CN107236978A - The enclosure method of the packing material and pore of closing oxidation rear substrate surface pore - Google Patents
The enclosure method of the packing material and pore of closing oxidation rear substrate surface pore Download PDFInfo
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- CN107236978A CN107236978A CN201710491610.XA CN201710491610A CN107236978A CN 107236978 A CN107236978 A CN 107236978A CN 201710491610 A CN201710491610 A CN 201710491610A CN 107236978 A CN107236978 A CN 107236978A
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- sealer
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- film
- pore
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- 239000000463 material Substances 0.000 title claims abstract description 45
- 230000003647 oxidation Effects 0.000 title claims abstract description 25
- 238000007254 oxidation reaction Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 title claims abstract description 22
- 239000011148 porous material Substances 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000012856 packing Methods 0.000 title claims abstract description 13
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 18
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000002253 acid Substances 0.000 claims abstract description 10
- 235000021355 Stearic acid Nutrition 0.000 claims abstract description 8
- 239000003575 carbonaceous material Substances 0.000 claims abstract description 8
- 239000012895 dilution Substances 0.000 claims abstract description 8
- 238000010790 dilution Methods 0.000 claims abstract description 8
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims abstract description 8
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims abstract description 8
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000008117 stearic acid Substances 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims abstract description 7
- -1 triglyceride compound Chemical class 0.000 claims abstract description 6
- 238000005498 polishing Methods 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 238000005245 sintering Methods 0.000 claims abstract description 5
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 235000021314 Palmitic acid Nutrition 0.000 claims abstract description 4
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000002210 silicon-based material Substances 0.000 claims abstract description 4
- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229930195735 unsaturated hydrocarbon Natural products 0.000 claims abstract description 4
- 239000003085 diluting agent Substances 0.000 claims description 16
- 239000003153 chemical reaction reagent Substances 0.000 claims description 12
- 238000005507 spraying Methods 0.000 claims description 12
- 239000007787 solid Substances 0.000 claims description 8
- PRPAGESBURMWTI-UHFFFAOYSA-N [C].[F] Chemical compound [C].[F] PRPAGESBURMWTI-UHFFFAOYSA-N 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 238000013329 compounding Methods 0.000 claims description 3
- 125000000623 heterocyclic group Chemical group 0.000 claims description 3
- 150000002576 ketones Chemical class 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 150000002632 lipids Chemical class 0.000 claims description 2
- UFTFJSFQGQCHQW-UHFFFAOYSA-N triformin Chemical compound O=COCC(OC=O)COC=O UFTFJSFQGQCHQW-UHFFFAOYSA-N 0.000 claims 1
- 239000003566 sealing material Substances 0.000 abstract description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 abstract 1
- 239000011737 fluorine Substances 0.000 abstract 1
- 229910052731 fluorine Inorganic materials 0.000 abstract 1
- 239000002904 solvent Substances 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 235000003642 hunger Nutrition 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000004040 pyrrolidinones Chemical class 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000006166 lysate Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/82—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/80—After-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Coating By Spraying Or Casting (AREA)
- Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention discloses the enclosure method of the packing material and pore of closing oxidation rear substrate surface pore, packing material, including the use of the sealer of dilution dilution agent, sealer is used：Fluorine carbon materials matter；Organosilicon and inorganic silicon material；Inorganic molybdenum disulfide material；Unsaturated hydrocarbons, unrighted acid, palmitic acid, stearic acid, the triglyceride compound material of the glyceric acid ester type compound of unrighted acid or palmitic, stearic；Enclosure method, comprises the following steps：Configure sealer；Filling perforation, Gu film, high temperature curve sintering is carried out to the workpiece after filling perforation, forms a tunic；Polishing or sanding.Advantages of the present invention：Embedded sealing of hole agent molecule in the surface pore of base material workpiece after oxidation, having workpiece, non-stick, coefficient of friction be low, antirust ability is strong, by the basal body structure that oxide-film is firm, with reference to the sealing material, so that workpiece is wear-resisting durable so that product can be widely used in industry and life.
Description
Technical field
The present invention relates to the enclosure method of the packing material and pore of closing oxidation rear substrate surface pore.
Background technology
Metal works easily get rusty, to prevent from getting rusty, at present typically can be using metal works are carried out oxidation processes, at this stage
The surface of workpiece particularly aoxidized in high precision through peroxidating seems very smooth, smooth, but aobvious workpiece is placed on
Under micro mirror, still can see during microscopic observation the surface of these workpiece has some loose holes, due to depositing for this some holes
The use of workpiece is had some limitations, as the casting iron pan of cooker be difficult when in use do not glue with good and
Antirust anti-wear performance, and to service life, there is also certain influence.
The content of the invention
The invention aims to solve problems of the prior art, and the oxidation rear substrate surface pore proposed
Inlay packing material and technology.
To achieve these goals, present invention employs following technical scheme：
The packing material of closing oxidation rear substrate surface pore, it is characterised in that：Closing including the use of dilution dilution agent
Agent, sealer uses any one or more mixing in following four material：
A, fluorine carbon materials matter；B, organosilicon and inorganic silicon material；C, inorganic molybdenum disulfide material；D, unsaturated hydrocarbons, insatiable hunger
With the acid of glycerine three of aliphatic acid, palmitic acid, stearic acid, the glyceric acid ester type compound of unrighted acid or palmitic, stearic
Compound material.
Preferably, the diluent includes following two：A, water are the aqueous diluent of solvent；B, with it is single one or more
The oiliness diluent of polarity or nonpolar organic solvent compounding.
Preferably, the diluent includes alcohol reagent, ketone reagent, phenyl ring class reagent or heterocyclic reagent.
Preferably, the concentration of the sealer is 5% -80%.
The enclosure method of oxidation rear substrate surface pore, it is characterised in that comprise the following steps：
Step 1: configuration sealer；
Step 2: filling perforation, is sprayed onto sealer in the hole that the base material workpiece surface after oxidation fills substrate surface, this
Some holes gap is sealed,
Step 3: solid film, carries out high temperature curve sintering so that the material in sealer is inlayed completely to the workpiece after filling perforation
Hole and the surface of workpiece are sealed in, a tunic is formed；
Step 4: polishing or sanding, the workpiece after solid film is mechanically polished or sanding method by the loose of surface and
After unwanted layers are removed, above-mentioned sealer just combines together completely with oxidation membrane pores.
Preferably, the material that the thickness of solid film rear oxidation film is more than or equal in 15um, the sealer in the step 3
Absorption is sealed at the film layer of 2/3 thickness of oxide-film ecto-entad.
Preferably, the fluorine carbon materials matter sealer spraying application baking temperature is 360 DEG C-430 DEG C, and the time is 5-8 points
Clock；
The spraying application time of the organosilicon sealer is 15-20 minutes, and baking temperature is 220 DEG C-280 DEG C；
The spraying application time of the molybdenum disulfide sealer is 20-30 minutes, and baking temperature is 200 DEG C-300 DEG C；
The spraying application temperature of the stearic acid sealer is 90 DEG C-110 DEG C, and baking time is 5-10 minutes.
The advantage of the invention is that：Oxidation rear substrate surface provided by the present invention pore inlays packing material and technology,
Embedded sealing of hole agent molecule, obtained finish surface in the surface pore of base material workpiece after oxidation, make workpiece have non-stick,
The advantage that coefficient of friction is low, antirust ability is strong, by the basal body structure that oxide-film is firm, with reference to the sealing material so that work
Part is more wear-resisting durable so that product can be widely used in various industry and life.
Brief description of the drawings
Fig. 1 is that the closing agent material of the present invention is embedded in the microstate schematic diagram on oxidation rear substrate surface.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.
The packing material for the closing oxidation rear substrate surface pore that the present invention is provided, the closing including the use of dilution dilution agent
Agent, sealer uses any one or more mixing in following four material：
A, fluorine carbon materials matter；B, organosilicon and inorganic silicon material；C, inorganic molybdenum disulfide material；D, unsaturated hydrocarbons, insatiable hunger
With the acid of glycerine three of aliphatic acid, palmitic acid, stearic acid, the glyceric acid ester type compound of unrighted acid or palmitic, stearic
Compound material.
The diluent includes following two：A, water are the aqueous diluent of solvent；B, with it is single one or more polarity or
The oiliness diluent of nonpolar organic solvent compounding.Diluent includes alcohol reagent, such as ethanol；Lipid reagent, such as second
Acetoacetic ester；Ketone reagent, such as acetone；Phenyl ring class reagent, such as dimethylbenzene；Heterocyclic reagent, such as pyrrolidones.
In construction according to specific construction parameter temperature, humidity and viscosity, the concentration of the sealer for 5%-
80%, it includes：
The aqueous dispersion of a, the fluorine carbon materials matter using poly- four ethene as representative.
B, the organosilicon are the oleaginous systems using dimethyl siloxane as representative.
C, the inorganic silicon are that, using the film layer of silica as representative, its solvent is using water as dispersion.
D, the inorganic molybdenum disulfide are the lysates using dimethylformamide to represent solvent.
E, the stearic acid are the sealer main bodys using pyrrolidones as solvent.
The enclosure method of oxidation rear substrate surface pore, comprises the following steps：
Step 1: the sealer needed for configuring as needed.
Step 2: filling perforation, is sprayed onto sealer in the hole that the base material workpiece surface after oxidation fills substrate surface, it is described
Workpiece refers to relatively loose porous, the more coarse steel substrate in surface, and these holes are sealed.
Step 3: solid film, carries out high temperature curve sintering so that the material in sealer is inlayed completely to the workpiece after filling perforation
It is sealed in the hole of workpiece surface, forms a tunic.Gu the material that the thickness of film rear oxidation film is more than or equal in 15um, sealer
Material absorption is sealed at the film layer of 2/3 thickness of oxide-film ecto-entad.
Ptfe emulsion class spraying application baking temperature in the fluorine carbon materials matter sealer is 360 DEG C -430 DEG C,
Time is 5-8 minutes.
The diformazan type siloxane spraying application time in the organosilicon sealer is 15-20 minutes, and baking temperature is
220℃—280℃。
The dimethyl formamide solution spraying application time in the molybdenum disulfide sealer is 20-30 minutes, baking temperature
Spend for 200 DEG C -300 DEG C.
Pyrrolidinone solvent spraying application temperature in the stearic acid sealer is 90 DEG C -110 DEG C, and baking time is
5-10 minutes.
Step 4: polishing or sanding, the workpiece after solid film is mechanically polished or sanding method by the loose of surface and
After unwanted layers are removed, above-mentioned sealer just combines together completely with oxide-film and hole.Because material is not in the sealer
It is sticky workpiece to be caused more outstanding and relatively more resistant to abrasive wear durable by the firm basal body structure of oxide-film with low coefficient of friction,
The finish surface obtained using such a closing mode, is that, to aoxidize membrane structure as main body, insertion is above-mentioned in substrate work-piece hole
The uncoated body surface of sealing of hole agent molecule, with fabulous feature, can adapt to a variety of industrial and life
Using.
Gu membrane process is prior art, Gu film refers to：Above-mentioned material and diluent are uniformly mixed into after liquid solvent, spray
The surface of workpiece substrate after to oxidation, because curing agent is liquid, therefore it can be flowed into the hole of workpiece surface, then in height
Bred during warm curve sintering so that curing agent liquid and substrate surface and hole strong bonded after oxidation, form one
Layer diaphragm, after then the loose and unwanted layers on surface are removed using the method for mechanical polishing, sanding, sealer and oxide-film
And hole just combines together completely, it is allowed to be formed the oxide-film of many premium properties, its performance includes non-adhesion behavior, low rubbed
Wipe coefficient.More outstanding and relatively more resistant to abrasive wear durable, such a closing mode for being allowed to embody by the firm basal body structure of oxide-film
The finish surface for finally obtaining us is to be embedded in above-mentioned hole sealing agent in substrate work-piece hole as main body to aoxidize membrane structure
The uncoated body surface of molecule so that product can be widely used in industry and life.
Material described in this programme has good non-stick in itself, but is difficult to fix with substrate work-piece, and this programme leads to
Cross and these materials are uniformly mixed with diluent respectively, the diluent is prior art, every kind of material has corresponding thereto
Diluent, the curing agent formed after mixing be liquid, curing agent is then sprayed on porose base material workpiece surface, curing agent handle
The hole of workpiece surface, which is filled up completely with, inlays, the state diagram after filling as shown in figure 1, in figure 1 be workpiece surface hole, 2 be above-mentioned
Any of which material molecule or its any combination in " a ", " b ", " c " or " d " four kinds of materials.
Embodiment described above can make those skilled in the art be more fully understood the present invention, but not to appoint
Where formula limitation is of the invention.Therefore, it will be appreciated by those skilled in the art that still can be modified to the present invention or equivalent
Replace；And technical scheme and its improvement of all spirit and technical spirit that do not depart from the present invention, it all should cover in the present invention
Among the protection domain of patent.
Claims (7)
1. the packing material of closing oxidation rear substrate surface pore, it is characterised in that：Including the use of the sealer of dilution dilution agent,
Sealer uses any one or more mixing in following four material：
A, fluorine carbon materials matter；B, organosilicon and inorganic silicon material；C, inorganic molybdenum disulfide material；D, unsaturated hydrocarbons, unsaturated lipid
Fat acid, palmitic acid, stearic acid, the glyceric acid ester type compound or the triglyceride of palmitic, stearic of unrighted acid
Compound material.
2. packing material according to claim 1, it is characterised in that the diluent includes following two：A, water are molten
The aqueous diluent of agent；B, the oiliness diluent with the singly polarity of one or more or nonpolar organic solvent compounding.
3. packing material according to claim 1 or 2, it is characterised in that：The diluent, which includes alcohol reagent, ketone, to be tried
Agent, phenyl ring class reagent or heterocyclic reagent.
4. packing material according to claim 1, it is characterised in that the concentration of the sealer is 5% -80%.
5. the enclosure method of rear substrate surface pore is aoxidized described in claim 1, it is characterised in that comprise the following steps：
Step 1: configuration sealer；
Step 2: filling perforation, is sprayed onto sealer in the hole that the base material workpiece surface after oxidation fills substrate surface, this some holes
Gap is sealed,
Step 3: solid film, carries out high temperature curve sintering so that the material in sealer inlays sealing completely to the workpiece after filling perforation
Hole and surface in workpiece, form a tunic；
Step 4: polishing or sanding, the workpiece after solid film is mechanically polished or sanding method by the loose and unnecessary of surface
After layer is removed, above-mentioned sealer just combines together completely with oxidation membrane pores.
6. enclosure method according to claim 5, it is characterised in that：The thickness of solid film rear oxidation film is big in the step 3
In equal to 15um, the material absorption in the sealer is sealed at the film layer of 2/3 thickness of oxide-film ecto-entad.
7. enclosure method according to claim 5, it is characterised in that：
The fluorine carbon materials matter sealer spraying application baking temperature is 360 DEG C-430 DEG C, and the time is 5-8 minutes；
The spraying application time of the organosilicon sealer is 15-20 minutes, and baking temperature is 220 DEG C-280 DEG C；
The spraying application time of the molybdenum disulfide sealer is 20-30 minutes, and baking temperature is 200 DEG C-300 DEG C；
The spraying application temperature of the stearic acid sealer is 90 DEG C-110 DEG C, and baking time is 5-10 minutes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610539519.6A CN106191964A (en) | 2016-07-09 | 2016-07-09 | Oxidation rear substrate surface pore inlays packing material and technology |
| CN2016105395196 | 2016-07-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107236978A true CN107236978A (en) | 2017-10-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610539519.6A Pending CN106191964A (en) | 2016-07-09 | 2016-07-09 | Oxidation rear substrate surface pore inlays packing material and technology |
| CN201710491610.XA Pending CN107236978A (en) | 2016-07-09 | 2017-06-26 | The enclosure method of the packing material and pore of closing oxidation rear substrate surface pore |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201610539519.6A Pending CN106191964A (en) | 2016-07-09 | 2016-07-09 | Oxidation rear substrate surface pore inlays packing material and technology |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111809214A (en) * | 2019-04-12 | 2020-10-23 | 平顶山市美伊金属制品有限公司 | Method for sealing pores on surface of oxidized substrate |
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| CN111809214A (en) * | 2019-04-12 | 2020-10-23 | 平顶山市美伊金属制品有限公司 | Method for sealing pores on surface of oxidized substrate |
| CN111809214B (en) * | 2019-04-12 | 2022-03-22 | 平顶山市美伊金属制品有限公司 | Method for sealing pores on surface of oxidized substrate |
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| CN106191964A (en) | 2016-12-07 |
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