CN107068919A - The method for manufacturing flexible panel - Google Patents

Abstract

The invention relates to a method for manufacturing a flexible panel, comprising: forming an electrorheological layer on a supporting substrate under the condition of applying an electric field; forming a flexible substrate on the electrorheological layer; forming the flexible substrate on the flexible substrate. Other structures of the panel; and changing the state of the electric field to change the electro-rheological layer into a liquid state to separate the flexible base from the supporting substrate. Using the method for manufacturing a flexible panel according to the present invention, the flexible panel can be easily peeled off from the support substrate, thereby avoiding possible damage to the flexible substrate or other substances remaining on the flexible panel during the peeling process of the flexible substrate.

Description

Method for manufacturing flexible panels

technical field

The present invention relates to a method of manufacturing a flexible panel.

Background technique

In recent years, various bendable flexible panels (eg, flexible display panels, flexible touch panels, etc.) have been developed. In the process of manufacturing these flexible panels, in order to support and move the flexible panels, the flexible panels are usually fabricated on a rigid support substrate, and then the flexible panels are peeled off from the support substrate.

Currently, laser lift-off is typically used to lift the flexible panel from the support substrate. However, during the laser lift-off process, the energy of the laser may affect the devices in the flexible panel. In addition, other substances may remain on the flexible panel during the peeling process.

Contents of the invention

In order to solve the defects existing in the prior art, aspects of the present invention provide a method for manufacturing a flexible panel.

According to an aspect of the present invention, a method of manufacturing a flexible panel includes: forming an electrorheological layer on a support substrate under the condition of applying an electric field; forming a flexible substrate on the electrorheological layer; forming a flexible substrate on the flexible substrate Other structures of the flexible panel; and changing the state of the electric field to make the electro-rheological layer into a liquid state, so that the flexible base is separated from the supporting substrate.

Optionally, changing the state of the electric field includes reducing the electric field strength such that the electric field strength is substantially lower than a critical value.

Optionally, the critical value is a critical electric field value at which the material of the electro-rheological layer changes from a solid state to a liquid state.

Optionally, the electro-rheological layer comprises: urea-coated Ba-Ti-O nanoparticles doped with rubidium (Rb) element.

Optionally, the method further includes: forming an adhesive layer between the supporting substrate and the flexible base to fix the flexible base to the supporting substrate.

Optionally, the adhesive layer surrounds the electro-rheological layer.

Optionally, the adhesive layer is formed on a peripheral portion of the flexible panel.

Optionally, the method further includes: cutting the flexible panel along a cutting line to remove a portion formed with the adhesive layer.

Optionally, the electro-rheological layer flows out through the cutting line, so that the flexible base is separated from the supporting substrate.

Optionally, the flexible panel is cut by wheel cutting or laser cutting.

In the method of manufacturing a flexible panel according to the present invention, an electrorheological layer is formed on a support substrate under application of an electric field; a flexible base is formed on the electrorheological layer; and the flexible panel is formed on the flexible base and changing the state of the electric field so that the electro-rheological layer becomes a liquid state, so that the flexible base is separated from the supporting substrate. Using the method for manufacturing a flexible panel according to the present invention, the flexible panel can be easily peeled off from the support substrate, thereby avoiding possible damage to the flexible substrate or other substances remaining on the flexible panel during the peeling process of the flexible substrate.

Description of drawings

The accompanying drawings are used to provide a further understanding of the present invention, and constitute a part of the description, together with the following specific embodiments, are used to explain the present invention, but do not constitute a limitation to the present invention. In the attached picture:

1 is a flowchart of a method for manufacturing a flexible panel according to one embodiment of the present invention;

2 is a schematic cross-sectional view of a method of manufacturing a flexible panel according to an embodiment of the present invention;

3 is a schematic cross-sectional view of a method of manufacturing a flexible panel according to another embodiment of the present invention; and

4 is a schematic cross-sectional view of a method of manufacturing a flexible panel according to another embodiment of the present invention.

detailed description

In order for those skilled in the art to better understand the technical solution of the present disclosure, the method for manufacturing a flexible panel provided by the present disclosure will be further described in detail below with reference to the accompanying drawings and specific embodiments.

FIG. 1 is a flowchart of a method for manufacturing a flexible panel according to an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view of a method for manufacturing a flexible panel according to an embodiment of the present invention. Referring to Figures 1 and 2, a method for manufacturing a flexible panel according to an embodiment of the present invention includes the following steps:

Step 101 , forming an electrorheological layer 110 on a support substrate 100 . The electrorheological layer can undergo a solid-liquid transition according to the state of the electric field. For example, when an electric field is applied, the electrorheological layer 110 may have a solid state when the electric field strength is higher than a certain threshold. In addition, the electro-rheological layer 110 may transition to a liquid state when the strength of the electric field decreases below the threshold. In other words, the electro-rheological layer 110 has a critical value (such as the above-mentioned threshold value), which is a critical electric field value for the material of the electro-rheological layer to change from a solid state to a liquid state. For example, in one embodiment, the electrorheological layer 110 may include urea-coated Ba—Ti—O nanoparticles doped with rubidium (Rb) elements.

Since the electrorheological layer 110 has different shapes according to the change of the electric field, step 101 may be performed under the condition that the electric field is applied. The above description of the electro-rheological layer 110 is only an example, and the present invention is not limited thereto. In the present invention, other electro-rheological materials may also be used to form the electro-rheological layer 110 .

Step 102 , forming a flexible substrate 120 on the electro-rheological layer 110 . In this step, when the flexible substrate 120 is formed, the electro-rheological layer 110 may have a solid form. Therefore, during the process of forming the flexible substrate 120 , the electro-rheological layer 110 can maintain its shape, so that the flexible substrate 120 can be supported and carried on the support substrate 100 .

The flexible substrate 120 may be formed of, for example, polyimide (PI) to be used as a substrate of the flexible panel. However, the present invention is not limited thereto, and the flexible base 120 may be made of other suitable base materials.

Step 103 , forming other structures 200 of the flexible panel on the flexible substrate 120 . After the flexible substrate 120 is formed, other structures 200 of the flexible panel can be formed on the flexible substrate 120 according to actual needs. For example, when the flexible panel is an organic light emitting diode (OLED) display panel, a thin film transistor (TFT) driving circuit, a pixel electrode, an organic light emitting layer, a common electrode and various functional layer structures may be formed on the flexible substrate 120 . However, the present invention is not limited thereto. For example, when the flexible panel is a flexible touch panel, structures such as detection electrodes and driving electrodes may be formed on the flexible substrate 120 . Those skilled in the art can realize other structures 200 of forming flexible panels on the flexible substrate 120 according to actual needs under the enlightenment of the present invention, so details will not be repeated here.

Step 104 , changing the state of the electric field to make the electro-rheological layer 110 into a liquid state, so as to separate the flexible substrate 120 from the support substrate 100 . When the state of the electric field changes, the electrorheological layer 110 changes from a solid state to a liquid state, and can flow out from between the flexible substrate 120 and the supporting substrate 100 , thereby separating the flexible substrate 120 from the supporting substrate 100 .

According to this embodiment, in the method of manufacturing a flexible panel, in the case of applying an electric field, an electrorheological layer is formed on a supporting substrate; a flexible substrate is formed on the electrorheological layer; and the flexible substrate is formed on the flexible substrate. Other structures of the panel; and changing the state of the electric field to change the electro-rheological layer into a liquid state to separate the flexible base from the supporting substrate. Using the method for manufacturing a flexible panel according to the present invention, the flexible panel can be easily peeled off from the support substrate, thereby avoiding possible damage to the flexible substrate or other substances remaining on the flexible panel during the peeling process of the flexible substrate.

In the foregoing embodiments, when the electric field intensity is higher than a certain threshold, the electrorheological layer 110 may have a solid state. In addition, the electro-rheological layer 110 may transition to a liquid state when the strength of the electric field decreases below the threshold. Therefore, in order to change the state of the electric field and make the electrorheological layer 110 into a liquid state, the electric field strength can be reduced so that the electric field strength is much lower than the critical value. Optionally, in this embodiment, it is also possible to cancel the applied electric field (ie, reduce the electric field strength to 0).

FIG. 3 is a schematic cross-sectional view of a method of manufacturing a flexible panel according to another embodiment of the present invention. Referring to FIG. 3 , an adhesive layer 130 may be further formed between the support substrate 100 and the flexible substrate 120 to fix the flexible substrate 120 to the support substrate 100 . The adhesive 130 may fix the flexible base 120 to the support substrate 100 , and the adhesive layer 130 may be formed to surround the electro-rheological layer 110 .

In one embodiment, the adhesive layer 130 may be formed before the electro-rheological layer 110 is formed, so that the electro-rheological layer 110 may be formed in the space surrounded by the adhesive layer 130 to prevent the electro-rheological layer 110 from flowing to other places. part. In one embodiment, the adhesive layer 130 may be formed of sealant.

In the embodiment shown in FIG. 3, the adhesive layer 130 is formed on the peripheral portion of the flexible panel. For example, the adhesive layer 130 is formed in a region other than an active area of the flexible panel (eg, in the case of a flexible display panel, the active area includes a display area of the flexible display panel). In this embodiment, after the flexible panel is manufactured, the flexible panel can be cut along the cutting line 140 to remove the portion formed with the adhesive layer 130 .

After the portion where the adhesive layer 130 is formed is removed, the electro-rheological layer 110 flows out through the cutting line 140 under the condition that the electro-rheological layer 110 becomes liquid, so that the flexible base 120 is separated from the support substrate 100 . In this embodiment, the flexible panel can be cut along the cutting line 140 before or after the electro-rheological layer 110 becomes liquid.

In one embodiment, the flexible panel may be slit using wheel cutting or laser cutting. Those skilled in the art can specifically implement the solution of splitting the flexible panel under the enlightenment of the present invention, so details will not be repeated here.

4 is a schematic cross-sectional view of a method of manufacturing a flexible panel according to another embodiment of the present invention. Referring to FIG. 4 , a plurality of flexible panels are formed on the supporting substrate 100 at one time, and an electrorheological layer 110 is formed between each flexible panel and the supporting substrate 100 , and each electrorheological layer 110 can be separated by an adhesive layer 130 open. In the embodiment of FIG. 4 , when the flexible panel is cut along the cutting line 140 , each flexible panel is separated from each other, thereby forming a plurality of flexible panels at one time, so as to further improve production efficiency.

The specific manner of forming multiple flexible panels at one time is basically the same as the details described in the foregoing embodiments, and will not be repeated here.

In the method of manufacturing a flexible panel according to the present invention, an electrorheological layer is formed on a support substrate under application of an electric field; a flexible base is formed on the electrorheological layer; and the flexible panel is formed on the flexible base and changing the state of the electric field so that the electro-rheological layer becomes a liquid state, so that the flexible base is separated from the supporting substrate. Using the method for manufacturing a flexible panel according to the present invention, the flexible panel can be easily peeled off from the support substrate, thereby avoiding possible damage to the flexible substrate or other substances remaining on the flexible panel during the peeling process of the flexible substrate.

It can be understood that, the above embodiments are only exemplary embodiments adopted for illustrating the principle of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also regarded as the protection scope of the present invention.

Claims (10)

1. a kind of method for manufacturing flexible panel, including：

In the case where applying electric field, electric current change layer is formed on supporting substrate；

Flexible substrates are formed in the electric current change layer；

The other structures of the flexible panel are formed in the flexible substrates；And

Change the state of the electric field, electric current change layer is changed into liquid condition, so that the flexible substrates and the supporting substrate Separation.

2. according to the method described in claim 1, wherein, changing the state of the electric field includes reduction electric-field intensity so that electricity Field intensity is significantly less than critical value.

3. method according to claim 2, wherein, the critical value is turned for the material of the electric current change layer by solid state It is changed into the critical electric field value of liquid body.

4. according to the method described in claim 1, wherein, the electric current change layer is included：The urea cladding of doping rubidium (Rb) element Ba-Ti-O nano particles.

5. according to the method described in claim 1, in addition to：

Adhesive phase is formed between the supporting substrate and the flexible substrates, the flexible substrates are fixed to the branch Support group plate.

6. method according to claim 5, wherein, described adhesive layer surrounds the electric current change layer.

7. method according to claim 5, wherein, described adhesive layer forms the periphery in the flexible panel.

8. method according to claim 7, in addition to：Along flexible panel described in line of cut cutting, to be formed with removing State the part of adhesive phase.

9. method according to claim 8, wherein, electric current change layer is flowed out by the line of cut so that the flexible base Bottom is separated with the supporting substrate.

10. method according to claim 8, wherein, cut or be cut by laser come flexible panel described in cutting using break bar.