CN107656599A - A kind of computer radiator - Google Patents
A kind of computer radiator Download PDFInfo
- Publication number
- CN107656599A CN107656599A CN201710835457.8A CN201710835457A CN107656599A CN 107656599 A CN107656599 A CN 107656599A CN 201710835457 A CN201710835457 A CN 201710835457A CN 107656599 A CN107656599 A CN 107656599A
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- Prior art keywords
- heat
- fin
- dissipating layer
- emission hole
- heat dissipating
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of computer radiator, radiating matrix including heat-radiating substrate, installed in the heat-radiating substrate upper end, polylith fin has been evenly arranged on the radiating matrix, graphene heat dissipating layer is provided with the left surface of the fin, spinning heat dissipating layer is provided with the right flank of the fin, and the first heat emission hole and the second heat emission hole are machined with every piece of fin, and first heat emission hole and the second heat emission hole run through graphene heat dissipating layer and spinning heat dissipating layer.Fin is arranged in parallel on radiating matrix, can increase the contact area of fin and air, increase cooling surface area, by being machined with the first heat emission hole and the second heat emission hole on a heat sink, can further improve radiating effect；By being provided with graphene heat dissipating layer, the radiating rate of fin is improved, by being provided with spinning heat dissipating layer, further improves heat dispersion.
Description
Technical field
The present invention relates to computer technical field of heat dissipation, more particularly to a kind of computer radiator.
Background technology
Radiator is all radiated using heat transfer, thermal convection current as major way at present.According to heat transfer, thermal convection current means
Difference, radiator product can be divided into active and passive two ways.Active is meant that there is the energy unrelated with heater
Participate in carrying out forced heat radiation, for example, fan, liquid it is cold in water pump, the compressor in freezing by change of state, these heat dissipations it is universal
Feature is efficiency high, but is also required to the auxiliary of other energy simultaneously.In contrast, it is exactly passively to only rely on heater or fin
Voluntarily diverging cooled.Heat can be produced in the CPU of computer and other parts at high speeds operation process, is radiated in fact just
It is the process of a heat transfer, it is therefore an objective to heat caused by CPU is taken on other media, cpu temperature control is steady at one
Within the scope of fixed.The environment lived according to us, CPU heat is finally among air to be diffused to, and this process is exactly electricity
Brain radiates.
In host computer radiation processes, often CPU is radiated using to fin, at present, conventional computer
The material of fin is copper and aluminium alloy, and the two respectively has its advantage and disadvantage.Good (the thermal conductivity factor 401W/m of copper of the thermal conductivity of copper
K), but expensive, difficulty of processing is higher, and weight is excessive (many fine copper radiators have been above limitations of the CPU to weight), heat
Capacity is smaller, and easily aoxidizes.In addition when copper once aoxidizes, its heat dispersion and life-span will be greatly reduced.It is and pure
Aluminium is too soft, it is impossible to directly uses, is all that the aluminium alloy used could provide enough hardness, is that price is low the advantages of aluminium alloy
It is honest and clean, it is in light weight, but its thermal conductivity (the thermal conductivity factor 237W/mK of aluminium) will be far short of what is expected than copper.Current computer radiator is led
Hot property is poor, radiating effect is bad, needs further to be improved.
The content of the invention
The present invention is in order to overcome deficiency of the prior art, there is provided a kind of computer radiator.
The present invention is to be achieved through the following technical solutions：
A kind of computer radiator, including heat-radiating substrate, the radiating matrix installed in the heat-radiating substrate upper end, dissipated described
Polylith fin has been evenly arranged on hot radical block, graphene heat dissipating layer has been provided with the left surface of the fin, described
Spinning heat dissipating layer is provided with the right flank of fin, and the first heat emission hole and the second radiating are machined with every piece of fin
Hole, and first heat emission hole and the second heat emission hole run through graphene heat dissipating layer and spinning heat dissipating layer.
Further, the graphene heat dissipating layer includes the composition of following mass parts：Graphene：Bonding agent：Solvent：Surface
Activating agent：Defoamer=20~30：1~3：40~80：1~3：5~10.
Further, the bonding agent is the diglycidyl ether of bisphenol-A, and the solvent is acetate mixture, described
Acetate mixture is 2- butoxy acetic acid ethyl esters, dimethyl ethylene glycol monobutyl ether ester, n-butyl acetate mixture, institute
State surfactant for Sodium Polyacrylate, neopelex, sodium alginate, sodium carboxymethylcellulose, odium stearate and
One kind in sodium cetanesulfonate, the defoamer are in benzyl carbinol oleate, dimethicone and dimethyl silicone polymer
One kind.
Further, the spinning heat dissipating layer is that the spinning mixed by polymer substance, conduction material and solvent is molten
Liquid is carried out made of Electrospun, and is arranged on by adhesive linkage on the right flank of the fin.
Further, the polymer substance is combined by boron nitride, silicon nitride and alumina substrate.
Further, the conduction material is conductive metal, conductibility carbon, conductive carbon, CNT, conductibility
One kind in polymer.
Further, the fin is made up of aluminum alloy materials, the aluminium alloy include aluminium, magnesium, zinc, copper, boron, nickel,
Manganese, chromium material, and formed according to following parts by weight, aluminium：Magnesium：Zinc：Copper：Boron：Nickel：Manganese：Chromium=60~80：10~20：10~20：
10~20：5~10：1~2：1~2：1~2.
Further, the radiating matrix is by any one material system in copper, aluminium, silver, nickel, tin, zinc, magnesium, tungsten, iron
Into.
Further, the heat-radiating substrate is made of insulating heat-conduction material.
Further, the thickness of the graphene heat dissipating layer is 30-100 μm, and the thickness of the spinning heat dissipating layer is 30-
100 μm, the diameter of first heat emission hole and the second heat emission hole is identical.
Compared with prior art, the beneficial effects of the invention are as follows：In the use of the present invention, heat-radiating substrate is arranged on electricity
Intracerebral, radiating matrix is arranged on heat-radiating substrate, and fin is arranged on radiating matrix, fin is arranged in parallel
On radiating matrix, the contact area of fin and air can be increased, increase cooling surface area, enable heat caused by computer
It is enough to be delivered in time in outside air；, can be further by being machined with the first heat emission hole and the second heat emission hole on a heat sink
Improve radiating effect in ground；By being provided with graphene heat dissipating layer, using the high thermal conductivity of graphene, heat can be rapidly along stone
Black alkene film carries out face transmission, and is delivered to inside fin rapidly, shortens heat-conducting interface material or heater members to dissipating
Time needed for backing heat transfer, the radiating rate of fin is improved, so as to reduce the temperature of computer；By being provided with spinning
Heat dissipating layer, net form state is made using Electrospun, so as to improve punching, and can further improve thermal diffusivity
Energy.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the sectional view of fin in the present invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Refer to Fig. 1 and Fig. 2, a kind of computer radiator of the invention, including heat-radiating substrate 1, installed in the radiating base
The radiating matrix 2 of the upper end of plate 1, polylith fin 3 is evenly arranged on radiating matrix 2, has been set on the left surface of fin 3
There is graphene heat dissipating layer 4, spinning heat dissipating layer 5 is provided with the right flank of fin, and is machined with every piece of fin 3
One heat emission hole 6 and the second heat emission hole 7, and the first heat emission hole 6 and the second heat emission hole 7 run through graphene heat dissipating layer 4 and spinning
Heat dissipating layer 5.When in use, heat-radiating substrate 1 is arranged in computer, radiating matrix 2 is arranged on heat-radiating substrate 1, and will dissipated
Backing 3 is arranged on radiating matrix 2, and fin 3 is arranged in parallel on radiating matrix 2, can increase fin and air
Contact area, increase cooling surface area, heat caused by computer is delivered in time in outside air；By radiating
The first heat emission hole 6 and the second heat emission hole 7 are machined with piece 3, can further improve radiating effect.The graphene heat dissipating layer
4 thickness is 30-100 μm, and the thickness of the spinning heat dissipating layer 5 is 30-100 μm, the heat emission hole of the first heat emission hole 6 and second
7 diameter is identical.
Heat-radiating substrate 1 is made of insulating heat-conduction material, on the one hand can improve its insulating properties between computer components
Can, it on the other hand can will be delivered on radiating matrix 2 and fin 3 and be radiated.
Radiating matrix 2 is made up of any one material in copper, aluminium, silver, nickel, tin, zinc, magnesium, tungsten, iron, can be according to need
Carry out selection use.
Fin 3 is made up of aluminum alloy materials, aluminium alloy include aluminium, magnesium, zinc, copper, boron, nickel, manganese, chromium material, and according to
Following parts by weight are formed, aluminium：Magnesium：Zinc：Copper：Boron：Nickel：Manganese：Chromium=60~80：10~20：10~20：10~20：5~10：1~
2：1~2：1~2.The addition of boron can improve the intensity of aluminium alloy, improve the wetability of aluminium alloy, be advantageous to improve alloy
Cold-forming property.But when the content of boron is smaller, the increased effect of intensity is smaller, and when the content of boron is larger, then to aluminium alloy
Corrosion resistance have a negative impact.The addition of nickel can improve the intensity of alloy, and can improve the natural potential of alloy, one
Determine to improve the corrosion resistance of alloy in degree, particularly reduce the corrosion rate under hot conditions, but when nickel content is excessive, then can
The extrusion performance of alloy is influenceed, drops low-alloyed mobility.The addition of manganese can refining alloy particle, improve the intensity of alloy,
But when the content of manganese is larger, when being higher by its solubility in the alloy, then the extrusion performance of alloy can be influenceed, influence adding for alloy
Work performance.The addition of chromium can improve the intensity of alloy, particularly improve the intensity after artificial aging, but when chromium content is excessive,
The color and luster of alloy can be influenceed, alloy coloring effect is deteriorated.The addition of zinc can increase the mobility of alloy, and that improves alloy can
Processability.The addition of copper can increase the intensity of alloy, improve the heat-sinking capability of alloy, while improve the ductility of alloy,
But when copper content is excessive, then can have a negative impact to the corrosivity of alloy.The addition of magnesium can increase alloy heat conductivility.
Graphene heat dissipating layer 4 includes the composition of following mass parts：Graphene：Bonding agent：Solvent：Surfactant：Defoaming
Agent=20~30：1~3：40~80：1~3：5~10.The bonding agent is the diglycidyl ether of bisphenol-A, and the solvent is
Acetate mixture, acetate mixture be 2- butoxy acetic acid ethyl esters, dimethyl ethylene glycol monobutyl ether ester, acetic acid just
Butyl ester mixture, the surfactant are Sodium Polyacrylate, neopelex, sodium alginate, carboxymethyl cellulose
One kind in sodium, odium stearate and sodium cetanesulfonate, the defoamer are benzyl carbinol oleate, dimethicone and poly- two
One kind in methylsiloxane.
Spinning heat dissipating layer 5 is that the spinning solution mixed by polymer substance, conduction material and solvent carries out Electrospun
It is manufactured, and be arranged on by adhesive linkage on the right flank of fin 3, polymer substance is by boron nitride, silicon nitride and aluminum oxide
Matrix is combined, and conduction material is in conductive metal, conductibility carbon, conductive carbon, CNT, conducting polymer
One kind.
By being provided with graphene heat dissipating layer 4, using the high thermal conductivity of graphene, heat can be thin along graphene rapidly
Film carries out face transmission, and is delivered to inside fin rapidly, shortens heat-conducting interface material or heater members and is passed to fin
The heat required time, the radiating rate of fin is improved, so as to reduce the temperature of computer.
By being provided with spinning heat dissipating layer 5, net form state is made using Electrospun, so as to improve punching, and
Heat dispersion can further be improved.
In the present invention, unless otherwise clearly defined and limited, the term such as term " installation ", " setting " should do broad sense reason
Solution, for example, it may be being fixedly connected or being detachably connected, or is integrally connected；Can mechanically connect, for this
For the those of ordinary skill in field, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not directly to contact but pass through it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Sign is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
General principle, principal character and the advantages of the present invention of the present invention has been shown and described above.The technology of the industry
For personnel it should be appreciated that the present invention is not limited to the above embodiments, that described in above-described embodiment and specification is only the present invention
Preference, be not intended to limit the present invention, without departing from the spirit and scope of the present invention, the present invention also have it is various
Changes and improvements, these changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by institute
Attached claims and its equivalent thereof.
Claims (10)
- A kind of 1. computer radiator, it is characterised in that：Dissipating including heat-radiating substrate (1), installed in the heat-radiating substrate (1) upper end Hot radical block (2), polylith fin (3), the left surface in the fin (3) are evenly arranged on the radiating matrix (2) On be provided with graphene heat dissipating layer (4), be provided with spinning heat dissipating layer (5) on the right flank of the fin, and dissipate at every piece The first heat emission hole (6) and the second heat emission hole (7), and first heat emission hole (6) and the second heat emission hole are machined with backing (3) (7) graphene heat dissipating layer (4) and spinning heat dissipating layer (5) are run through.
- A kind of 2. computer radiator according to claim 1, it is characterised in that：The graphene heat dissipating layer (4) include with The composition of lower mass parts：Graphene：Bonding agent：Solvent：Surfactant：Defoamer=20~30：1~3：40~80：1~3： 5~10.
- A kind of 3. computer radiator according to claim 2, it is characterised in that：The bonding agent is two shrinks of bisphenol-A Glycerin ether, the solvent are acetate mixture, and the acetate mixture is 2- butoxy acetic acid ethyl esters, dimethyl second Glycol monobutyl ether-ether, n-butyl acetate mixture, the surfactant be Sodium Polyacrylate, neopelex, One kind in sodium alginate, sodium carboxymethylcellulose, odium stearate and sodium cetanesulfonate, the defoamer are benzyl carbinol oil One kind in acid esters, dimethicone and dimethyl silicone polymer.
- A kind of 4. computer radiator according to claim 1, it is characterised in that：The spinning heat dissipating layer (5) is by high score The spinning solution that sub- material, conduction material and solvent mix is carried out made of Electrospun, and is arranged on institute by adhesive linkage On the right flank for stating fin (3).
- A kind of 5. computer radiator according to claim 4, it is characterised in that：The polymer substance is by boron nitride, nitrogen SiClx and alumina substrate are combined.
- A kind of 6. computer radiator according to claim 5, it is characterised in that：The conduction material be conductive metal, One kind in conductibility carbon, conductive carbon, CNT, conducting polymer.
- A kind of 7. computer radiator according to claim 1, it is characterised in that：The fin (3) is by aluminum alloy materials It is made, the aluminium alloy includes aluminium, magnesium, zinc, copper, boron, nickel, manganese, chromium material, and is formed according to following parts by weight, aluminium：Magnesium：Zinc： Copper：Boron：Nickel：Manganese：Chromium=60~80：10~20：10~20：10~20：5~10：1~2：1~2：1~2.
- A kind of 8. computer radiator according to claim 1, it is characterised in that：It is described radiating matrix (2) by copper, aluminium, silver, Any one material in nickel, tin, zinc, magnesium, tungsten, iron is made.
- A kind of 9. computer radiator according to claim 1, it is characterised in that：The heat-radiating substrate (1) is led using insulation Hot material is made.
- A kind of 10. computer radiator according to claim 1, it is characterised in that：The thickness of the graphene heat dissipating layer (4) For 30-100 μm, the thickness of the spinning heat dissipating layer (5) is 30-100 μm, first heat emission hole (6) and the second heat emission hole (7) Diameter it is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710835457.8A CN107656599A (en) | 2017-09-15 | 2017-09-15 | A kind of computer radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710835457.8A CN107656599A (en) | 2017-09-15 | 2017-09-15 | A kind of computer radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107656599A true CN107656599A (en) | 2018-02-02 |
Family
ID=61130296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710835457.8A Pending CN107656599A (en) | 2017-09-15 | 2017-09-15 | A kind of computer radiator |
Country Status (1)
| Country | Link |
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| CN (1) | CN107656599A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118870744A (en) * | 2024-07-04 | 2024-10-29 | 东莞市铭瑞精密五金科技有限公司 | A nano heat sink |
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| US20070053166A1 (en) * | 2005-09-08 | 2007-03-08 | Industrial Technology Research Institute | Heat dissipation device and composite material with high thermal conductivity |
| CN102675824A (en) * | 2011-03-09 | 2012-09-19 | 财团法人工业技术研究院 | Insulating heat-conducting composition and electronic device |
| CN104520100A (en) * | 2012-08-06 | 2015-04-15 | 阿莫绿色技术有限公司 | Heat sink and preparation method thereof |
| CN204360312U (en) * | 2015-01-11 | 2015-05-27 | 泉州三欣新材料科技有限公司 | A kind of CPU heat abstractor with Graphene heat dissipating layer |
| CN104710912A (en) * | 2015-03-31 | 2015-06-17 | 东莞市闻誉实业有限公司 | heat sink |
| CN104964259A (en) * | 2015-05-15 | 2015-10-07 | 东莞市闻誉实业有限公司 | Heat radiator |
| CN105204597A (en) * | 2015-10-24 | 2015-12-30 | 唐玉敏 | CPU radiator |
-
2017
- 2017-09-15 CN CN201710835457.8A patent/CN107656599A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070053166A1 (en) * | 2005-09-08 | 2007-03-08 | Industrial Technology Research Institute | Heat dissipation device and composite material with high thermal conductivity |
| CN102675824A (en) * | 2011-03-09 | 2012-09-19 | 财团法人工业技术研究院 | Insulating heat-conducting composition and electronic device |
| CN104520100A (en) * | 2012-08-06 | 2015-04-15 | 阿莫绿色技术有限公司 | Heat sink and preparation method thereof |
| CN204360312U (en) * | 2015-01-11 | 2015-05-27 | 泉州三欣新材料科技有限公司 | A kind of CPU heat abstractor with Graphene heat dissipating layer |
| CN104710912A (en) * | 2015-03-31 | 2015-06-17 | 东莞市闻誉实业有限公司 | heat sink |
| CN104964259A (en) * | 2015-05-15 | 2015-10-07 | 东莞市闻誉实业有限公司 | Heat radiator |
| CN105204597A (en) * | 2015-10-24 | 2015-12-30 | 唐玉敏 | CPU radiator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118870744A (en) * | 2024-07-04 | 2024-10-29 | 东莞市铭瑞精密五金科技有限公司 | A nano heat sink |
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Application publication date: 20180202 |