CN106057432A - Inductor - Google Patents

Abstract

The invention discloses an inductor which comprises a first core material, a lead, a second core material and a first lead frame. The first side of the first core material is provided with an accommodating space, the second side of the first core material is provided with a concave part, and the first side is opposite to the second side. The first core has a first height. The lead is arranged in the accommodating space. The second core material is arranged on the first side of the first core material and covers the accommodating space. The first lead frame is provided with a tabling part which is tabled in the concave part. The fitting portion has a second height. After the embedded part is embedded in the concave part of the first core material, the total height of the embedded part and the first core material is smaller than the sum of the first height and the second height. The lead frame of the inductor is embedded in the core material. When the inductor and the IC chip are packaged in a system integration way, the overall height can be effectively reduced, so that the electronic product is beneficial to the thin design.

Description

inductor

This application is a divisional application with the application number 201110020446.7 and the title of the invention "Inductor"

technical field

The invention relates to an inductor, in particular to an inductor capable of system integration package (System-In-Package, SIP) with an IC chip.

Background technique

An inductor is a passive electronic component that stores energy generated by a current passing through a magnetic field. The inductance value is used to measure the ability of an inductor to store magnetic energy. Inductors are generally wound into coils with wires, and according to Faraday's Law of Induction, the number of turns of wires can enhance the magnetic field in the coil. Inductance is created by the magnetic field formed around a current-carrying conductor, which has a tendency to resist changes in current. The number of turns of the wire, the cross-sectional area of the wire, and the material of the wire all affect the inductance value. For example, using high permeability magnetic material (such as iron oxide compound) to wrap the conductor will increase the magnetic flux.

At present, inductors with various structural designs have been disclosed in the prior art. For example, Japanese Patent Publication No. 3083909 discloses a drum type inductor; US Patent Publication No. 7477122 discloses another drum type inductor; US Patent Publication No. 20090160595 discloses an inductor and an IC Chip-integrated structure. Generally speaking, most existing inductors are integrated with IC chips in the following two ways.

1) The pins are directly extended from the lower magnetic core of the inductor to be soldered to the solder pins on the circuit board. However, in order to maintain a certain structural strength, the lower magnetic core needs to retain a certain thickness, so that the overall height after integration increases.

2) An external lead frame is connected under the lower magnetic core of the inductor to be welded with the lead frame of the IC chip. However, the height of the external lead frame will increase the overall height of the integration.

Therefore, under the condition that the required inductance value is the same, the overall height cannot be reduced when the existing inductor is stacked and packaged with the IC chip, which is not conducive to thinner design.

Contents of the invention

An object of the present invention is to provide an inductor in which a lead frame is fitted to a core material. When the inductor and the IC chip are packaged for system integration, the overall height can be effectively reduced, making the electronic product favorable for thinner design.

Another object of the present invention is to provide an inductor, which uses a lead frame to provide a platform for soldering with wires, so as to provide stronger soldering strength.

Based on the above purpose, the present invention provides an inductor, comprising a first core material, a wire, a second core material and a first lead frame. The first side of the first core material has an accommodating space, and the second side of the first core material has a recess, wherein the first side is opposite to the second side. The first core material has a first height. The wire is arranged in the accommodation space. The second core material is disposed on the first side of the first core material and covers the accommodating space. The first lead frame has a fitting part, and the fitting part is fitted into the recessed part. The fitting part has a second height. After the fitting part is fitted into the concave part of the first core material, the total height of the fitting part and the first core material is less than the sum of the first height and the second height.

Based on the above purpose, the present invention also provides an inductor, comprising a first core material, a wire, a second core material and a first lead frame. The first side of the first core material has an accommodating space, and the second side of the first core material has a recess, wherein the first side is opposite to the second side. The side of the first core material has perforations. The wire is arranged in the accommodation space. The second core material is disposed on the first side of the first core material and covers the accommodating space. The first lead frame has a fitting part and a welding platform, the fitting part is fitted into the recessed part, and the welding platform is connected to the fitting part. One end of the wire protrudes through the hole and is welded on the welding platform.

Based on the above purpose, the present invention also provides an electronic component, comprising a first core material, a wire, a second core material and a first lead frame. The first side of the first core material has an accommodating space, and the second side of the first core material has a recess, wherein the first side is opposite to the second side. The corners of the first core material have perforations. The wire is arranged in the accommodation space. The second core material is disposed on the first side of the first core material and covers the accommodating space. The first lead frame has a fitting part, and the fitting part is fitted into the recessed part. One end of the wire protrudes through the hole and is welded to the fitting part.

According to the above technical solution, the inductor of the present invention has at least the following advantages and beneficial effects: The present invention embeds the lead frame of the inductor into the core material. When the inductor and the IC chip are packaged for system integration, the overall height can be effectively reduced, making the electronic product favorable for thinner design. In addition, the inductor of the present invention uses a lead frame to provide a platform for soldering with wires, so as to provide stronger soldering strength.

The above description is only an overview of the technical solution of the present invention. In order to understand the technical means of the present invention more clearly, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and easy It is understood that a number of embodiments are specifically cited below, and the detailed description is as follows with reference to the accompanying drawings.

Description of drawings

FIG. 1 is a combined schematic diagram of an inductor and an IC chip package structure according to an embodiment of the present invention.

FIG. 2 is an exploded view of the inductor in FIG. 1 .

FIG. 3 is a front view of the inductor in FIG. 1 .

FIG. 4 is an external view of an inductor according to another embodiment of the present invention.

FIG. 5 is an exploded view of the inductor in FIG. 4 .

FIG. 6 is an appearance view of the inductor in FIG. 4 from another perspective.

FIG. 7 is an exploded view of the inductor in FIG. 6 .

FIG. 8 is a front view of the inductor in FIG. 4 .

FIG. 9 is an appearance view of the inductor in FIG. 4 with the second core material removed.

FIG. 10 is a schematic diagram of the combination of the inductor and IC chip package structure in FIG. 4 .

11 is a schematic diagram of an inductor and a second lead frame of an IC chip according to another embodiment of the present invention.

Wherein, the reference signs are explained as follows:

1, 5, 5' inductor 3, 7 IC chip package structure

10, 50 First core material 12, 52 Lead wire

14, 54 Second Core 16, 56, 56' First Lead Frame

70 Second lead frame 100, 500 Accommodating space

102, 502 Depressions 104, 504 Breakouts

160, 560 Fitting part 162 Welding platform

164, 564 pin 700 socket

702 Electrical contact S1 First side

S2 Second side H0, H0' Overall height

H1, H1' first height H2, H2' second height

detailed description

Please refer to FIG. 1 to FIG. 3, FIG. 1 is a combined schematic diagram of an inductor 1 and an IC chip package structure 3 according to an embodiment of the present invention, FIG. 2 is an exploded view of the inductor 1 in FIG. 1, and FIG. Front view of inductor 1 in . Inductor 1 is a passive electronic component that stores energy generated by a current passing through a magnetic field. As shown in FIGS. 1 to 3 , the inductor 1 includes a first core material 10 , a wire 12 , a second core material 14 and two first lead frames 16 . The material of the first core material 10 and the second core material 14 can be iron powder, iron oxide compound, permanent magnet or other magnetic materials. The shapes of the first core material 10 and the second core material 14 are not limited to the rectangle shown in the figure, and can be designed into other shapes according to practical applications, such as circle, ellipse, polygon and so on. The wire 12 may be a wire-wound coil formed by winding a copper wire.

As shown in Figure 2, the first side S1 of the first core material 10 has an accommodation space 100, and the second side S2 of the first core material 10 has four recesses 102 (due to the viewing angle, only three are shown in Figure 2 a recessed portion 102), wherein the first side S1 is opposite to the second side S2. In this embodiment, the four recesses 102 are respectively located at four corners around the first core material 10 , so that the usable area of the accommodating space 100 can be maximized. In this embodiment, the two first lead frames 16 respectively have two opposite fitting portions 160, soldering platforms 162 and pins 164, wherein the soldering platform 162 is connected between the two fitting portions 160, and the pins 164 are self-welding Platform 162 extends out. In practical application, the first lead frame 16 can be formed by a stamping process at one time.

When assembling the inductor 1 , the wire 12 is arranged in the containing space 100 first. Next, the second core material 14 is disposed on the first side S1 of the first core material 10 and covers the accommodating space 100 . After that, the fitting portion 160 of the first lead frame 16 is fitted into the corresponding concave portion 102 of the second side S2 of the first core material 10 . In this embodiment, two opposite sides of the first core material 10 have perforations 104 respectively, so that the two ends of the wires 12 can respectively protrude through the corresponding perforations 104 and be welded to the corresponding first lead frame 16. Welding platform 162, to provide stronger welding strength.

As shown in FIG. 3 , the first core material 10 has a first height H1, and the fitting portion 160 of the first lead frame 16 has a second height H2. After the fitting portion 160 of the first lead frame 16 is fitted into the concave portion 102 of the first core material 10, the total height H0 of the fitting portion 160 and the first core material 10 is smaller than the difference between the first height H1 and the second height H2. and.

As shown in FIG. 1 , when the inductor 1 and the IC chip package structure 3 are integrated into the package, the first lead frame 16 can be used to set up an air bridge, and the electrical contacts (not shown) of the IC chip package structure 3 below )connect. In this embodiment, the IC chip packaging structure 3 is formed by encapsulating the IC chip and its lead frame therein with a packaging compound. Since the IC chip packaging technology is a common technology in the general existing technology, it will not be repeated here. As mentioned above, since the total height H0 of the fitting portion 160 and the first core material 10 is less than the sum of the first height H1 of the first core material 10 and the second height H2 of the fitting portion 160, and the wire 12 is embedded The method is embedded in the accommodation space 100 of the first core material 10, so the present invention can meet the requirements of inductance characteristics without increasing the height of the inductor 1, and at the same time overcome the connection problem between the IC chip package structure 3 and the inductor 1 .

In this embodiment, the pins 164 of the first lead frame 16 can be designed as straight strips and extend downwards to connect with the electrical contacts of the IC chip package structure 3 . However, in another embodiment, the pins of the IC chip package structure 3 may also be extended upwards to connect with the pins of the lead frame 16 . In addition, the electrical contacts of the first lead frame 16 of the inductor 1 and the IC chip packaging structure 3 can also be connected by external pins. In other words, the connection method between the first lead frame 16 and the IC chip package structure 3 can be designed according to the actual application, and is not limited to the embodiment shown in the figure.

Please refer to FIG. 4 to FIG. 9, FIG. 4 is an appearance view of an inductor 5 according to another embodiment of the present invention, FIG. 5 is an exploded view of the inductor 5 in FIG. 4, and FIG. 6 is an inductor 5 in FIG. 4 In another perspective view, FIG. 7 is an exploded view of the inductor 5 in FIG. 6, FIG. 8 is a front view of the inductor 5 in FIG. 4, and FIG. 9 is a second view of the inductor 5 in FIG. External view of the core material 54. Inductor 5 is a passive electronic component that stores energy generated by passing a current through a magnetic field. As shown in FIGS. 4 to 9 , the inductor 5 includes a first core material 50 , a wire 52 , a second core material 54 and two first lead frames 56 . The material of the first core material 50 and the second core material 54 can be iron powder, iron oxide compound, permanent magnet or other magnetic materials. The shapes of the first core material 50 and the second core material 54 are not limited to the rectangle shown in the figure, and can be designed into other shapes according to practical applications, such as circle, ellipse, polygon and so on. The wire 52 may be a wire-wound coil formed by winding a copper wire.

5 and 7, the first side S1 of the first core material 50 has an accommodating space 500, and the second side S2 of the first core material 50 has four recesses 502, wherein the first side S1 and the second side S1 The two sides S2 are opposite. In this embodiment, the four recesses 502 are respectively located at four corners around the first core material 50 , so that the usable area of the accommodating space 500 can be maximized. In this embodiment, the two first lead frames 56 respectively have two opposite fitting portions 560 and pins 564 , wherein the pins 564 extend from the fitting portions 560 . In practical application, the first lead frame 56 can be formed by a stamping process at one time.

When assembling the inductor 5 , firstly, the wire 52 is disposed in the accommodating space 500 . Next, the second core material 54 is disposed on the first side S1 of the first core material 50 and covers the accommodating space 500 . After that, the fitting portion 560 of the first lead frame 56 is fitted into the corresponding concave portion 502 of the second side S2 of the first core material 50 . In this embodiment, two opposite corners of the first core material 50 respectively have perforations 504, so the two ends of the wires 52 can protrude through the corresponding perforations 504 and be welded to the corresponding first lead frame 56. 560 (as shown in FIG. 9 ) to provide stronger welding strength.

As shown in FIG. 8 , the first core material 50 has a first height H1 ′, and the fitting portion 560 of the first lead frame 56 has a second height H2 ′. After the fitting portion 560 of the first lead frame 56 is fitted into the concave portion 502 of the first core material 50, the total height H0' of the fitting portion 560 and the first core material 50 is smaller than the first height H1' and the second height The sum of H2'.

Please refer to FIG. 10 , which is a schematic diagram of the combination of the inductor 5 and the IC chip package structure 7 in FIG. 4 . As shown in FIG. 10 , when the inductor 5 and the IC chip package structure 7 are integrated into the package, the first lead frame 56 can be used to set up a bridge to connect with the IC chip package structure 7 below. As mentioned above, since the total height H0 of the fitting portion 560 and the first core material 50 is less than the sum of the first height H1 of the first core material 50 and the second height H2 of the fitting portion 560, and the wire 52 is embedded The method is buried in the accommodation space 500 of the first core material 50, so the present invention can meet the requirements of the inductance characteristics without increasing the height of the inductor 5, and at the same time overcome the connection problem between the IC chip packaging structure 7 and the inductor 5 .

In this embodiment, the pins 564 of the first lead frame 56 can be designed in a convex shape and extend downwards to connect with the IC chip package structure 7 . As shown in FIG. 10 , grooves 700 corresponding to pins 564 can be formed on the IC chip package structure 7 . When assembling, the pin 564 can be inserted into the groove 700 first, and then welded, so as to further increase the welding strength. However, in another embodiment, the pins of the IC chip package structure 7 may also be extended upwards to connect with the pins of the first lead frame 56 . In addition, the first lead frame 56 of the inductor 5 and the IC chip packaging structure 7 may also be connected by external pins. In other words, the connection method between the first lead frame 56 and the IC chip packaging structure 7 can be designed according to the actual application, and is not limited to the embodiment shown in the figure.

Please refer to FIG. 11 , which is a schematic diagram of an inductor 5 ′ and a second lead frame 70 of an IC chip according to another embodiment of the present invention. As shown in FIG. 11 , the second lead frame 70 of the IC chip can also be extended toward the first lead frame 56 ′ of the inductor 5 ′, so as to be electrically connected to the first lead frame 56 ′. In this embodiment, the second lead frame 70 includes two opposite U-shaped lead frames, but it is not limited thereto. In another embodiment, the second lead frame 70 may also be designed in a ring shape, depending on practical applications. In addition, the second lead frame 70 has an electrical contact 702 for forming an electrical connection with the IC chip. It should be noted that the second lead frame 70 may also have more than one electrical contact 702, the electrical contact 702 may be in the form of a sheet or other shapes, and the electrical contact 702 may be located in the middle or both sides of the second lead frame 70. Or other arbitrary positions, not limited to those shown in FIG. 11 .

It should be noted that the first core material 10 in FIG. 2 can also be replaced by the first core material 50 in FIG. 5, and the first core material 50 in FIG. 5 can also be replaced by the first core material 10 in FIG. Replacement, depending on the actual application.

According to the above technical solution, the inductor of the present invention has at least the following advantages and beneficial effects: The present invention embeds the lead frame of the inductor into the core material. When the inductor and the IC chip are packaged for system integration, the overall height can be effectively reduced, making the electronic product favorable for thinner design. In addition, the inductor of the present invention uses a lead frame to provide a platform for soldering with wires, so as to provide stronger soldering strength.

The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the claims of the present invention shall fall within the scope of the present invention.

Claims (12)

1. An inductor, characterized in that the inductor comprises: a core material, the lower surface of the core material having a protrusion on the lower surface to form a depression at a corner of the periphery of the lower surface of the core material; and The first lead frame has a fitting part, and the fitting part is fitted into the recessed part. 2. An inductor, characterized in that the inductor comprises: a core material, the lower surface of the core material having a protrusion on the lower surface to form a depression at a corner of the periphery of the lower surface of the core material; and The first lead frame has a fitting portion, and the fitting portion is fitted into the concave portion, and the first lead frame has a pin, and the pin is away from the core material from the fitting portion direction extension. 3. An inductor, characterized in that the inductor comprises: a core material having a lower surface having a first depression at a first corner of a periphery of the lower surface and a second depression at a second corner of the periphery of the lower surface; and The first lead frame has a first fitting part and a second fitting part, the first fitting part is fitted into the first concave part, and the second fitting part is fitted into the second In the recessed part, the first lead frame has a first pin and a second pin, and the first pin and the second pin are respectively away from the first fitting part and the second fitting part. The direction of the core material extends. 4. An inductor, characterized in that the inductor comprises: A core material, the upper surface of the core material has an accommodating space, the lower surface of the core material has a first concave portion located at a first corner of the periphery of the lower surface, and a first concave portion located at the periphery of the lower surface the second depression at the two corners; wires arranged in the accommodating space; and The first lead frame has a first fitting part and a second fitting part, the first fitting part is fitted into the first concave part, and the second fitting part is fitted into the second in the depression. 5. An inductor, characterized in that the inductor comprises: a core material, the lower surface of the core material has a first depression at a first corner, a second depression at a second corner, a third depression at a third corner, and a fourth corner at a periphery of the lower surface. the fourth depression; The first lead frame has a first fitting portion and a second fitting portion, the first fitting portion is fitted into the first recess, and the second fitting portion is fitted into the second recess Department; and The second lead frame has a third fitting portion and a fourth fitting portion, the third fitting portion is fitted into the third recess, and the fourth fitting portion is fitted into the fourth recess department. 6. An electronic component, characterized in that the electronic component comprises: A first core material, the lower surface of the first core material has a depression located at a first corner of the periphery of the lower surface, and the side of the upper surface of the first core material has a depression located above the first corner. Broken hole; a second core material, disposed above the upper surface of the first core material, and covering the pillar and the accommodation space; and The first lead frame has a fitting portion, the fitting portion is fitted into the recessed portion, and one end of the wire protrudes through the hole and is welded to the fitting portion. 7. A core material for an inductor, characterized in that the upper surface of the core material has an accommodating space for setting a coil, and the lower surface of the core material has a second a first depression at one corner, and a second depression at a second corner of the periphery of the lower surface, the side of the upper surface of the first core material has a first perforation above the first corner and a second hole located above the second corner, wherein the first fitting portion and the second fitting portion of the first lead frame are respectively fitted into the first recessed portion and the second recessed portion, the The two terminals of the coil are electrically connected to the first fitting part and the second fitting part of the first lead frame through the first hole and the second hole respectively. 8. A core material for an inductor, characterized in that, the upper surface of the core material has an accommodating space for setting a coil, and the lower surface of the core material has a first The recessed part of the corner, the side of the upper surface of the first core material has a hole above the first corner, wherein a fitting part of a lead frame is fitted into the recessed part, and the coil A terminal is electrically connected to the fitting part of the lead frame through the hole. 9. A system integrated package, characterized in that the system integrated package comprises: A first core material, the lower surface of the first core material has a depression located at a first corner of the periphery of the lower surface, and the side of the upper surface of the first core material has a depression located above the first corner. a hole; the first lead frame has a fitting portion, the fitting portion is fitted into the recessed portion, and one end of the wire protrudes through the hole and is welded to the fitting portion; and IC chip, the first lead frame has a first lead and a second lead, and the first lead and the second lead respectively extend from the first fitting part and the second fitting part to the direction of the IC chip, To be electrically connected with the IC chip. 10. A system integrated package, characterized in that the system integrated package comprises: A first core material, the lower surface of the first core material has a depression located at a first corner of the periphery of the lower surface, and the side of the upper surface of the first core material has a depression located above the first corner. Broken hole; The first lead frame has a fitting portion, the fitting portion is fitted into the recessed portion, and one end of the wire protrudes through the hole and is welded to the fitting portion; and An IC chip, the IC chip includes a second lead frame, and the second lead frame extends toward the direction of the first lead frame to be electrically connected to the first lead frame. 11. An inductor, characterized in that the inductor comprises: The first core material, the upper surface of the first core material has an accommodating space, the lower surface of the first core material has a first concave part and a second corner located at the first corner of the periphery of the lower surface the second recessed portion at the third corner, the third recessed portion at the third corner, and the fourth recessed portion at the fourth corner; wires arranged in the accommodating space; a second core material, disposed above the upper surface of the first core material, and covering the pillar and the accommodation space; and The first lead frame has a first fitting portion and a second fitting portion, the first fitting portion is fitted into the first recess, and the second fitting portion is fitted into the second recess Department; and The second lead frame has a third fitting portion and a fourth fitting portion, the third fitting portion is fitted into the third recess, and the fourth fitting portion is fitted into the fourth recess department. 12. An inductor, characterized in that the inductor comprises: A first core material, the upper surface of the first core material has a column and an accommodating space, the lower surface of the first core material has a first depression located at a first corner of the periphery of the lower surface, a second recess at the second corner, a third recess at the third corner, and a fourth recess at the fourth corner; a wire arranged in the accommodating space and surrounding the column; a second core material, disposed above the upper surface of the first core material, and covering the pillar and the accommodation space; and The first lead frame has a first fitting portion and a second fitting portion, the first fitting portion is fitted into the first recess, and the second fitting portion is fitted into the second recess Department; and The second lead frame has a third fitting portion and a fourth fitting portion, the third fitting portion is fitted into the third recess, and the fourth fitting portion is fitted into the fourth recess department.