CN106879192A - A PCBA board manufacturing method and system - Google Patents

Abstract

The invention provides a PCBA board manufacturing method and system, the method comprising: receiving an externally transmitted substrate, printing solder paste on the first surface of the substrate; mounting at least one first component on the first surface In the printed solder paste; flip the substrate mounted on the first side to the second side; print solder paste on the second side of the substrate; mount at least one second component on the In the solder paste printed on the second side; welding the first side and the second side of the substrate to obtain a PCBA board. Therefore, the solution provided by the present invention can reduce the cost consumed in the PCBA board manufacturing process.

Description

A PCBA board manufacturing method and system

technical field

The invention relates to the technical field of circuit board manufacturing, in particular to a PCBA board manufacturing method and system.

Background technique

PCBA board (Printed Circuit Board+Assembly, printed circuit board) is used as the physical carrier of various circuits and electronic components, so that some functions of electronic equipment can be realized. Therefore, the PCBA board is one of the important components in electronic equipment.

At present, the PCBA board manufacturing process is usually: the first side of the PCBA board is sequentially passed through five manufacturing processes including solder paste printing, solder paste inspection, component placement, reflow soldering, and optical inspection. After the first side of the PCBA board is manufactured, the second side of the PCBA board will go through five manufacturing processes including solder paste printing, solder paste inspection, component placement, reflow soldering, and optical inspection. After the manufacturing of the second side of the PCBA board is completed, the entire manufacturing process of the PCBA board is completed to obtain the PCBA board.

However, in the existing method, two reflow soldering manufacturing steps are required in the manufacturing process of the PCBA board, and the reflow soldering is the most critical manufacturing step, which takes a long time, consumes a lot of energy, and requires a lot of labor. Therefore, the cost of consumption is higher.

Contents of the invention

The invention provides a PCBA board manufacturing method and system, which can reduce the cost consumed in the PCBA board manufacturing process.

In a first aspect, the present invention provides a PCBA board manufacturing method, the method comprising:

receiving an externally transmitted substrate, and printing solder paste on the first surface of the substrate;

mounting at least one first component in the solder paste printed on the first side;

Turning the substrate mounted on the first side to the second side;

printing solder paste on the second side of the substrate;

mounting at least one second component in the solder paste printed on the second side;

Welding the first surface and the second surface of the substrate to obtain a PCBA board.

Preferably,

The mounting of at least one first component in the solder paste printed on the first surface includes:

Dip each of the first elements into the solder paste, wherein there is a set distance between the upper surface of each of the first elements and the upper surface of the solder paste.

Preferably,

The mounting of at least one second component in the solder paste printed on the second surface includes:

Dip each of the second elements into the solder paste, wherein there is a set distance between the upper surface of each of the second elements and the upper surface of the solder paste.

Preferably,

When there are at least two of said first elements and at least two of said second elements,

The mounting of at least one first component in the solder paste printed on the first surface includes:

Mounting a first component of the at least two first components whose size is smaller than a first threshold in the solder paste printed on the first surface;

A first component whose size is greater than or equal to a first threshold among the at least two first components is mounted in the solder paste printed on the first surface.

Preferably,

When there are at least two of said first elements and at least two of said second elements,

The mounting of at least one second component in the solder paste printed on the second surface includes:

Mounting a second component of the at least two second components whose size is smaller than a second threshold in the solder paste printed on the second surface;

A second component whose size is greater than or equal to a second threshold among the at least two second components is mounted in the solder paste printed on the second surface.

Preferably,

Further includes:

Detecting whether the thickness and area of the solder paste printed on the first side reach a preset value, if so, mounting at least one first component in the solder paste printed on the first side, otherwise, rejecting the substrate.

Preferably,

Further includes:

Detecting whether the thickness and area of the solder paste printed on the second side reach a preset value, if so, mounting at least one second component in the solder paste printed on the second side, otherwise, rejecting the substrate.

Preferably,

Further includes:

Whether there is an empty solder in the detected PCBA board, and/or, a short circuit,

If yes, determine that the PCBA board is unqualified;

Otherwise, it is determined that the PCBA board is qualified.

Second aspect, the present invention provides a kind of PCBA board manufacturing system, and this system comprises:

The solder paste printing machine is used to receive the externally transmitted substrate, print solder paste on the first side of the substrate, and output the substrate with the solder paste printed on the first side; receive the flipping output from the flipper to For the substrate on the second surface, print solder paste on the second surface of the substrate, and output the substrate after printing the solder paste on the second surface;

a placement machine, configured to receive the substrate printed with solder paste on the first side output by the solder paste printing machine, mount at least one first component in the solder paste printed on the first side, and place the first The substrate mounted on one side is output to the turnover machine; receiving the substrate printed with solder paste on the second side output by the solder paste printing machine, attaching at least one second component on the In the solder paste printed on the second side, the substrate mounted on the second side is output to the reflow furnace;

A plate turning machine, used to receive the substrate mounted on the first side output by the placement machine, flip the substrate mounted on the first side to the second side, and flip the substrate to the second side The substrate is output to the solder paste printing machine;

The reflow furnace is used to receive the substrate mounted on the second surface output by the placement machine, and solder the first surface and the second surface of the substrate to obtain a PCBA board.

Preferably,

The placement machine is configured to immerse each of the first components into the solder paste, wherein there is a set distance between the upper surface of each of the first components and the upper surface of the solder paste.

Preferably,

The placement machine is used for immersing each of the second components into the solder paste, wherein there is a set distance between the upper surface of each of the second components and the upper surface of the solder paste.

Preferably,

When there are at least two of said first elements and at least two of said second elements,

The placement machine includes: a first high-speed placement machine and a first general-purpose placement machine;

The first high-speed chip mounter is used to mount the first component of the at least two first components whose size is smaller than the first threshold in the solder paste printed on the first surface, and place the mounted The substrate is output to the first general-purpose mounter;

The first general-purpose placement machine is configured to receive the mounted substrate output by the first high-speed placement machine, and place the first component whose size is greater than or equal to the first threshold among the at least two first components. A component is mounted in the solder paste printed on the first surface, and the mounted substrate is transferred to the flipper.

Preferably,

When there are at least two of said first elements and at least two of said second elements,

The placement machine includes: a second high-speed placement machine and a second general-purpose placement machine;

The second high-speed placement machine is used to mount the second components whose size is smaller than the second threshold among the at least two second components in the solder paste printed on the second surface, and place the mounted The substrate is output to the second general-purpose mounter;

The second general-purpose placement machine is configured to receive the mounted substrate output by the second high-speed placement machine, and place the first of the at least two second components whose size is greater than or equal to the second threshold The second component is mounted in the solder paste printed on the second surface, and the mounted substrate is transferred to the reflow furnace.

Preferably,

Further include: the first solder paste inspection machine;

The first solder paste detector is used to receive the substrate with solder paste printed on the first side transmitted by the solder paste printing machine, and detect whether the thickness and area of the solder paste printed on the first side reach If it is a preset value, trigger the placement machine to mount at least one first component in the solder paste printed on the first surface; otherwise, reject the substrate.

Preferably,

It further includes: a second solder paste inspection machine;

The second solder paste detector is used to receive the substrate on which the solder paste is printed on the second side transmitted by the solder paste printing machine, and detect whether the thickness and area of the solder paste printed on the second side reach the If it is a preset value, trigger the placement machine to mount at least one second component in the solder paste printed on the second surface; otherwise, reject the substrate.

Preferably,

Further include: PCBA board inspection machine;

The PCBA board detector is used to detect whether there is empty soldering in the PCBA board obtained by the reflow oven, and/or, a short circuit, if yes, determine that the PCBA board is unqualified; otherwise, determine that the The PCBA board is qualified.

Embodiments of the present invention provide a method and system for manufacturing a PCBA board. By printing solder paste on the first surface of a received substrate, each component to be mounted is mounted in the solder paste printed on the first surface. After the mounting on the first side is completed, turn the substrate over to the second side. Then, solder paste is printed on the second side of the substrate, and each component to be mounted is mounted in the solder paste printed on the second side. After the mounting on the second side is completed, solder the first side and the second side of the substrate to obtain a PCBA board. From the above, it can be seen that after the first surface of the substrate is mounted, the solution does not solder the first surface, but turns the substrate over to the second surface, and continues to mount the second surface. After the second side has been mounted, the first and second sides of the substrate are welded, because only one welding link is required in the entire PCBA manufacturing process, so the solution provided by the present invention can reduce the PCBA. The cost incurred in the manufacturing process.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are For some embodiments of the present invention, those skilled in the art can also obtain other drawings based on these drawings without creative work.

Fig. 1 is the flowchart of a kind of PCBA board manufacturing method that an embodiment of the present invention provides;

Fig. 2 is a schematic structural view of a PCBA board manufacturing system provided by an embodiment of the present invention;

Fig. 3 is a schematic structural view of a PCBA board manufacturing system including a first high-speed placement machine and a first general-purpose placement machine provided by an embodiment of the present invention;

Fig. 4 is a schematic structural view of a PCBA board manufacturing system including a second high-speed placement machine and a second general-purpose placement machine provided by an embodiment of the present invention;

Fig. 5 is a schematic structural diagram of a PCBA board manufacturing system including a first solder paste detector provided by an embodiment of the present invention;

Fig. 6 is a schematic structural diagram of a PCBA board manufacturing system including a second solder paste detector provided by an embodiment of the present invention;

Fig. 7 is a schematic structural diagram of a PCBA board manufacturing system including a PCBA board inspection machine provided by an embodiment of the present invention;

Fig. 8 is a flowchart of a PCBA board manufacturing method provided by another embodiment of the present invention.

detailed description

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection of the present invention. scope.

As shown in Figure 1, the embodiment of the present invention provides a PCBA board manufacturing method, the method may include the following steps:

Step 101: receiving an externally transmitted substrate, and printing solder paste on the first surface of the substrate;

Step 102: mounting at least one first component in the solder paste printed on the first surface;

Step 103: Turn over the substrate mounted on the first side to the second side;

Step 104: printing solder paste on the second surface of the substrate;

Step 105: mounting at least one second component in the solder paste printed on the second surface;

Step 106: Solder the first surface and the second surface of the substrate to obtain a PCBA board.

According to the embodiment shown in FIG. 1 , by printing solder paste on the first surface of the received substrate, each component to be mounted is mounted in the solder paste printed on the first surface. After the mounting on the first side is completed, turn the substrate over to the second side. Then, solder paste is printed on the second side of the substrate, and each component to be mounted is mounted in the solder paste printed on the second side. After the mounting on the second side is completed, solder the first side and the second side of the substrate to obtain a PCBA board. From the above, it can be seen that after the first surface of the substrate is mounted, the solution does not solder the first surface, but turns the substrate over to the second surface, and continues to mount the second surface. After the second side is mounted, the first side and the second side of the substrate are welded, because only one welding link is needed in the manufacturing process of the whole PCBA board, therefore, the embodiments provided by the present invention can reduce PCBA The cost incurred in the board manufacturing process.

In one embodiment of the present invention, step 101 in the flowchart shown in FIG. 1 involves printing solder paste on the first surface of the substrate, and step 104 prints solder paste on the second surface of the substrate. It can be completed by the same solder paste printing equipment, or by two solder paste printing equipment respectively. The solder paste printing equipment is a solder paste printing machine, and the type of the solder paste printing machine can be determined according to business requirements.

In one embodiment of the present invention, step 102 in the above-mentioned flowchart shown in FIG. 1 mounts at least one first component in the solder paste printed on the first surface, and step 105 mounts at least one second component Encased in the solder paste printed on the second side. It can be completed by the same placement equipment, or it can be completed by two placement equipment respectively. The printing equipment is a placement machine, and the type of placement machine can be determined according to business requirements.

In one embodiment of the present invention, step 102 in the flow chart shown in FIG. 1 above attaches at least one first component to the solder paste printed on the first surface, which may include:

Dip each of the first elements into the solder paste, wherein there is a set distance between the upper surface of each of the first elements and the upper surface of the solder paste.

In this embodiment, the distance between the upper surface of each first component and the upper surface of the solder paste can be determined according to business requirements. Wherein, since the heights of the first components are inconsistent, the setting of the distance may have at least the following three situations:

Case 1: Based on the highest component among the first components, the set distance is the distance between the upper surface of the highest component and the upper surface of the solder paste;

Situation 1: Taking the component with the lowest height among the first components as the reference, the set distance is the distance between the upper surface of the component with the lowest height;

Case 3: Based on the components whose heights are at the average height level of each first component, the set distance is the distance between the upper surface of the components at the average height level and the upper surface of the solder paste.

In the above case 2, since the upper surface of other components whose height is higher than the lowest component may exist, exposing the upper surface of the first solder paste, the first solder paste has insufficient adhesion to each component that exposes the upper surface of the solder paste. When the substrate is turned over to the second surface, components may fall, so it is not a preferred method.

In one embodiment of the present invention, step 105 in FIG. 1 above mounts at least one second component in the solder paste printed on the second surface, which may include:

Dip each of the second elements into the solder paste, wherein there is a set distance between the upper surface of each of the second elements and the upper surface of the solder paste.

In this embodiment, the distance between the upper surface of each second component and the upper surface of the solder paste can be determined according to business requirements. Wherein, since the heights of the second components are inconsistent, there may be at least three situations in the setting of the distance. For these three situations, please refer to the above-mentioned embodiment of mounting at least one first component on the first surface .

According to the above-mentioned embodiment, when each component is mounted in the solder paste printed on the first surface or the second surface of the substrate, each component is immersed in the solder paste, wherein the upper surface of each component is in contact with the solder paste. There is a set distance between the upper surfaces. When the substrate is subjected to subsequent operations such as flipping and welding, it is possible to reduce the possibility of components falling off from the solder paste.

In one embodiment of the present invention, when there are at least two first elements and at least two second elements,

Then step 102 in FIG. 1 above mounts at least one first component in the solder paste printed on the first surface, including:

Mounting a first component of the at least two first components whose size is smaller than a first threshold in the solder paste printed on the first surface;

A first component whose size is greater than or equal to a first threshold among the at least two first components is mounted in the solder paste printed on the first surface.

In this embodiment, in order to determine the placement accuracy, the components with a size smaller than the first threshold are placed first, and after the components with a size smaller than the first threshold are placed, the components with a size greater than or equal to the first threshold are placed. Components are mounted. The first threshold may be determined according to service requirements.

In addition, the placement equipment used for placing components whose size is smaller than the first threshold can be determined according to business requirements, for example, it can be a high-speed placement machine. The placement equipment used for components whose placement size is greater than or equal to the first threshold can also be determined according to business requirements, for example, a general-purpose placement machine can be selected.

According to the above-mentioned embodiment, when mounting at least two components in the solder paste printed on the first surface of the substrate, the first components whose size is smaller than the first threshold among the first components are first mounted on the printed solder paste on the first surface. in the solder paste. Then, among the first components, the first components whose size is greater than or equal to the first threshold are mounted in the solder paste printed on the first surface. Since components of different sizes are mounted separately, the accuracy and efficiency of mounting can be improved.

In one embodiment of the present invention, when there are at least two first elements and at least two second elements,

Then step 105 in the above-mentioned FIG. 1 mounts at least one second component in the solder paste printed on the second surface, including:

Mounting a second component of the at least two second components whose size is smaller than a second threshold in the solder paste printed on the second surface;

A second component whose size is greater than or equal to a second threshold among the at least two second components is mounted in the solder paste printed on the second surface.

In this embodiment, in order to determine the placement accuracy, the components with a size smaller than the second threshold are placed first, and after the components with a size smaller than the second threshold are mounted, the components with a size greater than or equal to the second threshold are placed. Components are mounted. Wherein the second threshold may be determined according to service requirements.

In addition, the placement equipment used for placing components whose size is smaller than the second threshold can be determined according to business requirements, for example, it can be a high-speed placement machine. The placement equipment used for components whose placement size is greater than or equal to the second threshold can also be determined according to business requirements, for example, a general-purpose placement machine can be selected.

According to the above-mentioned embodiment, when mounting at least two components in the solder paste printed on the second surface of the substrate, the second components whose size is smaller than the second threshold among the first components are first mounted on the printed solder paste on the second surface. in the solder paste. Then, among the second components, the second components whose size is greater than or equal to the second threshold are mounted in the solder paste printed on the second surface. Since components of different sizes are mounted separately, the accuracy and efficiency of mounting can be improved.

In one embodiment of the present invention, the PCBA board manufacturing method may further include: detecting whether the thickness and area of the solder paste printed on the first surface reach a preset value, and if so, pasting at least one first component In the solder paste printed on the first side, otherwise, reject the substrate.

In this embodiment, the data corresponding to the thickness of the solder paste printed on the first side and the data corresponding to the area of the solder paste printed on the first side can be determined according to business requirements. For example, the thickness may be 1 mm. The data corresponding to the area is preferably the entire area of the first surface of the substrate.

In this embodiment, when it is detected that the thickness and area of the printed solder paste on the first side of the substrate have reached the preset data, then it means that the thickness and area of the printed solder paste on the first side of the substrate meet the following requirements. Requirements for component mounting, flipping and soldering. When it is detected that any of the thickness and area of the printed solder paste on the first side of the substrate does not reach the preset data, it means that the printed solder paste on the first side of the substrate cannot meet the requirements for subsequent component mounting and flipping. and welding requirements. The substrate cannot be operated in the subsequent process and should be removed to reduce the probability of generating unqualified PCBA boards.

According to the above-mentioned embodiment, when it is detected that the thickness and area of the solder paste printed on the first surface both reach preset values, each component to be mounted is mounted in the solder paste printed on the first surface. When any one of the thickness and area of the solder paste printed on the first side is detected does not reach the preset value, the substrate is rejected. Thereby, the probability of manufacturing unqualified PCBA boards can be reduced.

In one embodiment of the present invention, the PCBA board manufacturing method may further include: detecting whether the thickness and area of the solder paste printed on the second surface reach a preset value, and if so, pasting at least one second component In the solder paste printed on the second side, otherwise, reject the substrate.

In this embodiment, the data corresponding to the thickness of the solder paste printed on the second surface and the data corresponding to the area of the solder paste printed on the second surface can be determined according to business requirements. For example, the thickness may be 1 mm. The data corresponding to the area is preferably selected as the overall area of the second surface of the substrate.

In this embodiment, when it is detected that the thickness and area of the printed solder paste on the second side of the substrate have reached the preset data, it means that the thickness and area of the printed solder paste on the second side of the substrate meet the requirements of subsequent components. Mounting and soldering requirements. When it is detected that any of the thickness and area of the solder paste printed on the second side of the substrate does not reach the preset data, it means that the solder paste printed on the second side of the substrate cannot meet the requirements of subsequent component mounting and welding. Require. The substrate cannot be operated in the subsequent process and should be removed to reduce the probability of generating unqualified PCBA boards.

According to the above-mentioned embodiment, when it is detected that the thickness and area of the solder paste printed on the second surface both reach preset values, each component to be mounted is mounted in the solder paste printed on the second surface. When any one of the thickness and area of the printed solder paste on the second side does not reach the preset value, the substrate is rejected. Thereby, the probability of generating unqualified PCBA boards can be reduced.

In one embodiment of the present invention, the process of detecting whether the thickness and area of solder paste printed on the first side of the substrate reach a preset value, and detecting whether the thickness and area of solder paste printed on the second side of the substrate reach a preset value The process of setting the numerical value can be completed by the same solder paste inspection equipment, or by two solder paste inspection equipment respectively. The solder paste inspection equipment is a solder paste inspection machine, and the type of the solder paste inspection machine can be determined according to business requirements.

In one embodiment of the present invention, the PCBA board manufacturing method may further include: detecting whether there is an empty solder in the obtained PCBA board, and/or, a short circuit,

If yes, determine that the PCBA board is unqualified;

Otherwise, it is determined that the PCBA board is qualified.

In this embodiment, the obtained PCBA board can be tested by testing equipment, and the testing equipment can be determined according to business requirements. For example, it may be an automated optical inspection machine. Optical analysis can determine whether there is any one of empty soldering and short circuit in the PCBA board. If it exists, it means that the PCBA board is unqualified. If it is installed in the electronic equipment, it will affect the normal operation of the electronic equipment, so it should be discarded. When it does not exist, it means that the PCBA board is qualified and can be installed in electronic equipment.

According to the above embodiment, after the reflow oven finishes welding the first surface and the second surface of the substrate, if there is at least one of empty soldering and short circuit in the detected PCBA board, it is determined that the PCBA board is unqualified. When at least one of empty soldering and short circuit does not exist in the detected PCBA board, it is determined that the PCBA board is qualified. Therefore, unqualified PCBA boards can be eliminated in time according to the detection results of PCBA boards.

As shown in Figure 2, the embodiment of the present invention provides a PCBA board manufacturing system, the system includes:

The solder paste printing machine 201 is used to receive the externally transmitted substrate, print solder paste on the first side of the substrate, and output the substrate with the solder paste printed on the first side; receive the flip output by the flipper to the substrate on the second side, printing solder paste on the second side of the substrate, and outputting the substrate after printing the solder paste on the second side;

a mounter 202, configured to receive the substrate printed with solder paste on the first side outputted by the solder paste printing machine 201, and mount at least one first component in the solder paste printed on the first side, output the substrate mounted on the first side to the flipper 203; receive the substrate printed with solder paste on the second side output by the solder paste printing machine 201, and attach at least one second component Packing it into the solder paste printed on the second side, outputting the substrate mounted on the second side to the reflow furnace 204;

The plate turning machine 203 is used to receive the substrate mounted on the first side output by the placement machine 202, turn the substrate mounted on the first side to the second side, and turn the substrate to the second side. The substrate on both sides is output to the solder paste printing machine 201;

The reflow furnace 204 is configured to receive the substrate mounted on the second side output by the placement machine 202, and solder the first and second sides of the substrate to obtain a PCBA board.

According to the embodiment shown in FIG. 2 , the PCBA board manufacturing system includes: a solder paste printing machine, a placement machine, a board turning machine, and a reflow furnace. Solder paste is printed on the first side of the substrate by a solder paste printing machine, and the substrate printed with solder paste on the first side is output to the placement machine. Then use the placement machine to mount each component in the solder paste printed on the first side, and then output the substrate mounted on the first side to the flipper. Use the flipper to flip the substrate mounted on the first side to the second side, and output the substrate flipped to the second side to the solder paste printing machine. Then use a solder paste printing machine to print solder paste on the second side of the substrate, and transfer the substrate with solder paste printed on the second side to the mounter. Then use the placement machine to mount each component in the solder paste printed on the second side, and output the substrate mounted on the second side to the reflow furnace. Then use a reflow furnace to solder the first surface and the second surface of the substrate to obtain a PCBA board. From the above, it can be seen that this solution only needs one reflow furnace welding link in the whole PCBA board manufacturing process, therefore, the embodiment provided by the present invention can reduce the cost consumed in the PCBA board manufacturing process.

In one embodiment of the present invention, the placement machine 202 in the structural schematic diagram shown in FIG. 2 is used to immerse each of the first components into the solder paste, wherein the upper surface of each of the first components There is a set distance from the upper surface of the solder paste.

In one embodiment of the present invention, the placement machine 202 in the structural schematic diagram shown in FIG. 2 is used to immerse each of the second components into the solder paste, wherein the upper surface of each of the second components There is a set distance from the upper surface of the solder paste.

In one embodiment of the present invention, as shown in FIG. 3 , when there are at least two first elements and at least two second elements,

The mounter 202 may include: a first high-speed mounter 301 and a first general-purpose mounter 302;

The first high-speed chip mounter 301 is used to mount the first component of the at least two first components whose size is smaller than the first threshold in the solder paste printed on the first surface, and place the mounted The final substrate is output to the first general-purpose mounter 302;

The first general-purpose placement machine 302 is configured to receive the mounted substrate output by the first high-speed placement machine 301, and place the at least two first components with a size greater than or equal to the first threshold The first component is mounted in the solder paste printed on the first surface, and the mounted substrate is transferred to the board turning machine 203 .

In one embodiment of the present invention, as shown in FIG. 4, when there are at least two first elements and at least two second elements,

The mounter 202 may include: a second high-speed mounter 401 and a second general-purpose mounter 402;

The second high-speed placement machine 401 is used to mount the second components whose size is smaller than the second threshold among the at least two second components in the solder paste printed on the second surface, and place the mounted The substrate is output to the second general-purpose mounter 402;

The second general-purpose placement machine 402 is configured to receive the mounted substrate output by the second high-speed placement machine 401, and place the at least two second components with a size greater than or equal to the second threshold The second component is mounted in the solder paste printed on the second surface, and the mounted substrate is transferred to the reflow furnace 204 .

In one embodiment of the present invention, as shown in FIG. 5, the PCBA board manufacturing system may further include: a first solder paste detector 501;

The first solder paste detector 501 is used to receive the substrate with solder paste printed on the first side transmitted by the solder paste printing machine 201, and detect whether the thickness and area of the solder paste printed on the first side are If the preset value is reached, the placement machine 202 is triggered to mount at least one first component in the solder paste printed on the first surface; otherwise, the substrate is rejected.

In one embodiment of the present invention, as shown in FIG. 6, the PCBA board manufacturing system may further include: a second solder paste inspection machine 601;

The second solder paste detector 601 is used to receive the substrate with solder paste printed on the second side transmitted by the solder paste printing machine 201, and detect whether the thickness and area of the solder paste printed on the second side are If the preset value is reached, trigger the placement machine 202 to mount at least one second component in the solder paste printed on the second surface; otherwise, reject the substrate.

In one embodiment of the present invention, as shown in Figure 7, the PCBA board manufacturing system may further include: a PCBA board inspection machine 701;

The PCBA board detector 701 is used to detect whether there is empty soldering in the PCBA board obtained by the reflow oven 204, and/or, a short circuit, if yes, determine that the PCBA board is unqualified; otherwise, determine The PCBA board is qualified.

The information exchange and execution process among the units in the above-mentioned device are based on the same concept as the method embodiment of the present invention, and the specific content can refer to the description in the method embodiment of the present invention, and will not be repeated here.

The following PCBA board manufacturing system includes solder paste printing machine, solder paste inspection machine, high-speed placement machine, general-purpose placement machine, board turning machine, reflow furnace, PCBA board inspection machine, among which, the first side of the substrate and the second The same high-speed placement machine and general-purpose placement machine are used for the placement of the substrate; the same solder paste inspection machine is used as an example for the solder paste inspection of the first and second sides of the substrate. Expand the description of the PCBA board manufacturing method, as shown in Figure 8, the PCBA board manufacturing method may include the following steps:

Step 801: Utilize a solder paste printing machine to receive an externally transmitted substrate, and print solder paste on the first surface of the substrate.

In this step, the substrate may be transferred to the solder paste printing machine by a transfer device, such as a transfer belt. The substrate can also be manually transferred to the solder paste printer by an operator. When the solder paste printer receives the substrate, it prints solder paste on the first side of the substrate. At this time, printing can be performed according to the preset solder paste thickness and solder paste coverage area. When the first side is printed, the substrate is output to the solder paste inspection machine.

Step 802: Use a solder paste inspection machine to detect whether the thickness and area of the printed solder paste on the first side reach the preset values, if yes, perform step 803, otherwise, reject the substrate.

In this step, when it is detected that the thickness and area of the printed solder paste on the first side of the substrate have reached the preset data, it means that the thickness and area of the printed solder paste on the first side of the substrate meet the requirements of subsequent components. If there are requirements for mounting, flipping and welding, step 803 is performed. When it is detected that any of the thickness and area of the printed solder paste on the first side of the substrate does not reach the preset data, it means that the printed solder paste on the first side of the substrate cannot meet the requirements for subsequent component mounting and flipping. And soldering requirements, then remove the substrate.

Step 803: using a high-speed placement machine to mount the first components whose size is smaller than the first threshold among the at least two first components in the solder paste printed on the first surface.

In this step, a high-speed placement machine is used to mount the components whose size is smaller than the first threshold, such as 5 mm, among the first components into the solder paste printed on the first side that is qualified by the solder paste inspection machine.

Step 804: Using a general-purpose placement machine, mount the first components whose size is greater than or equal to the first threshold among the at least two first components in the solder paste printed on the first surface.

In this step, the first components whose size is greater than or equal to a first threshold, such as 5 mm, among the first components are mounted in the solder paste printed on the first surface by using a general-purpose placement machine.

Step 805: Turn over the mounted substrate on the first side to the second side by using a flipping machine.

Step 806: Print solder paste on the second surface of the substrate by using a solder paste printing machine.

In this step, printing can be performed according to the preset solder paste thickness and solder paste coverage area. When the second side is printed, the substrate is output to the solder paste inspection machine.

Step 807: Use a solder paste inspection machine to detect whether the thickness and area of the solder paste printed on the second surface reach the preset values, if yes, perform step 808, otherwise, reject the substrate.

In this step, when it is detected that the thickness and area of the solder paste printed on the second side of the substrate have reached the preset data, it means that the thickness and area of the solder paste printed on the second side of the substrate meet the requirements of subsequent components. If there are requirements for mounting, flipping and welding, step 808 is executed. When it is detected that any of the thickness and area of the solder paste printed on the second side of the substrate does not reach the preset data, it means that the solder paste printed on the second side of the substrate cannot meet the requirements for subsequent component mounting and flipping. And soldering requirements, then remove the substrate.

Step 808: using a high-speed placement machine to mount the second components whose size is smaller than the second threshold among the at least two second components in the solder paste printed on the second surface.

In this step, a high-speed placement machine is used to mount the components whose size is smaller than the second threshold, such as 5 mm, among the second components in the solder paste printed on the second side that is qualified by the solder paste inspection machine.

Step 809 : Mount the second components whose size is greater than or equal to the second threshold among the at least two second components in the solder paste printed on the second surface by using a general-purpose placement machine.

In this step, the second components whose size is greater than or equal to a second threshold, such as 5 mm, among the second components are mounted in the solder paste printed on the second surface by using a general-purpose placement machine.

Step 810: Solder the first surface and the second surface of the substrate with a reflow furnace to obtain a PCBA board.

In this step, the first surface and the second surface of the substrate are soldered by using a reflow furnace, and each component is respectively soldered on the first surface and the second surface, thereby obtaining a PCBA board.

Step 811: Use the PCBA board inspection machine to detect whether there are empty solders and/or short circuits in the obtained PCBA board, if yes, determine that the PCBA board is unqualified; otherwise, determine that the PCBA board is qualified.

In this step, the detection machine can determine whether there is any one of empty soldering and short circuit in the PCBA board. If it exists, it means that the PCBA board is unqualified. If it is installed in the electronic equipment, it will affect the normal operation of the electronic equipment, so it should be discarded. When it does not exist, it means that the PCBA board is qualified and can be installed in electronic equipment.

In summary, each embodiment of the present invention can at least achieve the following beneficial effects:

1. In the embodiment of the present invention, by printing solder paste on the first surface of the received substrate, each component to be mounted is mounted in the solder paste printed on the first surface. After the mounting on the first side is completed, turn the substrate over to the second side. Then, solder paste is printed on the second side of the substrate, and each component to be mounted is mounted in the solder paste printed on the second side. After the mounting on the second side is completed, solder the first side and the second side of the substrate to obtain a PCBA board. From the above, it can be seen that after the first surface of the substrate is mounted, the solution does not solder the first surface, but turns the substrate over to the second surface, and continues to mount the second surface. After the second side is mounted, the first side and the second side of the substrate are welded, because only one welding link is needed in the manufacturing process of the whole PCBA board, therefore, the embodiments provided by the present invention can reduce PCBA The cost incurred in the board manufacturing process.

2. In the embodiment of the present invention, when mounting each component in the solder paste printed on the first or second side of the substrate, immerse each component in the solder paste, wherein the upper surface of each component There is a set distance from the upper surface of the solder paste. When the substrate is subjected to subsequent operations such as flipping and welding, it is possible to reduce the possibility of components falling off from the solder paste.

3. In the embodiment of the present invention, when mounting at least two components in the solder paste printed on the first surface of the substrate, the first components whose size is smaller than the first threshold among the first components are first mounted on the second in solder paste printed on one side. Then, among the first components, the first components whose size is greater than or equal to the first threshold are mounted in the solder paste printed on the first surface. Since components of different sizes are mounted separately, the accuracy and efficiency of mounting can be improved.

4. In the embodiment of the present invention, when attaching at least two components to the solder paste printed on the second surface of the substrate, first place the second components whose size is smaller than the second threshold value among the first components, and place them on the second In solder paste printed on both sides. Then, among the second components, the second components whose size is greater than or equal to the second threshold are mounted in the solder paste printed on the second surface. Since components of different sizes are mounted separately, the accuracy and efficiency of mounting can be improved.

5. In the embodiment of the present invention, when it is detected that the thickness and area of the solder paste printed on the first side reach the preset values, each component to be mounted is mounted in the solder paste printed on the first side. When any one of the thickness and area of the solder paste printed on the first side is detected does not reach the preset value, the substrate is rejected. Thereby, the probability of manufacturing unqualified PCBA boards can be reduced.

6. In the embodiment of the present invention, when it is detected that the thickness and area of the solder paste printed on the second side reach the preset values, each component to be mounted is mounted in the solder paste printed on the second side. When any one of the thickness and area of the printed solder paste on the second side does not reach the preset value, the substrate is rejected. Thereby, the probability of generating unqualified PCBA boards can be reduced.

7. In the embodiment of the present invention, after the soldering of the first side and the second side of the substrate by the reflow furnace is completed, when there is at least one of empty soldering and short-circuit lines in the detected PCBA board, then determine the PCBA Board failed. When at least one of empty soldering and short circuit does not exist in the detected PCBA board, it is determined that the PCBA board is qualified. Therefore, unqualified PCBA boards can be eliminated in time according to the detection results of PCBA boards.

8. In the embodiment of the present invention, the PCBA board manufacturing system includes: a solder paste printing machine, a placement machine, a board turning machine and a reflow furnace. Solder paste is printed on the first side of the substrate by a solder paste printing machine, and the substrate printed with solder paste on the first side is output to the placement machine. Then use the placement machine to mount each component in the solder paste printed on the first side, and then output the substrate mounted on the first side to the flipper. Use the flipper to flip the substrate mounted on the first side to the second side, and output the substrate flipped to the second side to the solder paste printing machine. Then use a solder paste printing machine to print solder paste on the second side of the substrate, and transfer the substrate with solder paste printed on the second side to the mounter. Then use the placement machine to mount each component in the solder paste printed on the second side, and output the substrate mounted on the second side to the reflow furnace. Then use a reflow furnace to solder the first surface and the second surface of the substrate to obtain a PCBA board. From the above, it can be seen that this solution only needs one reflow furnace welding link in the whole PCBA board manufacturing process, therefore, the embodiment provided by the present invention can reduce the cost consumed in the PCBA board manufacturing process.

It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is a relationship between these entities or operations. There is no such actual relationship or sequence. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or device. Without further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional same elements in the process, method, article or apparatus comprising said element.

Those of ordinary skill in the art can understand that all or part of the steps for realizing the above-mentioned method embodiments can be completed by hardware related to program instructions, and the aforementioned programs can be stored in a computer-readable storage medium. When the program is executed, the It includes the steps of the above method embodiments; and the aforementioned storage medium includes: ROM, RAM, magnetic disk or optical disk and other various media that can store program codes.

Finally, it should be noted that: the above descriptions are only preferred embodiments of the present invention, and are only used to illustrate the technical solutions of the present invention, and are not used to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.

Claims (10)

1. A PCBA board manufacturing method is characterized in that, comprising: receiving an externally transmitted substrate, and printing solder paste on the first surface of the substrate; mounting at least one first component in the solder paste printed on the first side; Turning the substrate mounted on the first side to the second side; printing solder paste on the second side of the substrate; mounting at least one second component in the solder paste printed on the second side; Welding the first surface and the second surface of the substrate to obtain a printed circuit board (PCBA). 2. The method of claim 1, wherein, The mounting of at least one first component in the solder paste printed on the first surface includes: immersing each of the first components into the solder paste, wherein there is a set distance between the upper surface of each of the first components and the upper surface of the solder paste; and / or, The mounting of at least one second component in the solder paste printed on the second surface includes: Dip each of the second elements into the solder paste, wherein there is a set distance between the upper surface of each of the second elements and the upper surface of the solder paste. 3. The method of claim 1, wherein, When there are at least two of said first elements and at least two of said second elements, The mounting of at least one first component in the solder paste printed on the first surface includes: Mounting a first component of the at least two first components whose size is smaller than a first threshold in the solder paste printed on the first surface; Mounting a first component of the at least two first components whose size is greater than or equal to a first threshold in the solder paste printed on the first surface; and / or, When there are at least two of said first elements and at least two of said second elements, The mounting of at least one second component in the solder paste printed on the second surface includes: Mounting a second component of the at least two second components whose size is smaller than a second threshold in the solder paste printed on the second surface; A second component whose size is greater than or equal to a second threshold among the at least two second components is mounted in the solder paste printed on the second surface. 4. The method according to any one of claims 1 to 3, characterized in that, Further includes: Detecting whether the thickness and area of the solder paste printed on the first side reach a preset value, if so, mounting at least one first component in the solder paste printed on the first side, otherwise, rejecting said substrate; and / or, Further includes: Detecting whether the thickness and area of the solder paste printed on the second side reach a preset value, if so, mounting at least one second component in the solder paste printed on the second side, otherwise, rejecting the substrate. 5. The method according to claims 1 to 3, characterized in that, Further includes: Whether there is an empty solder in the detected PCBA board, and/or, a short circuit, If yes, determine that the PCBA board is unqualified; Otherwise, it is determined that the PCBA board is qualified. 6. A PCBA board manufacturing system, characterized in that, comprising: The solder paste printing machine is used to receive the externally transmitted substrate, print solder paste on the first side of the substrate, and output the substrate with the solder paste printed on the first side; receive the flipping output from the flipper to For the substrate on the second surface, print solder paste on the second surface of the substrate, and output the substrate after printing the solder paste on the second surface; a placement machine, configured to receive the substrate printed with solder paste on the first side output by the solder paste printing machine, mount at least one first component in the solder paste printed on the first side, and place the first The substrate mounted on one side is output to the turnover machine; receiving the substrate printed with solder paste on the second side output by the solder paste printing machine, attaching at least one second component on the In the solder paste printed on the second side, the substrate mounted on the second side is output to the reflow furnace; A plate turning machine, used to receive the substrate mounted on the first side output by the placement machine, flip the substrate mounted on the first side to the second side, and flip the substrate to the second side The substrate is output to the solder paste printing machine; The reflow furnace is used to receive the substrate mounted on the second surface output by the placement machine, and solder the first surface and the second surface of the substrate to obtain a PCBA board. 7. The system of claim 6, wherein: The placement machine is used to immerse each of the first components into the solder paste, wherein there is a set distance between the upper surface of each of the first components and the upper surface of the solder paste; and / or, The placement machine is used for immersing each of the second components into the solder paste, wherein there is a set distance between the upper surface of each of the second components and the upper surface of the solder paste. 8. The system of claim 6, wherein: When there are at least two of said first elements and at least two of said second elements, The placement machine includes: a first high-speed placement machine and a first general-purpose placement machine; The first high-speed chip mounter is used to mount the first component of the at least two first components whose size is smaller than the first threshold in the solder paste printed on the first surface, and place the mounted The substrate is output to the first general-purpose mounter; The first general-purpose placement machine is configured to receive the mounted substrate output by the first high-speed placement machine, and place the first component whose size is greater than or equal to the first threshold among the at least two first components. A component is mounted in the solder paste printed on the first surface, and the mounted substrate is transferred to the flipper; and / or, When there are at least two of said first elements and at least two of said second elements, The placement machine includes: a second high-speed placement machine and a second general-purpose placement machine; The second high-speed placement machine is used to mount the second components whose size is smaller than the second threshold among the at least two second components in the solder paste printed on the second surface, and place the mounted The substrate is output to the second general-purpose mounter; The second general-purpose placement machine is configured to receive the mounted substrate output by the second high-speed placement machine, and place the first of the at least two second components whose size is greater than or equal to the second threshold The second component is mounted in the solder paste printed on the second surface, and the mounted substrate is transferred to the reflow furnace. 9. The system according to any one of claims 6 to 8, characterized in that, Further include: the first solder paste inspection machine; The first solder paste detector is used to receive the substrate with solder paste printed on the first side transmitted by the solder paste printing machine, and detect whether the thickness and area of the solder paste printed on the first side reach a preset value, if yes, triggering the placement machine to mount at least one first component in the solder paste printed on the first side; otherwise, rejecting the substrate; and / or, It further includes: a second solder paste inspection machine; The second solder paste detector is used to receive the substrate on which the solder paste is printed on the second side transmitted by the solder paste printing machine, and detect whether the thickness and area of the solder paste printed on the second side reach the If it is a preset value, trigger the placement machine to mount at least one second component in the solder paste printed on the second surface; otherwise, reject the substrate. 10. The system according to any one of claims 6 to 8, characterized in that, Further include: PCBA board inspection machine; The PCBA board detector is used to detect whether there is empty soldering in the PCBA board obtained by the reflow oven, and/or, a short circuit, if yes, determine that the PCBA board is unqualified; otherwise, determine that the The PCBA board is qualified.