CN107723766A - The two-sided electrolytic copper plating device of volume to volume and its copper electroplating method for flexible circuit board - Google Patents
The two-sided electrolytic copper plating device of volume to volume and its copper electroplating method for flexible circuit board Download PDFInfo
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- CN107723766A CN107723766A CN201610652783.0A CN201610652783A CN107723766A CN 107723766 A CN107723766 A CN 107723766A CN 201610652783 A CN201610652783 A CN 201610652783A CN 107723766 A CN107723766 A CN 107723766A
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- Prior art keywords
- circuit board
- flexible circuit
- volume
- negative electrode
- groove
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- 238000007747 plating Methods 0.000 title claims abstract description 65
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 59
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 59
- 239000010949 copper Substances 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000009713 electroplating Methods 0.000 title abstract description 9
- 238000007599 discharging Methods 0.000 claims abstract description 46
- 238000004140 cleaning Methods 0.000 claims abstract description 26
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 24
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000003491 array Methods 0.000 claims abstract description 12
- 239000011248 coating agent Substances 0.000 claims description 21
- 238000000576 coating method Methods 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 229910003455 mixed metal oxide Inorganic materials 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 238000001223 reverse osmosis Methods 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 4
- 229910021641 deionized water Inorganic materials 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 3
- 229940116318 copper carbonate Drugs 0.000 claims description 3
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 claims description 3
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 claims description 3
- 229910000457 iridium oxide Inorganic materials 0.000 claims description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 2
- 238000012545 processing Methods 0.000 description 8
- 230000008859 change Effects 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005518 electrochemistry Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910016553 CuOx Inorganic materials 0.000 description 1
- YJZATOSJMRIRIW-UHFFFAOYSA-N [Ir]=O Chemical compound [Ir]=O YJZATOSJMRIRIW-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- -1 polyethylene Terephthalate Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention provides a kind of two-sided electrolytic copper plating device of volume to volume for flexible circuit board and its copper electroplating method, and electrolytic copper plating assembling device includes a plating module, and it includes a U-type groove, is arranged in plating module, and have a feeding mouth and a discharging opening；Multiple rollers, are arranged in U-type groove, a mobile flexible circuit board；Multiple non-solubility anodes, are arranged on the inwall of U-type groove；Multiple nozzle arrays, it is arranged on multiple non-solubility anodes；And a copper ion sensor, it is arranged in U-type groove, and produce a sensing value；One pan feeding cleaning groove, is arranged at the feeding mouth of U-type groove, and moves in the horizontal direction in flexible circuit board to feeding mouth；And the clean groove of discharging, the discharging opening of U-type groove is arranged at, and flexible circuit board is removed by discharging opening in the horizontal direction.
Description
Technical field
The present invention relates to a kind of electrolytic copper plating device and its copper electroplating method, espespecially a kind of volume to volume for flexible circuit board
Two-sided electrolytic copper plating device and its copper electroplating method.
Background technology
19th century mid-term, countries in the world economy and industry are in high speed development, industrial in machinery, automobile, shipbuilding, aircraft etc.
Manufacture in evolution, various improvement mechanical strengths for product surface, decoration or the treatable demand of other particularity by
Gradually emerge table top, then, Englishman and Russian separately design metal plating method, and with electrochemistry
(electrochemistry) theoretical maturation, electroplating principle are gradually understood by common people with method and extend to the whole world.19
Latter stage in century, it has been found that, can be in glass container inwall after silver nitrate solution and sodium hydroxide, ammoniacal liquor and aldehyde radical substance reaction
The a thin layer of argent of upper formation, and one minute surface of composition, i.e. silver mirror effect (silver mirror reaction), trigger people
Start to inquire into the method and technology of the enterprising row metal plated film of non-metallic material.
To twentieth century initial stage, the development of petrochemical industry and plastics industry drives the birth of various plastic product, people for
Also film develops industrywide standard to the enterprising row metal plating of plastic material.Such as the soft flat electricity that electronics applications field is commonly used
Flexible optoelectronic plate on cable and display, metallic finger electrode thereon is typically to electroplate the conduction such as copper with chemical electrolysis
The mode of good metal is completed, and the plating mode of most traditional flexible optoelectronic plate is to use rectilinear galvanoplastic, and cost is low
It is increasing however as required photoelectricity board size and speed is fast, it can be drawn using rectilinear galvanoplastic by the earth's core of the earth
The influence of power, and so that the thickness of electrode uniformity plated on electro-optical package is bad, later people develop the plating of horizontal
Method, it conveys therefore not influenceed by gravitational in a horizontal manner.
However, because large scale has surface tension is uneven to wait other problemses, therefore the electricity of maintenance levels formula galvanoplastic
Coating apparatus needs higher cost, in addition, horizontal galvanoplastic are difficult to ensure that coating film thickness all phases in electro-optical package opposing sides
Together, during and for that need to carry out double-sided coating, coating speed will be difficult to be lifted with quality.
It is therefore proposed that a kind of two-sided electrolytic copper plating device of volume to volume for flexible circuit board and its film plating process, its with
The transmission mode of whole volume to volume (roll-to-roll), flexible circuit board is lifted in the speed of two-sided electrolytic copper plating processing procedure, and
It is able to ensure that plated film has uniform coating film thickness and good quality during processing procedure, actually current all circles desire most ardently the skill of solution
Art problem.
The content of the invention
In view of the shortcomings that foregoing prior art, the main object of the present invention is to provide a kind of volume for flexible circuit board
To rolling up two-sided electrolytic copper plating device, it can lift flexible circuit board with whole volume to volume (roll-to-roll) transmission mode
In the speed of two-sided electrolytic copper plating processing procedure, and it is able to ensure that plated film has uniform coating film thickness during processing procedure, to reach quick
Production and the good purpose of coating quality.
In order to reach object defined above and other purposes, the two-sided electrolytic copper plating of the volume to volume for flexible circuit board of the invention
Device includes：One plating module, including：One U-type groove, it is arranged in the plating module, and with a feeding mouth and a discharging
Mouthful；Multiple rollers, it is arranged in the U-type groove, and a mobile flexible circuit board；Multiple non-solubility anodes, are arranged at the U
On the inwall of type groove；Multiple nozzle arrays, it is arranged on the multiple non-solubility anode；And a copper ion sensor, if
It is placed in the U-type groove, and produces a sensing value；One pan feeding cleaning groove, the feeding mouth of the U-type groove is arranged at, and with one
First negative electrode roller and the one second negative electrode roller opposite with the rotating direction of the first negative electrode roller, wherein, described
One negative electrode roller is juxtaposed in the pan feeding cleaning groove with the second negative electrode roller, and is moved in the horizontal direction described soft
Property circuit board to the feeding mouth in, wherein, the first negative electrode roller contacts the upper surface of the flexible circuit board, described the
Two negative electrode rollers contact the lower surface of the flexible circuit board；And the clean groove of discharging, it is arranged at the discharging of the U-type groove
Mouthful, and there is one the 3rd negative electrode roller and the one fourth negative electrode roller opposite with the rotating direction of the 3rd negative electrode roller,
Wherein, the 3rd negative electrode roller and the 4th negative electrode roller are juxtaposed in the clean groove of discharging, and by it is described go out
Material mouth removes the flexible circuit board in the horizontal direction, and the 3rd negative electrode roller contacts the upper surface of the flexible circuit board,
The 4th negative electrode roller contacts the lower surface of the flexible circuit board.
It is preferred that the multiple non-solubility anode is a mixed-metal oxides MMO, it is applied by a titanium wicking surface
Cover iridium oxide and form.
It is preferred that the two-sided electrolytic copper plating device of the volume to volume for flexible circuit board of the present invention also includes a reverse osmosis RO
Pure water device, it is connected to the pan feeding cleaning groove and/or the clean groove of discharging.
Produced it is preferred that the two-sided electrolytic copper plating device of the volume to volume for flexible circuit board of the present invention also includes a copper ion
Raw device, the copper ion sensor is connected to, and an at least copper ion is inputted into the U-type groove according to the sensing value.
It is preferred that the copper ion generator includes copper monoxide decomposer, a copper carbonate decomposer and a sulfuric acid
One or more of copper decomposer.
It is preferred that the flexible circuit board is made up of polyimides PI and/or PET PET.
It is preferred that the two-sided electrolytic copper plating device of the volume to volume for flexible circuit board of the present invention also includes an at least servo
Motor, the feeding mouth of the plating module and/or the discharging opening are arranged at, with the movement flexible circuit board.
It is preferred that copper-bath is provided with the U-type groove, the pan feeding cleaning groove and/or the clean groove of discharging
It is provided with deionized water.
It is preferred that the bottom of the U-type groove, which is provided with two, helps Pu.
It is by the pan feeding in the two-sided electrolytic copper plating device of the volume to volume for flexible circuit board of the use present invention
The first negative electrode roller of clean groove and the second negative electrode roller move the flexible circuit board in the horizontal direction, with cleaning
The upper surface and lower surface of the flexible circuit board；Then, the flexible circuit board is moved to institute by the pan feeding cleaning groove
State in the feeding mouth of U-type groove, the flexible circuit board is moved vertically down, and it is described U-shaped by being arranged at
Multiple nozzle arrays on the multiple non-solubility anode in groove carry out copper coating step to the flexible circuit board；It is described soft
Property circuit board after the U-type groove is entered, the flexible circuit board is vertically moved up, it is described by being arranged at
The multiple nozzle array on the multiple non-solubility anode in U-type groove carries out copper facing step to the flexible circuit board
Suddenly, and by the flexible circuit board by the discharging opening of the U-type groove it is moved in the clean groove of discharging；Finally, pass through
The 3rd negative electrode roller and the 4th negative electrode roller of the clean groove of discharging move the flexible circuit in the horizontal direction
Plate, with the upper surface and lower surface of the clean flexible circuit board.
Because the present invention is to use to combine horizontal and rectilinear combined type (hybrid) process apparatus, the multiple spray
The design of mouth array and the U-type groove can allow plated film to be influenceed to be preferably minimized by gravitational while processing procedure speed is taken into account,
And the uniformity of coating film thickness can be taken into account, in addition, the electric polarity of negative electrode is multiple negative electrode rollers progress with the clean groove that enters, discharges
Connect and match somebody with somebody, can simplify and reduce the volume of electroplanting device；Therefore, the present invention can reach quick production and the good purpose of coating quality.
In view of the shortcomings that foregoing prior art, it is a further object of the present invention to provide a kind of volume for flexible circuit board
To rolling up two-sided electrolytic copper plating process, it can lift flexible circuit board with whole volume to volume (roll-to-roll) transmission mode
In the speed of two-sided electrolytic copper plating processing procedure, and be able to ensure that plated film has uniform coating film thickness during processing procedure, with reach it is low into
Originally, quick and environmentally friendly purpose.
In order to reach object defined above and other purposes, the two-sided electrolytic copper plating of the volume to volume for flexible circuit board of the invention
Method comprises the following steps：One pan feeding clean operation, pass through the one first negative electrode roller and one second negative electrode of a pan feeding cleaning groove
Roller moves a flexible circuit board in the horizontal direction, with the upper surface and lower surface of the clean flexible circuit board；One is electric downwards
Step is plated, the flexible circuit board is moved in a feeding mouth of a U-type groove by the pan feeding cleaning groove, makes the soft electricity
Road plate moves vertically down, and multiple nozzles by being arranged on multiple non-solubility anodes in the U-type groove
Array carries out copper coating step to the flexible circuit board；One electroplated up step, make the flexible circuit board vertically to
Upper movement, by being arranged at the multiple nozzle array on the multiple non-solubility anode in the U-type groove to described
Flexible circuit board carries out copper coating step, and it is clean that by a discharging opening of the U-type groove flexible circuit board is moved into a discharging
In net groove；And a discharging clean operation, pass through one the 3rd negative electrode roller and one the 4th negative electrode roller of the clean groove of the discharging
The flexible circuit board is moved in the horizontal direction, with the upper surface and lower surface of the clean flexible circuit board.
Brief description of the drawings
Fig. 1 is an embodiment of the two-sided electrolytic copper plating device of volume to volume for being used for flexible circuit board according to the present invention, is shown
The structural representation of one plating module of the two-sided electrolytic copper plating device of volume to volume；
Fig. 2 is the embodiment for the two-sided electrolytic copper plating device of volume to volume for being used for flexible circuit board according to the present invention, is shown
Show and use schematic diagram during multigroup concatenation of the two-sided electrolytic copper plating device of the volume to volume；
Fig. 3 is the embodiment for the two-sided electrolytic copper plating device of volume to volume for being used for flexible circuit board according to the present invention, is shown
Show the overlooking the structure diagram of the two-sided electrolytic copper plating device of the volume to volume；
Fig. 4 is the embodiment for the two-sided electrolytic copper plating device of volume to volume for being used for flexible circuit board according to the present invention, is shown
Show to obtain the external circuit connection diagram of the two-sided electrolytic copper plating device of volume to volume；
Fig. 5 is an embodiment of the two-sided electrolytic copper plating process of volume to volume for being used for flexible circuit board according to the present invention, is shown
The process step schematic diagram of the two-sided electrolytic copper plating process of volume to volume.
Description of reference numerals：
10- electroplates module；11-U type grooves；111- feeding mouths；112- discharging openings；12- rollers；120- flexible circuit boards；13-
Non-solubility anode；131- anode gauze filters；14- nozzle arrays；15- copper ion sensors；150- copper ion generators；
16- helps Pu；20- pan feeding cleaning grooves；21- the first negative electrode rollers；22- the second negative electrode rollers；The clean groove of 30- dischargings；31- the 3rd is cloudy
Pole roller；The negative electrode rollers of 32- the 4th；40- servo motors；50- reverse osmosis pure water devices.
Embodiment
It is that embodiments of the present invention are illustrated by particular specific embodiment below, people skilled in the art can be by this
Content disclosed in specification understands other advantages and effect of the present invention easily.The present invention can also pass through other different tools
Body example is implemented or applied, and every details in description of the invention can also be based on different viewpoints and apply do not departing from this
Various modifications and change are carried out under the spirit of invention.
It should be clear that structure, ratio, size etc. that this specification institute accompanying drawings illustrate, only coordinating disclosed in specification
Content, so that people skilled in the art understands and reads, be not limited to the enforceable qualifications of the present invention, therefore not
Have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size, do not influenceing institute of the present invention
Under the effect of producing and the purpose that can reach, it all should fall and obtain the scope that can cover in disclosed technology contents
It is interior.
Based on the following one embodiment of the invention, description one is used for the two-sided electrolytic copper plating device of volume to volume of flexible circuit board
And its copper electroplating method.
Refer to shown in Fig. 1 to Fig. 4, the two-sided electrolytic copper plating device bag of the volume to volume for flexible circuit board of the invention
Include：One plating module 10, a pan feeding cleaning groove 20 and a clean groove 30 of discharging.
Electroplating module 10 includes a U-type groove 11, multiple rollers 12, multiple non-solubility anodes 13, multiple nozzle arrays 14
An and copper ion sensor 15.Wherein, U-type groove 11 is arranged in plating module 10, and has a feeding mouth 111 and a discharging opening
112, feeding mouth 111 is delivered in plating module 10 to be intended to plate material, and discharging opening 112 is output in electricity will plate finished product
Plate outside module 10；According to embodiments of the invention, copper-bath is provided with U-type groove 11.
Multiple rollers 12 are arranged in U-type groove 11, and a mobile flexible circuit board 120, soft according to embodiments of the invention
Property circuit board 120 is polyimides (polyimide, PI) and/or PET (polyethylene
Terephthalate, PET) formed, flexible circuit board 120 and is moved by the rotation of multiple rollers 12 in U-type groove.
Multiple non-solubility anodes 13 are arranged on the inwall of U-type groove 11；According to embodiments of the invention, it is each it is multiple it is non-can
Dissolubility anode 13 is a mixed-metal oxides (mixed metal oxide, MMO), and it is by a titanium core (titanium)
Surface coats 10~12g/m2Iridium oxide (IrO2) and form, in an embodiment of the present invention, each multiple non-solubility anodes
13 also include an anode gauze filter (anode mask filter) 131, and it can be by an at least titanium basket (titanium
Baskets) formed, the particulate such as the oxide pollution flexible circuit board of multiple non-solubility anodes 13 during preventing plating
The particulates such as oxide caused by 120 pollute flexible circuit board 120.
Multiple nozzle arrays 14 are arranged on multiple non-solubility anodes 13, it is had together with multiple non-solubility anodes 13
The electric polarity of sample；According to embodiments of the invention, multiple nozzle arrays 14 are made up of 200 halberd shape nozzles, are in soft electricity
Road plate 120 input U-type groove 11 with output U-type groove when in vertical direction during, multiple nozzle arrays 14 are to flexible circuit board 120
Carry out two-sided copper-containing substance spraying plating.
Copper ion sensor 15 is arranged in U-type groove 11, and whether the copper ion concentration to sense in U-type groove 11 falls within just
Within the category of constant value, and produce a sensing value；According to embodiments of the invention, in addition to a copper ion generator 150, copper
Ion generator 150 is connected to copper ion sensor 15, and according to copper ion sensor 15 a sensing value input at least bronze medal from
Son the copper ion of electroplate liquid consume during supplementing plating, makes the copper ion concentration in U-type groove 11 stable into U-type groove 11, with
Safeguard the quality during continuous coating；Wherein, copper ion generator 150 may include copper monoxide decomposer, a copper carbonate point
One or more of device and a copper sulphate decomposer are solved, in an embodiment of the present invention, copper ion generator 150 is oxygen
Change copper (CuOx) decomposer.
According to embodiments of the invention, the bottom of U-type groove 11 is provided with two and helps Pu 16, and two to help Pu 16 to be respectively arranged at U-shaped
The relative corner of the bottom of groove 11, the particulate such as the oxide pollution flexible circuit of multiple non-solubility anodes 13 during preventing plating
Plate 120.
According to embodiments of the invention, pan feeding cleaning groove 20 is arranged at the feeding mouth 111 of U-type groove 11, and with one first
Negative electrode roller 21 and the one second negative electrode roller 22 opposite with the rotating direction of the first negative electrode roller 21, wherein, the first negative electrode
The negative electrode roller 22 of roller 21 and second is juxtaposed in pan feeding cleaning groove 20, and moves flexible circuit board 120 in the horizontal direction
To feeding mouth 111, wherein, the first negative electrode roller 21 contacts the upper surface of flexible circuit board 120, and the second negative electrode roller 22 contacts
The lower surface of flexible circuit board 120, to the upper and lower surface of clean not copper-plated flexible circuit board 120, and make flexible circuit board
120 carry and the first negative electrode roller 21, the identical electric polarity of the second negative electrode roller 22.
According to embodiments of the invention, the clean groove 30 that discharges is arranged at the discharging opening 112 of U-type groove 11, and with one the 3rd
Negative electrode roller 31 and the one fourth negative electrode roller 42 opposite with the rotating direction of the 3rd negative electrode roller 31, wherein, the 3rd negative electrode
The negative electrode roller 32 of roller 31 and the 4th is juxtaposed in the clean groove 30 of discharging, and is removed in the horizontal direction by discharging opening 112 soft
Property circuit board 120, wherein, the 3rd negative electrode roller 31 contact flexible circuit board 120 upper surface, the 4th negative electrode roller 32 contacts soft
Property circuit board 120 lower surface, to the upper and lower surface of clean copper-plated flexible circuit board 120, and make flexible circuit board
120 carry and the 3rd negative electrode roller 31, the identical electric polarity of the 4th negative electrode roller 32.
According to embodiments of the invention, in addition to an at least servo motor 40 and a reverse osmosis (reverse osmosis,
RO) pure water device 50, at least a servo motor 40 are arranged at the feeding mouth 111 and/or discharging opening 112 of plating module 10, and use
To move flexible circuit board 120；Reverse osmosis pure water device 50 is connected to pan feeding cleaning groove 20 and/or the clean groove 30 of discharging, at this
In the embodiment of invention, pan feeding cleaning groove 20 and/or the clean groove 30 of discharging are provided with deionized water, and reverse osmosis pure water device 50 is used
Persistently to supply deionized water to pan feeding cleaning groove 20 and/or the clean groove 30 of discharging, to safeguard clean efficiency and coating quality.
Refer to shown in Fig. 5, in the two-sided electrolytic copper plating device of the volume to volume for flexible circuit board of the use present invention,
Also comprise the following steps：One pan feeding clean operation S1, the first negative electrode roller and the second negative electrode roller edge by pan feeding cleaning groove
Horizontal direction moves flexible circuit board, with the upper surface and lower surface of clean flexible circuit board；One downward plating step S2, will be soft
Property circuit board be moved to by pan feeding cleaning groove in the feeding mouth of U-type groove, flexible circuit board is moved vertically down, and logical
The multiple nozzle arrays crossed on the multiple non-solubility anodes being arranged in U-type groove carry out copper coating step to flexible circuit board；One
Electroplated up step S3, makes flexible circuit board vertically move up, and passes through the multiple non-solubilities being arranged in U-type groove
Multiple nozzle arrays on anode carry out copper coating step to flexible circuit board, and flexible circuit board is moved by the discharging opening of U-type groove
Move to discharging in clean groove；And one discharging clean operation S4, pass through the 3rd negative electrode roller and the 4th negative electrode of the clean groove that discharges
Roller moves flexible circuit board in the horizontal direction, with the upper surface and lower surface of clean flexible circuit board.
In the practical operation present invention, multigroup equipment can be continuously concatenated on demand to carry out continuous coating operation, referred to
Shown in Fig. 2.
Because the present invention is to use to combine horizontal and rectilinear combined type (hybrid) process apparatus, multiple nozzle numbers
The design of group 14 and U-type groove 11 can allow plated film to be influenceed to be preferably minimized by gravitational while processing procedure speed is taken into account, and can
The uniformity of coating film thickness is taken into account, in addition, the electric polarity of negative electrode is with multiple negative electrodes of pan feeding cleaning groove 20, the clean groove 30 of discharging
Roller connect matching somebody with somebody, and can simplify and reduce the volume of electroplanting device；And the bottom of U-type groove 11 set two help Pu 16 and each more
Individual non-solubility anode 13 also includes the oxidation of multiple non-solubility anodes 13 when an anode gauze filter 131 can prevent from electroplating
The particulate pollution flexible circuit board 120 such as oxide caused by the particulates such as thing pollution flexible circuit board 120；Therefore, the present invention is reachable
To the purpose quickly produced and coating quality is good.
Although embodiment is described with reference to many illustrative embodiments of the application, however, it should be noted that this area
Technical staff it is conceivable that various other changes and embodiment, these change and embodiment will fall into the spirit of disclosure principle with
In the range of.Especially, in the range of the disclosure, schema and appended claim, the composition set is combined to theme
Partly and/or setting can various changes can be made and modification.In addition to the change and modification made to part and/or setting,
Alternative purposes will be apparent to those skilled in the art.
Claims (10)
- A kind of 1. two-sided electrolytic copper plating device of volume to volume for flexible circuit board, it is characterised in that including：One plating module, including：One U-type groove, it is arranged in the plating module, and there is a feeding mouth and a discharging opening；Multiple rollers, it is arranged in the U-type groove, and a mobile flexible circuit board；Multiple non-solubility anodes, are arranged on the inwall of the U-type groove；Multiple nozzle arrays, it is arranged on the multiple non-solubility anode；AndOne copper ion sensor, it is arranged in the U-type groove, and produces a sensing value；One pan feeding cleaning groove, is arranged at the feeding mouth of the U-type groove, and with one first negative electrode roller and with it is described first cloudy One second opposite negative electrode roller of the rotating direction of pole roller, wherein, the first negative electrode roller and the second negative electrode roller It is juxtaposed in the pan feeding cleaning groove, and moves in the horizontal direction in the flexible circuit board to the feeding mouth, wherein, The first negative electrode roller contacts the upper surface of the flexible circuit board, and the second negative electrode roller contacts the flexible circuit board Lower surface；AndThe one clean groove of discharging, is arranged at the discharging opening of the U-type groove, and with one the 3rd negative electrode roller and with it is the described 3rd cloudy One the 4th opposite negative electrode roller of the rotating direction of pole roller, wherein, the 3rd negative electrode roller and the 4th negative electrode roller It is juxtaposed in the clean groove of the discharging, and the flexible circuit board is removed by the discharging opening in the horizontal direction, described the Three negative electrode rollers contact the upper surface of the flexible circuit board, and the 4th negative electrode roller contacts the following table of the flexible circuit board Face.
- 2. it is used for the two-sided electrolytic copper plating device of volume to volume of flexible circuit board as claimed in claim 1, it is characterised in that described Multiple non-solubility anodes are a mixed-metal oxides MMO, and it is coated iridium oxide by a titanium wicking surface and formed.
- 3. it is used for the two-sided electrolytic copper plating device of volume to volume of flexible circuit board as claimed in claim 1, it is characterised in that also wrap A reverse osmosis RO pure water devices are included, are connected to the pan feeding cleaning groove and/or the clean groove of discharging.
- 4. it is used for the two-sided electrolytic copper plating device of volume to volume of flexible circuit board as claimed in claim 1, it is characterised in that also wrap A copper ion generator is included, is connected to the copper ion sensor, and an at least copper ion is inputted to institute according to the sensing value State in U-type groove.
- 5. it is used for the two-sided electrolytic copper plating device of volume to volume of flexible circuit board as claimed in claim 4, it is characterised in that described Copper ion generator include one of copper monoxide decomposer, a copper carbonate decomposer and a copper sulphate decomposer or More persons.
- 6. it is used for the two-sided electrolytic copper plating device of volume to volume of flexible circuit board as claimed in claim 1, it is characterised in that described Flexible circuit board is made up of polyimides PI and/or PET PET.
- 7. it is used for the two-sided electrolytic copper plating device of volume to volume of flexible circuit board as claimed in claim 1, it is characterised in that also wrap An at least servo motor is included, is arranged at the feeding mouth of the plating module and/or the discharging opening, it is described soft with movement Circuit board.
- 8. it is used for the two-sided electrolytic copper plating device of volume to volume of flexible circuit board as claimed in claim 1, it is characterised in that described Copper-bath is provided with U-type groove, the pan feeding cleaning groove and/or the clean groove of discharging are provided with deionized water.
- 9. it is used for the two-sided electrolytic copper plating device of volume to volume of flexible circuit board as claimed in claim 1, it is characterised in that described The bottom of U-type groove is provided with two and helps Pu.
- 10. the two-sided electrolytic copper plating process of a kind of volume to volume for flexible circuit board, it is characterised in that comprise the following steps：One pan feeding clean operation, by one first negative electrode roller of a pan feeding cleaning groove and one second negative electrode roller in the horizontal direction A mobile flexible circuit board, with the upper surface and lower surface of the clean flexible circuit board；One downward plating step, the flexible circuit board is moved in a feeding mouth of a U-type groove by the pan feeding cleaning groove, The flexible circuit board is set to move vertically down, and multiple non-solubility anodes by being arranged in the U-type groove On multiple nozzle arrays to the flexible circuit board carry out copper facing；One electroplated up step, makes the flexible circuit board vertically move up, by being arranged in the U-type groove The multiple nozzle array on the multiple non-solubility anode carries out copper coating step to the flexible circuit board, and by described in Flexible circuit board is moved in a discharging cleaning groove by a discharging opening of the U-type groove；AndOne discharging clean operation, one the 3rd negative electrode roller and one the 4th negative electrode roller edge level side by the clean groove of discharging To the movement flexible circuit board, with the upper surface and lower surface of the clean flexible circuit board.
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|---|---|---|---|
| CN201610652783.0A CN107723766A (en) | 2016-08-10 | 2016-08-10 | The two-sided electrolytic copper plating device of volume to volume and its copper electroplating method for flexible circuit board |
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| CN201610652783.0A CN107723766A (en) | 2016-08-10 | 2016-08-10 | The two-sided electrolytic copper plating device of volume to volume and its copper electroplating method for flexible circuit board |
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| CN108893768A (en) * | 2018-07-03 | 2018-11-27 | 林显美 | A kind of electroplating device for soft double-sided wiring board |
| CN110366320A (en) * | 2019-08-19 | 2019-10-22 | 江苏上达电子有限公司 | Copper plating device and method for improving warping of flexible circuit board |
| TWI687360B (en) * | 2019-06-26 | 2020-03-11 | 台郡科技股份有限公司 | Vertical roll-to-roll wet process transmission equipment |
| CN114934308A (en) * | 2022-06-30 | 2022-08-23 | 东部超导科技（苏州）有限公司 | Device and method for electroplating copper on high-temperature superconducting strip based on non-soluble anode |
| CN115161734A (en) * | 2022-02-07 | 2022-10-11 | 昆山鑫美源电子科技有限公司 | A kind of continuous coating equipment and continuous coating method |
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| CN114934308A (en) * | 2022-06-30 | 2022-08-23 | 东部超导科技（苏州）有限公司 | Device and method for electroplating copper on high-temperature superconducting strip based on non-soluble anode |
| CN114934308B (en) * | 2022-06-30 | 2024-03-26 | 东部超导科技（苏州）有限公司 | High-temperature superconducting strip copper electroplating device and method based on insoluble anode |
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