CN107911999A - A kind of modularization liquid-cooled suit business device cabinet - Google Patents

Abstract

The present invention relates to a modular liquid-cooled server case, comprising: a box body; one or more liquid-cooled modules, wherein each liquid-cooled module includes: a housing, a liquid inlet valve, and a condenser, wherein the liquid-cooled module is A single server is inserted in operation and filled with cooling liquid; a connector for connecting the liquid cooling module to an external power source; and an auxiliary part including a liquid filling area and a liquid filling pipe. Using the modularized liquid-cooled server case of the present invention, if you want to maintain a single server, you only need to power off the working server, close the air outlet valve and liquid inlet valve, pull out the liquid cooling module, and then take out the server for separate maintenance Or replace it without affecting the operation of other servers. In addition, each liquid cooling module is equipped with a separate condenser, which can flexibly select the number of liquid cooling modules according to needs without fixed specifications.

Description

A modular liquid-cooled server chassis

technical field

The invention relates to the field of servers, and in particular to a modular liquid-cooled server chassis.

Background technique

With the rise of big data, cloud computing and AI (Artificial intelligence), the computing requirements of data centers and servers are getting higher and higher, and the computing architecture based on CPU chips is becoming more and more difficult to meet the analysis of big data. Model training for processing and artificial intelligence. Then, heterogeneous computing systems represented by GPU (Graphic Processing Unit, Graphics Processing Unit), FPGA (Field Programmable Gate Array, Programmable Gate Array) and ASIC (Application Specific Integrated Circuit, Application Specific Integrated Circuit, etc.) have great potential for development, and The power density continues to increase, a single chip can reach 300W or even more than 500W, and the density of a single cabinet can reach 40 or even 60kW. The traditional data center cooling technology uses precision air conditioners in computer rooms to exchange heat with the radiators of server computing chips through cold air. Due to the poor heat transfer characteristics of the air itself, the heat transfer resistance is high and the heat flux density is low, which can no longer meet the data requirements. The heat dissipation requirements of the new high-density heterogeneous computing and supercomputing in the center; in addition, with the rising energy costs and people's emphasis on green environmental protection, the energy saving requirements of servers and data centers are becoming stronger and stronger. On the premise of ensuring equipment safety and high-performance operation, how to improve the energy utilization efficiency of the data center and reduce the PUE (Power Usage Efficiency, energy usage efficiency) has become one of the goals pursued by the data center infrastructure.

In a traditional data center, the refrigeration unit provides chilled water to the end of the air conditioner to continuously cool down the IT equipment. The energy consumption of the refrigeration unit accounts for about 40% of the energy consumption of the data center, and the energy consumption is serious. The heater bypasses the refrigeration unit to partially realize natural cooling (free cooling) to save energy and reduce consumption, but it requires additional investment, occupies an area, and is limited by the regional environment and the maximum inlet air temperature of the server, so the effect is limited.

The liquid cooling technology that directly uses liquid to cool the server can achieve high heat exchange efficiency, thereby cooling the server chip, completely removing the refrigeration unit, and can run a higher server chip temperature without geographical restrictions, and the PUE can reach 1.02 or even lower. Considering the inherent factors such as the risk of water leakage, many failure points, and difficult maintenance of the cold plate liquid cooling system of the water-inlet server, immersion liquid cooling is the best cooling form to achieve high density and energy saving under the premise of reliability.

The existing immersion liquid cooling scheme is to directly immerse server chips and other devices in non-conductive liquid for direct heat exchange, which can be cooled by single-phase high-boiling point fluorinated liquid or mineral oil cooling, and two-phase low-boiling point fluorinated liquid cool down.

Because single-phase immersion cooling uses convection for heat transfer, there are uneven flow fields, low heat transfer efficiency (compared to two-phase immersion cooling), heat dissipation bottlenecks, and drag loss during IT equipment maintenance (that is, IT equipment surface staining There is liquid, and it is not easy to fall off quickly), it takes several hours to completely dry, which affects the normal maintenance of the server;

The two-phase immersion liquid cooling system is more promising because of its efficient and uniform phase change cooling, no drag loss during maintenance (the liquid on the surface of IT equipment will evaporate quickly), convenient maintenance, etc.;

However, the existing two-phase immersion liquid cooling solution is to place multiple IT servers in a large box "pool", which needs to be filled with a large amount of liquid to fill the structural gap in the box, making the liquid filling volume huge. The non-conductive fluorinated liquid itself is very expensive, which greatly increases the initial investment of immersion liquid cooling equipment, making it significantly higher than traditional air-cooled servers, and the return on investment is not high; at the same time, the huge box makes the fluorinated liquid There is a large amount of vapor dissipation on the surface; moreover, when a single IT server is being maintained, other servers may have to be shut down, otherwise there will be a larger amount of vapor dissipation, which will greatly increase maintenance costs and manpower requirements, making this This kind of immersion liquid cooling cannot be applied on a large scale.

Contents of the invention

In view of this, the embodiment of the present invention hopes to provide a modular liquid-cooled server chassis to solve or alleviate the technical problems in the prior art, and at least provide a beneficial option.

The technical scheme of the embodiment of the present invention is realized like this:

According to one embodiment of the present invention, a modular liquid-cooled server chassis is provided, including:

box;

One or more liquid cooling modules, wherein each liquid cooling module includes: a housing, a liquid inlet valve, and a condenser, wherein the liquid inlet valve is opened when the liquid cooling module is working, and the condenser is used for cooling gas in the liquid cooling module, and the liquid cooling module is plugged with a single server in operation and is filled with cooling liquid; and

a connector for connecting the liquid cooling module to an external power source; and

Auxiliary part, which includes a liquid-filled area and a liquid-filled tube, wherein,

the liquid-filled region is filled with cooling liquid; and

The liquid filling pipe is connected to the liquid inlet valve and used for delivering the liquid from the liquid filling area to the liquid cooling module.

In some embodiments, each liquid cooling module further includes a maintenance end cover, and the maintenance end cover is closed when the liquid cooling module is working.

In some embodiments, each liquid cooling module further includes a cooling valve, and the chassis further includes a first cooling pipe and a second cooling pipe; wherein,

The cooling valve is connected with the condenser;

the first cooling pipe is connected to each cooling valve and is used to deliver the coolant from the condenser of the liquid cooling module to the outside of the chassis; and

The second cooling water pipe is connected to each cooling valve, and is used to deliver coolant from the outside to the condenser.

In some embodiments, the chassis also includes a power supply and control system, which includes a power supply and a controller; wherein,

the power supply is connected to the connector for powering other components in the chassis through the connector; and

The controller is used to control other components in the chassis.

In some embodiments, each liquid cooling module further includes a pressure relief valve for discharging gas in the liquid cooling module to the outside.

In some embodiments, the cabinet further includes an air outlet pipe, and a steam treatment area connected to the air outlet pipe; wherein the air outlet pipe is connected to each pressure relief valve and receives the steam discharged from the pressure relief valve. gas.

In some embodiments, the tank further includes a filling valve connected to the filling area, through which cooling fluid can be added to the filling area.

In some embodiments, each liquid cooling module further includes a first sensor connected to the controller and used to monitor the liquid level of the cooling liquid in the liquid cooling module; wherein,

When the liquid level of the coolant in the liquid cooling module is higher than the first threshold, the first sensor generates a first signal and sends it to the controller, and the controller receives the first signal Then controlling the liquid inlet valve to close; and,

When the liquid level of the coolant in the liquid cooling module is lower than a second threshold, the first sensor generates a second signal and sends it to the controller, and the controller receives the second signal Then control the liquid inlet valve to open.

In some embodiments, each liquid cooling module further includes a second sensor connected to the controller and used to monitor the gas pressure in the liquid cooling module; wherein,

When the gas pressure is greater than a third threshold, the second sensor generates a third signal and sends it to the controller, and the controller controls the pressure relief valve to open after receiving the third signal for pressure relief.

In some embodiments, the liquid-filled area further includes a third sensor, which is connected to the controller and used to monitor the liquid level of the cooling liquid in the liquid-filled area; wherein,

When the liquid level of the coolant in the liquid-filled area is lower than a fourth threshold, the third sensor generates a fourth signal and sends it to the controller, and the controller receives the fourth signal An alarm signal is then issued to indicate the need for liquid filling.

In some embodiments, the first cooling tube and the second cooling tube are connected to an external heat exchange device.

In some embodiments, the heat exchange equipment is a dry cooler, a cooling tower or a building chilled water system.

In some embodiments, the coolant is cooling water.

In some embodiments, the connector is a quick-connect device.

In some embodiments, the cooling liquid is a fluorinated liquid.

The embodiments of the present invention have the following advantages due to the adoption of the above technical solutions: using the modularized liquid-cooled server chassis of the present invention, if you want to maintain a single server, you only need to power off the server in operation, and close the air outlet valve and the inlet valve. The liquid cooling module can be pulled out, and the server can be taken out for independent maintenance or replacement without affecting the operation of other servers. In addition, each liquid cooling module is equipped with a separate condenser, which can flexibly select the number of liquid cooling modules according to needs without fixed specifications.

The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the drawings and the following detailed description.

Description of drawings

In the drawings, unless otherwise specified, the same reference numerals designate the same or similar parts or elements throughout the several drawings. The drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in accordance with the present invention and should not be taken as limiting the scope of the present invention.

1 is a schematic cross-sectional view of a modular liquid-cooled server chassis according to a first embodiment of the present invention;

2 is a schematic cross-sectional view of a liquid cooling module according to a first embodiment of the present invention;

3 is a schematic cross-sectional view of a modular liquid-cooled server chassis according to a second embodiment of the present invention;

4 is a schematic cross-sectional view of a liquid cooling module according to a second embodiment of the present invention;

5 is a schematic cross-sectional view of a modular liquid-cooled server chassis according to a third embodiment of the present invention;

6 is a schematic cross-sectional view of a liquid cooling module according to a third embodiment of the present invention.

Detailed ways

In the following, only some exemplary embodiments are briefly described. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and descriptions are to be regarded as illustrative in nature and not restrictive.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial" , "radial", "circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device or Elements must have certain orientations, be constructed and operate in certain orientations, and therefore should not be construed as limitations on the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection or an indirect connection through an intermediary, it can be the internal communication of two components or the interaction relationship between two components . Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "side" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the level of the first feature is higher than that of the second feature. "Below", "below" and "under" the first feature to the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is less horizontal than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the invention. Furthermore, the present disclosure may repeat reference numerals and/or reference letters in different instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

FIG. 1 is a schematic cross-sectional view of a modular liquid-cooled server chassis provided by an embodiment of the present invention. As shown in FIG. 1 , the modular liquid-cooled server chassis 100 includes:

Case 110, one or more liquid cooling modules 120, connectors 130, and auxiliary parts.

The box body 110 accommodates all parts of the box body, and a cover (not shown) may be provided on its top or side, so that the operator can open the cover to check the parts in the box body 110 and replace the parts.

One or more liquid cooling modules 120 are disposed inside the box body 110 . FIG. 2 shows a single liquid cooling module, which includes a housing 121 , a liquid inlet valve 122 , and a condenser 123 , and a single server S is submerged in cooling liquid L. As shown in FIG.

When the liquid cooling module 120 is working, a single server S is completely submerged in the cooling liquid L, and the liquid inlet valve 122 is opened. In general, coolant is a low boiling point non-conductive liquid. In particular, the cooling liquid may be a fluorinated liquid. The performance of fluorinated liquid is stable, it will not react with active materials such as metals, plastics and elastomers, and it has excellent non-conductive and insulating properties regardless of high or low temperature, so it can be widely used to cool electronic equipment. The specific type of fluorinated liquid is not specifically limited in the present invention.

The connector 130 is used to connect the liquid cooling module to an external power source. The specific type of the connector 130 is not limited in the present invention. Preferably, the connector 130 may be a quick plug-in device, such as a power strip, so that the liquid cooling module can be plugged in and out quickly.

The auxiliary part includes a liquid filling area 141 and a liquid filling tube 142 .

The liquid filling area 141 is filled with cooling liquid; the liquid filling pipe 142 is connected to the liquid inlet valve 122 of each liquid cooling module 120 for delivering the cooling liquid in the liquid filling area 141 to the liquid cooling module 120 .

Due to the viewing angle, the liquid inlet valve 122 is covered by the liquid filling pipe 142 , and for the convenience of description, the valve is shown by a dotted line in FIG. 1 .

When the chassis 100 is in operation, the liquid cooling module 120 is plugged into the connector 130 and the liquid inlet valve 122 is opened. The connector 130 is connected to an external power supply to provide power for the liquid cooling module 120 and the server S. With the operation of the server S, the internal chip temperature gradually increases, reaching the boiling point of the cooling liquid L. At this time, the coolant vaporizes, and the heat from the chip and other parts of the server is taken away by latent heat. The vaporized cooling liquid bubbles float from the cooling liquid and are distributed to the gas area on the upper part of the liquid cooling module, and then the condenser 123 cools the cooling liquid gas into cooling liquid. The recondensed coolant drips into the coolant below, completing the coolant cycle.

The condenser 123 contains coolant. In particular, the coolant can be cooling water. The condenser 123 may be any type of condenser, for example, it may be a condensation pan, and the present invention is not specifically limited here.

Figure 1 shows 10 liquid cooling modules. It can be understood that other numbers of liquid cooling modules can be arranged in the box body 110 according to actual needs, and the size of the box body 110 will also change accordingly. In particular, boxes of different sizes can be provided according to different usage environments, which contain different numbers of liquid cooling modules and use connectors with adjustable socket numbers. For example, the number of servers used in a large data center is very large, so a larger chassis can be provided, which contains dozens or even hundreds of liquid cooling modules. For ordinary users, a small chassis can be provided, which contains a small number of liquid cooling modules. Since each liquid cooling module contains a condenser, the modularized liquid cooling server chassis provided by the present invention is very flexible, and the number of liquid cooling modules can be flexibly adjusted according to needs without fixed specifications.

In the present invention, since the condenser is arranged in each liquid cooling module, the cooling liquid can complete circulation in the liquid cooling module, thereby improving the utilization rate of the cooling liquid.

If a single server needs to be maintained, it can be stopped, and at the same time, the liquid cooling module 120 where the server is located is disconnected from the connector 130, and then the liquid inlet valve 122 of the liquid cooling module 120 is closed to complete the liquid cooling module. 120 is taken out from the case 110. At this time, other servers are still running normally without any impact. After the liquid cooling module 120 is taken out, the server S can be taken out of the cooling liquid for maintenance or replacement.

When reinstalling the server S, the server after maintenance or replacement can be placed in the liquid cooling module 120 again, the liquid inlet valve 122 of the liquid cooling module 120 is connected to the chassis, and the valve is opened. At this time, according to the liquid level pressure balance principle, the cooling liquid in the liquid filling area 141 will enter the liquid cooling module 120 through the liquid filling pipe 142 through the liquid inlet valve 122 . After the coolant height meets the requirements of the server, the liquid cooling module 120 can be connected to the connector 130, and the power can be re-powered to make it work normally.

It can be seen that, with the modularized liquid-cooled server chassis according to the present invention, a single server can be maintained and replaced without affecting other servers.

3 shows a schematic cross-sectional view of a modular liquid-cooled server chassis 200 according to a second embodiment of the present invention. The similarities between the chassis 200 and the chassis 100 will not be repeated here, and only the differences will be described in detail.

In the chassis 200 , as shown in FIG. 4 , each liquid cooling module 220 further includes a maintenance end cover 224 , and the maintenance end cover 224 is closed when the liquid cooling module 220 is working. In this way, if the server needs to be maintained, the cooling liquid will not be lost when the cover of the chassis is opened to take out the liquid cooling module.

As shown in FIGS. 3 and 4 , each liquid cooling module 220 may further include a cooling valve 225 , and the auxiliary part of the chassis 200 may further include a first cooling water pipe 243 and a second cooling water pipe 244 . The first and second cooling pipes 243 and 244 are connected to each cooling valve 225 and the external heat exchange equipment, and the first cooling pipe 243 is used to deliver the hot coolant from the condenser 223 to the external heat exchange equipment, while The second cooling pipe 244 is used to deliver the new coolant from the external heat exchange device to the condenser 223, so as to complete the replacement of the coolant.

In the present invention, the heat exchanging equipment is arranged outside the case 200, but it can be understood that the case 200 itself may also include the heat exchanging equipment. Additionally, the heat exchange equipment can be of any type such as dry coolers, cooling towers or building chilled water systems.

In addition, the chassis 200 also includes a power supply and control system 250 . As shown in FIG. 3 , the power supply and control system 250 includes a power supply 251 and a controller 252 . A power supply 251 is connected to the connector 230 to provide power to the components of the chassis 200 . The controller is connected to each component of the chassis to control each component, for example, it can control the opening and closing of each valve of the liquid cooling module 220, and power off and re-power the liquid cooling module 220, making the operation of the chassis 200 more convenient.

Preferably, as shown in FIG. 3 , the box body 210 may also include a liquid filling valve 211 connected to the liquid filling area 241, through which the liquid filling area 241 can be supplemented with cooling liquid, so as to avoid opening the case to Add coolant for user convenience.

Also, at some point, the server generates too much steam to cool down in time. At this time, the pressure inside the liquid cooling module 220 will increase, which will affect the cooling effect and even damage the condenser 223 . To this end, each liquid cooling module preferably includes a pressure relief valve 226 as shown in FIG. 4 . Through the pressure relief valve 226, the liquid cooling module 220 can be relieved to avoid problems caused by excessive pressure.

Gases expelled as a result of pressure relief may be vented to the external environment, but preferably may receive gas expelled from the pressure relief valves through an outlet pipe (not shown) connected to each pressure relief valve. Correspondingly, the auxiliary part also includes a steam treatment area 245, which is connected to the gas outlet pipe and collects the gas discharged from the gas outlet pipe. At normal temperature, the gas in the steam treatment area 245 condenses into a liquid, which drops in the liquid-filled area 241 . Afterwards, it can also be filled into the liquid cooling module 220 through the liquid filling pipe 242 , which improves the usage rate of the cooling liquid. It can be understood that the steam treatment area 245 may also be provided with a condensing device to cool the coolant gas, which is not specifically limited in the present invention.

FIG. 5 shows a schematic cross-sectional view of a modular liquid-cooled server chassis 300 according to a third embodiment of the present invention. The difference between the case 300 and the case 200 shown in FIG. 2 is that the liquid cooling module 320 and the liquid-filled region 341 of the case 300 may contain sensors. Apart from that, the rest of the chassis 300 is the same as the chassis 200, so it will not be repeated here.

It can be understood that one or more sensors may be provided in one or both of the above two components, and the present invention is not limited thereto. For the convenience of description, two sensors (as shown in FIG. 6 ) are set in the liquid cooling module 320 in the chassis 300, and one sensor is set in the liquid-filled area 341, and the first sensor 327, the second sensor 328, and the second sensor are respectively used. Three sensors 3411 are indicated.

The first, second, and third sensors 327, 328, and 3411 are respectively connected to the controller 352, which may be any type of sensors, such as contact depth sensors, pressure sensors, etc., and it will be appreciated that these sensors It can also be a non-contact sensor arranged on the wall of the cabinet, such as a laser sensor, an infrared sensor, and the like.

The first and second sensors 327 and 328 are disposed in each liquid cooling module 320 for monitoring the liquid level of the cooling liquid in the liquid cooling module 320 and the gas pressure in the liquid cooling module 320 respectively. After the server finishes maintenance and the liquid cooling module 320 is reinserted, the liquid cooling module 320 will be refilled with cooling liquid. When the first sensor 327 detects that the liquid level of the coolant in the liquid cooling module 320 exceeds the first threshold, it will generate a first signal to notify the controller 352, and the controller 352 will control the liquid inlet valve 323 to close according to the signal to stop cooling. entry of liquid. And, if the first sensor 325 detects that the liquid level in the liquid cooling module 320 is lower than the second threshold, a second signal will be sent to notify the controller 352, and the controller 352 will control the liquid inlet valve to open according to the signal, so that the liquid cooling module Replenish coolant. In this way, the liquid level of the cooling liquid in the liquid cooling module can be kept within a stable range. The first and second thresholds are set according to the amount of cooling fluid required to cool the server.

The second sensor 328 is used to monitor the gas pressure in the liquid cooling module 320 . When the gas pressure exceeds the third threshold, the second sensor 328 sends a third signal to notify the controller 352 , and the controller controls the pressure relief valve 326 to open according to the signal to relieve the pressure of the liquid cooling module 320 .

The third sensor 3411 is disposed in the liquid-filled area 341 for monitoring the liquid level of the coolant in the liquid-filled area 341 . When the liquid level drops below the fourth threshold, a fourth signal is sent to notify the controller 352, and the controller 352 sends an alarm signal according to the signal, and prompts that the coolant needs to be filled, and then can be filled through the liquid filling port 311 Coolant, to avoid problems caused by insufficient coolant.

Wherein, the third threshold and the fourth threshold can be set according to actual needs, which is not specifically limited in the present invention.

In particular, a sensor may also be provided in the steam treatment area 345 to monitor the gas pressure in the steam treatment area 346 , and a pressure relief valve may also be provided in the steam treatment area 345 . If the gas pressure exceeds the fifth threshold, a signal is sent to notify the controller 352, and the controller 352 controls the pressure relief valve to release pressure according to the signal, so as to discharge the gas in the steam treatment area 345 to the outside, or to an external airbag. If it is discharged to the external airbag, the gas in the airbag can be cooled to cooling liquid at normal temperature, and filled into the liquid filling area 341 through the liquid filling port 311 for reuse, so as to improve the utilization efficiency of the cooling liquid. It will be appreciated that the air bag may also be contained within the chassis. In this case, the airbag can be connected to a cooling device, or a cooling device is provided inside it, and after the gas in the airbag is cooled into cooling liquid, it can be connected to the liquid-filled area through an additional pipeline for reuse. The fifth threshold is determined according to actual needs.

The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person familiar with the technical field can easily think of its various changes or modifications within the technical scope disclosed in the present invention. Replacement, these should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.

Claims (15)

1. A modular liquid-cooled server chassis, characterized in that, comprising: box; One or more liquid cooling modules, wherein each liquid cooling module includes: a housing, a liquid inlet valve, and a condenser, wherein the liquid inlet valve is opened when the liquid cooling module is working, and the condenser is used for cooling gas in the liquid cooling module, and the liquid cooling module is plugged with a single server in operation and is filled with cooling liquid; and a connector for connecting the liquid cooling module to an external power source; and Auxiliary part, which includes a liquid-filled area and a liquid-filled tube, wherein, the liquid-filled region is filled with cooling liquid; and The liquid filling pipe is connected to the liquid inlet valve and used for delivering the liquid from the liquid filling area to the liquid cooling module. 2. The server chassis according to claim 1, wherein each liquid cooling module further comprises a maintenance end cover, and the maintenance end cover is closed when the liquid cooling module is working. 3. The server chassis according to claim 1, wherein each liquid cooling module further comprises a cooling valve, and the chassis further comprises a first cooling pipe and a second cooling pipe; wherein, The cooling valve is connected with the condenser; the first cooling pipe is connected to each cooling valve and is used to deliver the coolant from the condenser of the liquid cooling module to the outside of the chassis; and The second cooling water pipe is connected to each cooling valve, and is used to deliver coolant from the outside to the condenser. 4. The server cabinet according to claim 1, wherein the cabinet also includes a power supply and control system, which includes a power supply and a controller; wherein, the power supply is connected to the connector for powering other components in the chassis through the connector; and The controller is used to control other components in the chassis. 5 . The server chassis according to claim 4 , wherein each liquid cooling module further comprises a pressure relief valve, which is used to discharge the gas in the liquid cooling module to the outside. 6. The service cabinet of claim 5, wherein the cabinet further comprises an air outlet pipe, and a steam treatment area connected to the air outlet pipe; wherein the air outlet pipe is connected to each pressure relief valve And receiving gas discharged from the pressure relief valve. 7. The server case according to claim 4, wherein the case body further comprises a liquid filling valve connected to the liquid filling area, through which cooling liquid can be added to the liquid filling area. 8. The server chassis according to claim 4, wherein each liquid cooling module further comprises a first sensor connected to the controller and used to monitor the liquid level of the cooling liquid in the liquid cooling module; in, When the liquid level of the coolant in the liquid cooling module is higher than the first threshold, the first sensor generates a first signal and sends it to the controller, and the controller receives the first signal Then controlling the liquid inlet valve to close; and, When the liquid level of the coolant in the liquid cooling module is lower than a second threshold, the first sensor generates a second signal and sends it to the controller, and the controller receives the second signal Then control the liquid inlet valve to open. 9. The server chassis according to claim 5, wherein each liquid cooling module further comprises a second sensor connected to the controller and used to monitor the gas pressure in the liquid cooling module; wherein, When the gas pressure is greater than a third threshold, the second sensor generates a third signal and sends it to the controller, and the controller controls the pressure relief valve to open after receiving the third signal for pressure relief. 10. The server chassis according to claim 4, wherein the liquid-filled area further comprises a third sensor connected to the controller and used for monitoring the liquid level of the cooling liquid in the liquid-filled area; in, When the liquid level of the coolant in the liquid-filled area is lower than a fourth threshold, the third sensor generates a fourth signal and sends it to the controller, and the controller receives the fourth signal An alarm signal is then issued to indicate the need for liquid filling. 11. The server chassis according to claim 3, wherein the first cooling pipe and the second cooling pipe are connected to an external heat exchange device. 12. The server case according to claim 11, wherein the heat exchange device is a dry cooler, a cooling tower or a building chilled water system. 13. The server chassis according to claim 3, wherein the coolant is cooling water. 14. The server chassis according to claim 1, wherein the connector is a quick plug device. 15. The server chassis according to claim 1, wherein the cooling liquid is a fluorinated liquid.