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CN106799830B - A kind of polymer surfaces micro-structure thermal marking method of plasmaassisted - Google Patents

A kind of polymer surfaces micro-structure thermal marking method of plasmaassisted Download PDF

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Publication number
CN106799830B
CN106799830B CN201611113861.6A CN201611113861A CN106799830B CN 106799830 B CN106799830 B CN 106799830B CN 201611113861 A CN201611113861 A CN 201611113861A CN 106799830 B CN106799830 B CN 106799830B
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polymer
plasma
template
assisted
polymer material
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CN201611113861.6A
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CN106799830A (en
Inventor
彭林法
王晋
邓宇君
易培云
来新民
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Shanghai Jiao Tong University
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Shanghai Jiao Tong University
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/16—Cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B29C2033/725—Cleaning cleaning by plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

The present invention relates to a kind of polymer surfaces micro-structure thermal marking methods of plasmaassisted, method includes the following steps: being handled using plasma surface treatment technology polymer material and template surface；Heat polymer material to glass transition temperature (Tg) or more；Applying pressure makes the fine die cavity in its filling template；Unloading pressure；It is cooling, so that material and template is cooled to Tg hereinafter, solidifying formed polymer micro-structural；Apply knockout press and complete demoulding, obtains the polymeric articles that surface is machined with micro-structure.Compared with prior art, the present invention reduces the rebound of polymer in thermal imprint process by enhancing adherency, it reduces and realizes that high-precision replicates required imprint temperature, effectively shorten the dwell time, even without packing stage, it can significantly shorten the thermal imprint process period, improve processing efficiency, furthermore, the present invention applies cooling after allowing unloading completely again, provides more effective approach for the optimization of thermal imprint process process.

Description

A kind of polymer surfaces micro-structure thermal marking method of plasmaassisted
Technical field
The present invention relates to a kind of polymer surfaces micro-structure thermal marking methods, more particularly to reduce Polymer in Hot Embossing Lithography and return The method of bullet.
Background technique
Thermal imprint process as a kind of in surface of polymer substrates directly replicating microstructured method, in optical thin film, micro- It is had broad application prospects in the manufactures of products such as fluidic chip, MEMS and specific function material.Technique master Will be comprising heating, coining, cooling and four steps of demoulding, polymeric substrate used is mainly thermoplasticity class, concrete principle are as follows: room The polymer material that glassy state is under temperature is heated to after glass transition temperature (Tg) or more into rubbery state, and modulus is significant (usually 2~3 orders of magnitude of decline compared at room temperature) are reduced, and mobile performance then significantly improves, at this point, applying pressure can make Its die cavity for smoothly filling micro-nano-scale；Under rubbery state, the deformation recovery of polymer material also becomes very easy, unloading It can occur significantly to spring back (deformation recovery amount is up to 50% or more) in the process, therefore, after type is filled in completion, it usually needs give one Fixed pressure maintaining or altered time enables to accumulate in the elastic strain energy inside polymer material and is released by way of stress relaxation It puts, to effectively reduce springback capacity, in addition, giving enough coolings before unloading, returns to polymer material in conformal process Glassy state, the movement of segment, can further effectively reduce rebound in " freezing " strand, and the final high-precision for realizing micro-structure is multiple System.
As micro-structural polymer product is applied to people's lives more and more widely, process requirements also increasingly increase It is long, however, thermal imprint process needs the cooling before necessary dwell time and unloading, process cycle due to above-mentioned rebound problem It is longer, it is difficult to meet requirement of the needs of growth for processing efficiency.How to shorten the thermal imprint process process-cycle, improves it and add Work efficiency rate is a major challenge that hot press printing technology faces in industrial application.1998, the Tan etc. of Princeton university People proposes hot-rolling method for stamping (Tan, H., Gilbertson, A., Chou, S.Y., 1998.Roller nanoimprint Lithography.J.Vac.Sci.Technol.B 16,3926), although this method because of its continuous, efficient production method and It processes the ability of large area micro-structure and is widely paid close attention to and studied, but rebound problem therein compares traditional concora crush Method is more obvious, main reason is that the dwell time is short during continuous rolling and is difficult to apply before unloading cooling, and is Its accuracy of repetition is improved, generally has to reduce roll-in speed.Chinese patent 201110171743.1 discloses a kind of viscoelastic Heat triggering thermoplastic polymer ultrasonic method for stamping: firstly, template to be heated to the Tg or more 1~60 of thermoplastic polymer ℃；Then, polymer matrix film at room temperature is placed in template and is loaded ultrasonic vibration, utilize ultrasonic vibration trigger polymers The viscoplasticity heat production of material accelerates the softening and flowing of material in formation zone；Finally, stopping ultrasonic vibration and applying certain time Dwell pressure, to prevent the deformation recovery of polymer.The inventive method is contracted using the viscoplasticity heat production feature of polymer material Short heating and filling time, but in order to which decreasing rebound still needs the longer dwell time, thermal imprint process is processed The raising of efficiency is extremely limited.
Therefore, existing thermal imprint process also requires further improvement, and especially processing efficiency urgently further increases, and high The method of the reduction polymer deformation recovery of effect then becomes the key for improving thermal imprint process processing efficiency.
Summary of the invention
It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and provide a kind of plasmaassisteds Polymer surfaces micro-structure thermal marking method.Mainly overcome present in existing thermal imprint process since polymer rebound is made At the lower deficiency of processing efficiency, a kind of method for preventing polymer in uninstall process from springing back using adherency is provided, is reduced real Imprint temperature needed for now high-precision replicates, and the dwell time is effectively reduced, it can significantly shorten the thermal imprint process period, meanwhile, Heating and cooling process can be simplified using the present invention, provide more effective approach for the raising of thermal imprint process processing efficiency.
The purpose of the present invention can be achieved through the following technical solutions: a kind of polymer surfaces of plasmaassisted are micro- Structure thermal marking method, which is characterized in that method includes the following steps:
(1) it is surface-treated: polymer material and template surface being handled using plasma surface treatment technology, increase Adhesive attraction between strength polymer material and template；
(2) type is filled in hot pressing: more than heating polymer material to glass transition temperature (Tg), applying pressure makes it fill mould Fine die cavity on plate, and making using the adhesive attraction of enhancing to be formed between formed polymer micro-structural and die cavity wall surface can The bonding leaned on；
(3) unload: unloading pressure, the bonding that the rebound of polymer micro-structural is formed in step (2) in uninstall process hinder Only；
(4) cooling: cooling applies after the completion of unloading, so that material and template is cooled to Tg hereinafter, solidifying formed gather Object micro-structure is closed, while being changed into weak glue using the different strong adherency caused between polymer and template of Material shrinkage in cooling It is attached；
(5) it demoulds: applying knockout press and complete demoulding, obtain the polymeric articles that surface is machined with micro-structure.
The Surface Treatment with Plasma technology includes cleaning to template surface and changes to surface of polymer material Property.
The cleaning to template surface is plasma clean, is adsorbed on template surface using plasma cleaning Pollutant reduces the weak boundary layer in bonding；Template is prepared by the higher material of the modulus such as metal, silicon.
Described is modified as using corona or plasma surface modification raising polymeric material surface of polymer material Expect the method for surface energy.
The plasma clean includes that the organic pollutant of template surface is made to aoxidize and adopt using oxygen plasma With inert gas (argon gas, helium) plasma bombardment template surface；
The plasma surface modification is made using oxygen, nitrogen or air plasma processing polymer material Surface of polymer material oxidation or nitridation, generate carbonyl, carboxyl isopolarity group, improve polymer surfaces polarity and surface energy, To improve the model ylid bloom action power in bonding.
The polymer material is thermoplastic based polymer, and thickness is at 10 μm or more.
After the surface of polymer material processing, the thickness of surface reforming layer is less than 100nm, does not influence bulk material Performance.
The modified polymer material in surface, surface can reach 60mJ/m2More than.
The characteristic size of the polymer micro-structural is between 100nm~1000 μm.
The surface treatment of step (1) enhancing bonding, can independently of hot padding process, before carrying out hot padding at completion Reason, can also be integrated among hot padding process.By the adhesive attraction between reinforced polymeric material and template, make formed The formation between die cavity wall surface is reliable Nian Jie before unloading for polymer micro-structural, to prevent polymer micro-structural in uninstall process Rebound, may not need the dwell time in coining, and allow to apply cooling again after unloading.
Hot pressing described in step (2) fill type include plate to plate, roller to plate and roll-to-roll three kinds of coining modes.
The temperature that polymer material is heated described in step (2) is that can provide between Tg to Tg+50 DEG C according to Embosser Pressure limit, realize sufficiently fill type under the premise of, can by imprint temperature control near Tg.
Compared with prior art, the invention has the following advantages that
1, by enhance adhesive attraction make polymer material completion fill after type formed with die cavity wall surface it is reliable bonding, in bullet Property strain energy be less than and destroy i.e. off-loadable demoulding under conditions of energy needed for bonding interface, can significantly shorten realization high-precision and replicate The required dwell time, it might even be possible to remove entire packing stage, therefore can significantly shorten the thermal imprint process period, improve again Efficiency processed；
2, the invention at a lower temperature (such as near Tg), that is, under the conditions of material deformation reply volume is biggish, can be realized In high precision, efficient microstructure replication, polymeric substrate occurs serious thermal deformation, is thinned very when preventing from processing under higher temperature To the problems such as going bad.
3, the invention allows to apply cooling again after unloading, and improves the adaptability of thermal imprint process, while being hot padding work The optimization of skill provides more effective approach, for example, cooling is difficult to apply to unload it in continuous hot-rolling imprint process Before, it usually needs it reduces roll-in speed and improves roll temperature to avoid the obvious rebound of structure in unloading, and in the invention, Without applying cooling before unloading, but adherency is utilized to prevent the rebound in unloading, therefore can effectively improve roll-in speed and drop Low roll temperature.
4, individually cooling after can separating template, polymeric replicas with heating module after unloading, cooling efficiency is high, and nothing Need to heating module be heated up and be cooled down repeatedly, can further shorten process cycle, in addition, under efficient cooling condition, Using the inconsistent of template and polymer material shrinkage character, weaken the adhesive attraction at its interface automatically, is conducive to reduce de- Mould power improves demoulding efficiency.
The present invention prevents the rebound of polymer in unloading, significantly shortening process cycle, raising duplication effect by increase adherency Rate, while also helping and reduce imprint temperature and improve demoulding efficiency, it is a kind of high efficiency, high-precision imprinting moulding method.
Detailed description of the invention
Fig. 1 is the schematic diagram of polymer rebound in existing hot padding unloading；
Fig. 2 is the schematic diagram for reducing polymer rebound in hot padding unloading in the present invention by enhancing adherency；
Fig. 3 is the embodiment of the present invention 1, that is, the process flow chart being applied in flat hot padding；
Fig. 4 is the embodiment of the present invention 2, that is, the schematic device being applied in roll-to-roll hot-rolling coining；
In figure: 1- template, 2- polymer material, 3- plasma generator, the upper heating plate of 4-, heating plate under 5-, 6- are cold But device, 7- polymeric articles, 8- polymer material (coiled material), 9- let off roll, 10- plasma producing apparatus, the pre- hot charging of 11- It sets, 12- mold roller, 13- pressure roll, the upper cooling device of 14-, cooling device under 15-, 16- polymeric articles (coiled material), 17- stripping Digression controls roller, 18- wind-up roll, the template after I, II, III-cleaning, I, the II, III-modified polymer material in surface.
Specific embodiment
The present invention is described in detail with specific embodiment below in conjunction with the accompanying drawings.
Embodiment 1
In the present embodiment, template used is nickel mould made of electroforming, and polymer material used is PMMA (poly- methyl-prop E pioic acid methyl ester, Tg=110 DEG C), using flat method for stamping, using the process flow after present invention optimization as shown in figure 3, tool Body is described as follows:
Step 1: surface treatment.Prepare multi-disc template 1 and PMMA material 2, and using plasma producing apparatus 3 to its table Face is handled, and is bombarded template surface 30s using argon plasma, is removed the pollutants such as its greasy dirt remained on surface, obtains Number is the template of I, II, III ..., bombards PMMA material surface 30s using oxygen and nitrogen gas plasma, makes its surface layer point Subchain is broken and is oxidized, and generates carboxyl, carbonyl and hydroxyl isopolarity group, can be from 40mJ/m by its surface2It improves extremely left and right 80mJ/m2More than, obtain the PMMA material that number is I, II, III ...；
Step 2: heating.The temperature of heating plate 4, heating plate 5 is set in advance and is maintained at 130 DEG C (Tg+20 DEG C), by mould Plate I and PMMA material I are placed between heating plate 4,5 and heat 120s, make PMMA material I by thermal softening；
Step 3: load.Heating plate 4 is pushed, applies pressure 5MPa, the PMMA material I after softening is under pressure Fill type flowing, complete filling to fine die cavity in template I, pressure maintaining 30s (at 130 DEG C in PMMA material stress complete pine It relaxes and usually requires 500s or more, and can will reduce the dwell time in the present embodiment since the adherency using enhancing is come decreasing rebound It to 30s), fills in type and pressure maintaining period, makes to be formed between PMMA material and die cavity wall surface using the adhesive attraction of enhancing reliable viscous It connects；
Step 4: unloading.Move up heating plate 4, unloading pressure, the rebound of PMMA material is by step in uninstall process The bonding formed in rapid 3 is prevented.
Step 5: cooling.As shown in step 5-1, template I and PMMA material I are taken out between heating plate 4,5, are placed in In cooling device 6 cooling 60s to 50 DEG C hereinafter, as shown in step 5-2, heating plate 4,5 temperature are remained unchanged in cooling procedure, It can be used for the heating of template II and PMMA material II, that is, return to step 2 and start next process cycle.
Step 6: demoulding.Since nickel material and PMMA material modulus differ greatly, it is cooling in shrink it is inconsistent, interface it is viscous Attached effect thus weaken, applying lesser knockout press can smoothly demould, and obtain surface and be machined with the polymerization produce of fine structure Product 7, in addition, template I is circularly used among subsequent process cycle.
In the present embodiment, rebound is prevented using the adherency of enhancing, the dwell time is shortened, avoids to heating plate repeatedly Heating and cooling, while allowing concurrent job, thus can effectively enhance technological flexibility, shorten process cycle, significantly improves multiple Efficiency processed.
Embodiment 2
In the present embodiment, using roll-to-roll hot-rolling method for stamping, it is described as follows:
The device of use as shown in figure 3, wherein the rotation of let off roll 9, wind-up roll 18 and mold roller 12 be driven by motor, press The rotation of power roller 13 can be driven or be driven by motor by mold roller 12, and the hydraulic cylinder being connected with pressure roll 13 can push pressure roll 13 Mold roller 12 is pressed to, peel angle regulation roller 17 can be moved up and down to adjust peel angle when demoulding.
Polymer material used be PC (polycarbonate, Tg=150 DEG C) coiled material, 250 μm of thickness.
After roll-in starts, PC material 8 is spread out of from let off roll 9 with the speed of 0.5m/min, by plasma producing apparatus 10 The air plasma inspired starts to bombard the surface of PC material 8, enables its surface from 45mJ/m2It improves to 90mJ/m left and right2 More than.After the completion of surface treatment, PC material 8 is transferred into warm-up block, is preheated to 130 DEG C by irradiating formula preheating device 11 (Tg-20℃).After the completion of preheating, PC material 8 enters between mold roller 12 and pressure roll 13, and the temperature of mold roller 12 is set as 170 DEG C (Tg+20 DEG C), the roller pressure that pressure roll 13 applies is 10N/mm.
PC material 8 contacts subsequent temperature of continuing rising with mold roller 12, while with the rotation of mold roller 12 and pressure roll 13, load Process starts, and the pressure being subject on PC material 8 is gradually increased, and starts Deformation Flow and fills the fine die cavity on mold roller, and Formed with die cavity wall surface it is reliable bonding, as the pressure roll 13 of mold roller 12 continues to rotate, the pressure being subject on PC material 8 Starting to be gradually reduced after reaching maximum value, i.e., uninstall process starts, due to the bonding formed in loading procedure, PC material in unloading The rebound of formed fine structure is prevented from 8, and after the completion of unloading, PC material 8 passes between mold roller 12 and pressure roll 13 Out, it fits together due to adhesive attraction and with mold roller 12, PC is made by upper cooling device 14 and lower cooling device 15 at this time Formed fine structure cools and solidifies rapidly on material 8, and deviates from it from die cavity by tensile force, last further cold But to room temperature, the polymeric articles 16 that surface is machined with fine structure are obtained, and complete the winding of product by wind-up roll 18.
In the present embodiment, rebound is prevented using the adherency of enhancing, roll temperature can be effectively reduced, avoid under higher temperature Polymer material occur serious thermal deformation and it is thinned the problems such as, while roll-in speed can be improved, to improve duplicating efficiency.

Claims (9)

1.一种等离子体辅助的聚合物表面微结构热压印方法，其特征在于，该方法包括以下步骤：1. a plasma-assisted polymer surface microstructure hot embossing method is characterized in that, the method comprises the following steps: (1)表面处理：利用等离子表面处理技术对聚合物材料及模板表面进行处理，增强聚合物材料与模板之间的粘附作用；(1) Surface treatment: use plasma surface treatment technology to treat the surface of the polymer material and the template to enhance the adhesion between the polymer material and the template; (2)热压充型：加热聚合物材料至玻璃化转变温度(Tg)以上，施加压力使其充填模板上的微细模腔，并利用增强的粘附作用使已成形的聚合物微结构与模腔壁面之间形成可靠的粘接；(2) Hot press filling: heating the polymer material to above the glass transition temperature (Tg), applying pressure to fill the fine cavity on the template, and using enhanced adhesion to make the formed polymer microstructure and A reliable bond is formed between the walls of the cavity; (3)卸载：卸载压力，卸载过程中聚合物微结构的回弹被步骤(2)中形成的粘接阻止；(3) Unloading: unloading the pressure, the rebound of the polymer microstructure during the unloading process is prevented by the bonding formed in step (2); (4)冷却：冷却在卸载完成后施加，使材料和模板降温至Tg以下，固化已成形的聚合物微结构，同时利用冷却中材料收缩的不一致使聚合物与模板之间的强粘附转变为弱粘附；(4) Cooling: Cooling is applied after unloading is completed to cool the material and template below Tg, solidify the formed polymer microstructure, and at the same time utilize the inconsistency of material shrinkage during cooling to transform the strong adhesion between the polymer and the template for weak adhesion; (5)脱模：施加脱模力完成脱模，获得表面加工有微结构的聚合物产品。(5) Demoulding: applying demoulding force to complete demoulding to obtain polymer products with microstructures processed on the surface. 2.根据权利要求1所述的一种等离子体辅助的聚合物表面微结构热压印方法，其特征在于，所述的等离子表面处理技术包括对模板表面的等离子体模板表面清洗以及对聚合物材料表面的等离子体聚合物表面改性。2. A plasma-assisted polymer surface microstructure hot embossing method according to claim 1, wherein the plasma surface treatment technology comprises plasma template surface cleaning on the template surface and polymer surface cleaning. Plasma polymer surface modification of material surfaces. 3.根据权利要求2所述的一种等离子体辅助的聚合物表面微结构热压印方法，其特征在于，所述等离子体模板表面清洗的方法，包括常压大气等离子和真空低温等离子体清洗；3. A plasma-assisted polymer surface microstructure hot embossing method according to claim 2, wherein the method for cleaning the surface of the plasma template comprises atmospheric plasma at atmospheric pressure and vacuum and low-temperature plasma cleaning ; 所述的等离子体聚合物表面改性的方法，包括常压大气等离子、真空低温等离子体表面改性以及电晕处理。The method for surface modification of plasma polymer includes atmospheric plasma at atmospheric pressure, surface modification of vacuum and low temperature plasma and corona treatment. 4.根据权利要求3所述的一种等离子体辅助的聚合物表面微结构热压印方法，其特征在于，用于模板清洗的等离子体为氧气等离子体或氧气和惰性气体混合的等离子体，所述的惰性气体为氩气或氦气，利用氧气的氧化效应和惰性气体的轰击效应清除吸附在模板表面的有机污染物，减少粘接中的弱边界层；4. a kind of plasma-assisted polymer surface microstructure hot embossing method according to claim 3, is characterized in that, the plasma used for template cleaning is oxygen plasma or oxygen and inert gas mixed plasma, The inert gas is argon or helium, and the oxidation effect of oxygen and the bombardment effect of the inert gas are used to remove the organic pollutants adsorbed on the surface of the template and reduce the weak boundary layer in the bonding; 所述的等离子体聚合物表面改性是利用氧气、氮气或空气等离子体处理聚合物材料，使聚合物材料表面因氧化或氮化而生成极性基团，提高聚合物表面极性和表面能，从而提高粘接中的范德华作用力。The plasma polymer surface modification is to use oxygen, nitrogen or air plasma to treat the polymer material, so that the surface of the polymer material generates polar groups due to oxidation or nitridation, and improves the surface polarity and surface energy of the polymer. , thereby increasing the van der Waals force in the bonding. 5.根据权利要求1所述的一种等离子体辅助的聚合物表面微结构热压印方法，其特征在于，所述的聚合物材料为热塑性类聚合物，厚度在10μm以上。5 . The plasma-assisted hot embossing method for polymer surface microstructures according to claim 1 , wherein the polymer material is a thermoplastic polymer with a thickness of more than 10 μm. 6 . 6.根据权利要求4所述的一种等离子体辅助的聚合物表面微结构热压印方法，其特征在于，所述的聚合物材料表面进行处理后，其表面改性层的厚度小于100nm。6 . The plasma-assisted polymer surface microstructure hot embossing method according to claim 4 , wherein after the surface of the polymer material is treated, the thickness of the surface modification layer is less than 100 nm. 7 . 7.根据权利要求6所述的一种等离子体辅助的聚合物表面微结构热压印方法，其特征在于，表面改性后的聚合物材料，其表面能达到60mJ/m2以上。7 . The plasma-assisted polymer surface microstructure hot embossing method according to claim 6 , wherein the surface energy of the surface-modified polymer material reaches more than 60 mJ/m 2 . 8.根据权利要求6所述的一种等离子体辅助的聚合物表面微结构热压印方法，其特征在于，所述的聚合物的微结构的尺寸在100nm～1000μm之间。8 . The plasma-assisted thermal embossing method for polymer surface microstructures according to claim 6 , wherein the size of the polymer microstructures is between 100 nm and 1000 μm. 9 . 9.根据权利要求6所述的一种等离子体辅助的聚合物表面微结构热压印方法，其特征在于，步骤(2)所述的加热聚合物材料的温度为Tg至Tg+50℃之间。9 . The plasma-assisted polymer surface microstructure hot embossing method according to claim 6 , wherein the temperature of heating the polymer material in step (2) is between Tg and Tg+50° C. 10 . between.
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