CN106409703A - Special transfer nozzle for electronic component packaging and application thereof - Google Patents

Abstract

The invention discloses a special transfer nozzle for electronic component packaging. The special transfer nozzle comprises a substrate and a support column arranged on the substrate. A pair of protrusions is arranged on the tail end of the support column. The special transfer nozzle provided by the invention is applied to an electronic component COC packaging technology. Compared with the prior art, the special transfer nozzle for a COC packaging process has the advantages that the transfer nozzle is used to transfer a flux onto a resistance device to complete the transfer of solder; the flux is no longer soaked by a capacitor; the packaging efficiency is improved; a PCB board is always clean; and the welding quality and reliability are improved.

Description

A special transfer nozzle for electronic component packaging and its application

technical field

The invention relates to electronic component packaging technology, in particular to a special tool for packaging electronic components and a method for using the tool to package electronic components.

Background technique

With the further improvement of civilian and military electronic products' requirements for miniaturization, functional integration and large storage space, there are more and more miniaturized and high-density packaging forms of components, such as multi-module package (MCM: combining multiple bare Chips and other components are assembled on the same multilayer interconnect substrate, and then packaged to form high-density and high-reliability microelectronic components), system packaging (SIP: multiple functional chips, including processors, memory and other functional chips are integrated in one package to achieve a basically complete function), flip chip, etc. These packaging methods are used more and more, and the closed size of active and passive devices is getting smaller and smaller. The emergence of component stacking assembly technology not only greatly improves the logic operation function and storage space, but also provides end users with the possibility to freely choose the combination of devices. Component stacking assembly is to place components on top of the bottom components. Stacked components are usually CSP, BGA and COC packages. CSP packaging is suitable for ICs with a small number of pins, such as memory sticks and portable electronic products. It reduces the size of the chip's closed shape, so that the size of the bare chip can be as large as the size of the package. BGA packaging technology is mostly used for high-density, high-performance, multi-pin closures such as CPUs and motherboards. The COC package is an active RC equalizer for chip components that is used to reduce intersymbol interference in communication signal transmission. It has a very important parameter called balance resistance, and stacking can reduce balance resistance. The general steps of the existing COC packaging are as follows: 1. PCB printing, after the equipment normally mounts the BC (resistor device), the first step of welding is completed in the reflow oven; 2. The bottom of the TC (capacitor device) is dipped in flux and placed on the BC component Top; 3. Use a hot air gun to heat the molten tin. Under the action of "migration" of the flux, the tin in the molten state wets the solder end of the TC component and forms an alloy to complete the welding of TC and BC. The existing process method has the following disadvantages: low efficiency, easy contamination of the PCB board surface, and inability to guarantee soldering quality and reliability.

Contents of the invention

The purpose of the present invention is to overcome the defects of the above-mentioned existing COC packaging technology, and provide a transfer nozzle dedicated to the COC packaging process. The transfer nozzle is used to transfer the flux to the resistance device to complete the transfer of the solder without Capacitors need to be impregnated with flux, which not only improves the packaging efficiency, but also ensures the cleanliness of the PCB board and improves the soldering quality and reliability.

To achieve the above object, the present invention adopts the following technical solutions:

A special transfer nozzle for electronic component packaging, which is characterized in that it includes a base plate, a support column arranged on the base plate, and a pair of protrusions are provided at the end of the support column.

Preferably, the top surface of the protrusion is a plane.

Preferably, the top surface of the protrusion is rectangular.

Preferably, a pair of through holes are opened on the substrate, and the pair of through holes are respectively located on both sides of the support column, and are used to fix the transfer nozzle on the working head of the placement machine to realize automatic packaging.

A notch is opened on the edge of the substrate, and the angle formed by the notch and the through hole can be used as an angle mark.

The support column is vertically fixed on the base plate, and the support column includes a first cylindrical section, a circular platform section, a second cylindrical section and a raised fixing section connected in sequence, the first cylindrical section is fixed on the surface of the substrate, and is formed by the second cylindrical section. The outer diameters from the cylindrical section to the convex fixed section decrease successively.

Preferably, the section of the raised fixing section is in the shape of a racetrack.

The above-mentioned special transfer nozzle for electronic component packaging is applied in the electronic component COC packaging process, which includes the following steps:

S1: Print solder paste on the PCB, then mount the resistor device, and then complete the first step of welding in the reflow oven;

S2: Dip the projection of the transfer nozzle into the solder flux, take out the transfer nozzle, and print the solder flux on the surface of the projection onto the surface of the resistance device to complete the transfer of the solder flux;

S3: mounting the capacitor device on the resistive device printed with solder flux.

Preferably, the protrusions imprint solder flux on a pair of edge regions on the surface of the resistive device.

Preferably, the distance between the pair of protrusions is equal to the length of the area on the surface of the resistance device not coated with solder flux, and the width of the top surface of the protrusion is equal to the width of the area printed with solder flux on the surface of the resistance device.

Compared with prior art, the beneficial effect of the present invention is:

The invention pioneered the design of the transfer nozzle, which is used to transfer the solder flux on the resistance device, and the capacitor device can be mounted on the resistance device without impregnating the solder flux. Compared with the existing process method, there are three advantages :

1. Saving solder flux: the surface of the capacitive device is currently immersed in the flux solution, which is equivalent to the entire bottom surface of the capacitor device being impregnated with solder flux, that is, the soldering flux covers the entire top surface of the resistive device, while The present invention uses the raised transfer soldering flux of the transfer nozzle, and the soldering flux is only printed on a pair of edges of the resistance device, which greatly saves the amount of soldering flux and saves the cost.

2. Keep the surface of the PCB clean and tidy: the bottom surface of the entire capacitor device is impregnated with solder flux. When heating and melting tin, due to the large amount of solder flux, it is easy to flow out from the gap between the capacitor device and the resistor device and dirty the PCB board. However, the present invention uses a transfer nozzle to transfer printing, and only prints solder flux on a pair of edges of the resistance device. The solder flux is less, and there will be no excess solder flux dripping on the surface of the PCB board, and the surface of the board is maintained. Neat and beautiful.

3. Improved welding quality and reliability: Using the transfer nozzle of the present invention can realize COC packaging automation without the influence of human factors, greatly reducing quality risks and improving welding quality.

Description of drawings

Fig. 1 is the structural representation of the transfer nozzle of the present invention;

Fig. 2 is a structural schematic diagram of another angle of the transfer nozzle of the present invention;

Fig. 3 is an enlarged view of part A of Fig. 2;

FIG. 4 is a structural schematic view of the resistance device of the present invention mounted on a PCB.

detailed description

In the following, the present invention will be further described in conjunction with the drawings and specific embodiments.

Example 1

Please refer to accompanying drawings 1 and 2, the special transfer nozzle for electronic component packaging of the present invention includes a substrate 1, and the substrate 1 is cylindrical. A support column 2 is fixed on the surface of the base plate 1 , and a pair of protrusions 3 are provided at the ends of the support column 2 . The top surface of the protrusion 3 is plane. The top surface of the protrusion 3 is preferably designed as a rectangle.

Example 2

Please refer to accompanying drawings 1 and 2, the special transfer nozzle for electronic component packaging of the present invention includes a substrate 1, and the substrate 1 is cylindrical. A support column 2 is fixed on the surface of the base plate 1 , and a pair of protrusions 3 are provided at the ends of the support column 2 . The top surface of the protrusion 3 is plane. The top surface of the protrusion 3 is preferably designed as a rectangle. Specifically, the protrusion 3 may be a cuboid, a cube, or a trapezoid.

The support column 2 is vertically fixed on the surface of the base plate 1, and includes a first cylindrical section 21, a circular platform section 22, a second cylindrical section 23 and a raised fixing section 24 connected in sequence, and the first cylindrical section 21 is vertically fixed on the On the surface of the base plate 1 , the outer diameter decreases sequentially from the first cylindrical section 21 to the raised fixing section 24 . The cross-section of the protrusion fixing section 24 is racetrack-shaped, and the pair of protrusions 3 are fixed on the racetrack-shaped surface of the protrusion fixing section 24 .

Example 3

Please refer to accompanying drawings 1 and 2 , the special transfer nozzle for electronic component packaging of the present invention includes a substrate 1 . A support column 2 is fixed on the surface of the base plate 1 , and a pair of protrusions 3 are provided at the ends of the support column 2 . The top surface of the protrusion 3 is plane. The top surface of the protrusion 3 is preferably designed as a rectangle. Specifically, the protrusion 3 may be a cuboid, a cube, or a trapezoid.

The support column 2 includes a first cylindrical section 21, a circular truncated section 22, a second cylindrical section 23 and a raised fixing section 24 connected in sequence. The first cylindrical section 21 is vertically fixed on the surface of the substrate 1, and is formed by the first cylindrical section 21. The outer diameters from the cylindrical section 21 to the raised fixing section 24 decrease successively. The shaft of the first cylindrical section 21 defines an annular groove 21a. (appearance, no other functions)

The cross-section of the protrusion fixing section 24 is racetrack-shaped, and the pair of protrusions 3 are fixed on the racetrack-shaped surface of the protrusion fixing section 24 .

The substrate 1 is cylindrical, and a pair of through holes 12 are opened on the substrate, and the through holes 12 are respectively located on both sides of the support column 2 . A notch 11 is provided on the edge of the substrate, which can be used as an angle mark to improve the accuracy of the packaging process.

Example 4

Please refer to accompanying drawings 1 and 2 , the special transfer nozzle for electronic component packaging of the present invention includes a substrate 1 . A support column 2 is fixed on the surface of the base plate 1 , and a pair of protrusions 3 are provided at the ends of the support column 2 . The top surface of the protrusion 3 is plane. The top surface of the protrusion 3 is preferably designed as a rectangle. Specifically, the protrusion 3 may be a cuboid, a cube, or a trapezoid. The width f of the top surface of the protrusion 3 is set to be equal to the width F of the area 6a to be printed with solder flux on the surface of the resistor device. The distance d between the pair of protrusions 3 is set to be equal to the length D of the region 6b on the surface of the resistance device where no solder flux is printed.

Example 5

Applying the special transfer nozzle for electronic component packaging of the present invention to the electronic component COC packaging process includes the following steps:

S1: Print solder paste 5 on the PCB board 4, then mount the resistor device 6, and then complete the first step of welding in a reflow furnace;

S2: Dip the protrusion 3 of the transfer nozzle into the solder flux, take out the transfer nozzle, and print the solder flux on the surface of the protrusion 3 on the surface of the resistance device 6 to complete the transfer of the solder flux;

S3: mounting the capacitor device on the resistance device 6 coated with solder flux.

Example 6

Applying the special transfer nozzle for electronic component packaging of the present invention to the electronic component COC packaging process includes the following steps:

S1: Print solder paste 5 on the PCB board 4, then mount the resistor device 6, and then complete the first step of welding in a reflow furnace;

S2: Dip the protrusion 3 of the transfer nozzle into the flux, and after taking out the transfer nozzle, align the edges of the pair of protrusions 3 with the edge of the top surface of the resistor device 6. At this time, the top surface of the protrusion 3 The wide side f just overlaps with the wide side F of the area 6a to be printed with solder flux on the surface of the resistance device 6, and the distance d between the two protrusions 3 is just in time with the length D of the non-printed solder flux area 6b on the surface of the resistance device 6. Correspondingly, the solder flux on the surface of the protrusion 3 is printed on a pair of edge solder flux regions 6a to be printed on the surface of the resistance device 6, and the solder flux transfer is completed;

S3: mounting the capacitor device on the resistance device 6 coated with solder flux.

For those skilled in the art, various other corresponding changes and modifications can be made according to the technical solutions and ideas described above, and all these changes and modifications should fall within the protection scope of the claims of the present invention.

Claims (10)

1. a kind of electronic package special transfer mouth it is characterised in that：Including substrate, the support column being arranged on substrate, institute The end stating support column is provided with a pair of projection.

2. electronic package as claimed in claim 1 special transfer mouth it is characterised in that：Described raised top end surface is Plane.

3. electronic package as claimed in claim 2 special transfer mouth it is characterised in that：Described raised top end surface is in Rectangle.

4. electronic package as claimed in claim 1 special transfer mouth it is characterised in that：A pair is offered on described substrate Through hole, this is located at the both sides of support column respectively to through hole.

5. electronic package as claimed in claim 1 special transfer mouth it is characterised in that：The edge one of described substrate Breach.

6. electronic package as claimed in claim 1 special transfer mouth it is characterised in that：Described support column is vertically fixed on On substrate, the first cylindrical section, round platform section, the second cylindrical section and raised canned paragraph that support column includes being sequentially connected with, described first Cylindrical section is fixing on the surface of the substrate, and is sequentially reduced to raised canned paragraph external diameter by the first cylindrical section.

7. electronic package as claimed in claim 6 special transfer mouth it is characterised in that：The section of described projection canned paragraph In run-track shaped.

8. the special transfer of the electronic package described in claim 1 to 7 any one mouth is applied to electronic component COC encapsulation In it is characterised in that comprising the following steps：

S1：Print solder paste on pcb board, then mounts upper resistance device, completes first step welding after reflow oven；

S2：The projection of transfer mouth be impregnated in and help in solder, after taking out transfer mouth, the solder print that helps of convex surfaces is overlayed on resistance On the surface of device, complete to help solder transfer；

S3：Capacitor element is mounted on print be covered with the resistance device helping solder.

9. as claimed in claim 8 application it is characterised in that：This will help solder print to overlay on the one of resistance device surface projection To marginal area.

10. as claimed in claim 9 application it is characterised in that：This is equal on resistance device surface to the spacing between projection Do not print the length in the region helping solder, the width on described protruding apex surface is equal to be printed covering on resistance device surface and helps solder areas The width in domain.