CN107438007B - Circuit board assemblies and electronic equipment - Google Patents

Abstract

An embodiment of the present invention provides a circuit board assembly, including: the device comprises a substrate, a first port, a second port, a third port, a fourth port, a fifth port and a sixth port, wherein the substrate is provided with the first port, the second port, the third port, the fourth port, the fifth port and the sixth port; a first duplexer disposed on the substrate, the first duplexer having a first uplink port, a first downlink port, and a first common port, the first uplink port being connected to the first port, the first downlink port being connected to the second port, the first common port being connected to the third port; the second duplexer is arranged on the substrate and is provided with a second uplink port, a second downlink port and a second public port, the second uplink port is connected with the fourth port, the second downlink port is connected with the fifth port, and the second public port is connected with the sixth port.

Description

Circuit board assemblies and electronic equipment

technical field

The present invention relates to the field of communications, in particular to a circuit board assembly and electronic equipment.

Background technique

A conventional quadplexer typically includes two duplexers. Taking B1 and B3 quadrupole as an example, the antenna end (ANTport) is the common end of B1 and B3, carrying two radio frequency signals. In fact, the intermediate output is based on the two duplexers of B1 and B3. achieve the four functions.

Under normal circumstances, the insertion loss of the above-mentioned traditional quadplexer is more than 0.6db higher than that of the single-duplexer.

In order to be compatible with CA (Carrier Aggregation, carrier aggregation) and non-CA radio solutions, the traditional approach is to be compatible with quads and two duplexers. Quadruples are used to support CA, and quads are used to support non-CA. Diplexer. However, placing three devices in a PCB (Printed Circuit Board) at the same time takes up a lot of space.

Therefore, it is necessary to propose a new technical solution to solve the above-mentioned technical problems.

SUMMARY OF THE INVENTION

Embodiments of the present invention provide a circuit board assembly and an electronic device, which can save the layout space of the circuit board.

An embodiment of the present invention provides a circuit board assembly, including:

a substrate, the substrate is provided with a first port, a second port, a third port, a fourth port, a fifth port and a sixth port;

a first duplexer, the first duplexer is disposed on the substrate, the first duplexer has a first uplink port, a first downlink port and a first common port, the first uplink port a port is connected to the first port, the first downlink port is connected to the second port, and the first common port is connected to the third port;

a second duplexer, the second duplexer is disposed on the substrate, the second duplexer has a second upstream port, a second downstream port and a second common port, the second upstream port connected with the fourth port, the second downlink port is connected with the fifth port, and the second common port is connected with the sixth port;

The third port and the sixth port are selectively connected or disconnected.

An embodiment of the present invention provides an electronic device, including a casing and a circuit board assembly disposed in the casing, where the circuit board assembly is the circuit board assembly described in any one of the above.

The circuit board assembly provided by the present invention can reduce the layout space of the circuit board, and can realize the integrated setting of the quadplexer and the two-in-one duplexer.

Description of drawings

FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present invention.

FIG. 2 is a first structural schematic diagram of a circuit board assembly provided by an embodiment of the present invention.

FIG. 3 is a schematic diagram of a second structure of a circuit board assembly provided by an embodiment of the present invention.

FIG. 4 is a third structural schematic diagram of a circuit board assembly provided by an embodiment of the present invention.

FIG. 5 is a schematic diagram of a fourth structure of a circuit board assembly provided by an embodiment of the present invention.

FIG. 6 is a schematic diagram of a fifth structure of the circuit board assembly provided by the embodiment of the present invention.

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, only used to explain the present invention, and should not be construed as a limitation of the present invention.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc., or The positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as a limitation of the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as "first", "second" may expressly or implicitly include one or more of said features. In the description of the present invention, "plurality" means two or more, unless otherwise expressly and specifically defined.

In the description of the present invention, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relation. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

In the present invention, unless otherwise expressly specified and limited, a first feature "on" or "under" a second feature may include the first and second features in direct contact, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the invention. Furthermore, the present disclosure may repeat reference numerals and/or reference letters in different instances for the purpose of simplicity and clarity and not in itself indicative of a relationship between the various embodiments and/or arrangements discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

An embodiment of the present invention provides an electronic device. The electronic device may be a smartphone, a tablet computer, or the like. Referring to FIG. 1 , an electronic device 100 includes a cover plate 101 , a display screen 102 , a circuit board assembly 103 and a housing 104 .

The cover plate 101 is mounted on the display screen 102 to cover the display screen 102 . The cover plate 101 may be a transparent glass cover plate. In some embodiments, the cover plate 101 may be a glass cover plate made of a material such as sapphire.

The display screen 102 is mounted on the casing 104 to form a display surface of the electronic device 100 . The display screen 102 may include a display area 102A and a non-display area 102B. The display area 102A is used to display information such as images and texts. The non-display area 102B does not display information. The bottom of the non-display area 102B may be provided with functional components such as a fingerprint module, a touch control circuit, and the like.

The circuit board assembly 103 is mounted inside the housing 104 . The circuit board assembly 103 may be the main board of the electronic device 100 . Functional components such as a camera, a proximity sensor, and a processor may be integrated on the circuit board assembly 103 . Meanwhile, the display screen 102 may be electrically connected to the circuit board assembly 103 .

Referring to FIG. 2 and FIG. 3 , in some embodiments, the circuit board assembly 103 includes: a substrate 31 , a first duplexer 32 and a second duplexer 33 .

The substrate 31 is provided with a first port R1 , a second port T1 , a third port ant1 , a fourth port T2 , a fifth port R2 and a sixth port ant2 .

The first duplexer 32 is disposed on the substrate 31, the first duplexer 32 has a first uplink port 321, a first downlink port 322 and a first common port 323, the first uplink port 321 and the first port R1 For connection, the first downlink port 322 is connected with the second port T1, and the first common port 323 is connected with the third port ant1.

The second duplexer 33 is disposed on the substrate 31, the second duplexer 33 has a second uplink port 331, a second downlink port 332 and a second common port 333, and the second uplink port 331 is connected to the fourth port T2 , the second downlink port 332 is connected to the fifth port R2, and the second common port 333 is connected to the sixth port ant2.

Please refer to FIG. 4, wherein the first duplexer 32 further includes a first band-stop filter combination 32a and a second band-stop filter combination 32b, and the first band-stop filter combination 32a includes at least one first band-stop filter combination The second band stop filter combination 32b includes at least one second band stop filter.

Please refer to FIG. 5, the second duplexer 33 further includes a third band-stop filter combination 33a and a fourth band-stop filter combination 33b, and the third band-stop filter combination 33a includes at least one third band-stop filter, The fourth band stop filter combination 33b includes at least one fourth band stop filter.

Wherein, the third port ant1 and the sixth port ant2 are selectively connected or disconnected.

Referring to FIG. 6 , in some embodiments, the third port ant1 and the sixth port ant2 are provided with a switch 310 . One end of the switch 310 is connected to the third port ant1, and the other end of the switch 310 is connected to the sixth port ant2

The ground metal layer 31a is disposed on the substrate 31, the first duplexer 32 and the second duplexer 33 are disposed on the ground metal layer 31a, and the ground leads of the first duplexer 32 and the second duplexer 33 are connected to the ground. The feet are electrically connected to the ground metal layer 31a.

The ground metal layer 31a includes a first area 313a, a second area 311a, a third area 312a, a first connection area 315a, and a second connection area 314a; the first area 313a, the second area 311a, and the third area 312a are distributed in a zigzag shape , the first connection area 315a connects the first area 313a with the second area 311a, and the second connection area 314a connects the first area 311a with the third area 312a.

The first common port 323 and the second common port 333 are disposed side by side between the second area 313a and the third area 312a, and are symmetrical about the symmetry axis of the second area 311a and the third area 312a.

The first port R1 and the fifth port R2 are disposed on the first side of the first region 313a.

The second port T1 and the fourth port T2 are disposed on the second side of the first area 313a, and the second side is opposite to the first side.

The first area 313a, the second area 311a and the third area 312a are all rectangular.

In some embodiments, the circuit board assembly 103 further includes an antenna electrically connected to the third port or the sixth port.

In some embodiments, the circuit board assembly 103 further includes a radio frequency transceiver that is electrically connected to the first port, the second port, the fifth port, and the fourth port, respectively, so as to realize the connection with the first duplexer and the second duplexer. electrical connection.

As can be seen from the above, the circuit board assembly provided by the present invention can reduce the layout space of the circuit board, and can realize the integrated setting of the quadplexer and the two-in-one duplexer.

In the description of this specification, reference to the terms "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples", etc. A particular feature, structure, material, or characteristic described in this embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In summary, although the present invention has been disclosed above with preferred embodiments, the above preferred embodiments are not intended to limit the present invention. Those of ordinary skill in the art can make various Therefore, the protection scope of the present invention is subject to the scope defined by the claims.

In summary, although the present invention has been disclosed above with preferred embodiments, the above preferred embodiments are not intended to limit the present invention. Those of ordinary skill in the art can make various Therefore, the protection scope of the present invention is subject to the scope defined by the claims.

Claims (7)

1. A circuit board assembly, comprising:

the device comprises a substrate, a first terminal, a second terminal, a third terminal, a fourth terminal, a fifth terminal and a sixth terminal, wherein the substrate is provided with a grounding metal layer; the grounding metal layer comprises a first area, a second area, a third area, a first connecting area and a second connecting area; the first area, the second area and the third area are distributed in a delta shape, the first connecting area connects the first area with the second area, the second connecting area connects the first area with the third area, the first port and the fifth port are arranged on the first side of the first area, the second port and the fourth port are arranged on the second side of the first area, and the third port and the sixth port are arranged between the second area and the third area side by side and are symmetrical about the symmetry axes of the second area and the third area;

a first duplexer, disposed on the ground metal layer, the first duplexer having a first uplink port, a first downlink port, and a first common port, the first uplink port being connected to the first port, the first downlink port being connected to the second port, the first common port being connected to the third port, and a ground pin of the first duplexer being electrically connected to the ground metal layer;

a second duplexer, disposed on the ground metal layer, having a second uplink port, a second downlink port, and a second common port, where the second uplink port is connected to the fourth port, the second downlink port is connected to the fifth port, the second common port is connected to the sixth port, and a ground pin of the second duplexer is electrically connected to the ground metal layer;

the third port is selectively switched on or off with the sixth port.

2. The circuit board assembly of claim 1, further comprising a switch, one end of the switch being connected to the third port and the other end of the switch being connected to the sixth port.

3. The circuit board assembly of claim 1, wherein the first diplexer further comprises a first band stop filter combination comprising at least one first band stop filter and a second band stop filter combination comprising at least one second band stop filter.

4. The circuit board assembly of claim 1, wherein the second diplexer further comprises a third band-stop filter combination comprising at least one third band-stop filter and a fourth band-stop filter combination comprising at least one fourth band-stop filter.

5. The circuit board assembly of claim 1, further comprising an antenna electrically connected to the third port or the sixth port.

6. The circuit board assembly of claim 5, further comprising a radio frequency transceiver electrically connected to the first port, the second port, the fifth port, and the fourth port, respectively.

7. An electronic device comprising a housing and a circuit board assembly disposed in the housing, the circuit board assembly being the circuit board assembly of any one of claims 1-6.