CN107059077A - Improve the method for electroplating evenness - Google Patents
Improve the method for electroplating evenness Download PDFInfo
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- CN107059077A CN107059077A CN201611248038.6A CN201611248038A CN107059077A CN 107059077 A CN107059077 A CN 107059077A CN 201611248038 A CN201611248038 A CN 201611248038A CN 107059077 A CN107059077 A CN 107059077A
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000009713 electroplating Methods 0.000 title claims abstract description 20
- 238000007747 plating Methods 0.000 claims abstract description 72
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 230000010354 integration Effects 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 13
- 238000004458 analytical method Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Improve the method for electroplating evenness the present invention relates to a kind of, comprise the following steps：In the case of without cathode baffle, bare board is electroplated；The plate face for completing plating is averagely divided into N number of plating area；The plating thickness of each plating area is measured, and calculates plating thickness average；Set the corresponding cathode baffle percent opening of plating thickness average；Calculate the percent opening of each plating area of cathode baffle correspondence.This method is by calculating under the conditions of without cathode baffle, the average value of product surface plating thickness, so as to set up the reference data of cathode baffle perforate design, and pass through the analysis to product surface plating thickness, the anti-distribution for pushing away negative electrode plate face power line, perforate design is carried out to cathode baffle according to " similitude " principle, by the percent opening for adjusting each position of cathode baffle, reach the distribution of balance negative electrode plate face power line, and then effectively improve the uniformity of graphic plating, product quality is improved, and this method is applied to all gantry and electroplates producing line.
Description
Technical field
It is more particularly to a kind of to improve the method for electroplating evenness the present invention relates to electroplating technology field.
Background technology
Graphic plating uniformity is all the time to produce in the industry problem, and tradition improves the method for graphic plating uniformity to increase
If cathode baffle carries out overall adjustment, but conventional cathode baffle design is big regional bulk shielding design, can only be to negative electrode
The regulation of electric force lines distribution globality, it is impossible to carry out the adjustment that becomes more meticulous, is so easily caused the partially thin region of plating thickness originally, because of the moon
Pole baffle plate integrated regulation causes thickness of coating to become thinner, it is impossible to meet product quality and graphic plating uniformity controlling is wanted
Ask.
The content of the invention
Improve the method for electroplating evenness it is an object of the invention to provide a kind of, graphic plating uniformity can be improved,
Improve product quality.
To realize the purpose of the present invention, adopt the technical scheme that：
It is a kind of to improve the method for electroplating evenness, comprise the following steps：
In the case of without cathode baffle, bare board is electroplated；
The plate face for completing plating is averagely divided into N number of plating area；
Measure the plating thickness X of each plating areai, and calculate plating thickness average
The corresponding cathode baffle percent opening of plating thickness average is set as f；
Calculate the percent opening of each plating area of cathode baffle correspondence
This method is by calculating under the conditions of without cathode baffle, the average value of product surface plating thickness, so as to set up
The reference data of cathode baffle perforate design, and by the analysis to product surface plating thickness, it is counter to push away negative electrode plate face electric power
The distribution of line, carries out perforate design, by adjusting opening for each position of cathode baffle according to " similitude " principle to cathode baffle
Porosity, reaches the distribution of balance negative electrode plate face power line, and then effectively improves the uniformity of graphic plating, improves product product
Matter, and this method highly versatile, it is adaptable to electroplate producing line in all gantry.
Technical scheme is further illustrated below：
It is further that after the plating thickness for measuring each plating area, the data of measurement are fitted into plating thickness
Write music mapping.It is easy to analyze the thickness of electrodeposited coating.
It is further after the percent opening for calculating each plating area of cathode baffle correspondence, the data of calculating to be carried out equal
Change and integrate, and fit cathode baffle opening area distribution map.Data to calculating carry out balanced integration, and cathode baffle is according to area
Domain property carries out perforate design, is easy to the perforate of cathode baffle to make, and reduces manufacture difficulty.
It is further that the n plating area of opening area correspondence of cathode baffle, the regionality of the opening area is opened
PorosityWherein, 1≤n≤N.
It is further that the corresponding percent opening deviation in any two plating area in same opening area is d, its
In 0≤d≤3%.
It is further to calculate perforated area s=f ＇ × S of opening area, wherein, S is the gross area of opening area.
It is further, perforated area s=t × d, wherein, t is perforate number, and d is bore size.
It is further, wherein, 6mm≤d≤12mm.
It is further to adjust corresponding open by adjusting the perforate number or bore size of cathode baffle different zones
Porosity.
It is further, wherein, 30%≤f≤60%.
Compared with prior art, the invention has the advantages that：
The present invention is by calculating under the conditions of without cathode baffle, the average value of product surface plating thickness, so as to set up
The reference data of cathode baffle perforate design, and by the analysis to product surface plating thickness, it is counter to push away negative electrode plate face electric power
The distribution of line, carries out perforate design, by adjusting opening for each position of cathode baffle according to " similitude " principle to cathode baffle
Porosity, reaches the distribution of balance negative electrode plate face power line, and then effectively improves the uniformity of graphic plating, improves product product
Matter, and this method highly versatile, it is adaptable to electroplate producing line in all gantry.
Brief description of the drawings
Fig. 1 is the schematic flow sheet for the method that the embodiment of the present invention improves electroplating evenness；
Fig. 2 is plating thickness curved surface distribution map of the embodiment of the present invention；
Fig. 3 is cathode baffle opening area distribution map of the embodiment of the present invention.
Description of reference numerals：
10. plating area, 20. opening areas.
Embodiment
Embodiments of the invention are described in detail below in conjunction with the accompanying drawings：
As shown in figure 1, a kind of improve the method for electroplating evenness, comprise the following steps：
In the case of without cathode baffle, bare board is electroplated；
The plate face for completing plating is averagely divided into N number of plating area 10；
Measure the plating thickness X of each plating area 10i, and calculate plating thickness average
The corresponding cathode baffle percent opening of plating thickness average is set as f；
Calculate the percent opening of each plating area 10 of cathode baffle correspondence
This method is by calculating under the conditions of without cathode baffle, the average value of product surface plating thickness, so as to set up
The reference data of cathode baffle perforate design, and by the analysis to product surface plating thickness, it is counter to push away negative electrode plate face electric power
The distribution of line, carries out perforate design, by adjusting opening for each position of cathode baffle according to " similitude " principle to cathode baffle
Porosity, reaches the distribution of balance negative electrode plate face power line, and then effectively improves the uniformity of graphic plating, improves product product
Matter, and this method highly versatile, it is adaptable to electroplate producing line in all gantry.
In the present embodiment, with reference to table 1, the plate face for completing plating is averagely divided into 200 plating areas 10, each electricity
Plate the plating thickness X in region 10i, and as shown in Fig. 2 the data of measurement are fitted into plating thickness curved surface distribution map, just
Analyzed in the thickness to electrodeposited coating.The quantity of plating area 10 can also be set as other values according to the size of plate face.Table 1
For the plating thickness value of each plating area 10.
| 0.376 | 0.378 | 0.38 | 0.381 | 0.379 | 0.376 | 0.379 | 0.378 | 0.377 | 0.386 |
| 0.361 | 0.362 | 0.364 | 0.363 | 0.366 | 0.362 | 0.368 | 0.36 | 0.367 | 0.372 |
| 0.359 | 0.353 | 0.362 | 0.36 | 0.35 | 0.355 | 0.351 | 0.354 | 0.368 | 0.363 |
| 0.356 | 0.351 | 0.355 | 0.352 | 0.351 | 0.352 | 0.349 | 0.354 | 0.359 | 0.363 |
| 0.346 | 0.343 | 0.353 | 0.353 | 0.355 | 0.349 | 0.348 | 0.347 | 0.351 | 0.357 |
| 0.331 | 0.341 | 0.347 | 0.349 | 0.354 | 0.342 | 0.343 | 0.343 | 0.355 | 0.351 |
| 0.333 | 0.336 | 0.346 | 0.346 | 0.346 | 0.344 | 0.345 | 0.339 | 0.353 | 0.363 |
| 0.335 | 0.335 | 0.339 | 0.354 | 0.348 | 0.339 | 0.343 | 0.343 | 0.348 | 0.351 |
| 0.348 | 0.34 | 0.342 | 0.341 | 0.343 | 0.345 | 0.341 | 0.335 | 0.349 | 0.355 |
| 0.354 | 0.344 | 0.353 | 0.351 | 0.348 | 0.34 | 0.344 | 0.345 | 0.357 | 0.367 |
| 0.374 | 0.368 | 0.371 | 0.365 | 0.365 | 0.358 | 0.358 | 0.351 | 0.366 | 0.373 |
| 0.368 | 0.362 | 0.366 | 0.366 | 0.359 | 0.36 | 0.356 | 0.351 | 0.358 | 0.368 |
| 0.367 | 0.365 | 0.36 | 0.37 | 0.361 | 0.364 | 0.355 | 0.354 | 0.357 | 0.367 |
| 0.37 | 0.363 | 0.369 | 0.372 | 0.368 | 0.366 | 0.361 | 0.356 | 0.376 | 0.369 |
| 0.37 | 0.372 | 0.374 | 0.375 | 0.373 | 0.367 | 0.367 | 0.369 | 0.383 | 0.382 |
| 0.378 | 0.372 | 0.38 | 0.379 | 0.378 | 0.374 | 0.375 | 0.373 | 0.387 | 0.389 |
| 0.384 | 0.376 | 0.376 | 0.373 | 0.383 | 0.382 | 0.383 | 0.38 | 0.386 | 0.387 |
| 0.383 | 0.384 | 0.387 | 0.388 | 0.385 | 0.383 | 0.384 | 0.379 | 0.384 | 0.39 |
| 0.397 | 0.397 | 0.398 | 0.399 | 0.395 | 0.39 | 0.392 | 0.39 | 0.392 | 0.393 |
| 0.416 | 0.409 | 0.417 | 0.413 | 0.415 | 0.405 | 0.404 | 0.396 | 0.395 | 0.391 |
Table 1
According to the measurement data of table 1, the plating thickness average of the embodiment is 0.365 μm, and sets the plating thickness
It is that f is 50% to spend the corresponding cathode baffle percent opening of average, and percent opening f can also be set according to the distance of anode and negative electrode, plating
The factors such as standby and electroplating parameter are selected between 30%-60%.
The percent opening f of each plating area 10 of cathode baffle correspondence is calculated by percent opening fi, with reference to table 2, and such as Fig. 3 institutes
Show, by the homogenizing integration of the data of calculating, and fit cathode baffle opening area distribution map.Table 2 is each plating area
10 percent opening fi。
In the present embodiment, after homogenizing is integrated, cathode baffle is divided into four kinds of opening areas 20, as shown in figure 3,
Different opening areas 20 are distinguished by different colors, the corresponding percent opening scope of four kinds of opening areas 20 is respectively 45%-
48%th, the correspondence of any two plating area 10 in 48%-50%, 50%-53%, 53%-55%, same opening area 20
Percent opening deviation be d, wherein 0≤d≤3%.
As shown in figure 3, the n plating area 10 of an opening area 20 correspondence of cathode baffle, the area of the opening area 20
Domain property percent openingWherein, 1≤n≤N.Data to calculating carry out balanced integration, and cathode baffle is according to regionality
Perforate design is carried out, is easy to the perforate of cathode baffle to make, manufacture difficulty is reduced.
| 52% | 52% | 52% | 52% | 52% | 52% | 52% | 52% | 52% | 53% |
| 49% | 50% | 50% | 50% | 50% | 50% | 50% | 49% | 50% | 51% |
| 49% | 48% | 50% | 49% | 48% | 49% | 48% | 48% | 50% | 50% |
| 49% | 48% | 49% | 48% | 48% | 48% | 48% | 48% | 49% | 50% |
| 47% | 47% | 48% | 48% | 49% | 48% | 48% | 48% | 48% | 49% |
| 45% | 47% | 48% | 48% | 48% | 47% | 47% | 47% | 49% | 48% |
| 46% | 46% | 47% | 47% | 47% | 47% | 47% | 46% | 48% | 50% |
| 46% | 46% | 46% | 48% | 48% | 46% | 47% | 47% | 48% | 48% |
| 48% | 47% | 47% | 47% | 47% | 47% | 47% | 46% | 48% | 49% |
| 48% | 47% | 48% | 48% | 48% | 47% | 47% | 47% | 49% | 50% |
| 51% | 50% | 51% | 50% | 50% | 49% | 49% | 48% | 50% | 51% |
| 50% | 50% | 50% | 50% | 49% | 49% | 49% | 48% | 49% | 50% |
| 50% | 50% | 49% | 51% | 49% | 50% | 49% | 48% | 49% | 50% |
| 51% | 50% | 51% | 51% | 50% | 50% | 49% | 49% | 52% | 51% |
| 51% | 51% | 51% | 51% | 51% | 50% | 50% | 51% | 52% | 52% |
| 52% | 51% | 52% | 52% | 52% | 51% | 51% | 51% | 53% | 53% |
| 53% | 52% | 52% | 51% | 52% | 52% | 52% | 52% | 53% | 53% |
| 52% | 53% | 53% | 53% | 53% | 52% | 53% | 52% | 53% | 53% |
| 54% | 54% | 55% | 55% | 54% | 53% | 54% | 53% | 54% | 54% |
| 57% | 56% | 57% | 57% | 57% | 55% | 55% | 54% | 54% | 54% |
Table 2
Perforated area s=f ＇ × S of each opening area 20 is finally calculated, and regional is designed according to perforated area
Perforate number t and bore size d, completes the perforate design of cathode baffle, wherein, perforated area s=t × d, S is correspondence perforate
The gross area in region 20.
In the present embodiment, the bore size of each opening area 20 is identical, and d=10mm is easy to the making of cathode baffle,
Corresponding percent opening f ＇ are adjusted by adjusting the perforate number of different opening areas 20.The bore size of each opening area 20
Different value can also be set between 6mm-12mm according to actual needs, i.e., by adjusting the different opening areas 20 of cathode baffle
Perforate number or bore size adjust corresponding percent opening.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that coming for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of improve the method for electroplating evenness, it is characterised in that comprises the following steps：
In the case of without cathode baffle, bare board is electroplated；
The plate face for completing plating is averagely divided into N number of plating area；
Measure the plating thickness X of each plating areai, and calculate plating thickness average
The corresponding cathode baffle percent opening of plating thickness average is set as f；
Calculate the percent opening of each plating area of cathode baffle correspondence
2. according to claim 1 improve the method for electroplating evenness, it is characterised in that measures the electricity of each plating area
After thickness of coating, the data of measurement are fitted into plating thickness curved surface distribution map.
3. according to claim 1 improve the method for electroplating evenness, it is characterised in that calculates cathode baffle and corresponds to each
After the percent opening of plating area, by the homogenizing integration of the data of calculating, and cathode baffle opening area distribution map is fitted.
4. according to claim 3 improve the method for electroplating evenness, it is characterised in that an aperture area of cathode baffle
Domain n plating area of correspondence, the regional percent opening of the opening areaWherein, 1≤n≤N.
5. according to claim 4 improve the method for electroplating evenness, it is characterised in that appointing in same opening area
The corresponding percent opening deviation in two plating areas of anticipating is d, wherein 0≤d≤3%.
6. according to claim 4 improve the method for electroplating evenness, it is characterised in that calculates the perforate face of opening area
Product s=f ＇ × S, wherein, S is the gross area of opening area.
7. according to claim 6 improve the method for electroplating evenness, it is characterised in that the perforated area s=t × d,
Wherein, t is perforate number, and d is bore size.
8. according to claim 7 improve the method for electroplating evenness, it is characterised in that wherein, 6mm≤d≤12mm.
9. according to claim 7 improve the method for electroplating evenness, it is characterised in that different by adjusting cathode baffle
The perforate number or bore size of opening area adjusts corresponding percent opening.
10. the method for the improvement electroplating evenness according to any one of claim 1 to 9, it is characterised in that wherein, 30%
≤ f≤60%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611248038.6A CN107059077A (en) | 2016-12-29 | 2016-12-29 | Improve the method for electroplating evenness |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611248038.6A CN107059077A (en) | 2016-12-29 | 2016-12-29 | Improve the method for electroplating evenness |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110400756A (en) * | 2019-04-29 | 2019-11-01 | 深超光电（深圳）有限公司 | Reroute the preparation method of line structure |
| CN111155162A (en) * | 2020-02-26 | 2020-05-15 | 广东兴达鸿业电子有限公司 | Methods to improve the uniformity of PCB copper electroplating |
| CN111883449A (en) * | 2020-06-18 | 2020-11-03 | 宁波芯健半导体有限公司 | Method for improving height uniformity of electroplated bump |
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| US20040099532A1 (en) * | 2002-11-26 | 2004-05-27 | Hachman John T. | Apparatus and method for controlling plating uniformity |
| CN1506502A (en) * | 2002-12-11 | 2004-06-23 | 国际商业机器公司 | Method and equipment for controlling local electric current to obtain uniform electroplating thickness |
| CN101260550A (en) * | 2007-03-06 | 2008-09-10 | 厦门弘信电子科技有限公司 | Technique and device for manufacturing electroplating copper cathode baffle |
| CN201817561U (en) * | 2010-10-28 | 2011-05-04 | 南通华达微电子集团有限公司 | Opening shape-adjustable electroplate anode baffle |
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| CN103215618A (en) * | 2012-01-18 | 2013-07-24 | 昆山允升吉光电科技有限公司 | Method for adjusting shape of open pore of electroformed anode baffle plate |
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2016
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| US20040099532A1 (en) * | 2002-11-26 | 2004-05-27 | Hachman John T. | Apparatus and method for controlling plating uniformity |
| CN1506502A (en) * | 2002-12-11 | 2004-06-23 | 国际商业机器公司 | Method and equipment for controlling local electric current to obtain uniform electroplating thickness |
| CN101260550A (en) * | 2007-03-06 | 2008-09-10 | 厦门弘信电子科技有限公司 | Technique and device for manufacturing electroplating copper cathode baffle |
| CN201817561U (en) * | 2010-10-28 | 2011-05-04 | 南通华达微电子集团有限公司 | Opening shape-adjustable electroplate anode baffle |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110400756A (en) * | 2019-04-29 | 2019-11-01 | 深超光电（深圳）有限公司 | Reroute the preparation method of line structure |
| CN111155162A (en) * | 2020-02-26 | 2020-05-15 | 广东兴达鸿业电子有限公司 | Methods to improve the uniformity of PCB copper electroplating |
| CN111883449A (en) * | 2020-06-18 | 2020-11-03 | 宁波芯健半导体有限公司 | Method for improving height uniformity of electroplated bump |
| CN111883449B (en) * | 2020-06-18 | 2022-04-15 | 宁波芯健半导体有限公司 | Method for improving height uniformity of electroplated bump |
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