CN108276815A - A kind of circuit board coating composition and preparation method thereof - Google Patents
A kind of circuit board coating composition and preparation method thereof Download PDFInfo
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- CN108276815A CN108276815A CN201711388594.8A CN201711388594A CN108276815A CN 108276815 A CN108276815 A CN 108276815A CN 201711388594 A CN201711388594 A CN 201711388594A CN 108276815 A CN108276815 A CN 108276815A
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- coating composition
- board coating
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- 239000008199 coating composition Substances 0.000 title claims abstract description 35
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- -1 polyoxylethylene Polymers 0.000 claims abstract description 36
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims abstract description 30
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims abstract description 20
- GWOWVOYJLHSRJJ-UHFFFAOYSA-L cadmium stearate Chemical compound [Cd+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O GWOWVOYJLHSRJJ-UHFFFAOYSA-L 0.000 claims abstract description 17
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 claims abstract description 17
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000000843 powder Substances 0.000 claims abstract description 17
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 claims abstract description 16
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000391 magnesium silicate Substances 0.000 claims abstract description 15
- 229910052919 magnesium silicate Inorganic materials 0.000 claims abstract description 15
- 235000019792 magnesium silicate Nutrition 0.000 claims abstract description 15
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 14
- 229920001577 copolymer Polymers 0.000 claims abstract description 14
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 claims abstract description 13
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000000839 emulsion Substances 0.000 claims abstract description 13
- 229920000570 polyether Polymers 0.000 claims abstract description 12
- 238000002156 mixing Methods 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 235000008331 Pinus X rigitaeda Nutrition 0.000 claims 1
- 235000011613 Pinus brutia Nutrition 0.000 claims 1
- 241000018646 Pinus brutia Species 0.000 claims 1
- 150000001335 aliphatic alkanes Chemical class 0.000 claims 1
- 239000002304 perfume Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 239000004615 ingredient Substances 0.000 abstract description 3
- 230000003993 interaction Effects 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 description 8
- 229920002554 vinyl polymer Polymers 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 4
- 229920002472 Starch Polymers 0.000 description 3
- RNKIRQDHNHWGHM-UHFFFAOYSA-N chloroethene;ethenyl dodecanoate Chemical compound ClC=C.CCCCCCCCCCCC(=O)OC=C RNKIRQDHNHWGHM-UHFFFAOYSA-N 0.000 description 3
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000008107 starch Substances 0.000 description 3
- 235000019698 starch Nutrition 0.000 description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- UHXWLHYMUGRLKG-UHFFFAOYSA-N [Mg].O[Si](O)(O)O Chemical compound [Mg].O[Si](O)(O)O UHXWLHYMUGRLKG-UHFFFAOYSA-N 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000881 Modified starch Polymers 0.000 description 1
- 239000004368 Modified starch Substances 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000006210 lotion Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 235000019426 modified starch Nutrition 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
Abstract
The present invention provides a kind of circuit board coating compositions, including following components:15 parts by weight of vinyl chloride vinyl laurate methacrylate copolymer rubber powder, 0.2 0.8 amount part of Diacetone Acrylamide, 26 parts by weight of sodium peroxydisulfate, 5 10 parts by weight of magnesium silicate, 12 16 parts by weight of pentaerythrite, 37 parts by weight of ureidopropyltriethoxysilane, 50 100 parts by weight of aqueous acrylic emulsion, 15 parts by weight of sorbierite, 0.5 1 parts by weight of cadmium stearate, 28 parts by weight of polyoxylethylene abietate, 15 parts by weight of cyclohexanone, 0.2 0.9 parts by weight amino-polyether siloxanes.Each ingredient interaction influences each other, and improves the waterproof effect of the coating composition of preparation, is suitable for the protection of circuit board.
Description
Technical field
The present invention relates to technical field of coatings more particularly to a kind of circuit board coating composition and preparation method thereof.
Background technology
Currently, circuit board is widely used in electronic product.Electronic product equipment in wet environment in use, its most
Main problem is exactly its internal component moisture damage, the especially circuit board of precise structure, to the resistance capabilities of steam
It is poor, once electronic equipment intakes or by humidity, then the loss that can not be retrieved is caused, is not whole equipment scrapping, is exactly
Repair is removed, causes economic loss, equipment can not normal use.Therefore, it is necessary to coat water-repellent paint to circuit board surface.
In the prior art, coating and preparation method thereof has been obtained for widely reporting, for example, application No. is
200810185131.6 Chinese patent literature reports a kind of starch coating composition and covers with paint, lacquer, colour wash, etc. the coating composition
Coated article, which utilizes the starch with biological degradability from natural products, as one-pack-type coating
Fine properties and drying property, ornamenting, pencil hardness, wear resistance, adhesion, alkali resistance, resistance to molten can be formed
Agent and the excellent film of weatherability.The coating composition is characterized in that including to make starch and/or modified starch (a), contain
The hydroxyl value of the polymerizable monomer mixture copolymerization gained of 40-95 mass % aromatic series polymerizable monomers is 10-170mgKOH/g's
Resin combination (A) obtained by hydroxy acryl acid resin (b) and polyisocyanate compound (c) reaction.Application No. is
201510689227.6 Chinese patent literature reports a kind of coating composition comprising PVDF resins, acrylic resin and
The solvent for including isophorone, further relates to the coating system for including the coating composition, and the coating system further includes priming paint group
Object, background colour finish compositions and clear coat composition are closed, and the method for preparing the coating system.Application No. is
201510970688.0 Chinese patent literature reports a kind of coating, and each component material quality ratio is aqueous solution 40-50
Part, 1-2 parts of thickener, 30-40 parts of silica flour, 1-2 parts of adhesive, 20-30 parts of titanium dioxide, 10-20 parts of industrial naptha, filler 3-
5 parts.
But the waterproof effect of the coating of above-mentioned report is poor, is not suitable for the surfacecti proteon of circuit board.
Invention content
Present invention solves the technical problem that being to provide a kind of circuit board coating composition and preparation method thereof, have good
Good waterproof effect.
In view of this, the present invention provides a kind of circuit board coating composition, including following components:Vinyl chloride-bay
Sour ethylene-methyl acrylate copolymer rubber powder 1-5 parts by weight, Diacetone Acrylamide 0.2-0.8 amounts part, sodium peroxydisulfate 2-6
Parts by weight, magnesium silicate 5-10 parts by weight, pentaerythrite 12-16 parts by weight, ureidopropyltriethoxysilane 3-7 parts by weight, water
Property acrylic emulsion 50-100 parts by weight, sorbierite 1-5 parts by weight, cadmium stearate 0.5-1 parts by weight, polyoxylethylene abietate
2-8 parts by weight, cyclohexanone 1-5 parts by weight, 0.2-0.9 parts by weight amino-polyether siloxanes.
Preferably, vinyl chloride-vinyl laurate-methacrylate copolymer rubber powder 1-3 parts by weight.
Preferably, Diacetone Acrylamide 0.4-0.8 amounts part.
Preferably, sodium peroxydisulfate 2-5 parts by weight.
Preferably, magnesium silicate 7-10 parts by weight.
Preferably, pentaerythrite 12-14 parts by weight.
Preferably, ureidopropyltriethoxysilane 5-7 parts by weight.
Preferably, cadmium stearate 0.5-0.8 parts by weight.
Preferably, polyoxylethylene abietate 5-8 parts by weight.
Correspondingly, the present invention also provides a kind of preparation method of circuit board coating composition, include the following steps:By chlorine
Ethylene-vinyl laurate-methacrylate copolymer rubber powder 1-5 parts by weight, Diacetone Acrylamide 0.2-0.8 amounts part, mistake
Sodium sulphate 2-6 parts by weight, magnesium silicate 5-10 parts by weight, pentaerythrite 12-16 parts by weight, ureidopropyltriethoxysilane 3-7
Parts by weight, aqueous acrylic emulsion 50-100 parts by weight, sorbierite 1-5 parts by weight, cadmium stearate 0.5-1 parts by weight, rosin acid
Then 0.2- was added in high-speed stirred in agitator tank 10 minutes in polyoxyethylene ester 2-8 parts by weight, the mixing of cyclohexanone 1-5 parts by weight
0.9 parts by weight amino-polyether siloxanes is further continued for stirring 5 minutes, obtains circuit board coating composition.
The present invention provides a kind of circuit board coating composition, including following components:Vinyl chloride-vinyl laurate-methyl
Acrylate copolymer rubber powder 1-5 parts by weight, Diacetone Acrylamide 0.2-0.8 amounts part, sodium peroxydisulfate 2-6 parts by weight, silicic acid
Magnesium 5-10 parts by weight, pentaerythrite 12-16 parts by weight, ureidopropyltriethoxysilane 3-7 parts by weight, aqueous acrylic emulsion
50-100 parts by weight, sorbierite 1-5 parts by weight, cadmium stearate 0.5-1 parts by weight, polyoxylethylene abietate 2-8 parts by weight, ring
Hexanone 1-5 parts by weight, 0.2-0.9 parts by weight amino-polyether siloxanes.Compared with prior art, the present invention is with vinyl chloride-bay
Sour ethylene-methyl acrylate copolymer rubber powder, Diacetone Acrylamide, sodium peroxydisulfate, magnesium silicate, pentaerythrite, urea groups third
Ethyl triethoxy silicane alkane, aqueous acrylic emulsion, sorbierite, cadmium stearate, polyoxylethylene abietate, cyclohexanone, amino are poly-
Ether siloxanes is raw material, and each ingredient interaction influences each other, and improves the waterproof effect of the coating composition of preparation, fits
Protection for circuit board.
Specific implementation mode
For a further understanding of the present invention, the preferred embodiment of the invention is described with reference to embodiment, still
It should be appreciated that these descriptions are only the feature and advantage further illustrated the present invention, rather than to the claims in the present invention
Limitation.
The embodiment of the invention discloses a kind of circuit board coating compositions, including following components:Vinyl chloride-lauric acid second
Alkene-methacrylate copolymer rubber powder 1-5 parts by weight, Diacetone Acrylamide 0.2-0.8 amounts part, sodium peroxydisulfate 2-6 weight
Part, magnesium silicate 5-10 parts by weight, pentaerythrite 12-16 parts by weight, ureidopropyltriethoxysilane 3-7 parts by weight, aqueous third
Olefin(e) acid lotion 50-100 parts by weight, sorbierite 1-5 parts by weight, cadmium stearate 0.5-1 parts by weight, polyoxylethylene abietate 2-8
Parts by weight, cyclohexanone 1-5 parts by weight, 0.2-0.9 parts by weight amino-polyether siloxanes.
Preferably, vinyl chloride-vinyl laurate-methacrylate copolymer rubber powder 1-3 parts by weight, diacetone
Acrylamide 0.4-0.8 amount parts, sodium peroxydisulfate 2-5 parts by weight, magnesium silicate 7-10 parts by weight, pentaerythrite 12-14 parts by weight, urea
Base propyl-triethoxysilicane 5-7 parts by weight, cadmium stearate 0.5-0.8 parts by weight, polyoxylethylene abietate 5-8 parts by weight.
Correspondingly, the present invention also provides a kind of preparation method of circuit board coating composition, include the following steps:By chlorine
Ethylene-vinyl laurate-methacrylate copolymer rubber powder 1-5 parts by weight, Diacetone Acrylamide 0.2-0.8 amounts part, mistake
Sodium sulphate 2-6 parts by weight, magnesium silicate 5-10 parts by weight, pentaerythrite 12-16 parts by weight, ureidopropyltriethoxysilane 3-7
Parts by weight, aqueous acrylic emulsion 50-100 parts by weight, sorbierite 1-5 parts by weight, cadmium stearate 0.5-1 parts by weight, rosin acid
Then 0.2- was added in high-speed stirred in agitator tank 10 minutes in polyoxyethylene ester 2-8 parts by weight, the mixing of cyclohexanone 1-5 parts by weight
0.9 parts by weight amino-polyether siloxanes is further continued for stirring 5 minutes, obtains circuit board coating composition.
The present invention provides a kind of circuit board coating composition, including following components:Vinyl chloride-vinyl laurate-methyl
Acrylate copolymer rubber powder 1-5 parts by weight, Diacetone Acrylamide 0.2-0.8 amounts part, sodium peroxydisulfate 2-6 parts by weight, silicic acid
Magnesium 5-10 parts by weight, pentaerythrite 12-16 parts by weight, ureidopropyltriethoxysilane 3-7 parts by weight, aqueous acrylic emulsion
50-100 parts by weight, sorbierite 1-5 parts by weight, cadmium stearate 0.5-1 parts by weight, polyoxylethylene abietate 2-8 parts by weight, ring
Hexanone 1-5 parts by weight, 0.2-0.9 parts by weight amino-polyether siloxanes.Compared with prior art, the present invention is with vinyl chloride-bay
Sour ethylene-methyl acrylate copolymer rubber powder, Diacetone Acrylamide, sodium peroxydisulfate, magnesium silicate, pentaerythrite, urea groups third
Ethyl triethoxy silicane alkane, aqueous acrylic emulsion, sorbierite, cadmium stearate, polyoxylethylene abietate, cyclohexanone, amino are poly-
Ether siloxanes is raw material, and each ingredient interaction influences each other, and improves the waterproof effect of the coating composition of preparation, fits
Protection for circuit board.
For a further understanding of the present invention, technical solution provided by the invention is carried out specifically with reference to embodiment
Bright, protection scope of the present invention is not limited by the following examples.
Raw material used in the embodiment of the present invention is purchased in market.
Embodiment 1
Weigh vinyl chloride-vinyl laurate -1 parts by weight of methacrylate copolymer rubber powder, Diacetone Acrylamide 0.8
Measure part, 2 parts by weight of sodium peroxydisulfate, 10 parts by weight of magnesium silicate, 12 parts by weight of pentaerythrite, 7 weight of ureidopropyltriethoxysilane
Measure part, 50 parts by weight of aqueous acrylic emulsion, 5 parts by weight of sorbierite, 0.5 parts by weight of cadmium stearate, polyoxylethylene abietate 8
Then 0.9 parts by weight amino-polyether silicon was added in high-speed stirred in agitator tank 10 minutes in parts by weight, the mixing of 1 parts by weight of cyclohexanone
Oxygen alkane is further continued for stirring 5 minutes, obtains circuit board coating composition.
Embodiment 2
Weigh vinyl chloride-vinyl laurate -5 parts by weight of methacrylate copolymer rubber powder, Diacetone Acrylamide 0.2
Measure part, 6 parts by weight of sodium peroxydisulfate, 5 parts by weight of magnesium silicate, 16 parts by weight of pentaerythrite, 3 weight of ureidopropyltriethoxysilane
Part, 100 parts by weight of aqueous acrylic emulsion, 1 parts by weight of sorbierite, 1 parts by weight of cadmium stearate, 2 weight of polyoxylethylene abietate
Measure part, then 0.2 parts by weight amino-polyether silica was added in high-speed stirred in agitator tank 10 minutes in the mixing of 5 parts by weight of cyclohexanone
Alkane is further continued for stirring 5 minutes, obtains circuit board coating composition.
Embodiment 3
Weigh vinyl chloride-vinyl laurate -3 parts by weight of methacrylate copolymer rubber powder, Diacetone Acrylamide 0.5
Measure part, 4 parts by weight of sodium peroxydisulfate, 8 parts by weight of magnesium silicate, 14 parts by weight of pentaerythrite, 5 weight of ureidopropyltriethoxysilane
Part, 80 parts by weight of aqueous acrylic emulsion, 3 parts by weight of sorbierite, 0.7 parts by weight of cadmium stearate, 5 weight of polyoxylethylene abietate
Measure part, then 0.7 parts by weight amino-polyether silica was added in high-speed stirred in agitator tank 10 minutes in the mixing of 3 parts by weight of cyclohexanone
Alkane is further continued for stirring 5 minutes, obtains circuit board coating composition.
The explanation of above example is only intended to facilitate the understanding of the method and its core concept of the invention.It should be pointed out that pair
For those skilled in the art, without departing from the principle of the present invention, the present invention can also be carried out
Some improvements and modifications, these improvement and modification are also fallen within the protection scope of the claims of the present invention.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest range caused.
Claims (10)
1. a kind of circuit board coating composition, which is characterized in that including following components:
Vinyl chloride-vinyl laurate-methacrylate copolymer rubber powder 1-5 parts by weight, Diacetone Acrylamide 0.2-0.8 amounts
Part, sodium peroxydisulfate 2-6 parts by weight, magnesium silicate 5-10 parts by weight, pentaerythrite 12-16 parts by weight, ureido-propyl triethoxysilicane
Alkane 3-7 parts by weight, aqueous acrylic emulsion 50-100 parts by weight, sorbierite 1-5 parts by weight, cadmium stearate 0.5-1 parts by weight, pine
Perfume acid polyoxyethylene ester 2-8 parts by weight, cyclohexanone 1-5 parts by weight, 0.2-0.9 parts by weight amino-polyether siloxanes.
2. circuit board coating composition according to claim 1, which is characterized in that vinyl chloride-vinyl laurate-methyl
Acrylate copolymer rubber powder 1-3 parts by weight.
3. circuit board coating composition according to claim 1, which is characterized in that Diacetone Acrylamide 0.4-0.8
Measure part.
4. circuit board coating composition according to claim 1, which is characterized in that sodium peroxydisulfate 2-5 parts by weight.
5. circuit board coating composition according to claim 1, which is characterized in that magnesium silicate 7-10 parts by weight.
6. circuit board coating composition according to claim 1, which is characterized in that pentaerythrite 12-14 parts by weight.
7. circuit board coating composition according to claim 1, which is characterized in that ureidopropyltriethoxysilane 5-
7 parts by weight.
8. circuit board coating composition according to claim 1, which is characterized in that cadmium stearate 0.5-0.8 parts by weight.
9. circuit board coating composition according to claim 1, which is characterized in that polyoxylethylene abietate 5-8 weights
Measure part.
10. a kind of preparation method of circuit board coating composition, which is characterized in that include the following steps:
By vinyl chloride-vinyl laurate-methacrylate copolymer rubber powder 1-5 parts by weight, Diacetone Acrylamide 0.2-0.8
Measure part, sodium peroxydisulfate 2-6 parts by weight, magnesium silicate 5-10 parts by weight, pentaerythrite 12-16 parts by weight, ureido-propyl triethoxy
Silane 3-7 parts by weight, aqueous acrylic emulsion 50-100 parts by weight, sorbierite 1-5 parts by weight, cadmium stearate 0.5-1 parts by weight,
Polyoxylethylene abietate 2-8 parts by weight, the mixing of cyclohexanone 1-5 parts by weight, in high-speed stirred in agitator tank 10 minutes, then plus
Enter 0.2-0.9 parts by weight amino-polyether siloxanes and be further continued for stirring 5 minutes, obtains circuit board coating composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711388594.8A CN108276815A (en) | 2017-12-20 | 2017-12-20 | A kind of circuit board coating composition and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711388594.8A CN108276815A (en) | 2017-12-20 | 2017-12-20 | A kind of circuit board coating composition and preparation method thereof |
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| CN108276815A true CN108276815A (en) | 2018-07-13 |
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| CN201711388594.8A Pending CN108276815A (en) | 2017-12-20 | 2017-12-20 | A kind of circuit board coating composition and preparation method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103571291A (en) * | 2012-07-27 | 2014-02-12 | 比亚迪股份有限公司 | Waterproof coating |
| CN103958637A (en) * | 2011-11-29 | 2014-07-30 | 新田明胶株式会社 | Material for photocurable sealing, sealing method, sealing material, and case using same |
| CN104497745A (en) * | 2014-12-15 | 2015-04-08 | 深圳市优宝惠新材料科技有限公司 | Waterproof coating material composition |
| CN107446451A (en) * | 2015-10-16 | 2017-12-08 | 宁波高新区夏远科技有限公司 | A kind of environment-friendly waterproof paint and preparation method thereof |
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2017
- 2017-12-20 CN CN201711388594.8A patent/CN108276815A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103958637A (en) * | 2011-11-29 | 2014-07-30 | 新田明胶株式会社 | Material for photocurable sealing, sealing method, sealing material, and case using same |
| CN103571291A (en) * | 2012-07-27 | 2014-02-12 | 比亚迪股份有限公司 | Waterproof coating |
| CN103571291B (en) * | 2012-07-27 | 2016-05-04 | 比亚迪股份有限公司 | A kind of water-repellent paint |
| CN104497745A (en) * | 2014-12-15 | 2015-04-08 | 深圳市优宝惠新材料科技有限公司 | Waterproof coating material composition |
| CN107446451A (en) * | 2015-10-16 | 2017-12-08 | 宁波高新区夏远科技有限公司 | A kind of environment-friendly waterproof paint and preparation method thereof |
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Application publication date: 20180713 |