CN106637111B - 一种铌基硼掺杂金刚石泡沫电极及其制备方法与应用 - Google Patents
一种铌基硼掺杂金刚石泡沫电极及其制备方法与应用 Download PDFInfo
- Publication number
- CN106637111B CN106637111B CN201610920318.0A CN201610920318A CN106637111B CN 106637111 B CN106637111 B CN 106637111B CN 201610920318 A CN201610920318 A CN 201610920318A CN 106637111 B CN106637111 B CN 106637111B
- Authority
- CN
- China
- Prior art keywords
- foam
- boron
- doped diamond
- layer
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/46109—Electrodes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
- C23C14/025—Metallic sublayers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
- C23C16/0281—Deposition of sub-layers, e.g. to promote the adhesion of the main coating of metallic sub-layers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
- C23C16/277—Diamond only using other elements in the gas phase besides carbon and hydrogen; using other elements besides carbon, hydrogen and oxygen in case of use of combustion torches; using other elements besides carbon, hydrogen and inert gas in case of use of plasma jets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
- C23C16/278—Diamond only doping or introduction of a secondary phase in the diamond
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/343—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one DLC or an amorphous carbon based layer, the layer being doped or not
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/02—Electrodes; Manufacture thereof not otherwise provided for characterised by shape or form
- C25B11/03—Electrodes; Manufacture thereof not otherwise provided for characterised by shape or form perforated or foraminous
- C25B11/031—Porous electrodes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
- C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
- C25B11/091—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/46109—Electrodes
- C02F2001/46133—Electrodes characterised by the material
- C02F2001/46138—Electrodes comprising a substrate and a coating
- C02F2001/46147—Diamond coating
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2101/00—Nature of the contaminant
- C02F2101/30—Organic compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/10—Process efficiency
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Molecular Biology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Hydrology & Water Resources (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Combustion & Propulsion (AREA)
- Plasma & Fusion (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
- Inert Electrodes (AREA)
Abstract
Description
Claims (13)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610920318.0A CN106637111B (zh) | 2016-10-21 | 2016-10-21 | 一种铌基硼掺杂金刚石泡沫电极及其制备方法与应用 |
| US16/342,976 US11603594B2 (en) | 2016-10-21 | 2017-02-22 | Boron doped diamond electrode and preparation method and applications thereof |
| PCT/CN2017/074374 WO2018072367A1 (zh) | 2016-10-21 | 2017-02-22 | 一种硼掺杂金刚石电极及其制备方法与应用 |
| US16/086,608 US10995192B2 (en) | 2016-03-21 | 2017-02-22 | Composite material reinforced by foamed skeleton and preparation method and uses thereof |
| PCT/CN2017/074397 WO2017161993A1 (zh) | 2016-03-21 | 2017-02-22 | 一种泡沫骨架增强复合材料及制备方法与应用 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610920318.0A CN106637111B (zh) | 2016-10-21 | 2016-10-21 | 一种铌基硼掺杂金刚石泡沫电极及其制备方法与应用 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106637111A CN106637111A (zh) | 2017-05-10 |
| CN106637111B true CN106637111B (zh) | 2019-02-01 |
Family
ID=58856040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610920318.0A Active CN106637111B (zh) | 2016-03-21 | 2016-10-21 | 一种铌基硼掺杂金刚石泡沫电极及其制备方法与应用 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106637111B (zh) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI662162B (zh) * | 2016-11-15 | 2019-06-11 | 財團法人工業技術研究院 | 一種電鍍方法及其系統 |
| CN109019563B (zh) * | 2017-06-09 | 2021-02-26 | 清华大学 | 多孔金属复合结构 |
| CN108315711B (zh) * | 2018-02-26 | 2020-02-07 | 南京航空航天大学 | 一种提高掺硼金刚石电极膜基结合性能的纳秒激光基体预处理方法 |
| CN109030596A (zh) * | 2018-05-31 | 2018-12-18 | 武汉工程大学 | 一种柱状硼掺杂金刚石电极传感器的制备方法及其应用 |
| CN109444202A (zh) * | 2018-09-13 | 2019-03-08 | 江苏大学 | 一种利用激光制备石墨烯的实验检测装置与方法 |
| CN109518159B (zh) * | 2018-11-21 | 2020-12-04 | 中国科学院大学 | 一种过渡族金属元素与氮共掺杂生长金刚石的方法 |
| CN109518305A (zh) * | 2018-11-26 | 2019-03-26 | 华侨大学 | 一种金刚石与碳纳米管纤维复合材料的制备方法 |
| CN109402710A (zh) * | 2018-12-21 | 2019-03-01 | 郑州元素工具技术有限公司 | 一种裸金刚石线的生产方法 |
| CN110156120B (zh) * | 2019-06-26 | 2023-04-25 | 中南大学 | 污水处理装置及处理方法 |
| CN110560050A (zh) * | 2019-08-22 | 2019-12-13 | 浙江工业大学 | 硼掺杂银纳米海绵状电化学合成氨催化剂及其制备方法 |
| CN110773109A (zh) * | 2019-11-01 | 2020-02-11 | 成都理工大学 | 一种含氧氮化硼纳米花的制备方法 |
| CN111005010B (zh) * | 2019-12-18 | 2021-05-25 | 昆明理工大学 | 一种纳米金刚石金属化薄膜的制备方法、产品及应用 |
| CN111115762B (zh) * | 2019-12-25 | 2022-06-03 | 河南省功能金刚石研究院有限公司 | 一种泡沫镍电极及其制备方法 |
| CN111591953B (zh) * | 2020-05-07 | 2022-08-05 | 南京航空航天大学 | 针状微电极及其制备方法 |
| CN111485223B (zh) * | 2020-05-11 | 2022-05-24 | 南京岱蒙特科技有限公司 | 一种超高比表面积硼掺杂金刚石电极及其制备方法和应用 |
| CN111825271B (zh) * | 2020-05-11 | 2023-05-02 | 南京岱蒙特科技有限公司 | 一种太阳能电-生物节能水处理系统和处理水的方法 |
| CN111646633B (zh) * | 2020-05-11 | 2022-11-04 | 南京岱蒙特科技有限公司 | 一种高效节能三维电极有机水处理系统及其处理水的方法 |
| CN111778506B (zh) * | 2020-05-11 | 2023-10-03 | 中南大学 | 一种梯度硼掺杂金刚石增强金属基复合材料及其制备方法和应用 |
| CN111675417B (zh) * | 2020-05-11 | 2022-10-18 | 江苏净钻环保科技有限公司 | 一种磁性吸附辅助光电催化氧化水处理系统和处理水的方法 |
| CN111593316B (zh) * | 2020-05-11 | 2022-06-21 | 南京岱蒙特科技有限公司 | 一种高比表面积超亲水的梯度硼掺杂金刚石电极及其制备方法和应用 |
| CN111471978B (zh) * | 2020-05-11 | 2023-02-21 | 中南大学 | 一种高体量金刚石增强金属基复合材料及其制备方法和应用 |
| CN111962118B (zh) * | 2020-07-09 | 2023-02-17 | 中南大学 | 一种高性能的电镀金刚石工具及其制备方法和应用 |
| CN112607831B (zh) * | 2020-12-17 | 2022-12-23 | 江苏羟源环能科技有限公司 | 一种活性元素均匀掺杂型薄膜电极及其制备方法 |
| CN112897646B (zh) * | 2021-01-19 | 2022-07-01 | 山东欣远新材料科技有限公司 | 一种掺硼金刚石薄膜电极泡沫金属基体的制备方法 |
| CN112981365B (zh) * | 2021-04-20 | 2021-08-20 | 北京科技大学 | 一种网笼多层结构硼掺杂金刚石电极的制备方法 |
| CN113897675B (zh) * | 2021-09-15 | 2023-04-11 | 湖南新锋先进材料科技有限公司 | 一种掺杂金刚石颗粒及其制备方法与应用 |
| CN113881929B (zh) * | 2021-09-15 | 2024-04-02 | 湖南新锋先进材料科技有限公司 | 一种双面结构的金刚石-石墨烯薄膜及其制备方法和应用 |
| CN114101660B (zh) * | 2021-09-22 | 2024-03-22 | 湖南新锋先进材料科技有限公司 | 一种核壳结构的金刚石颗粒及其制备方法和应用 |
| CN116920793B (zh) * | 2022-03-30 | 2025-10-17 | 中国石油天然气集团有限公司 | 一种用于co2吸附捕集的石墨烯多孔材料及制备方法 |
| CN115404459B (zh) * | 2022-09-07 | 2023-11-21 | 湖南新锋科技有限公司 | 一种分布式掺硼金刚石/金属基复合材料及其制备方法和应用 |
| CN115740720B (zh) * | 2022-11-15 | 2025-07-25 | 华北水利水电大学 | 一种掺氮金刚石多孔钛复合膜电极及其制备方法 |
| CN117361895A (zh) * | 2023-11-09 | 2024-01-09 | 内蒙古科技大学 | 一种于离子液体中电沉积制备类金刚石薄膜的方法 |
| CN117286364B (zh) * | 2023-11-24 | 2024-04-12 | 中铝科学技术研究院有限公司 | 一种三维网络结构石墨烯增强金属基复合材料及制备方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6180014B1 (en) * | 1999-12-10 | 2001-01-30 | Amir Salama | Device and method for treating water with ozone generated by water electrolysis |
| CN2918400Y (zh) * | 2006-07-14 | 2007-07-04 | 吴金炉 | 一种电净水消毒器 |
| CN102242374A (zh) * | 2011-06-30 | 2011-11-16 | 南京航空航天大学 | 钛基掺硼金刚石涂层电极的制备方法 |
| CN105779804A (zh) * | 2016-03-21 | 2016-07-20 | 中南大学 | 一种泡沫骨架结构增强金属基复合材料及制备方法 |
-
2016
- 2016-10-21 CN CN201610920318.0A patent/CN106637111B/zh active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6180014B1 (en) * | 1999-12-10 | 2001-01-30 | Amir Salama | Device and method for treating water with ozone generated by water electrolysis |
| CN2918400Y (zh) * | 2006-07-14 | 2007-07-04 | 吴金炉 | 一种电净水消毒器 |
| CN102242374A (zh) * | 2011-06-30 | 2011-11-16 | 南京航空航天大学 | 钛基掺硼金刚石涂层电极的制备方法 |
| CN105779804A (zh) * | 2016-03-21 | 2016-07-20 | 中南大学 | 一种泡沫骨架结构增强金属基复合材料及制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106637111A (zh) | 2017-05-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106637111B (zh) | 一种铌基硼掺杂金刚石泡沫电极及其制备方法与应用 | |
| US11603594B2 (en) | Boron doped diamond electrode and preparation method and applications thereof | |
| CN106435518B (zh) | 一种高比表面积硼掺杂金刚石电极及其制备方法和应用 | |
| Chang et al. | Conductivity modulation of 3D‐printed shellular electrodes through embedding nanocrystalline intermetallics into amorphous matrix for ultrahigh‐current oxygen evolution | |
| Mei et al. | 3D macroporous boron-doped diamond electrode with interconnected liquid flow channels: a high-efficiency electrochemical degradation of RB-19 dye wastewater under low current | |
| Deng et al. | Hollow TiO2@ Co9S8 core–branch arrays as bifunctional electrocatalysts for efficient oxygen/hydrogen production | |
| Sultana et al. | Gold doping in a layered Co‐Ni hydroxide system via galvanic replacement for overall electrochemical water splitting | |
| Walsh et al. | Developments in electrode design: structure, decoration and applications of electrodes for electrochemical technology | |
| Zanin et al. | Porous boron-doped diamond/carbon nanotube electrodes | |
| Chen et al. | A fast electrodeposition method for fabrication of lanthanum superhydrophobic surface with hierarchical micro-nanostructures | |
| He et al. | Improved electrochemical performance of boron-doped diamond electrode depending on the structure of titanium substrate | |
| CN102174709A (zh) | 三维金属镍纳米渐变体阵列结构及其制备方法 | |
| CN108459003A (zh) | 一种银纳米颗粒包覆氧化锌表面增强拉曼散射效应基底的制备方法 | |
| CN105926013B (zh) | 一种电沉积制备类贝壳层状结构氧化石墨烯复合膜的方法 | |
| Flis-Kabulska et al. | Electrodeposits of nickel with reduced graphene oxide (Ni/rGO) and their enhanced electroactivity towards hydrogen evolution in water electrolysis | |
| CN107398561A (zh) | 一种具有规则形状的铜纳米片的制备方法 | |
| Liu et al. | A comparative study on Ti/IrO2–Ta2O5 anodes prepared by microwave plasma-assisted sintering and conventional thermal decomposition methods | |
| CN101642714A (zh) | 一种核壳型纳米双金属Fe/Pd催化剂的制备方法 | |
| CN111519163A (zh) | 一种高导电长寿命高比表面积的硼掺杂金刚石电极及其制备方法和应用 | |
| Chung et al. | Templated fabrication of three-dimensional ordered macroporous Cu2O/Ni structure for glucose sensing | |
| CN101638796B (zh) | 用于水电解反应的阳极催化剂的制备方法 | |
| CN113235118B (zh) | 一种导电金属有机骨架阳极的电化学合成方法 | |
| Behrouznejad et al. | High-performance/low-temperature-processed dye solar cell counter electrodes based on chromium substrates with cube-like morphology | |
| Flis-Kabulska et al. | Anodically treated Ni/reduced graphene oxide electrodeposits as effective low-cost electrocatalysts for hydrogen evolution in alkaline water electrolysis | |
| CN102345148B (zh) | 一种利用电沉积快速制备含稀土元素的阴极超疏表面涂层的方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190815 Address after: 211500 Hengli Park, 339 Xiongzhou South Road, Longchi Street, Liuhe District, Nanjing City, Jiangsu Province, 222 buildings, 2 units, 302 rooms Patentee after: Nanjing Daimount Technology Co.,Ltd. Address before: Yuelu District City, Hunan province 410083 Changsha Lushan Road No. 932 Patentee before: Central South University |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20250807 Address after: Yuelu District City, Hunan province 410083 Changsha Lushan Road No. 932 Patentee after: CENTRAL SOUTH University Country or region after: China Address before: 211500 Hengli Park, 339 Xiongzhou South Road, Longchi Street, Liuhe District, Nanjing City, Jiangsu Province, 222 buildings, 2 units, 302 rooms Patentee before: Nanjing Daimount Technology Co.,Ltd. Country or region before: China |
|
| TR01 | Transfer of patent right |