CN106558757B - Processing method of antenna structure - Google Patents

Abstract

A kind of antenna structure processing method is provided, the processing method includes: offer conductive shell, the conductive shell have the outer surface that is arranged outwardly and and outer surface back to inner surface, the conductive shell includes the first conductive part, the second conductive part and the default cutting region between the first conductive part and the second conductive part, and the default cutting region includes at least one first cut portion and at least one second cut portion；Cut the default cutting region, wherein, second cut portion is cut from inner surface exterior surface direction, to form the slit of preset quantity, first cut portion is cut from outer surface inner surface direction, to form the slit of preset quantity, but the first cut portion is not cut through, to form conductive connection part between the first conductive part and the second conductive part.

Description

Processing method of antenna structure

technical field

The present disclosure relates to the technical field of electronic devices, and more particularly, to an antenna structure processing method capable of simplifying the manufacturing process.

Background technique

With the development of science and technology and the diversification of electronic products, consumers have higher and higher requirements on the appearance of electronic devices (especially portable communication devices). In order to improve the appearance aesthetics of electronic devices, more and more antenna structures on the housings of electronic devices are improved from a slot form to a micro-slot form.

Figure 1 shows an example of an antenna structure in the form of a micro-slot on a conductive housing of an electronic device according to the prior art. As shown in FIG. 1 , a micro-slit tape 1 is provided in a predetermined area of a conductive housing of an electronic device, and the conductive housing of the electronic device is divided into at least two conductive parts 2 and 3 by the micro-slit tape 1 . The micro-slit tape 1 includes a plurality of micro-slits formed by cutting predetermined regions of a conductive shell, and a non-conductive material is filled in the plurality of micro-slits. In addition, the microslit tape 1 also includes a connecting portion 4 that electrically connects the two conductive portions 2 and 3 . Wherein, the connection part 4 may be an uncut part in a predetermined area of the conductive housing, or may be a separately provided conductive connection part.

For the casing with the above structure, there are two processing methods commonly used in the prior art.

In the first method, a plurality of micro-slits are cut from the outer surface of the conductive shell toward the inner surface, and the conductive shell is first injection molded to fill the plurality of micro-slots with non-conductive material. Then, the inner surface of the conductive shell is processed, the inner cavity structure is fabricated, and secondary injection molding is performed on the inner surface of the shell to form other reinforcing structures or connecting structures and the like. In this method, although the uncut portion can be reserved on the inner side of the housing as the conductive connection portion when the micro-slit is cut, it needs to be injection molded twice, which is complicated in process and high in manufacturing cost.

In the second method, a plurality of micro-slits are cut from the inner surface to the outer surface of the shell, and then the plurality of micro-slits and the inner cavity structure of the shell are injection-molded at the same time. Although in this method, the filling of multiple micro-slits with non-metallic materials and the injection molding of the inner cavity structure of the shell can be completed only by one injection, but because of the cutting from the inner surface of the shell to the outer surface, it is impossible to fill the inner surface of the shell. The conductive connections remain on the surface, but the two conductive parts 2 and 3 need to be connected by riveting or soldering additional conductive connections. This results in the need for an additional riveting or welding process, and the cutting of the shell and the fixing of the micro-slit tape during the riveting or welding process is also very difficult, so not only the process is complicated, but also the shell is likely to be deformed during the injection molding process.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a method for manufacturing an antenna structure that can simplify the manufacturing process and save the manufacturing cost.

Another object of the present invention is to provide a processing method of an antenna structure that can prevent the conductive shell from being deformed during the injection molding process.

According to an aspect of the present disclosure, there is provided a method of fabricating an antenna structure, the fabrication method comprising: providing a conductive housing, the conductive housing having an outer surface disposed outwardly and an inner surface facing away from the outer surface, the The conductive housing includes a first conductive portion, a second conductive portion, and a preset cutting area located between the first conducting portion and the second conducting portion, the preset cutting area including at least one first cutting portion and at least one first cutting portion. Two cutting parts; cutting the preset cutting area, wherein the second cutting part is cut from the inner surface to the outer surface direction to form a preset number of micro-slits, and the first cutting part is cut from the outer surface to the inner surface direction part to form a preset number of micro-slits without cutting through the first cutting part, thereby forming a conductive connection part between the first conductive part and the second conductive part.

The processing method may further include an injection molding step. In the injection molding step, the predetermined number of micro-slits and the inner cavity structure of the conductive shell are simultaneously injection-molded.

The processing method may further include the step of processing the inner surface of the conductive shell to make the inner cavity structure before the injection molding step.

The second cutting portion may be multiple, and in the cutting step, all the second cutting portions may be cut first, and then the first cutting portion may be cut, or the first cutting portion may be cut first, and then the first cutting portion may be cut. The second cutting portion is cut, or the cutting is performed sequentially according to the arrangement order of the first cutting portion and the second cutting portion.

When the second cut portion is cut from the inner surface to the outer surface, a portion of the residual material may be left on the outer surface of the housing.

The machining method may further include the step of machining the outer surface of the conductive housing to remove the residual material.

The thickness of the remaining material may be greater than or equal to 1.0 mm.

The conductive connection portion may protrude from the inner surface of the conductive housing or be flush with the inner surface of the conductive housing.

The number of the micro-slits of the first cutting part and the second cutting part may be the same, and the micro-slits of the first cutting part may communicate with the micro-slits of the second cutting part respectively and be located on the same line.

The slit widths of the micro slits may be the same as each other, and may be 0.03 mm˜0.5 mm.

One of the first conductive portion and the second conductive portion may constitute a radiation element of the antenna structure, and the other of the first conductive portion and the second conductive portion may constitute a grounding element of the antenna structure.

The radiating element may form two radiating elements on both sides of one conductive connection portion, and the two radiating elements may be respectively connected to two antenna circuits.

Each radiating element may be electrically connected to the ground element by a feeder.

Description of drawings

The above and other objects, features and advantages of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

Figure 1 shows an example of an antenna structure in the form of a micro-slot on a conductive housing of an electronic device according to the prior art;

FIG. 2 is a flowchart of a method for manufacturing an antenna structure according to an exemplary embodiment of the present disclosure;

3 is a schematic diagram illustrating a conductive housing according to an exemplary embodiment of the present disclosure;

4 is a schematic diagram illustrating cutting a second cutting portion of a preset cutting area according to an exemplary embodiment of the present disclosure;

5 is a schematic diagram illustrating an inner surface of a cut conductive housing according to an exemplary embodiment of the present disclosure;

6 is a schematic diagram illustrating an outer surface of a cut conductive housing according to an exemplary embodiment of the present disclosure;

Fig. 7 is a schematic view taken along the line A-A' of Fig. 4;

Fig. 8 is a right side view showing the conductive case in Fig. 7;

9 is a schematic diagram showing the inner surface of the conductive housing after injection molding of the microslit;

10 is a schematic diagram illustrating an antenna structure viewed from an outer surface direction of a conductive housing according to an exemplary embodiment of the present disclosure;

FIG. 11 shows a schematic diagram of an antenna current loop corresponding to the antenna structure shown in FIG. 10 according to an exemplary embodiment of the present disclosure.

Detailed ways

Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings.

This disclosure may, however, be illustrated in different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments described herein are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It will be apparent that, although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these Terminology restrictions. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of example embodiments.

A method of fabricating an antenna structure according to an exemplary embodiment of the present disclosure will be described below with reference to FIGS. 2 to 9 .

As shown in FIG. 2, in step S10, a conductive casing is provided. As shown in FIG. 3 , the conductive housing 1000 may be a housing detachably coupled to an electronic device, eg, a rear housing of the electronic device. The electronic device may be, for example, a cell phone. The conductive housing 1000 may be formed of a conductive material, for example, may be formed of alloys such as aluminum alloys, magnesium alloys, copper alloys, or other similar types.

The conductive housing 1000 has an outer surface disposed outwardly and an inner surface facing away from the outer surface, the outer surface of the conductive housing 1000 may be a surface exposed to the outside for user contact, and the inner surface of the conductive housing 1000 may be is the surface facing the internal structure of the electronic device. Also, the conductive case 1000 may have two side surfaces opposed to each other in the width direction of the case 1000 .

The conductive housing 1000 includes a pre-cut area 100 and a first conductive part 200 and a second conductive part 300 separated by the pre-cut area 100 . The provision of a preset cutting area at the upper portion of the conductive housing is schematically shown in FIG. 3 . However, the present disclosure is not limited thereto, for example, two or more preset cutting regions may be formed as needed, and various modifications may be made to the formation positions of the preset cutting regions as needed. In addition, the predetermined cutting regions divided in FIG. 3 are formed flat and perpendicular to both side surfaces of the conductive case. However, the present disclosure is not limited thereto, and various modifications may be made to the shape of the preset cutting region according to needs such as aesthetics and the like. For example, the preset cutting area may be formed in a curved path between the two side surfaces.

The preset cutting area 100 includes at least one first cutting part 110 and at least one second cutting part 120 . It should be noted that the first cutting part 110 and the second cutting part 120 are not divided physically, but are logically divided according to the next cutting process. In addition, although FIG. 3 schematically shows that the preset cutting area 100 is divided into one first cutting part 110 and two second cutting parts 120 separated by the first cutting part 110 , it can be Two or more first cutting parts 110 and three or more second cutting parts 120 separated by the two or more first cutting parts 110 are provided in the preset cutting region 100 . In addition, the formation position of the first cutting portion 110 in the preset cutting area 100 is determined according to the wavelength of the radiation element, which will be described in detail later when describing the antenna structure.

Next, as shown in FIGS. 2 and 4, in step S20, the preset cutting area 100 is cut. The preset cutting area 100 may be cut using various cutting knives 2000 known in the art, for example, the preset cutting area 100 may be cut using a T-knife.

When cutting the pre-cut area 100 , the second cutting portion 120 of the pre-cut area 100 is cut from the inner surface of the conductive housing 1000 to the outer surface to form a pre-set number of micro-slits from the outer surface of the conductive housing 1000 . The first cutting portion 110 of the preset cutting area 100 is cut facing the inner surface direction to form a second preset number of micro slits, but the first cutting portion 110 is not cut, so that the first conductive portion 200 and the second conductive portion are not cut through. Conductive connection parts 111 are formed between 300 (as shown in FIG. 5 and FIG. 9 ).

According to the present disclosure, the order of cutting the first cutting part 110 and the second cutting part 120 is not particularly limited, as long as it is ensured that the second cutting part 120 is cut from the inner surface of the conductive case 1000 to the outer surface direction and the second cutting part 120 is cut from the outer surface of the conductive case 1000 It is sufficient to cut the first cutting portion 110 in the direction of the inner surface from the outer surface.

As an example, the second cutting portion 120 and the first cutting portion 110 may be sequentially cut in the order in which the second cutting portion 120 and the first cutting portion 110 are arranged. That is, the second cutting part 120 is cut from the inner surface to the outer surface direction, when cutting to the first cutting part 110, the cutter is turned to the outer surface direction to cut the first cutting part 110 from the outer surface to the inner surface direction, and then, When cutting to the second cutting portion 120, the second cutting portion 120 is cut from the inner surface toward the outer surface. If a plurality of first cutting parts 110 are provided, cutting is performed in the above-mentioned manner until all the second cutting parts 120 and the first cutting parts 110 are cut. It is also possible to provide cutting knives on both sides of the housing to cut the inner and outer surfaces, respectively.

As another example, the first cutting portion 110 may be cut from the outer surface after the second cutting portion 120 is completely cut from the inner surface to the outer surface direction. For example, the second cutting part 120 can be cut from the inner surface to the outer surface first, and when the first cutting part 110 is encountered, the cutter is lifted without cutting the first cutting part 110, and the next second cutting part 120 can be cut continuously. After the second cutting portion 120 is completely cut, the first cutting portion 110 is cut from the outer surface to the inner surface direction.

As another example, after the first cutting part 110 is cut from the outer surface to the inner surface direction, the second cutting part 120 may be cut from the inner surface to the outer surface direction.

According to the present disclosure, the conductive connection part 111 may protrude from the inner surface of the conductive case 1000 . However, the present disclosure is not limited thereto, and the conductive connection part 111 may also be flush with the inner surface of the conductive housing 1000 . It should be understood that the thickness of the conductive connection portion 111 should ensure reliable electrical connection between the first conductive portion 200 and the second conductive portion 300 .

FIG. 5 schematically shows the inner surface of the conductive housing 1000 including two preset cutting regions 100 after cutting. FIG. 6 schematically shows the outer surface of the conductive housing 1000 including two preset cutting regions 100 after cutting.

As shown in FIG. 5 , in the second cutting portion 120 , a plurality of micro slits 121 are formed as viewed from the direction of the inner surface of the conductive housing 1000 . In addition, in the second cutting part 120, the conductive layers 122 separated by the micro slits 121 are also included, that is, the micro slits 121 and the conductive layers 122 are alternately formed with each other. Although it is schematically shown in FIG. 5 that three micro-slits 121 are formed, the present disclosure is not limited thereto, and the number of micro-slits may be changed as required. As shown in FIG. 6 , viewed from the direction of the outer surface of the conductive housing 1000 , when the second cutting portion 120 is cut, a portion of residual material may be left on the outer surface of the conductive housing 1000 . As embodied in FIG. 6 , the microslits 121 do not penetrate the outer surface of the conductive housing 1000 . This structure will be described in detail later in FIGS. 7 and 8 .

Referring again to FIG. 5 , from the direction of the inner surface of the conductive housing 1000 , a conductive connecting portion 111 that is not cut is formed in the first cutting portion 110 to connect the first conductive portion 200 and the second conductive portion 300 . Referring to FIG. 6 , a plurality of micro slits 112 are formed in the first cutting portion 110 as viewed from the direction of the outer surface of the conductive housing 1000 . Although it is schematically shown in FIG. 6 that three micro-slits 112 are formed, the present disclosure is not limited thereto, and the number of micro-slits may be changed as needed. In addition, in the first cutting part 110, the conductive layers 113 separated by the micro slits 112 are also included, that is, the micro slits 112 and the conductive layers 113 are alternately formed with each other.

According to the present disclosure, the number of micro slits of the first cutting part 110 and the second cutting part 120 may be the same. In addition, the micro slits of the first cutting part 110 and the micro slits of the second cutting part 120 may be located on the same cutting surface, respectively. That is, the micro slits of the first cutting part 110 and the micro slits of the second cutting part 120 may communicate with each other and be located on the same line, so that the micro slits of the first cutting part 110 can be seen from the outer surface of the conductive housing. The slits are respectively one slit with the micro slits of the second cutting part 120 .

Furthermore, according to the present disclosure, the slit widths of the micro slits in the first cutting part 110 and the second cutting part 120 may be the same as each other, for example, may correspond to the thickness of the blade of the cutting tool 2000 . According to the present disclosure, the slit width of the micro slit may be 0.03mm˜0.5mm, preferably 0.03mm˜0.15mm. Considering the aesthetic appearance of the conductive shell, the narrower the slit width of the micro slit, the better

FIG. 7 is a schematic view showing the conductive case taken along the line A-A' of FIG. 4 , and FIG. 8 is a right side view showing the case in FIG. 7 . Referring to FIG. 7 and FIG. 8 , part of the remainder 123 of the second cutting portion 120 will be described below.

As shown in FIG. 7 , when the micro-slits of the second cutting part 120 are cut, part of the residual material 123 remains on the outer surface of the conductive housing 1000 . This part of the residual material 123 can prevent deformation of the casing in the injection molding step to be described later. Preferably, the thickness d (as shown in FIG. 8 ) of the part of the residual material 123 is greater than or equal to 1.0 mm.

Optionally, part of the remaining material 123 may not be retained, but the second cutting part 120 may be completely cut through, so that the micro-slits 121 in the second cutting part 120 penetrate through the inner and outer surfaces of the conductive housing 1000 .

After the plurality of micro-slits 121 and 112 are formed according to the above steps, in step S30, the micro-slits and the inner cavity structure of the conductive housing 1000 may be simultaneously injection-molded. 9 is a schematic diagram showing the inner surface of the conductive housing after injection molding of the microslit.

The inner cavity structure of the conductive housing 1000 may be processed before injection molding, however, the present disclosure is not limited thereto. As shown in FIG. 9 , by injection molding the microslits, the microslits may be filled with a non-conductive material to form the non-conductive layer 124 . By injection molding the inner cavity structure of the conductive housing 1000 , the reinforcement structure and the connection structure can be formed.

From the inner surface of the conductive case, conductive layers 122 and non-conductive layers 124 are alternately stacked in the second cutting region 120 . Preferably, the width of each non-conductive layer may be 0.03mm˜0.5mm (equivalent to the width of the microslit). The width of each non-conductive layer 124 may be the same, and the width of the conductive layer 122 and the width of the non-conductive layer 124 may be the same or different. to the width in the direction of the second conductive portion 300 .

Since the conductive layer 122 is formed of the conductive case 1000 that is not cut, the material of the conductive layer 122 may be the same as that of the conductive case 1000 . The non-conductive layer 124 may comprise plastic.

In addition, the conductive connection part 111 may be electrically connected to the conductive layer 122 in addition to the electrical connection between the first conductive part 200 and the second conductive part 300 .

As described in the background art section of the present disclosure, through the first method of the prior art, although the uncut portion can be reserved on the inner side of the housing as a conductive connection portion when the micro-slit is cut, it needs to be injected twice, and the process is cumbersome , the production cost is high. Through the second method of the prior art, although the filling of the non-metallic materials of the multiple micro-slits and the injection of the inner cavity structure of the shell can be completed by only one injection molding, since the conductive connection parts cannot be retained on the inner surface of the shell, It is therefore necessary to connect the two conductive parts by riveting or welding an additional conductive connection. This results in the need for an additional riveting or welding process, and the cutting of the shell and the fixing of the micro-slit tape during the riveting or welding process is also very difficult, so not only the process is complicated, but also the shell is likely to be deformed during the injection molding process.

However, according to the present disclosure, the following effects can be simultaneously achieved: the filling of a plurality of micro-slits with non-metallic materials and the injection-molding of the inner cavity structure of the casing can be completed by only one injection molding, and at the same time, the micro-slits can be retained on the inner side of the conductive casing when the micro-slits are cut. Conductive connections (111 in Figures 5 and 9) without additional riveting or welding processes. Therefore, according to the present disclosure, the manufacturing process can be simplified and the reliability of the product can be improved.

As described above, when the second cutting part 120 is cut, part of the residual material 123 (as shown in FIGS. 7 and 8 ) can be left, and the partial residual material 123 can ensure that the conductive shell is not deformed during the injection molding process.

After the injection molding is completed, part of the residual material 123 may be removed when processing the appearance surface (outer surface) of the conductive housing 1000 . For example, in the subsequent processing, it can be cut to the position of the arrow shown in FIG. 8 to remove part of the residual material 123 . However, the present disclosure is not limited thereto, as long as it is ensured that part of the residual material 123 is removed.

As can be seen from the above description, even if part of the residual material 123 is left when the second cutting part 120 is cut, the part can be cut off during the process of the appearance surface processing (a process necessary for manufacturing the mobile phone case, for example, cutting the lens hole) after the injection molding is completed Remaining material 123. That is, even if part of the residual material 123 is retained in order to prevent deformation of the conductive shell during the injection molding process, part of the residual material 123 can be cut off during the appearance surface machining process without over-injecting the micro-slit or inner cavity structure.

10 is a schematic diagram illustrating an antenna structure viewed from an outer surface direction of a conductive case according to an exemplary embodiment of the present disclosure. The composition and working principle of the antenna structure fabricated according to the processing method of the exemplary embodiment of the present disclosure will be described below with reference to FIG. 10 .

Specifically, one of the first conductive portion 200 and the second conductive portion 300 may constitute a radiating element of the antenna structure, and the other of the first conductive portion 200 and the second conductive portion 300 may constitute a radiating element of the antenna structure. The grounding element, in the exemplary embodiment of the present application, is described by taking the first conductive part 200 as the radiation element and the second conductive part 300 as the grounding element as an example.

The non-metallic material filled in the micro-slits 121 of the second cutting part 120 and the non-metallic material filled in the micro-slits 112 of the first cutting part 110 may communicate with each other, and thus the non-conductive layer 124 in the second cutting part 120 may On the same layer as the non-conductive layer 114 in the first cut portion 110 . In addition, the conductive layer 122 in the second cutting part 120 may be located on the same layer as the conductive layer 113 in the first cutting part 110 .

According to the conductive case formed by the method as described above, the conductive connection portion 111 is located inside the conductive case 1000 and connects the first conductive portion 200 and the second conductive portion in the direction opposite to the first conductive portion 200 and the second conductive portion 300 300, and can be electrically connected to conductive layers 122 and 113.

Based on the composition of the antenna structure of the above-described exemplary embodiment of the present disclosure, the first conductive portion 200 constituting the radiating element forms two radiating elements on both sides of the conductive connecting portion 111, and the two radiating elements are respectively connected to the two antenna circuits, that is, A radiating element is connected to an antenna circuit, where the antenna circuit may refer to a circuit for logic control of the antenna structure. In other words, the first conductive part 200 is divided into two radiation units (ie, the first radiation unit 200a and the second radiation unit 200b shown in FIG. 10 ) by the conductive connection part 111 . It should be understood that the division of the first conductive portion 200 here refers to logical division, not that the first conductive portion 200 is cut.

Specifically, the first conductive portion 200 may be divided into two radiation units by the extension line of the conductive connection portion 111 from the second conductive portion 300 to the first conductive portion 200 as a boundary. For example, the first conductive part 200 may be divided into a first radiation unit 200a and a second radiation unit 200b with the extension lines of the two sides of the conductive connection part 111 as a boundary.

Preferably, the lengths L1 and L2 of the second cutting portion may be determined according to the wavelengths of the corresponding radiation units. Therefore, the formation position of the conductive connection portion 111 can be determined. In addition, according to the total width of the conductive housing, the length L3 of the conductive connection portion 111 may be determined.

Specifically, the antenna structures of the exemplary embodiments of the present disclosure can be applied to antennas (ie, radiating elements) with different operating frequencies, and the required lengths of radiating elements with different operating frequencies are different, which can be calculated based on existing wavelengths and frequencies. Formula, calculate the wavelength corresponding to the working frequency of the radiation unit, preferably, the length of the radiation unit can be 1/2 of the wavelength. The lengths L1 and L2 required by the radiation units 200a and 200b with different operating frequencies can be determined in the above manner, thereby determining the length L3 of the conductive connecting portion 111, and the setting position of the conductive connecting portion 400 is also determined.

In an exemplary embodiment of the present disclosure, the antenna structure may further include a plurality of feed lines, each radiating element is electrically connected to the second conductive part 300 as a ground element through the feed lines, and here, one feed line may correspond to a radiating element. Preferably, the plurality of feed lines may be arranged to face the rear surface of the conductive housing.

FIG. 11 shows a schematic diagram of an antenna current loop corresponding to the antenna structure shown in FIG. 10 according to an exemplary embodiment of the present disclosure.

In the example shown in FIG. 3, the antenna structure may include two feed lines (feed line 10 and feed line 20), one end of feed line 10 is connected to the first conductive part 200 (ie, the first radiating element 200a), The other end of the feeder 10 is connected to the second conductive part 300, and the antenna current loop 11 can be formed at this time (ie, feeder 10—first conductive part 200—conductive connection part 111—second conductive part 300—feeder 10). .

Similarly, one end of the feed line 20 is connected to the first conductive part 200 (ie, the second radiating element 200b), and the other end of the feed line 20 is connected to the second conductive part 300, at this time, the antenna current loop 22 (ie, the antenna current loop 22) can be formed. Feeder 20—first conductive portion 200—conductive connection portion 111—second conductive portion 300—feeder 2).

Here, in the exemplary embodiment of the present application, since the first conductive portion 200 is divided into two radiating elements by the conductive connecting portion 111, and respectively constitute different antenna current loops, the length of the antenna is changed, thereby realizing the antenna Frequency adjustment.

It should be understood that the case where one conductive connection portion 111 is provided as shown in FIGS. 10 and 11 is only an example, and the present application is not limited to this, and two or more conductive connection portions 111 may be provided according to actual needs. The at least one conductive connection may be two. Accordingly, the first conductive part 200 may be divided into three or more radiation units. In addition, one conductive connection part may include two conductive bridge parts, and the first conductive part 200 may be divided into two radiating elements based on the two conductive bridge parts, and one radiating element corresponds to one conductive bridge part, so as to form two antenna current loops to adjust the antenna frequency. However, the present disclosure is not limited thereto, and various modifications may be made to the conductive connection portion.

As described above, according to the exemplary embodiments of the present disclosure, it is possible to provide a method of manufacturing an antenna structure capable of simplifying a manufacturing process. In addition, another exemplary embodiment of the present disclosure may provide a method of manufacturing an antenna structure capable of preventing deformation of a conductive housing during an injection molding process.

Although the present disclosure has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that form and detail may be made therein without departing from the spirit and scope of the present disclosure as defined by the following claims various changes on.

Claims (13)

1. a kind of processing method of antenna structure, the processing method include:

Conductive shell is provided, the conductive shell have the outer surface that is arranged outwardly and and outer surface back to inner surface, institute Stating conductive shell includes that the first conductive part, the second conductive part and default between the first conductive part and the second conductive part cut Region is cut, the default cutting region includes at least one first cut portion and at least one second cut portion；

Cut the default cutting region, wherein second cut portion is cut from inner surface exterior surface direction, to be formed The slit of preset quantity cuts first cut portion from outer surface inner surface direction, to form the slit of preset quantity, But the first cut portion is not cut through, to form conductive connection part between the first conductive part and the second conductive part.

2. processing method according to claim 1, the processing method further includes injection step, in the injection step In, the inner-cavity structure of slit and conductive shell to the preset quantity is molded simultaneously.

3. processing method according to claim 2, the processing method further includes before injection step in conductive shell Inner surface side the step of being processed to obtain inner-cavity structure.

4. processing method according to claim 1, wherein second cut portion be it is multiple, in the cutting step In, first all second cut portions are cut, then cut first cut portion again, or first to the first cutting part It point is cut, then the second cut portion is cut, or setting according to the first cut portion and the second cut portion Sequence is set successively to be cut.

5. processing method according to any one of claim 1 to 4, wherein cut from inner surface exterior surface direction When the second cut portion, retain part clout in the outer surface of the shell.

6. processing method according to claim 5, wherein the processing method further include to the outer surface of conductive shell into The step of row processing is to remove the clout.

7. processing method according to claim 5, wherein the thickness of the clout is more than or equal to 1.0mm.

8. processing method according to claim 1, wherein the conductive connection part from the inner surface of conductive shell protrude or Person is concordant with the inner surface of conductive shell.

9. processing method according to claim 1, wherein the quantity of the slit of the first cut portion and the second cut portion It is identical, and the slit of the first cut portion is connected to the slit of the second cut portion respectively.

10. processing method according to claim 9, wherein the slit width of the slit is mutually the same, and for 0.03mm~ 0.5mm。

11. processing method according to claim 1, wherein one in the first conductive part and the second conductive part constitute described in The radiating element of antenna structure, another in the first conductive part and the second conductive part constitute the ground connection member of the antenna structure Part.

12. processing method according to claim 11, wherein two sides shape of the radiating element in a conductive connection part At two radiating elements, described two radiating elements are respectively connected to two antenna circuits.

13. processing method according to claim 12, wherein each radiating element is electrically connected to described connect by feed line Ground element.