CN107820377A - Board-level circuit pinpoints heater and method - Google Patents
Board-level circuit pinpoints heater and method Download PDFInfo
- Publication number
- CN107820377A CN107820377A CN201711057075.3A CN201711057075A CN107820377A CN 107820377 A CN107820377 A CN 107820377A CN 201711057075 A CN201711057075 A CN 201711057075A CN 107820377 A CN107820377 A CN 107820377A
- Authority
- CN
- China
- Prior art keywords
- board
- thermal insulation
- insulation board
- heater
- level circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/345—Arrangements for heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Surface Heating Bodies (AREA)
Abstract
The invention discloses a kind of board-level circuit fixed point heater and method, it belongs to the technology of circuit protection field, and device includes：Thermal insulation board and some bottoming holes, wherein：Bottoming hole is distributed in thermal insulation board, and calandria is embedded with bottoming hole, is connected between calandria by being arranged at the metal wire of heat-insulated plate surface, method includes：Step S1, the metal wire of inverted S-shaped setting is laid on the surface of the thermal insulation board；Step S2, the insulated paint is coated on the surface of the thermal insulation board；Step S3, the predeterminated position on the surface of the thermal insulation board open up the bottoming hole；Step S4, the calandria is embedded in the bottoming hole.The beneficial effect of the technical scheme is：Present apparatus small volume, the efficiency of heating surface is high, can greatly reduce power consumption.
Description
Technical field
The present invention relates to a kind of technology of circuit protection field, specifically a kind of board-level circuit fixed point heater and
Method.
Background technology
The environment temperature that extreme low temperature environment refers to microelectronic component work is less than -153 degrees Celsius.Now, chip operation
Environment temperature is less than commercial chip operating temperature standard, the operating temperature mark of even below military chip.For example, in moon table
Face back of the body Yang Chu temperature can as little as -180 degrees Celsius, and the ambient temperature in hollow of space can as little as -269 degrees Celsius.In pole
Hold under low temperature, many semiconductor devices can show different features, such as mobility increase, threshold voltage rise, subthreshold value pendulum
Width reduces, saturation rate increases, source and drain electric charge shares effect reduces or grid induced drain electric current reduces etc., while current-carrying occurs
Sub- freezing effect, and carrier freezing effect can cause war ping effect, delay by effect, the hesitation phenomena such as.Navigating
In its application, in order to ensure circuit space converter system worked well, many circuits need to run in incubator, add system
Complexity and cost.
The existing circuit for needing to work at low temperature, is required for being positioned in incubator.Can be right when incubator heats
Whole circuit board is heated, but is not that all places on circuit board are required for heating, and so will result in huge
Cost, the waste in space, energy.
The content of the invention
The present invention is directed to deficiencies of the prior art, proposes a kind of board-level circuit fixed point heater and method,
Its small volume, the efficiency of heating surface is high, can greatly reduce power consumption.
The present invention is achieved by the following technical solutions：
The present invention relates to a kind of board-level circuit to pinpoint heater, wherein, including：Thermal insulation board and some bottoming holes, it is described
Bottoming hole is distributed in the thermal insulation board, is embedded with calandria in the bottoming hole, between the calandria by be arranged at it is described every
The metal wire of hotplate surface is connected.
Preferably, plate circuit fixed point heater, wherein, described metal wire is distributed in the font of falling S.
Preferably, plate circuit fixed point heater, wherein, described bottoming hole and the calandria all to be circular or
Ellipse.
Preferably, plate circuit fixed point heater, wherein, the material of described thermal insulation board is poly terephthalic acid fourth
Diol ester.
Preferably, plate circuit fixed point heater, wherein, the surface of the setting metal wire of described thermal insulation board
Coated with insulated paint.
Preferably, plate circuit fixed point heater, wherein, the material of described metal wire is copper.
Preferably, plate circuit fixed point heater, wherein, the material of described calandria is CrAlxOr CrNby, its
In：X scopes are that 0.2~0.4, y scopes are 0.7~0.9.
The present invention relates to a kind of manufacture method of board-level circuit fixed point heater, comprise the following steps：
Step S1, the metal wire of inverted S-shaped setting is laid on the surface of the thermal insulation board；
Step S2, the insulated paint is coated on the surface of the thermal insulation board；
Step S3, the predeterminated position on the surface of the thermal insulation board open up the bottoming hole；
Step S4, the calandria is embedded in the bottoming hole.
The beneficial effect of the technical scheme is：The device volume is small, and the efficiency of heating surface is high, can greatly reduce power consumption.
Brief description of the drawings
Fig. 1 is in the preferred embodiment of the present invention, and a kind of board-level circuit pinpoints schematic diagram of heating device；
Fig. 2 is a kind of metal wire layout drawing of board-level circuit fixed point heater in the preferred embodiment of the present invention；
Fig. 3 is a kind of insulated paint distribution map of board-level circuit fixed point heater in the preferred embodiment of the present invention；
Fig. 4 is a kind of bottoming hole location drawing of board-level circuit fixed point heater in the preferred embodiment of the present invention；
Fig. 5 is in the preferred embodiment of the present invention, and a kind of calandria of board-level circuit fixed point heater sets figure；
Fig. 6 is in the preferred embodiment of the present invention, and a kind of manufacture method flow of board-level circuit fixed point heater is shown
It is intended to；
In figure：1 thermal insulation board, 2 bottoming holes, 3 calandrias, 4 metal wires, 5 insulated paint.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art obtained on the premise of creative work is not made it is all its
His embodiment, belongs to the scope of protection of the invention.
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings, but not as limiting to the invention.
As shown in figure 1, the present embodiment includes：Including：Thermal insulation board 1 and some bottoming holes 2, wherein：Bottoming hole 2 be distributed in every
Hot plate 1, calandria 3 is embedded with bottoming hole 2, is connected between calandria 3 by being arranged at the metal wire 4 on the surface of thermal insulation board 1.
Thermal insulation board 1 is high-temperature resistance plastice, and its material is polybutylene terephthalate (PBT), and resistance to warm spot reaches 120 DEG C.
Metal wire 4 is evenly equipped with thermal insulation board 1, metal wire 4 is set in the font of falling S.The material of metal wire 4 is copper.Thermal insulation board 1
The surface of setting metal wire 4 be coated with insulated paint 5.The position that needs to heat on the surface of thermal insulation board 1 offers some bottoming holes 2,
Calandria 3 is embedded with bottoming hole 2.The material of calandria 3 is CrAlxOr CrNby, wherein：X scopes are 0.2~0.4, y scopes
For 0.7~0.9.Bottoming hole 2 and calandria 3 are circular or ellipse.
Q=I2*R*t (2)
Chip at calandria 3 is obtained according to formula (1), (2) and (3)HeatedTemperatureDifferenceFormula is：Wherein：
Q is caloric value；
K is the coefficient of heat conduction；
A is contact area or heating area；
△ T are both ends temperature difference；
△ L are the length of heat transfer；
I is the electric current for flowing through resistance；
R is the resistance for heating resistor；
T is the duration；
ρ is the resistivity coefficient of heating resistor；
L is the length of heating resistor；
D is the thickness of heating resistor；
W is the width of heating resistor.
As shown in Fig. 2 being uniformly distributed metal wire 4 on thermal insulation board 1 first, metal wire 4 is in the font of falling S.
As shown in figure 3, the cloth for completing metal wire 4 postpones, insulated paint 5 is coated on the surface of metal wire 4.
As shown in figure 4, the cloth for completing insulated paint 5 postpones, needing to set bottoming hole 2, bottoming hole 2 to module heating position
Be shaped as ellipse or circular.
As shown in figure 5, calandria 3 is set in bottoming hole 2, to realize the heating to circuit.
As shown in fig. 6, the present embodiment is related to a kind of method for manufacturing board-level circuit fixed point heater, including following step
Suddenly：
Step S1, on the surface of thermal insulation board 1 in inverted S-shaped setting metal wire 4.Metal wire 4 is set to be paved with whole thermal insulation board 1.
Step S2, insulated paint 5 is coated on the surface of thermal insulation board 1, to fix plain conductor.
Step S3, bottoming hole 2 is opened up in specified location, the length of oval aperture is determined by required heating amount.This is specified
Position is to need the region where the module that heats under low temperature environment in the circuit that works.
Step S4, calandria 3 is embedded in bottoming hole 2, is heated with the circuit to the lower section of thermal insulation board 1.
Compared with prior art, present apparatus small volume, the efficiency of heating surface is high, can greatly reduce power consumption.
Preferred embodiments of the present invention are the foregoing is only, not thereby limit embodiments of the present invention and protection model
Enclose, to those skilled in the art, should can appreciate that all with made by description of the invention and diagramatic content
Scheme obtained by equivalent substitution and obvious change, should be included in protection scope of the present invention.
Claims (8)
1. a kind of board-level circuit pinpoints heater, it is characterised in that including：
Thermal insulation board and some bottoming holes, the bottoming hole are distributed in the thermal insulation board, and calandria is embedded with the bottoming hole, described
It is connected between calandria by being arranged at the metal wire of the heat-insulated plate surface.
2. board-level circuit according to claim 1 pinpoints heater, it is characterized in that, described metal wire is in the font of falling S
Distribution.
3. board-level circuit according to claim 1 pinpoints heater, it is characterized in that, described bottoming hole and the heating
Body is all circular or ellipse.
4. board-level circuit according to claim 1 pinpoints heater, it is characterized in that, described in the setting of described thermal insulation board
The surface of metal wire is coated with insulated paint.
5. board-level circuit according to claim 4 pinpoints heater, it is characterized in that, the material of described thermal insulation board is poly-
Mutual-phenenyl two acid bromide two alcohol ester.
6. board-level circuit according to claim 1 pinpoints heater, it is characterized in that, the material of described metal wire is
Copper.
7. board-level circuit according to claim 1 pinpoints heater, it is characterized in that, the material of described calandria is
CrAlxOr CrNby, wherein：X scopes are that 0.2~0.4, y scopes are 0.7~0.9.
8. a kind of preparation method of board-level circuit fixed point heater, it is characterised in that applied to any in such as claim 1-7
Board-level circuit fixed point heater described in one, it is further comprising the steps of：
Step S1, the metal wire of inverted S-shaped setting is laid on the surface of the thermal insulation board；
Step S2, the insulated paint is coated on the surface of the thermal insulation board；
Step S3, the predeterminated position on the surface of the thermal insulation board open up the bottoming hole；
Step S4, the calandria is embedded in the bottoming hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711057075.3A CN107820377A (en) | 2017-10-24 | 2017-10-24 | Board-level circuit pinpoints heater and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711057075.3A CN107820377A (en) | 2017-10-24 | 2017-10-24 | Board-level circuit pinpoints heater and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107820377A true CN107820377A (en) | 2018-03-20 |
Family
ID=61603760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711057075.3A Pending CN107820377A (en) | 2017-10-24 | 2017-10-24 | Board-level circuit pinpoints heater and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107820377A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1242927A (en) * | 1996-12-31 | 2000-01-26 | 诺基亚电信公司 | Method and arrangement for heating component |
| CN1853446A (en) * | 2003-09-17 | 2006-10-25 | 朴财相 | Heater and method for manufacturing heater using PCB |
| CN201341507Y (en) * | 2008-12-10 | 2009-11-11 | 朴钟润 | Electric heating insole |
| CN201557323U (en) * | 2009-11-26 | 2010-08-18 | 杭州华三通信技术有限公司 | Structure for heating devices on PCB |
| CN102678199A (en) * | 2011-02-14 | 2012-09-19 | 通用电气公司 | Components with cooling channels and methods of manufacture |
| CN103082733A (en) * | 2011-11-08 | 2013-05-08 | 心愿家纺（南通）有限公司 | A mattress with magnetic therapy and electric heating effects |
| CN203423812U (en) * | 2013-07-05 | 2014-02-05 | 大连理工大学 | Controllable fixed-point uniform electric heating device in model test |
| CN103962079A (en) * | 2013-01-28 | 2014-08-06 | 西门子公司 | Heating device and device for generating chemical reaction |
| KR20160081630A (en) * | 2014-12-31 | 2016-07-08 | 홍예브게니 | Multi-purpose PCB including easy-cut electrical lines |
-
2017
- 2017-10-24 CN CN201711057075.3A patent/CN107820377A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1242927A (en) * | 1996-12-31 | 2000-01-26 | 诺基亚电信公司 | Method and arrangement for heating component |
| CN1853446A (en) * | 2003-09-17 | 2006-10-25 | 朴财相 | Heater and method for manufacturing heater using PCB |
| CN201341507Y (en) * | 2008-12-10 | 2009-11-11 | 朴钟润 | Electric heating insole |
| CN201557323U (en) * | 2009-11-26 | 2010-08-18 | 杭州华三通信技术有限公司 | Structure for heating devices on PCB |
| CN102678199A (en) * | 2011-02-14 | 2012-09-19 | 通用电气公司 | Components with cooling channels and methods of manufacture |
| CN103082733A (en) * | 2011-11-08 | 2013-05-08 | 心愿家纺（南通）有限公司 | A mattress with magnetic therapy and electric heating effects |
| CN103962079A (en) * | 2013-01-28 | 2014-08-06 | 西门子公司 | Heating device and device for generating chemical reaction |
| CN203423812U (en) * | 2013-07-05 | 2014-02-05 | 大连理工大学 | Controllable fixed-point uniform electric heating device in model test |
| KR20160081630A (en) * | 2014-12-31 | 2016-07-08 | 홍예브게니 | Multi-purpose PCB including easy-cut electrical lines |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180320 |