CN106653749A - Display module and preparation method thereof - Google Patents

Abstract

The embodiment of the present invention discloses a display module and a preparation method thereof. The display module includes: a display screen body including a plurality of screen body terminals; a chip-on-chip film located above the display screen body, and the chip-on-chip film includes A drive unit and a number of drive terminals electrically connected to the drive unit, the drive terminals are arranged in alignment with the terminals of the screen body; an anisotropic conductive film is located between the display screen body and the chip-on-chip film, and the anisotropic conductive film The film is used to bond the aligned screen terminals and drive terminals into a terminal group, and the anisotropic conductive film includes conductive particles, and the conductive particles are used to electrically connect the screen terminals and drive terminals in the terminal group. Sexual connection; the insulating layer is located on the side surface of the terminal group facing the adjacent terminal group. By providing an insulating layer on the side surface of the terminal group facing the adjacent terminal group, when the distance between the adjacent terminal groups is very close, the two terminal groups will not be short-circuited by conductive particles, ensuring the safety of the display module.

Description

Display module and manufacturing method thereof

technical field

The invention relates to the field of display technology, in particular to a display module and a preparation method thereof.

Background technique

A current display module generally includes a display body and a driving unit for controlling pixels in the display body, and the driving unit is usually arranged in a chip on film (COF). Wherein, the chip-on-film also includes drive terminals connected to the drive unit, and the display screen includes screen terminals connected to pixels, and the drive terminals and screen terminals are generally connected by a heat-cured Anisotropic Conductive Film (ACF). To achieve bonding, the conductive particles (ie, ACF particles) in the anisotropic conductive film are used to electrically connect the screen terminal and the driving terminal, so that the driving unit can control the display state of the pixel.

However, with the gradual improvement of the resolution of current display modules, the number and density of display module drive terminals and screen terminals are increasing, which leads to an increasing distance between adjacent drive terminals or adjacent screen terminals. Small, adjacent terminals are prone to short circuit under the action of conductive particles, resulting in damage to the display module.

Contents of the invention

The purpose of the embodiments of the present invention is to provide a display module and a manufacturing method thereof, so as to solve the above-mentioned problems.

In order to solve the above technical problems, an embodiment of the present invention provides a display module, including:

A display body, including a plurality of screen body terminals;

A chip-on-chip film located above the display body, the chip-on-chip film includes a drive unit and a number of drive terminals electrically connected to the drive unit, and the drive terminals are arranged in alignment with the screen body terminals;

An anisotropic conductive film is located between the display body and the chip-on-chip film, and the anisotropic conductive film is used to bond the aligned terminals of the screen body and drive terminals into a terminal group, and the anisotropic conductive film Including conductive particles, the conductive particles are used to electrically connect the screen terminal and the drive terminal in the terminal group;

The insulating layer is located on the side surface of the terminal group facing the adjacent terminal group.

In an embodiment of the present invention, the insulating layer includes a first portion located on the screen terminal and a second portion located on the drive terminal.

In an embodiment of the present invention, the screen terminal includes a top surface facing the aligned drive terminals, and the first portion extends to part of the top surface.

In an embodiment of the present invention, the driving terminals include a bottom surface facing the aligned driving terminals, and the second portion extends to part of the bottom surface.

In an embodiment of the present invention, the distance between the two parts of the insulating layer located on the bottom surface and the top surface is smaller than the diameter of the conductive particles.

In an embodiment of the present invention, each of the terminal groups has an insulating layer.

In the embodiment of the present invention, the terminal groups are arranged in the same row, and the insulating layer is located on the side surface of each terminal group on the same side.

In the embodiment of the present invention, the thickness of the insulating layer is 2 microns.

In an embodiment of the present invention, the display module is a flexible display module.

In order to solve the above technical problems, an embodiment of the present invention provides a method for preparing a display module, including:

A display screen body is provided, and a plurality of screen body terminals are formed on the display screen body, and the screen body terminals are covered with a photoresist layer;

Retaining the photoresist layer on the side surface of the screen terminal, the side surface of the screen terminal is set to face the adjacent drive terminal;

A chip-on-chip film is provided, and a plurality of drive terminals are formed on the chip-on film, and the drive terminals are covered with a photoresist layer;

Retaining a photoresist layer on a side surface of the driving terminal, the side surface of the driving terminal being arranged to face an adjacent driving terminal;

An anisotropic conductive film is arranged above the display body;

The chip-on-chip film is arranged above the heterogeneous conductive film, and the driving terminals in the chip-on-film film are aligned with the screen body terminals in the display screen;

The anisotropic conductive film is heated and cured so that the aligned screen terminals and drive terminals are bonded to form a terminal group, and the screen terminals in the terminal group cooperate with the photoresist layer on the drive terminals to form an insulating layer.

It can be seen from the above technical solutions provided by the embodiments of the present invention that in the display module and its manufacturing method provided by the embodiments of the present invention, an insulating layer is provided on the side surface of the terminal group facing the adjacent terminal group, and the adjacent terminals When the group distance is very close, the two terminal groups will not be short-circuited by conductive particles, ensuring the safety of the display module.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments described in the present invention. Those skilled in the art can also obtain other drawings based on these drawings without any creative effort.

FIG. 1 is a schematic side view of a display module in an embodiment of the present invention.

FIG. 2 is a schematic top view of a display module in an embodiment of the present invention.

FIG. 3 is a flowchart of a manufacturing method of a display module in an embodiment of the present invention.

detailed description

In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

FIG. 1 is a schematic side view of a display module in an embodiment of the present invention. As shown in FIG. 1, the display module 100 includes a display body 10, a chip-on-chip film 20, an anisotropic conductive film 30, and an insulating layer 40. The display module 100 can be a common flexible display and can be applied to mobile phones and tablets. computer and other fields. The structure of the display module 100 will be described in detail below in conjunction with specific embodiments.

The display screen 10 includes a panel 11 carrying pixels (not shown) and a plurality of screen terminals 12 on the panel 11. The aforementioned pixels may be OLED pixels, and the screen terminals 12 are electrically connected to a certain number of pixels. The bulk terminal 12 can control the display module of these pixels. Of course, the display screen 10 also includes a scanning circuit connecting the screen terminals 12 and these pixels, and the number and position of the screen terminals 12 can be preset according to the number and layout of the pixels, so details are not repeated here.

The chip-on-film 20 is located above the display body 10. The chip-on-film 20 may include a film body 21 and a drive terminal 22 arranged on the film body 21. The drive terminal 22 is connected to a peripheral control circuit (not shown), and the peripheral control circuit generates drive signal and transmit the drive signal to the drive terminal. The number and layout of the drive terminals 22 can be preset according to the number and layout of the screen body terminals 12, so that when the chip-on-film 20 is arranged above the display body 10, each drive terminal 22 is arranged in alignment with one screen body terminal 12 .

It is worth noting that the aforementioned "chip-on film 20 is located above the display body 10" is only used to limit the chip-on film 20 covering the display body 10, and does not limit the specific relationship between the chip-on film 20 and the display body 10. Orientation, for example, when the display screen body 10 is set facing downward, the COF 20 is located below the display screen body 10 , which will not be described in detail here.

The anisotropic conductive film 30 is located between the display body 10 and the COF 20 . The anisotropic conductive film 30 may include an adhesive 31 and conductive ions 32 inside the adhesive 31 . The adhesive 31 may be made of materials such as resin.

In an initial state, the heterotropic conductive film 30 is laid between the display body 10 and the COF 20 . Subsequently, the shape of the adhesive 31 is adjusted through thermal curing and other technical means, and then the screen terminal 12 in the display body 10 is bonded to the driving terminal 22 in the chip-on-chip film 20 arranged in alignment through the adhesive 31 . In the embodiment of the present invention, the mutually bonded screen terminals 12 and driving terminals 22 can form a terminal group 60, and then each screen terminal 12 forms a terminal group 60 with an aligned driving terminal 22 (refer to FIG. 2 shown).

In practical application, in each terminal group, there is a gap 50 between the screen body terminal 12 and the drive terminal 22, and this gap 50 is filled by the anisotropic conductive film 30, and the conductive particles 32 in the anisotropic conductive film are also filled in the gap 50. Inside.

Specifically, the screen body terminal 12 includes a top surface 121 forming a gap 50, and the drive terminal 22 includes a bottom surface 221 forming a gap 50. When the density of the conductive particles 32 in the gap is sufficient, the terminal group 60 can be made by the conductive particles 32. The top surface 121 of the screen body terminal 12 and the bottom surface 221 of the driving terminal 22 are electrically connected, so that the driving signal generated by the peripheral control circuit can pass through the driving terminal 22 and the screen body terminal 12 to reach the pixel to be controlled. Of course, since the heterogeneous conductive film is filled with more conductive particles 32 , there are also more conductive particles 32 between adjacent terminal groups 60 .

FIG. 2 is a schematic top view of a display module in an embodiment of the present invention. As shown in FIG. 2 , the number of insulating layers 30 may be consistent with the number of terminal groups 60 , so that each terminal group 60 has one insulating layer 30 .

In the embodiment of the present invention, the terminal group 60 is roughly in the shape of a square column, and the terminal group 60 includes a side surface 61 facing the adjacent terminal group. The other part on the terminal 22 , that is, each side surface 61 extends from the panel 11 to the gap 50 , and then extends from the gap 50 to the film body 21 .

Correspondingly, the insulating layer 30 also includes a first portion 31 located on the screen terminal 12 and a second portion 32 located on the drive terminal 22 , the first portion 31 is located on the screen terminal 12 , and the second portion 32 is located on the drive terminal 22 . Due to the existence of the insulating layer 30, when the adjacent terminal groups 60 are very close, the two terminal groups 60 will not be short-circuited by the conductive particles, which ensures the safety of the display module.

In the embodiment of the present invention, the first part 31 of the insulating layer 30 also extends to the top surface 121 of the part of the screen body terminal 12, the second part 32 also extends to the bottom surface 221 of the part of the driving terminal 22, and the insulating layer is located on The distance between the parts of the bottom surface and the top surface is smaller than the diameter of the conductive particles 32, so that a barrier is formed in the gap 50, and the conductive particles in the gap 50 are separated from the two terminal groups 60 that need to be isolated. The conductive particles 32 are separated to prevent the conduction of the two conductive particles 32, resulting in a short circuit between the two terminal groups.

The position of the side surface 61 also differs depending on the layout of the terminal group. For example, when the terminal groups 60 are all arranged in the same row, the side surface 61 is the surface of the terminal groups 60 facing the two sides of the same row; There are 4 groups, and there are 4 side surfaces 61 correspondingly. Regardless of the number of side surfaces 61, the insulating layer 30 may be located on any one side surface 61 or on all side surfaces simultaneously.

In the embodiment of the present invention, taking the terminal group 60 arranged in the same line as an example, the number of side surfaces 61 facing the same line in the terminal group 60 is two, and the insulating layer 30 can be located on the same side of any terminal group 60 On the side surface 61 , the insulating layer 30 located on this side can electrically isolate the terminal group 60 from the conductive particles 32 located in the adjacent terminal group 60 .

To sum up, in the display module provided by the embodiment of the present invention, by providing an insulating layer on the side surface of the terminal group facing the adjacent terminal group, when the distance between the adjacent terminal groups is very close, the two terminal groups will not It will be short-circuited by conductive particles to ensure the safety of the display module. At the same time, the bonding yield and space utilization can be improved, and the spacing between the terminals to be bonded can be reduced from the original 48um to 38um, which is in line with the current development trend of high-resolution display modules.

FIG. 3 is a flowchart of a manufacturing method of a display module in an embodiment of the present invention. The display module described in the foregoing embodiments can be prepared through this method, and the method specifically includes the following steps 101 to 104 .

In step 101, a display screen body 10 is provided, and several screen body terminals 12 are formed on the display screen body 10, and the screen body terminals 12 are covered with a photoresist layer.

In the process of forming the screen terminal 12 on the display screen body 10, a patterned photoresist layer will be covered on the display screen body 10, so that the screen body part forming the screen body terminal 121 is covered by the photoresist layer for preparation. Subsequent exposure and development processes are performed on the display screen body to form screen body terminals. Therefore, the top surface 121 and the peripheral side of the formed screen terminal 12 will be covered with a photoresist layer.

In step 102 , the photoresist layer on the side surface of the screen terminal 12 is left, and the side surface of the screen terminal is set to face the adjacent driving terminal.

The photoresist layer on the top surface 121 of the screen body terminal and the photoresist layer on part of the side are cleaned, and only the photoresist layer on the side surface facing the adjacent drive terminal is left.

Of course, in other embodiments of the present invention, part of the photoresist layer on the top surface 121 can also be reserved to form an inverted L-shaped photoresist layer with the photoresist layer on the side surface.

In step 103, a chip-on-chip film 20 is provided, and a plurality of driving terminals 22 are formed on the chip-on-chip film 20, and the driving terminals 22 are covered with a photoresist layer;

In the process of forming the drive terminal 22 on the chip-on film 20, a patterned photoresist layer will be covered on the chip-on film 20, so that the chip-on film forming the drive terminal 22 is covered by the photoresist layer for subsequent processing. The COF is exposed and developed to form the driving terminals 22 . Therefore, the bottom surface 221 and the peripheral side of the formed driving terminal are covered with a photoresist layer.

In step 104, the photoresist layer on the side surface of the driving terminal 22 is retained, and the side surface of the driving terminal is set to face the adjacent driving terminal;

The photoresist layer on the bottom surface 221 of the driving terminal and the photoresist layer on a part of the side are cleaned, and only the photoresist layer on the side surface facing the adjacent driving terminal is left.

Of course, in other embodiments of the present invention, part of the photoresist layer on the bottom surface 221 can also be reserved to form an inverted L-shaped photoresist layer with the photoresist layer on the side surface.

In step 105 , an anisotropic conductive film 30 is disposed on the display screen body 10 .

The anisotropic conductive film 20 is in the form of a solid film and includes a plurality of conductive particles 32 inside. An anisotropic conductive film 30 is laid on the top of the display screen body 10 , and the screen body terminals 12 in the display panel face the anisotropic conductive film 30 .

In step 106 , the COF 20 is disposed above the heterogonal conductive film 30 , and the driving terminals 22 in the COF are aligned with the screen body terminals 12 in the display screen.

The driving terminals 22 in the COF 20 face the opposite side conductive film 30 , so that each driving terminal 22 is aligned with the screen terminal 12 in the display screen.

In step 107, the heterogonal conductive film 30 is heated and cured, so that the aligned screen terminals 12 and drive terminals 22 are bonded into a terminal group 60, and the screen terminals 12 and drive terminals in the terminal group 60 The photoresist layer on 22 cooperates to form the insulating layer 40 .

After the heterogeneous conductive film 30 is heated and cured, the aligned screen terminals 12 and drive terminals 22 are bonded to form a terminal group 60, and the parts of the screen terminals 12 and drive terminals 22 that are not covered by the photoresist layer will be covered with The conductive particles 31 in the anisotropic conductive film conduct conduction.

Moreover, the photoresist layer on the screen terminal and the drive terminal in each terminal group will be close to form an insulating layer 60, so that when the distance between adjacent terminal groups is very close, the two terminal groups will not be short-circuited by conductive particles, ensuring Displays the security of the mod. At the same time, the bonding yield and space utilization can be improved, and the spacing between the terminals to be bonded can be reduced from the original 48um to 38um, which is in line with the current development trend of high-resolution display modules.

At the same time, only part of the photoresist layer used in the original exposure and development process needs to be retained to form the insulating layer, without additional process steps, making the preparation of the display module simple.

Each embodiment in this specification is described in a progressive manner, the same and similar parts of each embodiment can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and for relevant parts, refer to part of the description of the method embodiment.

The above descriptions are only examples of the present invention, and are not intended to limit the present invention. Various modifications and variations of the present invention will occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the scope of the claims of the present invention.

Claims (10)

1. a kind of display module, it is characterised in that include：

Display screen body, including some screen body ends；

Chip on film, positioned at the display screen body top, the chip on film include driver element and with the driver element The some drive terminals being electrically connected with, the drive terminal is alignd setting with body end is shielded；

Different side's conducting film, between the display screen body and chip on film, different side's conducting film is used for arrange alignment With drive terminal bonding into terminal group, different side's conducting film includes conducting particles to screen body end, and the conducting particles is used It is electrically connected with drive terminal in screen body end in the terminal group is caused；

Insulating barrier, positioned at the terminal group on the side surface of abutting end subgroup.

2. display module as claimed in claim 1, it is characterised in that the insulating barrier includes being located on screen body end Part I and the Part II in drive terminal.

3. display module as claimed in claim 2, it is characterised in that the screen body end attached bag includes the drive for arranging of aliging The top surface of moved end, the Part I extends to the top surface of part.

4. display module as claimed in claim 3, it is characterised in that the drive terminal includes the drive for arranging of aliging The bottom surface of moved end, the Part II extends to the bottom surface of part.

5. display module as claimed in claim 4, it is characterised in that the insulating barrier is located at two of the bottom surface and top surface That what is divided is smaller than the diameter of the conducting particles.

6. display module as claimed in claim 1, it is characterised in that each described terminal group is respectively provided with insulating barrier.

7. display module as claimed in claim 1, it is characterised in that the terminal group is arranged in same a line, the insulating barrier On the side surface of the same side of each terminal group.

8. display module as claimed in claim 1, it is characterised in that the thickness of the insulating barrier is 2 microns.

9. display module as claimed in claim 1, it is characterised in that the display module is flexible display screen module.

10. a kind of preparation method of display module, it is characterised in that include：

Display screen body is provided, some screen body end are formed on display screen body, on screen body end photoresist layer is coated with；

Retain the photoresist layer on the side surface of screen body end, the side surface of screen body end is arranged to face Adjacent driven terminal；

Chip on film is provided, some drive terminals are formed in the chip on film, in the drive terminal photoresist is coated with Layer；

Retain the photoresist layer on the side surface of the drive terminal, the side surface of the drive terminal is arranged to face Adjacent driven terminal；

Different side's conducting film is set above the display screen body；

The chip on film is arranged at into different side's conducting film top, drive terminal and the display screen in the chip on film Screen body end alignment in vivo is arranged；

Be heating and curing different side's conducting film so that alignment arrange the screen body end son with drive terminal bonding into terminal Screen body end and photoresist layer in drive terminal cooperatively form insulating barrier in group, the terminal group.