CN107271029A - A kind of hydrophone integration module and its manufacturing process - Google Patents

Abstract

The invention provides a hydrophone integrated module, which has high integration, rich functions, small volume, light weight, and is easy to meet the requirements of a small-sized installation environment. It includes a substrate on which a hydrophone sensor, a pressure The sensor, communication module and ASIC chip, hydrophone sensor, pressure sensor, communication module and ASIC chip are respectively packaged in the injection molding layer. The earphone sensor is connected to the pressure sensor through wires and conductive wires arranged in the substrate, the hydrophone sensor and the pressure sensor are respectively connected to the conductive wires arranged in the substrate through wires, and the communication module and the ASIC chip are respectively connected to the conductive wires through solder balls. wires, and the conductive wires are connected to the bottom pads arranged on the lower surface of the substrate. In addition, the invention also provides a manufacturing process of the hydrophone integrated module.

Description

A hydrophone integrated module and its manufacturing process

technical field

The invention relates to the technical field of hydrophones, in particular to a hydrophone integrated module and a manufacturing process thereof.

Background technique

The hydrophone, also known as the underwater microphone, can convert the acoustic signal generated by the underwater pressure change into an electrical signal, so that the underwater pressure can be reliably obtained. It is often used for sound field mapping and acoustic sensor detection and calibration. And research in the field of acoustics, such as the detection, calibration and performance evaluation of ultrasonic equipment. With the continuous development and progress of science and technology, the application technology of hydrophones has gradually matured.

In the prior art, the hydrophone is usually a single device with a relatively single function, requiring many external components to work together, and the integration level is low, resulting in a complex structure of the entire hydrophone device, and it is difficult to make the size small and miniaturized , seriously affecting the portability and applicability of use.

Contents of the invention

In view of the above problems, the present invention provides a hydrophone with high integration, rich functions, small volume, light weight, and easy to meet the requirements of small size installation environment. In addition, the present invention also provides a hydrophone The manufacturing process of the device integrated module.

Its technical scheme is as follows: a hydrophone integrated module, including a substrate, is characterized in that: the substrate is provided with a hydrophone sensor, a pressure sensor, a communication module and an ASIC chip, and the hydrophone sensor, pressure The sensor, the communication module and the ASIC chip are respectively packaged in the injection molding layer. The upper end of the hydrophone sensor is provided with a sound inlet opening communicating with the environment acoustics. The upper end of the pressure sensor is provided with an induction opening communicating with the outside. The sensor is connected to the pressure sensor through a wire and a conductive wire arranged in the substrate, the hydrophone sensor and the pressure sensor are respectively connected to the conductive wire arranged in the substrate through a wire, and the communication module and the ASIC chip are respectively connected to the conductive traces through solder balls, and the conductive traces are connected to the bottom pads arranged on the lower surface of the substrate.

Further, the hydrophone sensor includes a first sensor wafer, the upper surface of the first sensor wafer is etched to form columnar protrusions, and the upper surface of the first sensor wafer is connected to the second sensor wafer. The lower surface of the circle is vacuum-bonded to form a cavity, and the upper surface of the second sensor wafer is formed on the upper surface of a composite layer that is an upper metal conductive layer, a piezoelectric material layer, and a lower metal conductive layer from top to bottom. The edge of the layer is wrapped in the passivation layer, and the upper metal conductive layer and the lower metal conductive layer are respectively extended outward to form an upper extension and a lower extension, and the upper extension and the lower extension are respectively provided with There are pads, the lower surface of the first sensor wafer is bonded to the upper surface of the substrate, and the hydrophone sensors are respectively connected to the conductive traces through the pads.

Further, the upper conductive metal layer and the lower conductive metal layer are respectively Mo layers.

Further, the piezoelectric material layer is an AlN layer.

Further, the communication module is any one of bluetooth, wifi, and mobile communication modules.

Further, a controller module is also provided on the substrate.

Further, a power module is also provided on the substrate.

A kind of manufacturing process of hydrophone integrated module is characterized in that: comprising the following steps:

Step 1: providing a first sensor wafer, and etching the first sensor wafer to form columnar protrusions;

Step 2: Vacuum bonding the upper surface of the first sensor wafer obtained in step 1 to the lower surface of the second sensor wafer to form a cavity;

Step 3: The upper surface of the second sensor wafer is formed with a composite layer of upper metal conductive layer, piezoelectric material layer and lower metal conductive layer from top to bottom through the SOI process, and the edge of the composite layer is wrapped with a passivation layer middle;

Step 4: setting pads on the upper surface of the upper extension of the upper metal conductive layer, and setting pads on the upper surface of the lower extension of the lower metal conductive layer to obtain a hydrophone sensor;

Step 5: mount the communication module chip and ASIC chip on the substrate;

Step 6: attach the pressure sensor and the hydrophone sensor obtained in step 4 to the substrate;

Step 7: The base plate is plastic-sealed, and the upper end of the hydrophone sensor exposes an acoustic inlet opening communicating with the environment acoustics, and the upper end of the pressure sensor exposes an induction opening communicating with the outside.

Further, between step 2 and step 3, the upper part of the second sensor wafer is thinned.

The hydrophone integrated module of the hydrophone of the present invention integrates a hydrophone sensor, a pressure sensor, a communication module and an ASIC chip, the current depth can be reflected by the pressure sensor, and a certain depth can be detected by combining the hydrophone sensor and the ASIC chip. Underwater acoustic signal, the detected acoustic signal is converted into an electrical signal, and transmitted through the communication module to realize wireless data transmission; in addition, according to needs, the hydrophone integrated module of the hydrophone of the present invention can also integrate the controller and The power supply module further enriches the functions; the hydrophone of the present invention takes advantage of the advantages of semiconductor manufacturing technology, and the hydrophone sensor, pressure sensor, communication module and ASIC chip are integrated on one substrate, the volume of the hydrophone can be reduced, and at the same time The performance is enhanced, and at the same time, the difficulty of the packaging process is low, which can reduce the complexity of the PCB circuit board, and the reliability is good.

Description of drawings

Fig. 1 is the structural representation of hydrophone integrated module of the present invention;

Fig. 2 is a schematic diagram of step a to step d of the manufacturing process of the hydrophone integrated module of the present invention;

Fig. 3 is a schematic diagram of step e to step h of the manufacturing process of the hydrophone integrated module of the present invention.

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

See Fig. 1, Fig. 2, Fig. 3, a kind of hydrophone integrated module of the present invention comprises substrate 1, and substrate 1 is provided with hydrophone sensor 2, pressure sensor 3, communication module 4 and ASIC chip 5, the present invention In the example, the communication module is bluetooth, the hydrophone sensor 2, the pressure sensor 3, the communication module 4 and the ASIC chip 5 are respectively packaged in the injection molding layer 6, and the upper end of the hydrophone sensor 2 is provided with an acoustic entry opening 7 communicating with the environment acoustics, The upper end of the pressure sensor 3 is provided with an externally connected sensing opening 8. The hydrophone sensor 2 is connected to the pressure sensor 3 through a wire 9 and a conductive wire 10 arranged in the substrate 1. The hydrophone sensor 2 and the pressure sensor 3 are connected to the pressure sensor 3 through a wire 9 respectively. Connect to the conductive traces 10 arranged in the substrate 1 , the communication module 4 and the ASIC chip 5 are respectively connected to the conductive traces 10 through solder balls 11 , and the conductive traces 10 are connected to the bottom pads 12 provided on the lower surface of the substrate 1 .

The hydrophone sensor 2 includes a first sensor wafer 21, the upper surface of the first sensor wafer 21 forms columnar protrusions 22 by etching, and the upper surface of the first sensor wafer 21 and the lower surface of the second sensor wafer 23 Surface vacuum bonding forms a cavity 24, and the upper surface of the second sensor wafer 24 is formed on the upper surface of the composite layer respectively comprising an upper metal conductive layer 25, a piezoelectric material layer 26, and a lower metal conductive layer 27, and the upper metal conductive layer The layer 25 and the lower metal conductive layer 27 are respectively Mo layers, the piezoelectric material layer 26 is an AlN layer, the edge of the composite layer is wrapped in the passivation layer 28, and the upper metal conductive layer 25 and the lower metal conductive layer 27 extend outward respectively to form The upper extension 29 and the lower extension 210, the upper extension 29 and the lower extension 210 are respectively provided with pads 211, the lower surface of the first sensor wafer 21 is bonded to the upper surface of the substrate 1, and the hydrophone sensor 2 passes through The pads 211 are respectively connected to the conductive traces 10 .

See Fig. 2, Fig. 3, the manufacturing process of hydrophone integrated module of the present invention, comprises the following steps:

Step a: providing a first sensor wafer, and etching the first sensor wafer to form columnar protrusions;

Step b: Vacuum bonding the upper surface of the first sensor wafer obtained in step 1 to the lower surface of the second sensor wafer to form a cavity;

Step c: Thinning the upper part of the second sensor wafer,

Step d: The upper surface of the second sensor wafer is formed with a composite layer consisting of an upper metal conductive layer, a piezoelectric material layer, and a lower metal conductive layer from top to bottom through the SOI process, and the edge of the composite layer is wrapped with a passivation layer middle;

Step e: setting pads on the upper surface of the upper extension of the upper metal conductive layer, and setting pads on the upper surface of the lower extension of the lower metal conductive layer to obtain a hydrophone sensor;

Step f: mount the communication module chip and the ASIC chip on the substrate;

Step g: attaching the pressure sensor and the hydrophone sensor obtained in step d to the substrate;

Step h: The base plate is plastic-sealed, the upper end of the hydrophone sensor exposes a sound inlet opening communicating with the ambient acoustics, and the upper end of the pressure sensor exposes an induction opening communicating with the outside.

The hydrophone integrated module of the hydrophone of the present invention integrates a hydrophone sensor, a pressure sensor, a communication module and an ASIC chip, the current depth can be reflected by the pressure sensor, and a certain depth can be detected by combining the hydrophone sensor and the ASIC chip. The underwater acoustic signal converts the detected acoustic signal into an electrical signal and transmits it through the communication module. According to needs, the hydrophone integration module of the hydrophone of the present invention can also integrate a controller and a power supply module to further enrich functions; With the help of the advantages of semiconductor manufacturing technology, the hydrophone of the present invention integrates the hydrophone sensor, pressure sensor, communication module and ASIC chip on one substrate, the volume of the hydrophone can be reduced, and the performance can be enhanced at the same time. The process difficulty is low, the complexity of the PCB circuit board can be reduced, and the reliability is good.

The hydrophone sensor uses AlN as the piezoelectric material layer. ALN has the advantages of wide band gap and high sound velocity, which can improve the sensitivity of the hydrophone. A cavity is formed by vacuum bonding of ASIC wafer and silicon wafer, forming air metal reflection The interface confines the sound wave to the piezoelectric material, reduces the leakage of sound energy to the substrate, improves the sensitivity of the hydrophone, has the advantages of large bandwidth, large dynamic range and better linearity, and can detect farther and more Weak sound signals are of great significance for large-scale civilian fields such as ocean exploration, waterway monitoring, pipe network monitoring, and underwater navigation; at the same time, setting columnar protrusions in the cavity can limit the position of the hydrophone sensor and prevent The hydrophone sensor is adhered to the bottom surface of the cavity, and the hydrophone sensor cannot be reset, resulting in damage to the hydrophone.

The above is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto, any changes or substitutions that can be easily imagined by anyone familiar with the technology within the technical scope disclosed in the present invention are all Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.

Claims (9)

1. A hydrophone integrated module, comprising a substrate, is characterized in that: the substrate is provided with a hydrophone sensor, a pressure sensor, a communication module and an ASIC chip, and the hydrophone sensor, a pressure sensor, a communication module and The ASIC chips are respectively packaged in the injection molding layer. The upper end of the hydrophone sensor is provided with a sound inlet opening communicating with the environment acoustics. The upper end of the pressure sensor is provided with an induction opening communicating with the outside. The conductive traces in the substrate are connected to the pressure sensor, the hydrophone sensor and the pressure sensor are respectively connected to the conductive traces provided in the substrate, the communication module and the ASIC chip through wires The conductive traces are respectively connected by solder balls, and the conductive traces are connected to the bottom pads disposed on the lower surface of the substrate. 2. A kind of hydrophone integrated module according to claim 1, characterized in that: the hydrophone sensor comprises a first sensor wafer, and the upper surface of the first sensor wafer forms a columnar convex surface by etching. From the beginning, the upper surface of the first sensor wafer and the lower surface of the second sensor wafer are vacuum bonded to form a cavity, and the upper surface of the second sensor wafer is formed from top to bottom respectively. layer, a piezoelectric material layer, and a composite layer of a lower metal conductive layer, the edge of the composite layer is wrapped in a passivation layer, and the upper metal conductive layer and the lower metal conductive layer extend outward to form an upper extension and a lower metal conductive layer respectively. The lower extension, the upper extension and the lower extension are respectively provided with pads, the lower surface of the first sensor wafer is bonded to the upper surface of the substrate, and the hydrophone sensors are respectively connected to each other through the pads The conductive traces. 3. A hydrophone integrated module according to claim 2, characterized in that: the upper conductive metal layer and the lower conductive metal layer are respectively Mo layers. 4. A hydrophone integrated module according to claim 2, characterized in that: the piezoelectric material layer is an AlN layer. 5. A hydrophone integrated module according to claim 1, characterized in that: said communication module is any one of bluetooth, wifi, and mobile communication modules. 6 . The hydrophone integrated module according to claim 1 , wherein a controller module is further arranged on the substrate. 6 . 7 . The integrated hydrophone module according to claim 1 , wherein a power supply module is further provided on the substrate. 7 . 8. A manufacturing process of a hydrophone integrated module, characterized in that: comprising the following steps: Step 1: providing a first sensor wafer, and etching the first sensor wafer to form columnar protrusions; Step 2: Vacuum bonding the upper surface of the first sensor wafer obtained in step 1 to the lower surface of the second sensor wafer to form a cavity; Step 3: The upper surface of the second sensor wafer is formed with a composite layer of upper metal conductive layer, piezoelectric material layer and lower metal conductive layer from top to bottom through the SOI process, and the edge of the composite layer is wrapped with a passivation layer middle; Step 4: setting pads on the upper surface of the upper extension of the upper metal conductive layer, and setting pads on the upper surface of the lower extension of the lower metal conductive layer to obtain a hydrophone sensor; Step 5: mount the communication module chip and ASIC chip on the substrate; Step 6: attach the pressure sensor and the hydrophone sensor obtained in step 4 to the substrate; Step 7: The base plate is plastic-sealed, and the upper end of the hydrophone sensor exposes an acoustic inlet opening communicating with the environment acoustics, and the upper end of the pressure sensor exposes an induction opening communicating with the outside. 9. The manufacturing process of a hydrophone integrated module according to claim 8, characterized in that: between step 2 and step 3, the upper part of the second sensor wafer is thinned.