CN105867035A - Fan-out routing system, array substrate and liquid crystal display device - Google Patents
Fan-out routing system, array substrate and liquid crystal display device Download PDFInfo
- Publication number
- CN105867035A CN105867035A CN201610413059.2A CN201610413059A CN105867035A CN 105867035 A CN105867035 A CN 105867035A CN 201610413059 A CN201610413059 A CN 201610413059A CN 105867035 A CN105867035 A CN 105867035A
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- fan
- cabling
- metal
- out cabling
- wiring structure
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention relates to a fan-out routing structure which comprises at least a pair of a first fan-out routing wire and a second fan-out routing wire which are uniform in routing shape, mutually corresponding in up-down position and isolated by an insulating layer. A front section of each first routing wire is formed by a first metal layer made of first metal while a rear section of the same is formed by a second metal layer made of second metal, each first metal layer and the corresponding second metal layer are in up-down arrangement in position, and the front section and the rear section of each first fan-out routing wire are connected together through a first insulating layer via hole; a front section of each second fan-out routing wire is formed by the corresponding second metal layer while a rear section of the same is formed by the corresponding first metal layer, and the front section and the rear section of each second fan-out routing wire are connected together through a second insulating layer via hole. The invention further provides an array substrate and a liquid crystal display device. By the fan-out routing structure, needs on designing a narrow frame with high resolution can be met, and bad display effect caused by impedance difference of adjacent fan-out routing can be avoided.
Description
Technical field
The present invention relates to technical field of liquid crystal display, particularly relate to a kind of fan-out Wiring structure, array base palte
And liquid crystal indicator.
Background technology
TFT-LCD i.e. thin film transistor (TFT) LCD, is in active matrix type liquid crystal display (AM-LCD)
One.Liquid crystal flat panel display, special TFT-LCD, is currently the only in brightness, contrast, merit
Catch up with in the combination properties such as consumption, life-span, volume and weight and display device more than CRT comprehensively, it
Function admirable, large-scale production characteristic are good, and automaticity is high, and the cost of raw material is cheap, development space
Wide, the main product of new century will be rapidly become, be a bright spot of 21 century global economy growth.
A new generation TFT-LCD is low temperature polycrystalline silicon (LTPS) product at present.
In LTPS product design, export entrance territory, effective display area from integrated circuit (IC) section
(AA) cabling between is defined as fan-out (Fanout) cabling.Existing Fanout cabling generally there are two
The mode of kind, sees Fig. 1 and Fig. 2.
Fig. 1 goes out Wiring structure schematic diagram for a kind of existing single metal fan.In FIG, single gold is used
Belong to the mode of (Single Metal), be as a example by full HD (FHD) by resolution: owing to LTPS produces
Product many employings demultiplexer (DEMUX) structure, then in design source electrode (Source) side
1080 are needed, then use the mode of Fig. 1 to be accomplished by 1080 metals 1 during Fanout cabling
(Metal1) when or 1080 metals 2 (Metal2), using Single Metal, it is necessary to consider phase
Distance between adjacent metal (Metal) cabling, prevents from causing adjacent metal cabling to send out owing to exposure limits
Raw short circuit (Short), so owing to walk 1080 lines, then corresponding Fanout region will be to height
There is certain requirement.And this most directly influences whether the height of frame (Border) of Source side
Degree.
Fig. 2 goes out Wiring structure schematic diagram for a kind of existing two kinds of metal fans.In order to compress Fanout cabling district
Territory height, and then derive Fanout cabling mode corresponding for Fig. 2: this kind of mode use Metal1 and
The cabling mode that Metal2 is staggered, owing to there is insulating barrier between Metal1 and Metal2 in this mode
(PV), thus need not worry that adjacent metal cabling too closely cannot expose generation due to distance again
Short, it is only necessary to consider certain light transmittance.But when resolution is more and more higher, this framework
Also the demand that source side frame (source border) is reduced cannot met.Simultaneously because Metal1
With the difference of Metal2 resistivity, it is bad that this mode also brings along in display sometimes.
Therefore, narrow limit cannot have been met for the Fanout cabling that current resolution is traditional time more and more higher
Frame designs this problem, needs badly and proposes new Fanout cabling mode.
Summary of the invention
Therefore, it is an object of the invention to propose a kind of fan-out Wiring structure, by new Fanout cabling
Mode realizes narrow frame design demand under high-resolution.
A further object of the present invention is to propose a kind of array base palte, real by new Fanout cabling mode
Narrow frame design demand under existing high-resolution.
Another object of the present invention is to propose a kind of liquid crystal indicator, by new Fanout cabling side
Formula realizes narrow frame design demand under high-resolution.
For achieving the above object, the invention provides a kind of fan-out Wiring structure, including: at least one pair of is walked
Wire shaped is consistent and position is the most corresponding up and down the first fan-out cabling and the second fan-out cabling, this first fan
Go out between cabling and the second fan-out cabling by insulator separation；The leading portion of this first fan-out cabling by material is
The first metal layer of the first metal is formed, and the back segment of this first fan-out cabling is the bimetallic the by material
Two metal levels are formed, and the position of this first metal layer and the second metal level is levels configuration, this first fan
The leading portion and the back segment that go out cabling are interconnected by the first insulating barrier via；This second fan-out cabling
Leading portion formed by this second metal level, the back segment of this second fan-out cabling is formed by this first metal layer,
Leading portion and the back segment of this second fan-out cabling are interconnected by the second insulating barrier via.
Wherein, in addition to being close in the part of this first insulating barrier via and the second insulating barrier via, this is first years old
The leading portion of fan-out cabling is the most relative with the leading portion of this second fan-out cabling to be overlapped, this first fan-out cabling
Back segment is the most relative with the back segment of this second fan-out cabling to be overlapped.
Wherein, including multipair walk wire shaped is consistent and position is the most corresponding up and down the first fan-out cabling and the
Two fan-out cablings, wherein, each first fan-out cabling be arranged in parallel the most at equal intervals, each second fan-out
Cabling be arranged in parallel the most at equal intervals.
Wherein, the impedance configuration of described first fan-out cabling and the second fan-out cabling is equal.
Wherein, the back segment of described first fan-out cabling and the second fan-out cabling is respectively equipped with extension, described
The extension of the first fan-out cabling and the extension of the second fan-out cabling the most mutually stagger.
Wherein, this first metal and the second metal are identical metal.
Wherein, this first metal and the second metal are different metals.
Wherein, described fan-out Wiring structure is used for connecting data wire or gate line.
For achieving the above object, present invention also offers a kind of array base palte, including fan-out as above
Wiring structure.
For achieving the above object, present invention also offers a kind of liquid crystal indicator, including as above
Array base palte.
In sum, the fan-out Wiring structure of the present invention, array base palte and liquid crystal indicator are capable of
Narrow frame design demand under high-resolution, can also avoid because of adjacent fan-out cabling resistance difference simultaneously
The display brought is bad.
Accompanying drawing explanation
Below in conjunction with the accompanying drawings, by the detailed description of the invention of the present invention is described in detail, will make the present invention's
Technical scheme and other beneficial effects are apparent.
In accompanying drawing,
Fig. 1 goes out Wiring structure schematic diagram for a kind of existing single metal fan；
Fig. 2 goes out Wiring structure schematic diagram for a kind of existing two kinds of metal fans；
Fig. 3 is the structural representation of fan-out Wiring structure one of the present invention preferred embodiment；
Fig. 4 is the section enlarged diagram of dotted portion in Fig. 3.
Detailed description of the invention
See the structural representation that Fig. 3 and Fig. 4, Fig. 3 are fan-out Wiring structure one of the present invention preferred embodiment
Figure, Fig. 4 is the section enlarged diagram of dotted portion in Fig. 3.Owing to invention focuses on fan-out cabling
Structure, the therefore not shown dependency structure that may relate to such as substrate, insulating barrier, passivation layer etc. in Fig. 3.
The fan-out Wiring structure of the present invention specifically includes that at least one pair of walks that wire shaped is consistent and position is the most right
The first fan-out cabling 10 and the second fan-out cabling 20 answered, this first fan-out cabling 10 and the second fan-out are walked
By insulating barrier 30 (Fig. 3 does not shows, can be found in Fig. 4) isolation to keep insulation between line 20；This first fan
The leading portion 11 going out cabling 10 is formed by the first metal layer that material is the first metal, this first fan-out cabling
The back segment 12 of 10 is that bimetallic second metal level is formed by material, and in Fig. 3, the first metal is metal
2, the second metal is metal 1, and the position of this first metal layer and the second metal level is levels configuration, should
(Fig. 3 does not shows, structure by the first insulating barrier via for the leading portion 11 of the first fan-out cabling 10 and back segment 12
Can be found in Fig. 4) interconnect to form the first complete fan-out cabling 10；This second fan-out is walked
The leading portion 21 of line 20 is formed by this second metal level, the back segment 22 of this second fan-out cabling 20 by this
One metal level is formed, and the leading portion 21 of this second fan-out cabling 20 and back segment 22 are by the second insulating barrier via
It is interconnected on (Fig. 3 does not shows, structure can be found in Fig. 4) together to form the second complete fan-out cabling
20.Metal 1 can be identical metal with metal 2, it is also possible to for different metals.
See Fig. 3, in this preferred embodiment, except being close in this first insulating barrier via and the second insulating barrier
Outside the part of via, on the leading portion 11 of this first fan-out cabling 10 and the leading portion 21 of this second fan-out cabling 20
Lower coincidence relatively, the back segment 12 of this first fan-out cabling 10 and the back segment about 22 of this second fan-out cabling 20
Relatively overlap.Selection as an alternative, also may be used in the position of the first fan-out cabling 10 and the second fan-out cabling 20
To be configured to mutually stagger certain distance by translation based on the configuration shown in Fig. 3.As it is shown on figure 3, remove
Outside first fan-out cabling 10 of pairing and the second fan-out cabling 20, whole fan-out Wiring structure can also include
Multipair walk wire shaped is consistent and position is the most corresponding up and down the first fan-out cabling and the second fan-out cabling, its
In, each first fan-out cabling can be arranged in parallel each other at equal intervals, each second fan-out cabling mutually it
Between can be arranged in parallel at equal intervals.Additionally, in the preferred embodiment shown in Fig. 3, except one group the most at equal intervals
Outside the first paired fan-out cabling be arrangeding in parallel and the second fan-out cabling, the most symmetrical is provided with another group
The first paired fan-out cabling and the second fan-out cabling.
The back segment 12 of the first fan-out cabling 10 and the back segment 22 of the second fan-out cabling 20 can set further respectively
There are extension 13 and 23, the extension 13 of described first fan-out cabling 10 and the extension of the second fan-out cabling 20
Mutually staggering in portion about 23, and then is conveniently used for connecting data wire or gate line.First fan-out cabling 10 He
The impedance of the second fan-out cabling 20 can be equal by design configurations, to reduce resistance difference further.
As shown in Figure 4, when making the fan-out Wiring structure of the present invention, can be by difference shape on substrate
Become the second metal level (metal 1), insulating barrier 30, the first metal layer (metal 2), etch the most respectively
Two metal levels and the first metal layer form cabling pattern, by the insulating barrier via (PV on insulating barrier 30
Via) pattern on the second metal level and the first metal layer is connected.
New Fanout cabling mode proposed by the invention, major part region uses Metal1 and Metal2
Overlapping mode, then uses PV Via to realize the thread-changing between Metal1 and Metal2 at zone line.
By use overlapping by the way of, both can save the space of half by more existing monolayer gage system, and one
Fanout cabling, in zone line thread-changing, the mode using Metal1 with Metal2 to connect, can reduce phase
The diversity of adjacent impedance, improves display quality.Thread-changing is carried out by PV Via, to a signal in centre
From the point of view of, one section of cabling lower floor, and walk on upper strata, so palpus saltus step, all signals are all such
Design, then the impedance between adjacent traces just can be mutually matched, will not be variant, it is ensured that signal passes
Defeated performance more preferably, reduces parasitic capacitance.
Present invention also offers the array base palte using above-mentioned fan-out Wiring structure, and liquid crystal display dress
Put.The fan-out Wiring structure of the present invention applies also for applying as follows:
1, liquid crystal display row scanning (Gate) drive circuit being integrated on array base palte；
2, it is applied to mobile phone, display, the raster data model field of TV；
3, the industry advanced technology of LCD and OLED is contained
4, the stability of this circuit is applicable in the middle of the panel design of high-res.
In sum, the fan-out Wiring structure of the present invention, array base palte and liquid crystal indicator are for when dividing
Fanout cabling traditional when resolution is more and more higher cannot meet this problem of narrow frame design, proposes
A kind of new Fanout cabling mode, it is possible to achieve narrow frame design demand under high-resolution, keeps away simultaneously
The display exempting to bring because of adjacent Fanout cabling resistance difference is bad.
The above, for the person of ordinary skill of the art, can be according to the technical side of the present invention
Other various corresponding changes and deformation are made in case and technology design, and all these change and deformation are all answered
Belong to the protection domain of appended claims of the present invention.
Claims (10)
1. a fan-out Wiring structure, it is characterised in that including: at least one pair of is walked, and wire shaped is consistent and position
Put the first the most corresponding up and down fan-out cabling and the second fan-out cabling, this first fan-out cabling and the second fan
Go out between cabling by insulator separation；The leading portion of this first fan-out cabling is by first that material is the first metal
Metal level is formed, and the back segment of this first fan-out cabling is that bimetallic second metal level is formed by material,
The position of this first metal layer and the second metal level be levels configuration, the leading portion of this first fan-out cabling and
Back segment is interconnected by the first insulating barrier via；The leading portion of this second fan-out cabling by this second
Metal level is formed, and the back segment of this second fan-out cabling is formed by this first metal layer, this second fan-out cabling
Leading portion and back segment interconnected by the second insulating barrier via.
2. fan-out Wiring structure as claimed in claim 1, it is characterised in that first exhausted except being close in this
Outside the part of edge layer via and the second insulating barrier via, the leading portion of this first fan-out cabling and this second fan-out
The leading portion of cabling overlaps the most relatively, the back segment of this first fan-out cabling and the back segment of this second fan-out cabling
The most relatively overlap.
3. fan-out Wiring structure as claimed in claim 1, it is characterised in that include multipair walk wire shaped
Consistent and the first fan-out cabling that position is the most corresponding up and down and the second fan-out cabling, wherein, each first fan
Going out cabling to be arranged in parallel the most at equal intervals, each second fan-out cabling is the most parallel to be set
Put.
4. fan-out Wiring structure as claimed in claim 1, it is characterised in that described first fan-out cabling
It is equal with the impedance configuration of the second fan-out cabling.
5. fan-out Wiring structure as claimed in claim 1, it is characterised in that described first fan-out cabling
It is respectively equipped with extension, the extension and second of described first fan-out cabling with the back segment of the second fan-out cabling
The extension of fan-out cabling the most mutually staggers.
6. fan-out Wiring structure as claimed in claim 1, it is characterised in that this first metal and second
Metal is identical metal.
7. fan-out Wiring structure as claimed in claim 1, it is characterised in that this first metal and second
Metal is different metal.
8. fan-out Wiring structure as claimed in claim 1, it is characterised in that described fan-out Wiring structure
For connecting data wire or gate line.
9. an array base palte, it is characterised in that include as arbitrary in claim 1～8 as described in fan-out walk
Line structure.
10. a liquid crystal indicator, it is characterised in that include array base as claimed in claim 9
Plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610413059.2A CN105867035A (en) | 2016-06-12 | 2016-06-12 | Fan-out routing system, array substrate and liquid crystal display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610413059.2A CN105867035A (en) | 2016-06-12 | 2016-06-12 | Fan-out routing system, array substrate and liquid crystal display device |
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| Publication Number | Publication Date |
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| CN105867035A true CN105867035A (en) | 2016-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610413059.2A Pending CN105867035A (en) | 2016-06-12 | 2016-06-12 | Fan-out routing system, array substrate and liquid crystal display device |
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Application publication date: 20160817 |