a schematic structural diagram of preparing an organic light-emitting layer according to an embodiment of the present invention;

6 is a schematic structural diagram of preparing a second electrode according to an embodiment of the present invention;

7-10 are schematic structural diagrams of each process of preparing a plurality of independently arranged first sub-electrodes and a non-conductive layer located between two adjacent first sub-electrodes on a base substrate according to an embodiment of the present invention;

11 is a schematic diagram of an arrangement structure of organic light-emitting display units in an organic light-emitting display panel according to an embodiment of the present invention;

12 is a schematic diagram of an arrangement structure of organic light-emitting display units in another organic light-emitting display panel provided by an embodiment of the present invention;

FIG. 13 is a schematic diagram of the arrangement structure of another organic light emitting display unit in an organic light emitting display panel provided by an embodiment of the present invention.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be completely described below with reference to the accompanying drawings in the embodiments of the present invention and through specific implementation manners. Obviously, the described embodiments are a part of the embodiments of the present invention, rather than all the embodiments, based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work, All fall within the protection scope of the present invention.

An embodiment of the present invention provides a method for fabricating an organic light-emitting display panel, which includes providing a base substrate; preparing a plurality of independently arranged first sub-electrodes on one side of the base substrate and located between two adjacent first sub-electrodes The non-conductive layer includes a first non-conductive layer and a second non-conductive layer, and at least one first non-conductive layer is included between two adjacent second non-conductive layers; pixels are prepared at the second non-conductive layer A definition layer, an organic light-emitting display area is formed between two adjacent pixel definition layers; an organic light-emitting layer of the same type is prepared in the organic light-emitting display area; a second electrode is prepared on the side of the organic light-emitting display layer and the pixel definition layer away from the substrate . Using the above technical solution, at least one first non-conductive layer is included between two adjacent second non-conductive layers, a pixel definition layer is prepared at the second non-conductive layer, and an organic light-emitting display is formed between two adjacent pixel definition layers The same type of organic light-emitting layer is prepared in the organic light-emitting display area, and each organic light-emitting layer of the same type corresponds to at least two first sub-electrodes, that is, one preparation of the organic light-emitting layer can form at least two organic light-emitting display units. The pixel resolution of the organic light-emitting display panel is improved under the condition that the existing organic light-emitting layer preparation process remains unchanged.

The above is the core idea of the present invention, and the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

FIG. 1 is a schematic flowchart of a method for preparing an organic light-emitting display panel provided by an embodiment of the present invention. As shown in FIG. 1 , the method for preparing an organic light-emitting display panel provided by an embodiment of the present invention may include:

S110, providing a base substrate.

Exemplarily, FIG. 2 is a schematic structural diagram of a base substrate provided by an embodiment of the present invention. As shown in FIG. 2 , the base substrate 10 may be a flexible base substrate, and its material may include polyimide, poly At least one of ethylene phthalate, polyethylene naphthalate, polycarbonate, polyarylate, and polyethersulfone; the base substrate 10 may also be a rigid base substrate, specifically glass substrate or other rigid substrate. The embodiment of the present invention does not limit the type and material of the base substrate 10 .

S120. Prepare a plurality of independently arranged first sub-electrodes and a non-conductive layer located between two adjacent first sub-electrodes on one side of the base substrate, where the non-conductive layer includes a first non-conductive layer and a second non-conductive layer, at least one of the first non-conductive layers is included between two adjacent second non-conductive layers.

Exemplarily, FIG. 3 is a schematic structural diagram of preparing a plurality of independently arranged first sub-electrodes on one side of the base substrate and a non-conductive layer between two adjacent first sub-electrodes provided by an embodiment of the present invention, as shown in FIG. As shown in FIG. 3 , a plurality of independently arranged first sub-electrodes 201 are prepared on one side of the base substrate 10 , and the first sub-electrodes 201 may be anode electrodes of an organic light emitting display panel. Optionally, a non-conductive layer 30 is formed between two adjacent first sub-electrodes 201, and along the direction perpendicular to the base substrate 10, as shown in the X direction in FIG. 3, the thickness of the first sub-electrodes 201 may be The thickness of the non-conductive layer 30 is the same; along the extension direction of the base substrate 10, as shown in the Y direction in FIG. The electrodes 201 are provided in isolation.

Optionally, the non-conductive layer 30 in the embodiment of the present invention may include a first non-conductive layer 301 and a second non-conductive layer 302 , and at least one first non-conductive layer 302 is formed between two adjacent second non-conductive layers 302 . The conductive layer 301 is shown in FIG. 3 . Since a non-conductive layer 30 is formed between two adjacent first sub-electrodes 201, the non-conductive layer includes a first non-conductive layer 301 and a second non-conductive layer 302, and between two adjacent second non-conductive layers 302 At least one first non-conductive layer 301 is formed, therefore, at least two first sub-electrodes 201 are formed between two adjacent second non-conductive layers 302 . FIG. 3 only takes as an example that one first non-conductive layer 301 is formed between two adjacent second non-conductive layers 302 , and two first sub-electrodes 201 are formed between two adjacent second non-conductive layers 302 . illustrate.

S130, a pixel definition layer is prepared at the second non-conductive layer, and an organic light emitting display area is formed between two adjacent pixel definition layers.

Exemplarily, FIG. 4 is a schematic structural diagram of preparing a pixel definition layer at the second non-conductive layer provided by an embodiment of the present invention. As shown in FIG. 4 , a pixel definition layer 40 is prepared at the second non-conductive layer 302, adjacent to the second non-conductive layer 302. An organic light-emitting display area is formed between the two pixel definition layers 40 , and color mixing between pixels can be prevented or reduced by the pixel definition layer 40 . Optionally, the material of the pixel definition layer 40 may include at least one of organic insulating materials such as polyimide, polyamide, acrylic resin, cyclobutene, and phenolic resin; the pixel definition layer 40 may also include SiO ₂ , At least one of inorganic insulating materials such as SiN _x , Al ₂ O ₃ , CuO _x , Tb ₄ O ₇ , Y ₂ O ₃ , Nb ₂ O ₅ and Pr ₂ O ₃ ; and, the pixel definition layer 40 may also have organic A multi-layer structure formed by alternating insulating materials and inorganic insulating materials. Optionally, the thickness of the pixel definition layer 40 may be 1-3 μm.

S140, preparing an organic light-emitting layer of the same type in the organic light-emitting display region.

Exemplarily, FIG. 5 is a schematic structural diagram of preparing an organic light-emitting layer according to an embodiment of the present invention. The organic light-emitting layer 50 is located in an organic light-emitting display area defined by two adjacent pixel definition layers 40 . The organic light-emitting layers of the same type in the embodiments of the present invention refer to organic light-emitting layers with the same emission color, such as red organic light-emitting layers, green organic light-emitting layers, blue organic light-emitting layers, and the like. The optional organic light-emitting layer 50 may include a hole injection layer, a hole transport layer, an organic light-emitting material layer, an electron transport layer, and an electron injection layer stacked in sequence. Optionally, the organic light-emitting layer 50 may be formed using low molecular or high molecular organic materials.

Optionally, to prepare the same type of organic light-emitting layer in the organic light-emitting display area, the same type of organic light-emitting layer may be prepared in the organic light-emitting display area by means of inkjet printing. Using the inkjet printing method to prepare the organic light-emitting layer can realize precise positioning of printing, strong pattern preparation ability, material saving and low cost. Optionally, the same type of organic light-emitting layer is prepared in the organic light-emitting display area, and the method of vapor deposition may also be used. The embodiment of the present invention does not limit the specific method for preparing the organic light-emitting layer.

S150. Prepare a second electrode on the side of the organic light-emitting layer and the pixel definition layer that is away from the base substrate.

Exemplarily, FIG. 6 is a schematic structural diagram of preparing a second electrode provided by an embodiment of the present invention. As shown in FIG. 6 , a second electrode 60 is prepared on the side of the organic light-emitting layer 50 and the pixel definition layer 40 away from the base substrate 10 . , the second electrode 60 can be an electrode arranged on the whole surface, and used in conjunction with a plurality of individually arranged first sub-electrodes 201 to realize the normal display light emission of the organic light emitting display panel.

Optionally, the material of the second electrode 60 may be at least one of Ag, Mg, Al, Au, Ni, or a composite electrode Mg:Ag.

To sum up, the method for fabricating an organic light-emitting display panel provided by the embodiments of the present invention prepares a plurality of independently arranged first sub-electrodes and a non-conductive layer located between two adjacent first sub-electrodes on one side of the base substrate. , the non-conductive layer includes a first non-conductive layer and a second non-conductive layer, at least one first non-conductive layer is included between two adjacent second non-conductive layers, and a pixel definition layer is prepared at the second non-conductive layer. An organic light-emitting display area is formed between two adjacent pixel definition layers, and an organic light-emitting layer of the same type is prepared in the organic light-emitting display area, and each organic light-emitting layer of the same type corresponds to at least two first sub-electrodes, that is, an organic light-emitting layer is prepared once At least two organic light-emitting display units can be formed to ensure that the pixel resolution of the organic light-emitting display panel can be improved without changing the existing organic light-emitting layer preparation process.

Optionally, preparing a plurality of independently arranged first sub-electrodes and a non-conductive layer between two adjacent first sub-electrodes on one side of the base substrate may include:

A non-conductive material layer is prepared on one side of the base substrate, and the non-conductive material layer covers the base substrate;

Perform ion implantation on the non-conductive material layer in the non-conductive material layer corresponding to the location where the first sub-electrode is arranged to form a conductive layer and a non-conductive layer arranged at intervals, the conductive layer corresponds to a plurality of independently arranged first sub-electrodes, and the non-conductive layer Corresponding to the non-conductive layer between two adjacent first sub-electrodes.

Optionally, ion implantation is performed on the non-conductive material layer in the non-conductive material layer corresponding to the setting position of the first sub-electrode to form a conductive layer and a non-conductive layer arranged at intervals, and the conductive layer corresponds to a plurality of independently arranged first sub-electrodes. , the non-conductive layer corresponds to the non-conductive layer between two adjacent first sub-electrodes, and may include:

Prepare a photoresist layer on the side of the non-conductive material layer away from the base substrate;

patterning the photoresist layer to obtain a photoresist retention area and a photoresist peeling area, and the photoresist peeling area exposes the non-conductive material layer corresponding to the setting position of the first sub-electrode;

Ion implantation is performed on the non-conductive material layer corresponding to the photoresist exposed area, and the photoresist layer left in the photoresist reserved area is removed to form a conductive layer and a non-conductive layer arranged at intervals, and the conductive layer corresponds to a plurality of independently arranged first layers. A sub-electrode, and the non-conductive layer corresponds to the non-conductive layer between two adjacent first sub-electrodes.

Specifically, FIG. 7 to FIG. 10 are the structures of each process of preparing a plurality of independently arranged first sub-electrodes and a non-conductive layer located between two adjacent first sub-electrodes on a base substrate provided by an embodiment of the present invention Schematic diagram, referring to FIGS. 7-10 , the preparation of a plurality of independently arranged first sub-electrodes on the base substrate and the non-conductive layer between two adjacent first sub-electrodes specifically include:

As shown in FIG. 7 , an entire non-conductive material layer 70 is prepared on one side of the base substrate 10 , and the non-conductive material layer 70 covers the base substrate 10 . Optionally, the non-conductive material layer 70 can be prepared on the side of the base substrate 10 by means of evaporation. The non-conductive material layer 70 may include an inorganic thin film or a polymer thin film. When the non-conductive material layer 70 is an inorganic thin film, its material may be, for example, at least one of amorphous silicon, silicon oxide and silicon nitride; When the layer 70 is a polymer film, the material thereof may be, for example, SU8.

As shown in FIG. 8 , a photoresist layer 80 is prepared on the side of the non-conductive material layer 70 away from the base substrate 10 , and the photoresist layer 80 covers the non-conductive material layer 70 .

As shown in FIG. 9 , the photoresist layer 80 is patterned to obtain a photoresist reserved area 801 and a photoresist peeling area 802 , and the photoresist peeling area 802 exposes the non-contact area corresponding to the setting position of the first sub-electrode 201 Conductive material layer 70 .

As shown in FIG. 10 , ion implantation is performed on the non-conductive material layer 70 corresponding to the photoresist exposed area 802, and the photoresist layer left in the photoresist reserved area 801 is removed to form a conductive layer and a non-conductive layer arranged at intervals, The conductive layer corresponds to a plurality of independently arranged first sub-electrodes 201 , and the non-conductive layer corresponds to the non-conductive layer 30 between two adjacent first sub-electrodes 201 .

Optionally, when the non-conductive material layer 70 is ion implanted, the ions implanted may include at least one of Cr, Cu, Ag, Ti, Mo and Ni metal ions, or K+, N+, Ga+, Ar+, Li+ and at least one of Ne+ ions. Optionally, when ion implantation is performed on the non-conductive material layer 70 , the ion implantation dose during ion implantation may be greater than or equal to 5*10 ¹⁵ /cm ² .

Optionally, when the non-conductive material layer 70 is an inorganic thin film such as amorphous silicon, oxidized or silicon nitride, at least one of Cr, Cu, Ag, Ti, Mo and Ni metal ions is implanted into the inorganic thin film. The implantation dose can be greater than or equal to 5*10 ¹⁵ /cm ² , which is used to increase the conductivity of the inorganic thin film. The non-conductive material layer 70 is ion-implanted to form a conductive layer, which is used as the first sub-electrode in the organic light-emitting display panel, namely anode electrode. For example, a non-conductive material layer 70 of silicon oxide material can be grown on the base substrate 10 by a plasma-enhanced chemical vapor deposition method, and then a metal evaporation vacuum arc ion implantation system can be used, such as implanting Ti ions, and the voltage during ion implantation can be is 40KV, and the ion implantation beam current can be 5*10 ¹⁶ /cm ² , which can ensure that the conductivity of the inorganic thin film rises from 10 ^-14 S/cm to 500 S/cm, and increases the conductivity of the inorganic thin film. The non-conductive material layer 70 A conductive layer is formed through ion implantation as the first sub-electrode 201 in the organic light emitting display panel.

Optionally, when the non-conductive material layer 70 is an organic polymer film, by implanting at least one of K+, N+, Ga+, Ar+, Li+ and Ne+ ions into the organic polymer film, the implantation dose can be greater than or equal to 5* 10 ¹⁵ /cm ² , the implantation energy can be greater than or equal to 20keV, which is used to increase the conductivity of the organic polymer film. The non-conductive material layer 70 is ion implanted to form a conductive layer, which is used as the first sub-electrode in the organic light-emitting display panel, namely anode electrode. For example, an ion implanter can be used to first implant the polyaniline film with Ar ⁺ with an energy of 40keV and an implantation dose of ^{10 15} /cm ² , and then implant the polyaniline ( Ar+) film. In this way, the conductivity of the organic polymer film can be increased from 10 ^-15 S/cm to 200 S/cm, and the conductivity of the organic polymer film can be increased. The non-conductive material layer 70 is ion implanted to form a conductive layer, which serves as a The first sub-electrode 201 .

Optionally, preparing a pixel definition layer at the second non-conductive layer may include:

etching the second non-conductive layer;

A pixel definition layer is prepared at the corresponding position of the second non-conductive layer.

Optionally, in the embodiment of the present invention, an organic light-emitting layer of the same type may be prepared in the organic light-emitting display area by means of inkjet printing, which may specifically include:

preparing a hole injection layer in the organic light emitting display area;

preparing a hole transport layer on the side of the hole injection layer away from the first sub-electrode;

The same type of organic light-emitting material layer is prepared on the side of the hole transport layer away from the hole injection layer by means of inkjet printing;

preparing an electron transport layer on the side of the organic light-emitting material layer away from the hole transport layer;

The electron injection layer is prepared on the side of the electron transport layer away from the organic light emitting material layer.

Exemplarily, before the hole injection layer is prepared in the organic light emitting display region, the substrate may be cleaned and surface plasma treated, so that the surface contact angle is less than 20°. After that, the hole injection layer is sequentially coated by spin coating, blade coating, and extrusion coating method, and then heat treatment is performed. Between 20-100nm. After the hole injection layer is prepared, spin coating, blade coating, and extrusion coating are used to coat the hole transport layer in turn, and then heat treatment. The heat treatment temperature can be 80-200 ° C to remove the remaining solvent to ensure hole injection. The film thickness of the layers is controlled between 10-100 nm. After the hole injection layer is prepared, the RGB luminescent material ink with a certain concentration (0.2%-10%) and viscosity (0.5-10cp) will be printed separately by an inkjet printer. The volume of the RGB printing ink is based on the actual resolution of the display screen. The rate and design are determined, and the volume accuracy is required to be controlled within ±20%. Then, vacuum heating and drying are performed, the vacuum degree is controlled at 1-105 Pa, and the drying temperature is 40-200° C. After drying, the film thickness of the organic light-emitting layer material layer is between 10-100 nm. After the organic light-emitting material layer is prepared, spin coating, blade coating, and extrusion coating are used to coat the electron transport layer in turn, and then heat treatment. The film thickness is controlled between 10-80nm. After the preparation of the electron transport layer is completed, it is transferred to a vacuum chamber to prepare the electron injection layer.

Optionally, continuing to refer to FIG. 6 , an embodiment of the present invention further provides an organic light-emitting display panel, the organic light-emitting display panel is prepared by using the method for preparing an organic light-emitting display panel provided by the embodiment of the present invention, which may specifically include:

base substrate 10;

A plurality of independently arranged first sub-electrodes 201 located on one side of the base substrate 10 and a non-conductive layer 30 are formed between two adjacent first sub-electrodes 201; the non-conductive layer includes a first non-conductive layer 301 and a second non-conductive layer 30 The non-conductive layer 302 includes at least one first non-conductive layer 301 between two adjacent second non-conductive layers 302;

The pixel definition layer 40 located at the second non-conductive layer 302 forms an organic light emitting display area between two adjacent pixel definition layers 40;

the same type of organic light-emitting layer 50 located in the organic light-emitting display area;

The second electrode 60 is located on the side of the organic light emitting display layer 50 and the pixel definition layer 40 away from the base substrate 10 .

The organic light emitting display panel provided by the embodiment of the present invention includes at least one first non-conductive layer between two adjacent second non-conductive layers, a pixel definition layer is provided at the second non-conductive layer, and two adjacent pixels define An organic light-emitting display area is formed between the layers, and an organic light-emitting layer of the same type is prepared in the organic light-emitting display area. Each organic light-emitting layer of the same type corresponds to at least two first sub-electrodes, that is, one organic light-emitting layer can correspond to at least two organic light-emitting layers. The light-emitting display unit ensures that the pixel resolution of the organic light-emitting display panel can be improved under the condition that the existing organic light-emitting layer preparation process remains unchanged.

Optionally, FIG. 11 is a schematic diagram of an arrangement structure of organic light-emitting display units in an organic light-emitting display panel provided by an embodiment of the present invention. As shown in FIG. 11 , in the organic light-emitting display panel provided by the embodiment of the present invention, the organic light-emitting layer 50 It may include a red organic light-emitting layer 501, a green organic light-emitting layer 502 and a blue organic light-emitting layer 503, wherein each of the red organic light-emitting layer 501, the green organic light-emitting layer 502 and the blue organic light-emitting layer 503 corresponds to at least two first sub-layers. For the electrode 201, FIG. 11 only takes an example that each of the red organic light-emitting layer 501, the green organic light-emitting layer 502 and the blue organic light-emitting layer 503 corresponds to two first sub-electrodes 201 as an example. As shown in FIG. 11 , each organic light-emitting layer 50 of the same type corresponds to at least two first sub-electrodes 201 , that is, at least two organic light-emitting display units can be formed by preparing the organic light-emitting layer 50 once, ensuring that the organic light-emitting layer can be prepared in the existing organic light-emitting layer. Under the condition that the process remains unchanged, the pixel resolution of the organic light emitting display panel is improved.

Optionally, FIG. 12 is a schematic diagram of an arrangement structure of organic light emitting display units in another organic light emitting display panel provided by an embodiment of the present invention. The arrangement of the organic light emitting display units shown in FIG. 12 is different from the arrangement of the organic light emitting display units shown in FIG. 11 . 12, the two adjacent organic light-emitting layers 50 are arranged irregularly, which not only ensures that at least two organic light-emitting display units can be formed by preparing the organic light-emitting layer 50 once, but also ensures that the existing organic light-emitting layer preparation process is unchanged. The pixel resolution of the organic light-emitting display panel; meanwhile, the pixel rendering method is used to further improve the pixel resolution of the organic light-emitting display panel.

Optionally, FIG. 13 is a schematic diagram of an arrangement structure of organic light-emitting display units in an organic light-emitting display panel provided by an embodiment of the present invention. The arrangement of the organic light-emitting display units shown in FIG. 13 is the same as that of the organic light-emitting display units shown in FIGS. 11 and 12 . The units are arranged differently. In FIG. 13 , each of the red organic light-emitting layer 501, the green organic light-emitting layer 502 and the blue organic light-emitting layer 503 corresponds to four first sub-electrodes 201. One preparation of the organic light-emitting layer 50 can form four organic light-emitting display units. , to ensure that the pixel resolution of the organic light-emitting display panel is improved under the condition that the existing organic light-emitting layer preparation process remains unchanged. At the same time, the pixel rendering method is used to further improve the pixel resolution of the organic light emitting display panel.

The following is an example of the implementation of the 120PPI display screen. The size of the sub-pixel is 70 μm*210 μm, and the size of the sub-pixel in the display area is 40 μm*150 μm. Taking the preparation of the green organic light-emitting material layer as an example, the ink printing concentration is 1% and the viscosity is 1.2cp. The comparison of each scheme is as follows:

Comparison table of inkjet printing requirements of the prior art and the technical solutions provided by the embodiments of the present invention

As shown in the table above, in the prior art, when using inkjet printing technology to prepare organic light-emitting display units, the required amount of ink in each organic light-emitting display unit is 45pl. Ink, the accuracy of the ink volume is required to be ±1pl, and the accuracy of the two directions in which the printing area is required to be ±5μm and ±10μm respectively during inkjet printing. The requirements for ink volume accuracy and printing accuracy are high. When scheme 1 as shown in Fig. 11 is adopted, two sub-pixels are formed by one inkjet printing (each organic light-emitting display area includes two organic light-emitting display units), the required ink volume is increased from 45pl to 120pl, and the required ink dripping from 3 drops increased to 4 drops, the corresponding volume of ink per drop increased from 15pl to 30pl, the requirement for the amount of ink ejected each time by the inkjet printer was reduced, and the volume accuracy of the ink was also reduced, from ±1pl to ±2pl. In addition, scheme 1 also reduces the accuracy requirements of equipment operation, for example, the y-direction accuracy is reduced from the displacement accuracy of ±10um to the displacement accuracy of ±15um. Or under the condition that inkjet printing requires the same accuracy, the pixel resolution of the organic light emitting display panel can be improved. Scheme 2 shown in FIG. 12 and Scheme 3 shown in FIG. 13 are the same, especially scheme 3, four sub-pixels are formed by one inkjet printing, (each organic light-emitting display area includes four organic light-emitting display units), The ink volume per printing increases, and the ink precision requirements are reduced, which reduces the ink volume control requirements of the printing equipment. At the same time, the displacement accuracy of the device in the x-direction and the displacement accuracy in the y-direction are both reduced, which is expected to greatly reduce the equipment cost. Or under the condition that inkjet printing requires the same accuracy, the pixel resolution of the organic light emitting display panel can be improved.

Note that the above are only preferred embodiments of the present invention and applied technical principles. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and can also include more other equivalent embodiments without departing from the concept of the present invention. The scope is determined by the scope of the appended claims.

Claims (8)

1. A method for preparing an organic light-emitting display panel, comprising: providing a base substrate; A plurality of independently arranged first sub-electrodes and a non-conductive layer located between two adjacent first sub-electrodes are prepared on one side of the base substrate, and the non-conductive layer covers the base substrate; A photoresist layer is prepared on the side of the non-conductive material layer away from the base substrate, and the photoresist layer covers the non-conductive layer; the non-conductive layer divides the first sub-electrode into multiple segments; The photoresist layer is patterned to obtain a photoresist retention area and a photoresist peeling area, and the photoresist peeling area exposes the non-conductive material layer corresponding to the setting position of the first sub-electrode ; Perform ion implantation on the non-conductive material layer corresponding to the photoresist exposed area, and remove the photoresist layer left in the photoresist reserved area to form a conductive layer and a non-conductive layer arranged at intervals. The conductive layer corresponds to a plurality of independently arranged first sub-electrodes, and the non-conductive layer corresponds to the non-conductive layer between two adjacent first sub-electrodes; The non-conductive layer includes a first non-conductive layer and a second non-conductive layer, and at least one first non-conductive layer is included between two adjacent second non-conductive layers; A pixel definition layer is prepared at the second non-conductive layer, and an organic light emitting display area is formed between two adjacent pixel definition layers; preparing the same type of organic light-emitting layer in the organic light-emitting display area; The organic light-emitting layer includes: a red organic light-emitting layer, a blue organic light-emitting layer, and a green organic light-emitting layer, each of the red organic light-emitting layer, the blue organic light-emitting layer, and the green organic light-emitting layer corresponds to at least two first sub-electrodes; A second electrode is prepared on a side of the organic light-emitting layer and the pixel definition layer away from the base substrate. 2 . The method for preparing an organic light-emitting display panel according to claim 1 , wherein preparing a pixel definition layer at the second non-conductive layer comprises: 3 . etching the second non-conductive layer; A pixel definition layer is prepared at the position corresponding to the second non-conductive layer. 3 . The method for manufacturing an organic light-emitting display panel according to claim 1 , wherein the non-conductive material layer comprises an inorganic thin film or a polymer thin film. 4 . 4. The method for preparing an organic light-emitting display panel according to claim 1, wherein the ions to be implanted include at least one of Cr, Cu, Ag, Ti, Mo and Ni metal ions, or K+, N+, At least one of Ga+, Ar+, Li+ and Ne+ ions. 5 . The method for manufacturing an organic light emitting display panel according to claim 1 , wherein the ion implantation dose during ion implantation is greater than or equal to 5*10 ¹⁵ /cm ² . 6 . 6 . The method for preparing an organic light-emitting display panel according to claim 1 , wherein preparing an organic light-emitting layer of the same type in the organic light-emitting display area comprises: The same type of organic light-emitting layer is prepared in the organic light-emitting display area by means of inkjet printing. 7. The method for preparing an organic light-emitting display panel according to claim 6, wherein the same type of organic light-emitting layer is prepared in the organic light-emitting display area by means of inkjet printing, comprising: preparing a hole injection layer in the organic light emitting display region; preparing a hole transport layer on the side of the hole injection layer away from the first sub-electrode; By means of inkjet printing, the same type of organic light-emitting material layer is prepared on the side of the hole transport layer away from the hole injection layer; preparing an electron transport layer on the side of the organic light-emitting material layer away from the hole transport layer; An electron injection layer is prepared on the side of the electron transport layer away from the organic light emitting material layer. 8 . An organic light-emitting display panel, characterized in that it is prepared by the method for preparing an organic light-emitting display panel according to any one of claims 1 to 7 , comprising: substrate substrate; a plurality of independently arranged first sub-electrodes located on one side of the base substrate and a non-conductive layer located between two connected first sub-electrodes, the non-conductive layer covering the base substrate; A photoresist layer is prepared on the side of the non-conductive material layer away from the base substrate, and the photoresist layer covers the non-conductive layer; the non-conductive layer divides the first sub-electrode into multiple segments; The photoresist layer is patterned to obtain a photoresist retention area and a photoresist peeling area, and the photoresist peeling area exposes the non-conductive material layer corresponding to the setting position of the first sub-electrode ; Perform ion implantation on the non-conductive material layer corresponding to the photoresist exposed area, and remove the photoresist layer left in the photoresist reserved area to form a conductive layer and a non-conductive layer arranged at intervals. The conductive layer corresponds to a plurality of independently arranged first sub-electrodes, and the non-conductive layer corresponds to the non-conductive layer between two adjacent first sub-electrodes; The non-conductive layer includes a first non-conductive layer and a second non-conductive layer, and at least one first non-conductive layer is included between two adjacent second non-conductive layers; a pixel definition layer located at the second non-conductive layer, an organic light-emitting display area is formed between two adjacent pixel definition layers; an organic light-emitting layer of the same type located in the organic light-emitting display region; The organic light-emitting layer includes: a red organic light-emitting layer, a blue organic light-emitting layer, and a green organic light-emitting layer, each of the red organic light-emitting layer, the blue organic light-emitting layer, and the green organic light-emitting layer corresponds to at least two first sub-electrodes; a second electrode located on a side of the organic light-emitting layer and the pixel definition layer away from the base substrate.

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