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CN107124816A - The straight-through radiating copper base of one kind and its preparation technology - Google Patents

The straight-through radiating copper base of one kind and its preparation technology Download PDF

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Publication number
CN107124816A
CN107124816A CN201710229304.9A CN201710229304A CN107124816A CN 107124816 A CN107124816 A CN 107124816A CN 201710229304 A CN201710229304 A CN 201710229304A CN 107124816 A CN107124816 A CN 107124816A
Authority
CN
China
Prior art keywords
layer
copper
copper foil
polypropylene
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710229304.9A
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Chinese (zh)
Inventor
万海平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHANGHAI WLCP ELECTRICAL & TECHNOLOGY Co Ltd
Original Assignee
SHANGHAI WLCP ELECTRICAL & TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHANGHAI WLCP ELECTRICAL & TECHNOLOGY Co Ltd filed Critical SHANGHAI WLCP ELECTRICAL & TECHNOLOGY Co Ltd
Priority to CN201710229304.9A priority Critical patent/CN107124816A/en
Publication of CN107124816A publication Critical patent/CN107124816A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

Field is made the present invention relates to wiring board, specifically a kind of straight-through radiating copper base and its preparation technology.Including Copper base material layer, polypropylene layer, copper foil layer, it is characterised in that：The top of the Copper base material layer is sequentially provided with polypropylene layer and copper foil layer from bottom to up, the top of Copper base material layer is provided with a LED boss, the top of the LED boss sequentially passes through polypropylene layer and copper foil layer and exposed outside copper foil layer from bottom to up, the upper surface of the copper foil layer is provided with wire line, and ink layer is coated with the copper foil layer outside wire line.Compared with the existing technology, with high-termal conductivity, bulk thermal conductivity is more than 50W to the present invention, and as the raising of thermal conductivity not only increases the service life of module product, while reducing the bulk temperature of module, improves the product quality of LED modules.

Description

The straight-through radiating copper base of one kind and its preparation technology
Technical field
Field is made the present invention relates to wiring board, specifically a kind of straight-through radiating copper base and its preparation technology.
Background technology
Traditional circuit base plate manufacture craft circuit base plate wire is designed on same circuit base plate with heat dissipation bonding pad, because leading Therefore the design wire of line circuit has mixed polypropylene or other thermal conductive insulation glue systems with the insulation of radiating main material intermediate demand, and this is exhausted Mixing for edge layer generates larger thermal resistance to the radiating of whole substrate, therefore causes whole thermal conductivity to decline.Using LED There is bottleneck in the heat derives produced by journey, cause the reduction of LED service lifes, module material high-temperature oxydation repeatedly, heat product It is poly- to cause electronic component and wafer damage to cause electronic failure.
The content of the invention
The present invention improves mould to overcome the deficiencies in the prior art, a kind of straight-through radiating copper base of design and its preparation technology The service life of set product, and the bulk temperature of module is reduced, improve LED quality.
To achieve the above object, a kind of straight-through radiating copper base of design, including Copper base material layer, polypropylene layer, copper foil layer, its It is characterised by：The top of the Copper base material layer is sequentially provided with polypropylene layer and copper foil layer from bottom to up, and the top of Copper base material layer is set There is a LED boss, the top of the LED boss sequentially passes through polypropylene layer and copper foil layer and exposed in copper foil layer from bottom to up Outside, the upper surface of the copper foil layer is provided with wire line, and ink layer is coated with the copper foil layer outside wire line.
One is offered on the polypropylene and copper foil respectively with the shape in the hole of LED boss.
Some structure holes are offered on the Copper base material layer, the structure hole sequentially passes through polypropylene layer, copper from bottom to up Layers of foil and ink layer.
A kind of preparation technology of straight-through radiating copper base as claimed in claim 1, it is characterised in that comprise the following steps：
1）Step 1, shape needed for Copper base material being made into wiring board；
2）Step 2, etching resisting ink is pasted on Copper base material surface, fiting chemical etching mode is produced by way of image transfer LED boss；
3）Step 3, one is engraved on polypropylene and profile-followed in the hole of LED projection shapes and forms hollow out；
4）Step 4, one is engraved on copper foil and profile-followed in the hole of LED projection shapes and forms hollow out；
5）Step 5, it is combined, by triplicity and is formed after combination in the way of Copper base material, polypropylene and copper foil successively It is overall；
6）Step 6, the substrate surface for completing step 5 attaches etching resisting ink, by the method fiting chemical etching side for influenceing transfer Formula, makes wire line；
7）Step 7, the position that the substrate surface that complete step 6 need not be welded, prints curing ink, fixed welding；
8）Step 8, opening mechanism hole and profile on the substrate for completing step 7；
9）Step 9, it is surface-treated.
Hollow out is made by a kind of in punching or laser cutting on polypropylene in the step 3, wherein poly- Propylene can use other thermal conductive insulation glue systems.
Hollow out is made by a kind of in punching or laser cutting on copper foil in the step 4.
By Copper base material, polypropylene and copper foil triplicity it is combined by way of temperature-pressure in the step 5.
Opening mechanism hole and profile are made by a kind of in punching or CNC in the step 8.
Compared with the existing technology, with high-termal conductivity, bulk thermal conductivity is more than 50W to the present invention, and carrying with thermal conductivity Height not only increases the service life of module product, while reducing the bulk temperature of module, improves the product product of LED modules Matter.
Brief description of the drawings
Fig. 1 is the structural representation of copper-based flaggy in the present invention.
Fig. 2 is the structural representation of polypropylene layer in the present invention.
Fig. 3 is the structural representation of copper foil layer in the present invention.
Fig. 4 is the structural representation after completion step 5 in the present invention.
Fig. 5 is the structural representation after completion step 6 in the present invention.
Fig. 6 is structural representation of the invention.
Referring to Fig. 1~Fig. 6, wherein, 1 is copper-based flaggy, and 2 be LED boss, and 3 be polypropylene layer, and 4 be copper foil layer, and 5 be hole, 6 be structure hole, and 7 be wire line, and 8 be ink layer.
Embodiment
Embodiment one：
As shown in figure 1, the main material that Copper base material layer 1 is conducted as LED heat, and etching resisting ink is attached in Copper base material layer surface, The LED boss 2 for needing to weld LED location is made by the formula fiting chemical etching mode of image transfer.Meanwhile, such as scheme Shown in 2 and Fig. 3, respectively on polypropylene layer 3 and copper foil layer 4 by the way of punching or laser cutting by corresponding " LED boss 2 position " is punched to form hollow out.Then as shown in figure 4, successively in sequence Copper base material layer 1, polypropylene layer 3, copper foil layer 4 Mode, be combined, triplicity is formed entirety by the way of temperature-pressure after combination, the product after combination is by centre Layer polypropylene layer 3 makes LED lug boss positions be separated with surface lines copper foil layer 4 as insulating barrier, so as to realize straight-through independent radiating And the structure of wire line separation.As shown in figure 5, etching resisting ink is attached on the surface of copper foil layer 4, by way of image transfer Fiting chemical etching mode, makes wire line 7.As shown in fig. 6, in the position that need not will be welded on copper foil layer 4, printing Ink, fixed welding position, it is to avoid connect tin in welding process and obtain other bad, protects substrate layer.Finally successively by mechanism orifice and Profile is made by way of punching or CNC, while being surface-treated to avoid welding copper face exposure oxygen in atmosphere Change influence welding, improve welding quality.
The present invention is in use, with high-termal conductivity, bulk thermal conductivity>50W, can not only be improved with the raising of thermal conductivity Product service life, while reducing module bulk temperature, improves LED module product quality.

Claims (8)

1.一种直通散热铜基板，包括铜基材层，聚丙烯层，铜箔层，其特征在于：所述铜基材层（1）的上方从下至上依次设有聚丙烯层（3）和铜箔层（4），铜基材层（1）的上方设有一个LED凸台（2），所述LED凸台（2）的顶部从下至上依次贯穿聚丙烯层（3）和铜箔层（4）并露出在铜箔层（4）外，所述铜箔层（4）的上表面设有导线线路（7），位于导线线路（7）外的铜箔层（4）上涂覆有油墨层（8）。1. A straight-through heat dissipation copper substrate, including a copper substrate layer, a polypropylene layer, and a copper foil layer, characterized in that: the copper substrate layer (1) is sequentially provided with a polypropylene layer (3) from bottom to top and a copper foil layer (4), an LED boss (2) is provided above the copper substrate layer (1), and the top of the LED boss (2) runs through the polypropylene layer (3) and the copper layer from bottom to top in sequence The foil layer (4) is exposed outside the copper foil layer (4), and the upper surface of the copper foil layer (4) is provided with a wire line (7), which is located on the copper foil layer (4) outside the wire line (7) Coated with an ink layer (8). 2.如权利要求1所述的一种直通散热铜基板，其特征在于：所述聚丙烯（3）和铜箔（4）上分别开设有一个随形于LED凸台（2）的孔（5）。2. A straight-through heat dissipation copper substrate according to claim 1, characterized in that: said polypropylene (3) and copper foil (4) are respectively provided with a hole ( 5). 3.如权利要求1所述的一种直通散热铜基板，其特征在于：所述铜基材层（1）上开设有若干结构孔（6），所述结构孔（6）从下至上依次贯穿聚丙烯层（3）、铜箔层（4）和油墨层（8）。3. A through heat dissipation copper substrate according to claim 1, characterized in that: the copper substrate layer (1) is provided with a number of structural holes (6), and the structural holes (6) are sequentially arranged from bottom to top Through the polypropylene layer (3), copper foil layer (4) and ink layer (8). 4.一种如权利要求1所述的直通散热铜基板的制备工艺，其特征在于包括如下步骤：4. A preparation process for a straight-through heat dissipation copper substrate as claimed in claim 1, characterized in that it comprises the steps of: 1）步骤1，将铜基材做成线路板所需形状；1) Step 1, make the copper substrate into the shape required by the circuit board; 2）步骤2，在铜基材表面贴覆抗蚀油墨，通过影像转移的方式配合化学蚀刻方式制作出LED凸台；2) Step 2, paste the anti-corrosion ink on the surface of the copper substrate, and make the LED boss through the method of image transfer and chemical etching; 3）步骤3，在聚丙烯上镂刻一个随形于LED凸台形状的孔并形成镂空；3) Step 3, engraving a hole conforming to the shape of the LED boss on the polypropylene and forming a hollow; 4）步骤4，在铜箔上镂刻一个随形于LED凸台形状的孔并形成镂空；4) Step 4, engraving a hole conforming to the shape of the LED boss on the copper foil and forming a hollow; 5）步骤5，依次按照铜基材、聚丙烯和铜箔的方式进行组合，组合后将三者结合并形成整体；5) Step 5, sequentially combine the copper base material, polypropylene and copper foil, and combine the three to form a whole; 6）步骤6，完成步骤5的基板表面贴附抗蚀油墨，通过影响转移的方法配合化学蚀刻方式，制作导线线路；6) Step 6, finish attaching the resist ink on the surface of the substrate in step 5, and make the wire circuit through the method of affecting the transfer and matching the chemical etching method; 7）步骤7，将完成步骤6的基板表面不需要焊接的位置，印刷上油墨，固定焊接；7) In step 7, print the ink on the position on the surface of the substrate that does not need to be welded in step 6, and fix the welding; 8）步骤8，在完成步骤7的基板上开机构孔和外形；8) Step 8, opening mechanical holes and shapes on the substrate that completed step 7; 9）步骤9，表面处理。9) Step 9, surface treatment. 5.如权利要求4所述的一种直通散热铜基板的制备工艺，其特征在于：所述步骤3中在聚丙烯上镂空是通过冲切或激光切割中的一种来制作的，其中聚丙烯可以使用其他导热绝缘胶系。5. The preparation process of a through-through heat dissipation copper substrate as claimed in claim 4, characterized in that: in the step 3, hollowing out the polypropylene is made by punching or laser cutting, wherein the polypropylene Propylene can use other thermally conductive and insulating adhesive systems. 6.如权利要求4所述的一种直通散热铜基板的制备工艺，其特征在于：所述步骤4中在铜箔上镂空是通过冲切或激光切割中的一种来制作的。6 . The manufacturing process of through-through heat dissipation copper substrate according to claim 4 , wherein the hollowing out on the copper foil in the step 4 is made by punching or laser cutting. 6 . 7.如权利要求4所述的一种直通散热铜基板的制备工艺，其特征在于：所述步骤5中将铜基材、聚丙烯和铜箔三者结合是通过加温加压的方式进行组合。7. The preparation process of a through heat dissipation copper substrate as claimed in claim 4, characterized in that: in the step 5, the combination of the copper substrate, polypropylene and copper foil is carried out by heating and pressurizing combination. 8.如权利要求4所述的一种直通散热铜基板的制备工艺，其特征在于：所述步骤8中开机构孔和外形是通过冲切或CNC中的一种来制作的。8. The manufacturing process of through-through heat dissipation copper substrate as claimed in claim 4, characterized in that: in the step 8, opening mechanism holes and shapes are made by punching or CNC.
CN201710229304.9A 2017-04-10 2017-04-10 The straight-through radiating copper base of one kind and its preparation technology Pending CN107124816A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110167258A (en) * 2019-05-24 2019-08-23 上海温良昌平电器科技股份有限公司 A kind of aluminium plating copper substrate structure and its preparation process
CN112820814A (en) * 2021-02-26 2021-05-18 上海鼎晖科技股份有限公司 Dam-free COB LED substrate and preparation method and application thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020100967A1 (en) * 1997-12-10 2002-08-01 Morio Gaku Semiconductor plastic package and process for the production thereof
CN101192601A (en) * 2006-11-30 2008-06-04 东芝照明技术株式会社 Lighting device with semiconductor light emitting element
US20080278917A1 (en) * 2007-05-07 2008-11-13 Advanced Connectek Inc. Heat dissipation module and method for fabricating the same
TW201112460A (en) * 2009-09-25 2011-04-01 yi-zhang Chen Heat dissipation substrate for LED and method of manufacturing the same
US20110101410A1 (en) * 2008-03-25 2011-05-05 Lin Charles W C Semiconductor chip assembly with post/base/post heat spreader
CN103687278A (en) * 2013-11-26 2014-03-26 广州兴森快捷电路科技有限公司 Boss-type metal-based sandwich rigid-flex plate and production method thereof
CN105304390A (en) * 2015-11-04 2016-02-03 昆山兴协和光电科技有限公司 LED strip, manufacturing method of LED strip as well as backlight module and keyboard using LED strip
CN106455291A (en) * 2016-08-22 2017-02-22 景旺电子科技(龙川)有限公司 Metal copper-based printed board structure with high heat dissipation and preparation method thereof
CN206963171U (en) * 2017-04-10 2018-02-02 上海温良昌平电器科技股份有限公司 The straight-through radiating copper base of one kind

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020100967A1 (en) * 1997-12-10 2002-08-01 Morio Gaku Semiconductor plastic package and process for the production thereof
CN101192601A (en) * 2006-11-30 2008-06-04 东芝照明技术株式会社 Lighting device with semiconductor light emitting element
US20080278917A1 (en) * 2007-05-07 2008-11-13 Advanced Connectek Inc. Heat dissipation module and method for fabricating the same
US20110101410A1 (en) * 2008-03-25 2011-05-05 Lin Charles W C Semiconductor chip assembly with post/base/post heat spreader
TW201112460A (en) * 2009-09-25 2011-04-01 yi-zhang Chen Heat dissipation substrate for LED and method of manufacturing the same
CN103687278A (en) * 2013-11-26 2014-03-26 广州兴森快捷电路科技有限公司 Boss-type metal-based sandwich rigid-flex plate and production method thereof
CN105304390A (en) * 2015-11-04 2016-02-03 昆山兴协和光电科技有限公司 LED strip, manufacturing method of LED strip as well as backlight module and keyboard using LED strip
CN106455291A (en) * 2016-08-22 2017-02-22 景旺电子科技(龙川)有限公司 Metal copper-based printed board structure with high heat dissipation and preparation method thereof
CN206963171U (en) * 2017-04-10 2018-02-02 上海温良昌平电器科技股份有限公司 The straight-through radiating copper base of one kind

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
吴建辉: "《印制电路板的电磁兼容性设计》", 28 February 2005, 北京：国防工业出版社, pages: 41 - 42 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110167258A (en) * 2019-05-24 2019-08-23 上海温良昌平电器科技股份有限公司 A kind of aluminium plating copper substrate structure and its preparation process
CN110167258B (en) * 2019-05-24 2024-06-25 上海温良昌平电器科技股份有限公司 Aluminum copper-plated substrate structure and preparation process thereof
CN112820814A (en) * 2021-02-26 2021-05-18 上海鼎晖科技股份有限公司 Dam-free COB LED substrate and preparation method and application thereof

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Application publication date: 20170901

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