CN106816403A - A kind of ejector pin mechanism, tool and ultra-thin chip packaging technology - Google Patents
A kind of ejector pin mechanism, tool and ultra-thin chip packaging technology Download PDFInfo
- Publication number
- CN106816403A CN106816403A CN201611214940.6A CN201611214940A CN106816403A CN 106816403 A CN106816403 A CN 106816403A CN 201611214940 A CN201611214940 A CN 201611214940A CN 106816403 A CN106816403 A CN 106816403A
- Authority
- CN
- China
- Prior art keywords
- thimble
- ultra
- chip
- ejector pin
- pin mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 28
- 238000012536 packaging technology Methods 0.000 title claims abstract description 12
- 241000748087 Hymenothrix Species 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of ejector pin mechanism, tool and ultra-thin chip packaging technology, ejector pin mechanism includes thimble seat, thimble and lock sleeve, thimble seat is provided with a round platform for fixing thimble, some decile groovings are radially provided with round platform, offered at grooving position along the symmetrical hole clipping in round platform axle center, each hole clipping is used to fix a thimble, and at least provided with two hole clippings on each grooving, round platform is provided with the external screw thread matched with lock sleeve internal thread.The present invention devises the special ejector pin mechanism suitable for ultra-thin chip, can be arranged symmetrically some thimble heads along chip center on thimble seat, effectively solves the problems, such as to cause chip rupture due to chip discontinuity, and use and change easily.Ultra-thin chip packaging technology of the invention, chip rupture is easily caused when efficiently solving the problems, such as that ultra-thin chip is attached with nation's line.
Description
Technical field
The present invention relates to COB (Chip on board) manufacturing process of mobile phone camera ultra-thin chip, and in particular to a kind of
The special fixture and ultra-thin chip packaging technology of ejector pin mechanism, ejector pin mechanism for ultra-thin chip.
Background technology
At present, the thickness typically 300um of the chip that mobile phone camera manufacturer lens assembling is used, but with mobile phone
Tend to ultrathin development, this requires that camera also wants ultrathin, and whole camera module can be reduced using ultra-thin chip
Thickness, at the same it is strict to the making technology process requirements of COB, so as to reach the process rate with common module, due to ultra-thin
Chip thickness only has 100um, if using normal thimble, chip holds very much during chip D/A (Die Attach) attachings
It is easily rupturable.And chip is vacantly easily caused chip rupture at W/B (Wire Bonding).Therefore the equipment that existing D/A stands
And technique needs to be transformed for ultra-thin chip and optimized.
The content of the invention
Goal of the invention：For problems of the prior art, the present invention provides a kind of thimble machine for ultra-thin chip
The packaging technology of structure, ejector pin mechanism special fixture and ultra-thin chip, it is easy with nation's line process to solve ultra-thin chip attaching
The problem of rupture.
Technical scheme：To achieve the above object, the present invention is adopted the following technical scheme that：
A kind of ejector pin mechanism for ultra-thin chip, including thimble seat, thimble and lock sleeve, the thimble seat are provided with one
The individual round platform for fixing thimble, is radially provided with some decile groovings on the round platform, edge is offered at the grooving position
The symmetrical hole clipping in round platform axle center, each hole clipping is used to fix a thimble, at least provided with two hole clippings on each grooving, circle
Platform is provided with the external screw thread matched with lock sleeve internal thread.
Preferably, the round platform middle part is circumferentially arranged with groove, round platform top is provided with and is matched with lock sleeve top
The conical surface.
Preferably, the thimble is elongate cylindrical shape, thimble head is provided with taper, and top rounding is processed.
Preferably, the thimble is made of wolfram steel material grinding and polishing.
A kind of special fixture for above-mentioned ejector pin mechanism, including a L-type base, two guide rails that level is set up, can
Along the sliding block of slide on base, and positioned at base left half, the limited post of position is moved to left for limiting sliding block, it is described
Ejector pin mechanism is arranged on sliding block, can be moved to the left with sliding block, and the L-type base top position that thimble is touched is plane.
A kind of ultra-thin chip packaging technology, comprises the following steps：
By Stress control distribution system by glue application in the chip adhesive region of printed substrate；
By vacuum suction and the jack-up of ejector thimble, ultra-thin chip is picked up, the ejector will using such as right
Seek the ejector pin mechanism described in any one of 1-4；
The vacuum slot that suction has ultra-thin chip moves to the chip adhesive overlying regions of the printed substrate for finishing glue, will
Ultra-thin chip attaches to chip adhesive region.
Preferably, using the picture glue pattern of flakes in chip adhesive region.
Beneficial effect：Compared with prior art, the present invention devises special ejector pin mechanism suitable for ultra-thin chip, can be
Some thimble heads are arranged symmetrically along chip center on thimble seat, effectively solve to cause chip rupture due to chip discontinuity
Problem.And ejector pin mechanism of the invention can by special fixture quick assembling and ensure thimble head flush, using with more
Change easily.Ultra-thin chip packaging technology of the invention, also to the figure and area of picture glue in addition to improving thimble structure
Carry out special design and management and control so that the picture glue surface of ultra-thin chip is identical with die size, while not excessive glue is also ensured,
Vacantly chip rupture is easily caused when solving the problems, such as ultra-thin chip nation line.
Brief description of the drawings
Fig. 1 is the ejector pin mechanism assembling schematic diagram of the embodiment of the present invention.
Fig. 2 is the arrangement schematic diagram of the thimble relative to chip of the embodiment of the present invention.
Fig. 3 is the ejector pin mechanism special replacement tool of the embodiment of the present invention.
Fig. 4 is the usage scenario schematic diagram of the embodiment of the present invention.
Fig. 5 is picture glue pattern schematic diagram in the packaging technology of the embodiment of the present invention.
In figure, 10- thimble seat round platforms, 11- groovings, 12- hole clippings, 13- grooves, the 14- conical surfaces, 20- thimbles, 30- lock sleeves,
40-L type bases, 41- guide rails, 42- limited posts, 43- flat parts, 44- sliding blocks, 50- ejector pin mechanisms to be installed, 1- ejector pin mechanisms, 2-
UV mould+wafer rings, 3- chips, 4- nations head suction nozzle.
Specific embodiment
Below in conjunction with the accompanying drawings and specific embodiment, the present invention is further illustrated.
As shown in figure 1, a kind of ejector pin mechanism for ultra-thin chip disclosed in the embodiment of the present invention, including thimble seat, top
Pin and lock sleeve, thimble seat are processed into by cylinder, and one end is fixed in machinery equipment, and the other end fixes thimble, can set
Ejected under standby drive and withdrawn.Fixed on thimble seat on the round platform 10 of thimble and be radially provided with some decile groovings 11, at least
The round platform quartering, grooving 11 are offered into some hole clippings 12 at position, each hole clipping 12 is used to fix a thimble 20, and each is cut
At least provided with two hole clippings 12 on groove 11, all hole clippings 12 are symmetrical along round platform axle center.Fig. 2 is one is used for ultra-thin square shaped core
The thimble arrangement schematic diagram of piece, several tiny thimble heads are symmetrical centered on chip center when chip is acted on,
So that chip uniform force and it is non-breakable.Thimble 20 is elongate cylindrical shape, and 0.15~0.20mm of diameter, head is provided with 10
Spend the taper of left and right, and top rounding treatment (R0.40-0.50mm).Thimble can be set using wolfram steel material by using precision
Standby grinding and polishing is made, and possesses height because it has high rigidity 92.0HRA and 4000MPa bending strength using high-quality wolfram steel material
Wearability and fabulous corrosion resistance.
Internal thread is set on lock sleeve 30, the bottom of round platform 10 sets external screw thread, during assembling thimble 20, required thimble 20 inserted successively
Enter in hole clipping 12, put lock sleeve 30 and tighten clockwise.It is easy to thimble circumferentially arranged with groove 13 in the middle part of round platform 10
Plug operation and observation.The top of round platform 10 is additionally provided with the conical surface 14 matched with the top of lock sleeve 30.
In order to ensure the concordant length of all thimbles is consistent, thimble special fixture as shown in Figure 3, the tool bag can be used
Include a L-type base 40, two guide rails 41 that level is set up, the sliding block 44, Yi Jiwei that can be slided along guide rail 41 on the base 40 it
In the left half of base 40, the limited post 42 of position is moved to left for limiting sliding block 44.When changing thimble using the special fixture, will push up
Needle stand is arranged on sliding block 44, thimble seat horizontal positioned, axial line and guide rail parallel, loads thimble and lock sleeve, by sliding block 44
It is moved to the left at limited post 42, thimble is withstood thimble by the flat part 43 of L-type base upper left quarter to concordant, is then turned round
Tight lock sleeve is the installation or replacing for completing thimble, very convenient.Two guide rails 41 can use two cylinders, on sliding block 44
If two with the through hole of guide rail, be enclosed within guide rail 41 and be capable of achieving slip, processing and manufacturing is simple.
Fig. 3 is to use the scene graph (saving miscellaneous part) of the ejector pin mechanism of the embodiment of the present invention.Placed after chip burst
On the wafer rings for posting UV films, the vacuum suction and thimble of nation's head are by chip from jack-up on UV films.In order to prevent ultra-thin chip
Split by thimble bursting, it is necessary to using special ejector pin mechanism of the invention.A kind of ultra-thin chip disclosed in the embodiment of the present invention
Packaging technology, mainly includes：
Glue is drawn, epoxy resin glue is coated on the chip adhesive area of printed substrate by Stress control distribution system
Domain.Common chip draws glue and uses ' × ' type, and glue area coverage just can be with and if ultra-thin chip more than the 80% of chip area
Glue area coverage is too small, and in W/B, chip is vacantly easily caused chip rupture, so being used such as Fig. 5 institutes for ultra-thin chip
The picture glue pattern of the flakes for showing, can make up the deficiency that common ' × ' draws glue, it is ensured that glue is evenly distributed on chip
Within effective area, and every length for drawing tree lace road and picture glue speed can be adjusted.
Absorption, by vacuum suction and the jack-up of ejector thimble, ultra-thin chip is picked up from UV films.
Attach, the suction nozzle that suction has chip moves to the top of the printed substrate for finishing glue, chip attaching chip is glued
Close region.
Above-described embodiment is only intended to clearly illustrate example of the present invention, and is not to embodiments of the present invention
Restriction.For those of ordinary skill in the field, other not similar shapes can also be made on the basis of the above description
The change or variation of formula.There is no need and unable to be exhaustive to all of implementation method.And these belong to spirit of the invention
Among the obvious change or variation extended out are still in protection scope of the present invention.
Claims (7)
1. a kind of ejector pin mechanism for ultra-thin chip, it is characterised in that including thimble seat, thimble and lock sleeve, the thimble
Seat is provided with a round platform for fixing thimble, and some decile groovings, the grooving position are radially provided with the round platform
Place is offered along the symmetrical hole clipping in round platform axle center, and each hole clipping is used to fix a thimble, on each grooving at least provided with
Two hole clippings, round platform is provided with the external screw thread matched with lock sleeve internal thread.
2. a kind of ejector pin mechanism for ultra-thin chip according to claim 1, it is characterised in that the round platform pars intermedia
Position is provided with the conical surface matched with lock sleeve top circumferentially arranged with groove, round platform top.
3. a kind of ejector pin mechanism for ultra-thin chip according to claim 1, it is characterised in that the thimble is elongated
Cylindric, thimble head is provided with taper, and top rounding is processed.
4. a kind of ejector pin mechanism for ultra-thin chip according to claim 1, it is characterised in that the thimble uses tungsten
Steel material grinding and polishing is made.
5. a kind of special fixture for the ejector pin mechanism as described in claim any one of 1-4, it is characterised in that including a L
Type base, two guide rails that level is set up on base along the sliding block of slide, and positioned at base left half, can be used for
Limitation sliding block moves to left the limited post of position, and the ejector pin mechanism is arranged on sliding block, can be moved to the left with sliding block, and thimble is touched
L-type base top position be plane.
6. a kind of ultra-thin chip packaging technology, it is characterised in that comprise the following steps：
By Stress control distribution system by glue application in the chip adhesive region of printed substrate；
By vacuum suction and the jack-up of ejector thimble, ultra-thin chip is picked up, the ejector is using such as claim 1-4
Ejector pin mechanism described in any one；
The vacuum slot that suction has ultra-thin chip moves to the chip adhesive overlying regions of the printed substrate for finishing glue, will be ultra-thin
Chip attaches to chip adhesive region.
7. ultra-thin chip packaging technology according to claim 1, it is characterised in that use flakes in chip adhesive region
Picture glue pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611214940.6A CN106816403A (en) | 2016-12-26 | 2016-12-26 | A kind of ejector pin mechanism, tool and ultra-thin chip packaging technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611214940.6A CN106816403A (en) | 2016-12-26 | 2016-12-26 | A kind of ejector pin mechanism, tool and ultra-thin chip packaging technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106816403A true CN106816403A (en) | 2017-06-09 |
Family
ID=59110466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611214940.6A Withdrawn CN106816403A (en) | 2016-12-26 | 2016-12-26 | A kind of ejector pin mechanism, tool and ultra-thin chip packaging technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106816403A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110126261A (en) * | 2019-06-11 | 2019-08-16 | 深圳市深科达智能装备股份有限公司 | Display or touch module 3D printing glue-line method |
| CN111398312A (en) * | 2020-02-19 | 2020-07-10 | 深圳市海铭德科技有限公司 | Thimble test head structure |
| CN114496854A (en) * | 2022-01-26 | 2022-05-13 | 华天科技（西安）有限公司 | A multi-thimble coplanarity calibration fixture for DB process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040035500A (en) * | 2002-10-22 | 2004-04-29 | 삼성전자주식회사 | Lift pin leveling apparatus for wafer stage |
| TWM335012U (en) * | 2008-01-14 | 2008-06-21 | Fu Jen Chang Technology Co Ltd | Multi-needle pushing needle structure |
| CN203600060U (en) * | 2013-11-08 | 2014-05-21 | 昆山永康精密模具有限公司 | Ejection needle machining jig |
| CN204391081U (en) * | 2014-12-10 | 2015-06-10 | 南通富士通微电子股份有限公司 | Thimble seat |
| CN204441271U (en) * | 2015-01-19 | 2015-07-01 | 蒋丽军 | A kind of semiconductor packages patch device thimble structure |
-
2016
- 2016-12-26 CN CN201611214940.6A patent/CN106816403A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040035500A (en) * | 2002-10-22 | 2004-04-29 | 삼성전자주식회사 | Lift pin leveling apparatus for wafer stage |
| TWM335012U (en) * | 2008-01-14 | 2008-06-21 | Fu Jen Chang Technology Co Ltd | Multi-needle pushing needle structure |
| CN203600060U (en) * | 2013-11-08 | 2014-05-21 | 昆山永康精密模具有限公司 | Ejection needle machining jig |
| CN204391081U (en) * | 2014-12-10 | 2015-06-10 | 南通富士通微电子股份有限公司 | Thimble seat |
| CN204441271U (en) * | 2015-01-19 | 2015-07-01 | 蒋丽军 | A kind of semiconductor packages patch device thimble structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110126261A (en) * | 2019-06-11 | 2019-08-16 | 深圳市深科达智能装备股份有限公司 | Display or touch module 3D printing glue-line method |
| CN110126261B (en) * | 2019-06-11 | 2021-04-13 | 深圳市深科达智能装备股份有限公司 | Method for 3D printing of adhesive layer by display or touch module |
| CN111398312A (en) * | 2020-02-19 | 2020-07-10 | 深圳市海铭德科技有限公司 | Thimble test head structure |
| CN114496854A (en) * | 2022-01-26 | 2022-05-13 | 华天科技（西安）有限公司 | A multi-thimble coplanarity calibration fixture for DB process |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170609 |