CN107329319A - Quantum dot diaphragm and preparation method thereof, backlight module - Google Patents
Quantum dot diaphragm and preparation method thereof, backlight module Download PDFInfo
- Publication number
- CN107329319A CN107329319A CN201710604041.5A CN201710604041A CN107329319A CN 107329319 A CN107329319 A CN 107329319A CN 201710604041 A CN201710604041 A CN 201710604041A CN 107329319 A CN107329319 A CN 107329319A
- Authority
- CN
- China
- Prior art keywords
- quantum dot
- layer
- barrier layer
- quantum
- diaphragm
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Links
- 239000002096 quantum dot Substances 0.000 title claims abstract description 98
- 238000002360 preparation method Methods 0.000 title claims description 6
- 230000004888 barrier function Effects 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 94
- 238000000576 coating method Methods 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 26
- 239000003292 glue Substances 0.000 claims description 12
- 239000011253 protective coating Substances 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- -1 alcohol ester Chemical class 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 7
- 229920000728 polyester Polymers 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 6
- 229910000673 Indium arsenide Inorganic materials 0.000 claims description 4
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 4
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 claims description 4
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 4
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 4
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 claims description 3
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 claims description 3
- 229910052980 cadmium sulfide Inorganic materials 0.000 claims description 3
- 239000012044 organic layer Substances 0.000 claims description 3
- 229920006267 polyester film Polymers 0.000 claims description 3
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 claims description 2
- 238000007740 vapor deposition Methods 0.000 claims description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- AQCDIIAORKRFCD-UHFFFAOYSA-N cadmium selenide Chemical compound [Cd]=[Se] AQCDIIAORKRFCD-UHFFFAOYSA-N 0.000 claims 1
- 239000011229 interlayer Substances 0.000 claims 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 229910017083 AlN Inorganic materials 0.000 description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 3
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- WKBPZYKAUNRMKP-UHFFFAOYSA-N 1-[2-(2,4-dichlorophenyl)pentyl]1,2,4-triazole Chemical compound C=1C=C(Cl)C=C(Cl)C=1C(CCC)CN1C=NC=N1 WKBPZYKAUNRMKP-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 229910004611 CdZnTe Inorganic materials 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910004262 HgTe Inorganic materials 0.000 description 1
- 241000764773 Inna Species 0.000 description 1
- 239000004425 Makrolon Substances 0.000 description 1
- 229910000661 Mercury cadmium telluride Inorganic materials 0.000 description 1
- 241001025261 Neoraja caerulea Species 0.000 description 1
- 241000227425 Pieris rapae crucivora Species 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910007709 ZnTe Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- DOTMOQHOJINYBL-UHFFFAOYSA-N molecular nitrogen;molecular oxygen Chemical compound N#N.O=O DOTMOQHOJINYBL-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
- Luminescent Compositions (AREA)
Abstract
A kind of quantum dot diaphragm, including the first barrier layer set gradually, the first quantum dot layer, basalis, the second quantum dot layer, the second barrier layer, first quantum dot layer includes the green light quantum point being dispersed in polymeric material, second quantum dot layer includes the red light quantum point for being dispersed in polymeric material, first barrier layer is deposited on first quantum dot layer, and second barrier layer is deposited on second quantum dot layer.The quantum dot diaphragm excellent performance of the present invention, suitable industrialization.
Description
Technical field
The present invention relates to display field, more particularly to a kind of quantum dot diaphragm for backlight display field.
Background technology
Quantum dot is that LCD backlight shows that product improves a kind of effective ways of colour gamut.Compared to common white light LEDs, make
With quantum dot diaphragm collocation blue-ray LED, LCD colour gamut can be improved to more than 100%NTSC by original 70%NTSC, so that
Show more preferable color saturation.
Existing quantum dot diaphragm is made up of two Obstruct membrane intermediate course quantum dot layers, and in sandwich structure, it makes work
Skill mainly includes:Two Obstruct membranes are applied as by film with the macromolecule glue for being mixed with red-green glow quantum dot by coating process, and
It is cured to form.The Obstruct membrane deposits inorganic coating on organic group bottom and constituted.
The content of the invention
It is an object of the invention to provide a kind of new quantum dot diaphragm, the quantum dot diaphragm cost of prior art is solved
High, self-absorption is big and is difficult the problem of doing thin.
The invention provides a kind of quantum dot diaphragm, including set gradually the first barrier layer, the first quantum dot layer, substrate
Layer, the second quantum dot layer, the second barrier layer, first quantum dot layer include the green glow amount being dispersed in polymeric material
Sub-, second quantum dot layer includes the red light quantum point for being dispersed in polymeric material, the first barrier layer deposition
On first quantum dot layer, second barrier layer is deposited on second quantum dot layer.
Preferably, the base layer thickness scope is 25 microns -100 microns, first quantum dot layer and described second
Quantum dot layer thickness range is 20 microns -50 microns.
Preferably, the thickness range of first barrier layer and second barrier layer is 200 nanometers -2 microns.
Preferably, the basalis is the polyester film formed by polyethylene terephthalate.
Preferably, first barrier layer and second barrier layer include inorganic coating and protective coating.
Preferably, first barrier layer and second barrier layer include alternate organic layer and inorganic coating, and
Protective coating.
Preferably, the inorganic coating is alumina layer or silicon oxide layer.
Preferably, the thickness of the quantum dot diaphragm is no more than 120 microns.
Preferably, the thickness of the quantum dot diaphragm is no more than 100 microns.
Preferably, the green light quantum point and red light quantum point include at least one of following material:Cadmium selenide, vulcanization
Cadmium, cadmium telluride, zinc selenide, indium phosphide, indium arsenide, perovskite.
The invention also provides a kind of backlight module, the backlight module includes quantum dot diaphragm as described above.
The invention also provides a kind of preparation method of quantum dot diaphragm, comprise the following steps:Obtain green quantum dispensing
Liquid and red light quantum point glue;Green light quantum point glue and red light quantum point glue are respectively coated in polyesters basalis
Upper and lower surface, solidify to form the first quantum dot layer, polyesters basalis, the composite construction of the second quantum dot layer;Institute
The upper and lower surface for stating composite construction deposits the first barrier layer and the second barrier layer respectively.
Preferably, the deposition is realized by magnetron sputtering, plasma chemical vapor deposition or atomic vapor deposition.
The new quantum dot diaphragm of the present invention, changes the quantum dot diaphragm structure design of prior art, simplifies technique,
Effectively reduce cost, it is easier to obtain relatively thin quantum dot film, and avoid the self-absorption that red green quantum dot mixing causes and show
As.
Brief description of the drawings
Fig. 1 is the structural representation of quantum dot diaphragm in the present invention.
Embodiment
Below in conjunction with embodiment of the present invention, the technical scheme in the embodiment of the present invention is described in detail, shown
So, described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Based in the present invention
Embodiment, the every other implementation that those of ordinary skill in the art are obtained on the premise of creative work is not made
Mode, belongs to the scope of the present invention.
With reference to Fig. 1, the invention discloses a kind of new quantum dot diaphragm 100, including the first barrier layer set gradually
102nd, the first quantum dot layer 104, basalis 106, the second quantum dot layer 108, the second barrier layer 110.First quantum dot layer 104 is wrapped
The green light quantum point 114 being dispersed in polymeric material 112 is included, the second quantum dot layer 108 includes being dispersed in polymerization
Red light quantum point 116 in thing material 112.First barrier layer 102 is deposited on the first quantum dot layer 104, the second barrier layer 110
It is deposited on the second quantum dot layer 108.
First barrier layer 102 is identical with the structure of the second barrier layer 110.First barrier layer 102 includes being used to obstruct water oxygen
Inorganic coating 118 and protective coating 120.Inorganic coating 118 is positioned adjacent to the side of the first quantum dot layer 104, protective coating
120 are arranged far from the side of the first quantum dot layer 104.Inorganic coating 118 refers to that the water oxygen being made up of inorganic material obstructs energy
The strong barrier layer of power, inorganic material effectively stops aqueous vapor and the effect of oxygen by being reached in the dense arrangement of atomic level.
One preferred embodiment in, inorganic coating 118 include aluminum oxide, aluminium nitride, aluminum oxynitride, titanium oxide, titanium nitride, nitrogen oxygen
Change at least one of titanium, zirconium oxide, zirconium nitride, nitrogen oxidation zirconium, silica, carborundum, silicon oxynitride, graphene.At one
In preferred embodiment, inorganic coating 118 is alumina layer or silicon oxide layer.The deposition process of inorganic coating 118 is preferred
Including injection, sputtering, evaporation, vacuum moulding machine, plasma chemical vapor deposition or ald.In a preferred implementation
In mode, inorganic coating 118 is formed by magnetron sputtering.The material of protective coating 120 is preferably acrylic resin, and thickness is 8-
12 microns.
Protective coating 120 includes poly- silicones, poly epoxy resin, polyurethane, makrolon, poly- fluororesin, poly- methyl-prop
E pioic acid methyl ester, polyformaldehyde, polyethylene, Vingon, ethylene-vinyl alcohol copolymer, polyvinyl acetate, polytetrafluoroethylene (PTFE),
Polyvinyl butyral, polypropylene, polyamide, polyethylene terephthalate, PEN or poly- to benzene
Dioctyl phthalate butanediol ester, polyacrylate, polystyrene acrylonitrile resin, poly- Colombia's resin, poly- CR-39 resins, poly- OZ
Series plastics, poly- TS-26 resins, poly- APO resins, poly- MR resins, poly- MH resins, poly- NAS resins, poly- ADC resins, poly- TOPAS
At least one of resin, poly- ARTON resins.Preferably, 5%-10% diffusion particle, particle are added with protective coating 120
Particle diameter is 5-10 microns.Second barrier layer 110 is identical with the composition structure of the first barrier layer 102.
Basalis 106 is preferably polyester material, it is preferable that basalis 106 is by polyethylene terephthalate shape
Into polyester film.Preferably, 5%-10% diffusion particle is added with basalis 106, particle diameter is 5-10 microns.Substrate
Layer not only act as the effect for separate red green quantum dot layer, also make the first quantum dot layer, basalis, the second quantum dot layer formed answer
Close the deposition that structure preferably adapts to inorganic barrier layer, it is to avoid cause quantum dot because quantum dot layer is softer, deposition stress is excessive
Diaphragm is crimped and problem of Cracking.
In a preferred embodiment, the thickness of quantum dot diaphragm 100 is no more than 120 microns, and wherein basalis 106 is thick
It is 25 microns -100 microns to spend scope, and the first quantum dot layer 104 and the thickness range of the second quantum dot layer 110 are 20 micron -50
Micron.Preferably, the thickness of quantum dot diaphragm 100 is no more than 100 microns.It is highly preferred that the thickness of quantum dot diaphragm 100 does not surpass
Cross 80 microns.
Green light quantum point 114 and red light quantum point 116 comprising silicon class quantum dot, IIB-VIA compounds of group quantum dot,
IIIA-VA compounds of group quantum dot, VA-VIA compounds of group quantum dot, the mixing of perovskite quantum dot and above-mentioned various quantum dots
One kind in thing.IIB-VIA compounds of group quantum dot include from by CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe,
HgTe、CdSeS、CdSeTe、CdSTe、ZnSeS、ZnSeTe、ZnSTe、HgSeS、HgSeTe、HgSTe、CdZnS、CdZnSe、
CdZnTe、CdHgS、CdHgSe、CdHgTe、HgZnS、HgZnSe、HgZnTe、CdZnSeS、CdZnSeTe、CdZnSTe、
The one kind selected in the group of CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe and HgZnSTe composition.IIIA‐
VA compounds of group quantum dot include from by GaN, GaP, GaAs, AlN, AlP, AlAs, InN, InP, InAs, GaNP, GaNAs,
GaPAs、AlNP、AlNAs、AlPAs、InNP、InNAs、InPAs、GaAlNP、GaAlNAs、GaAlPAs、GaInNP、
The one kind selected in the group of GaInNAs, GaInPAs, InAlNP, InAlNAs and InAlPAs composition.The side of being preferable to carry out
In formula, quantum dot is core shell structure.In a preferred embodiment, green light quantum point and red light quantum point include following material
At least one of:Cadmium selenide, cadmium sulfide, cadmium telluride, zinc selenide, indium phosphide, indium arsenide, perovskite.
The polymeric material 112 of scattered quantum dot preferably includes to be modified poly- silicones, modified polyurethane, modified poly-epoxy tree
At least one of fat, modified polypropene acid resin.More there is choosing, it is good to oil-soluble quantum dot dissolubility that polymeric material is selected from
And the strong poly- epoxy modified acrylic resin of water oxygen obstructing capacity.Preferably, also it is added with 5%-10%'s in polymeric material
Diffusion particle, particle diameter is 5-10 microns.
Cause the inorganic defect of coating 118 for the irregularities that avoid luminescent layer, cause the water oxygen barrier of inorganic coating 118
Can be not enough, in one preferred embodiment, one layer of smooth finish (figure is provided between quantum dot layer and inorganic coating 118
Not shown in), the surface roughness of smooth finish is less than 100 nanometers.Smooth finish can by chemical vapour deposition technique, etc. from
It is prepared by the methods such as daughter coating.
Backlight module, display device or light-emitting device can be prepared using the quantum dot diaphragm 100 of the present invention.Display dress
Put including TV, mobile phone, wrist-watch etc..The quantum dot diaphragm 100 of the present invention is preferably used on mobile phone.In backlight module, quantum
Point diaphragm arrangement is on LED light direction.
The invention also provides a kind of preparation method of quantum dot diaphragm 100, comprise the following steps:Obtain green light quantum point
Glue and red light quantum point glue;Green light quantum point glue and red light quantum point glue are respectively coated in polyesters basalis
Upper and lower surface, solidify to form the first quantum dot layer 104, polyesters basalis 106, second quantum dot layer 108 and answer
Close structure;Smooth finish, inorganic coating, organic layer, inorganic coating, protection are sequentially depositing in the upper and lower surface of the composite construction
Coating, forms the first barrier layer 102 and the second barrier layer 110.Preferably, deposition passes through magnetron sputtering, Both Plasma Chemical Vapor
Deposition is realized.
In a detailed embodiment, the first barrier layer 102 is identical with the structure of the second barrier layer 110, the first barrier layer
102 include the inorganic coating 118 and protective coating 120 for obstructing water oxygen.Inorganic coating 118 is positioned adjacent to the first quantum dot
The side of layer 104, protective coating 120 is arranged far from the side of the first quantum dot layer 104.Inorganic coating 118 refers to by inorganic
The strong barrier layer of water oxygen obstructing capacity that material is constituted, inorganic material in the dense arrangement of atomic level by reaching effective stop
The effect of aqueous vapor and oxygen.In one preferred embodiment, inorganic coating 118 includes aluminum oxide, aluminium nitride, nitrogen oxidation
Aluminium, titanium oxide, titanium nitride, titanium oxynitrides, zirconium oxide, zirconium nitride, nitrogen oxidation zirconium, silica, carborundum, silicon oxynitride, graphite
At least one of alkene.In one preferred embodiment, inorganic coating 118 is alumina layer or silicon oxide layer.
Although inventor has done more detailed elaboration and enumerated to technical scheme, it will be appreciated that for
For those skilled in the art, above-described embodiment is modified and/or the flexible or equivalent alternative solution of use is obvious
, can not all depart from the essence of spirit of the present invention, the term occurred in the present invention be used for elaboration to technical solution of the present invention and
Understand, can not be construed as limiting the invention.
Claims (12)
1. a kind of quantum dot diaphragm, it is characterised in that including the first barrier layer set gradually, the first quantum dot layer, basalis,
Second quantum dot layer, the second barrier layer, first quantum dot layer include the green quantum being dispersed in polymeric material
Point, second quantum dot layer includes the red light quantum point for being dispersed in polymeric material, and first barrier layer is deposited on
On first quantum dot layer, second barrier layer is deposited on second quantum dot layer.
2. quantum dot diaphragm according to claim 1, it is characterised in that the base layer thickness scope is 25 micron -100
Micron, first quantum dot layer and the second quantum dot layer thickness range are 20 microns -50 microns.
3. quantum dot diaphragm according to claim 1 or 2, it is characterised in that first barrier layer and second resistance
The thickness range of interlayer is 200 nanometers -2 microns.
4. quantum dot diaphragm according to claim 1, it is characterised in that the basalis is by poly terephthalic acid second two
The polyester film of alcohol ester formation.
5. quantum dot diaphragm according to claim 1, it is characterised in that first barrier layer and second barrier layer
Include inorganic coating and protective coating.
6. quantum dot diaphragm according to claim 5, it is characterised in that first barrier layer and second barrier layer
Including alternate organic layer and inorganic coating, and protective coating.
7. the quantum dot diaphragm according to claim 5 or 6, it is characterised in that the inorganic coating be alumina layer or
Silicon oxide layer.
8. quantum dot diaphragm according to claim 1, it is characterised in that the thickness of the quantum dot diaphragm is no more than 120
Micron.
9. quantum dot diaphragm according to claim 1, it is characterised in that the green light quantum point and red light quantum point include
At least one of following material:Cadmium selenide, cadmium sulfide, cadmium telluride, zinc selenide, indium phosphide, indium arsenide, perovskite.
10. a kind of backlight module, it is characterised in that the backlight module includes any described quantum dot in claim 1-9
Diaphragm.
11. a kind of preparation method of quantum dot diaphragm, it is characterised in that comprise the following steps:Obtain green light quantum point glue and
Red light quantum point glue;Green light quantum point glue and red light quantum point glue are respectively coated in the upper table in polyesters basalis
Face and lower surface, solidify to form the first quantum dot layer, polyesters basalis, the composite construction of the second quantum dot layer;Described multiple
The upper and lower surface for closing structure deposits the first barrier layer and the second barrier layer respectively.
12. preparation method according to claim 1, it is characterised in that the deposition passes through magnetron sputtering, plasma chemical
Vapour deposition or atomic vapor deposition are realized.
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| CN201710604041.5A CN107329319A (en) | 2017-07-21 | 2017-07-21 | Quantum dot diaphragm and preparation method thereof, backlight module |
| CN201810766823.3A CN109031777A (en) | 2017-07-21 | 2018-07-13 | Quantum dot diaphragm and preparation method thereof and backlight module |
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| CN201710604041.5A CN107329319A (en) | 2017-07-21 | 2017-07-21 | Quantum dot diaphragm and preparation method thereof, backlight module |
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Application publication date: 20171107 |