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CN105819390B - Sensor - Google Patents

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Publication number
CN105819390B
CN105819390B CN201510000425.7A CN201510000425A CN105819390B CN 105819390 B CN105819390 B CN 105819390B CN 201510000425 A CN201510000425 A CN 201510000425A CN 105819390 B CN105819390 B CN 105819390B
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China
Prior art keywords
elastic cantilever
elastic
outline border
group
fixed part
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Application number
CN201510000425.7A
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Chinese (zh)
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CN105819390A (en
Inventor
裘进
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Sirui Technology Co.,Ltd.
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SHANGHAI XIRUI TECHNOLOGY Co Ltd
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Publication of CN105819390A publication Critical patent/CN105819390A/en
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  • Pressure Sensors (AREA)

Abstract

The present invention provides a kind of sensor, including an outline border and one first elastic cantilever group, every one first elastic cantilever both ends of the first elastic cantilever group are connect with an internal component and the outline border respectively, for the internal component to be connected to the outline border, the outline border includes a framework and an at least buffer part, each buffer part includes a fixed part and one second elastic cantilever group, the anchor point that the fixed part is arranged on substrate substrate with one is fixedly connected, the both ends of every one second elastic cantilever of the second elastic cantilever group are connect with the fixed part and the framework respectively, for the buffer part to be connected to the framework, every one first elastic cantilever of the axial direction and the first elastic cantilever group of every one second elastic cantilever of the second elastic cantilever group it is axially vertical.The invention has the advantages that reducing the knots modification of working frequency, or even keep working frequency constant, improves the detection accuracy of sensor.

Description

Sensor
Technical field
The present invention relates to micro mechanical technology field more particularly to a kind of sensors.
Background technique
Micro mechanical sensor is the microsensor manufactured using microelectronic process engineering and micromachining technology. Compared with traditional sensor, it has, and small in size, light weight and cost is low, low in energy consumption, high reliablity, is suitable for batch production, is easy In integrated and realize intelligentized feature.Meanwhile it is allowed to complete certain tradition machineries in the characteristic size of micron dimension The irrealizable function of sensor institute.
But existing micro mechanical sensor Shortcomings.Referring to Fig. 1, the internal component 10 of sensor passes through at least one Elastic cantilever 11 is connect with the outline border 12 of sensor, and the outline border 12 in the two anchor point 13(attached drawings being oppositely arranged by using Dotted line mark) it is fixed on substrate substrate (not indicated in attached drawing).It, will be in the bullet when the sensor is by encapsulation pressure Property cantilever beam 11 on generate an axial force so that the rigidity of elastic cantilever 11 changes, change working frequency, to influence The detection accuracy of sensor.
Summary of the invention
The technical problem to be solved by the invention is to provide a kind of sensors, can offset the shadow of device encapsulation pressure It rings, reduces the knots modification of working frequency, or even keep working frequency constant, improve the detection accuracy of sensor.
To solve the above-mentioned problems, the present invention provides a kind of sensors, including an outline border and one first elastic cantilever Group, every one first elastic cantilever both ends of the first elastic cantilever group connect with an internal component and the outline border respectively It connects, for the internal component to be connected to the outline border, the outline border includes a framework and an at least buffer part, each described Buffer part includes a fixed part and one second elastic cantilever group, and it is solid that the anchor point on substrate substrate is arranged in the fixed part and one Fixed connection, the both ends of every one second elastic cantilever of the second elastic cantilever group respectively with the fixed part and the frame Body connection, for the buffer part to be connected to the framework, every one second elastic cantilever of the second elastic cantilever group The axial direction of beam is axially vertical with every one first elastic cantilever of the first elastic cantilever group.
Further, the outline border includes two symmetrically arranged buffer parts.
Further, the second elastic cantilever group includes two the second elastic cantilevers, described two second elastic suspendeds Arm beam is symmetricly set on the fixed part both ends.
Further, the side of the outline border towards the fixed part is provided with a recess, for accommodating second bullet Property cantilever beam.
It is an advantage of the current invention that the sensor of the prior art is under the influence of encapsulating pressure, in connection internal component and An axial force can be generated on first elastic cantilever of outline border, the rigidity of the first elastic cantilever can change, and change work Frequency, to influence the detection accuracy of sensor, in order to solve the technical problem, buffering is arranged in the present invention on the outline border Portion, the buffer part have one and first elastic cantilever the second axially vertical elastic cantilever, when the sensor by To encapsulation pressure influence when, second elastic cantilever can offset the shadow of encapsulation pressure by itself Flexible change It rings, so that the rigidity of the first elastic cantilever be avoided to change, keeps working frequency constant, improve the detection essence of sensor Degree.
Detailed description of the invention
Fig. 1 is the structure schematic diagram of existing sensor;
Fig. 2 is the structure schematic diagram of inventive sensor.
Specific embodiment
It elaborates with reference to the accompanying drawing to the specific embodiment of sensor provided by the invention.
Referring to fig. 2, inventive sensor includes an outline border 20 and one first elastic cantilever group (not indicating in attached drawing).Institute Stating the first elastic cantilever group includes at least one first elastic cantilever 23, the both ends difference of every one first elastic cantilever 23 It is connect with an internal component 24 and the outline border 20, first elastic cantilever 23 is used for 24 elasticity of internal component even It is connected to the outline border 20.In this embodiment, two the first elastic cantilevers 23 are schematically drawn.In the present invention In, the axial direction for defining first elastic cantilever 23 is first direction, in this embodiment, first elastic suspended The axial direction of arm beam 23 is horizontal direction.
The outline border 20 includes a framework 21 and an at least buffer part 22.Each first elastic cantilever 23 with it is described Framework 21 connects.
Each buffer part 22 includes a fixed part 25 and one second elastic cantilever group (not indicating in attached drawing).
The fixed part 25 and the anchor point 30 that is arranged on the substrate substrate (not indicating in attached drawing) of the sensor are solid Fixed connection, the outline border 20 is fixed on the substrate substrate.It blocks since anchor point 30 is fixed portion 25, is used in Fig. 2 Indicate to dotted line anchor point 30.
The second elastic cantilever group includes at least one second elastic cantilever 26.Each second elastic cantilever One end of beam 26 is connect with the fixed part 25, and the other end is connect with the framework 21, and second elastic cantilever 26 is used for The buffer part 22 is elastically connected to the framework 21, the fixed part 25 by 26 elasticity of the second elastic cantilever with The framework 21 connects, and then the outline border 20 is fixed on the anchor point 30.In this embodiment, described second is outstanding Arm beam group includes two the second elastic cantilevers 26, and described two second elastic cantilevers 26 are symmetricly set on the fixed part 25 Both ends, and then the fixed part 25 is elastically connected to the framework 21.
In the present invention, the axial direction for defining every one second elastic cantilever 26 is second direction.Then second elastic suspended The second direction of arm beam 26 is vertical with the first direction of first elastic cantilever 23 with the first elastic cantilever group Every one first elastic cantilever it is axially vertical.Such as in this embodiment, the first direction is horizontal direction, then The second direction is vertical direction.
Under the influence of the encapsulation pressure of sensor in the prior art, in connection internal component 24 and the first bullet of outline border 20 Property cantilever beam 23 on can generate an axial force, the rigidity of the first elastic cantilever 23 can change, thus change first elasticity The working frequency of cantilever beam 23, and then influence the detection accuracy of sensor.Buffer part 22 is arranged in the present invention on the outline border 20. The buffer part 22 have one and first elastic cantilever 23 the second axially vertical elastic cantilever 26, when the sensor When being influenced by encapsulation pressure, second elastic cantilever 26 can offset encapsulation pressure by itself Flexible change Influence keep the working frequency of the first elastic cantilever 23 so that the rigidity of the first elastic cantilever 23 be avoided to change It is constant, improve the detection accuracy of sensor.In this embodiment, the working frequency of first elastic cantilever 23 is Refer to the driving frequency of the first elastic cantilever 23.
Preferably, the outline border 20 includes two symmetrically arranged buffer parts 22, with further counteracting encapsulation pressure to biography The influence of sensor.Preferably, the side of the outline border 20 towards the fixed part 25 is provided with a recess 27, the recess 27 with For accommodating second elastic cantilever 26, second elastic cantilever 26 and the framework 21 of 27 bottoms of the recess connect It connects, further to save space.The size for exaggerating second elastic cantilever 26 in this embodiment, in practice On, the size of second elastic cantilever 26 can be needed according to the design of real sensor and is adjusted.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art Member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as Protection scope of the present invention.

Claims (3)

1. a kind of sensor, including an outline border and one first elastic cantilever group, every the 1 of the first elastic cantilever group One elastic cantilever both ends are connect with an internal component and the outline border respectively, described outer for the internal component to be connected to Frame, which is characterized in that the outline border includes a framework and an at least buffer part, and each buffer part includes a fixed part and one Second elastic cantilever group, the anchor point that the fixed part is arranged on substrate substrate with one are fixedly connected, second elastic suspended The both ends of every one second elastic cantilever of arm beam group are connect with the fixed part and the framework respectively, are used for the buffering Portion is connected to the framework, the axial direction of every one second elastic cantilever of the second elastic cantilever group and first elasticity Every one first elastic cantilever of cantilever beam group it is axially vertical;Described second elastic overarm group includes two the second elastic cantilevers Beam, the both ends of the fixed part are arranged in described two elastic cantilevers, and described two second elastic cantilevers are along its axial direction Direction is symmetrical arranged opposite to each other.
2. sensor according to claim 1, which is characterized in that the outline border includes two symmetrically arranged buffer parts.
3. sensor according to claim 1, which is characterized in that the side of the outline border towards the fixed part is provided with One recess, for accommodating second elastic cantilever.
CN201510000425.7A 2015-01-04 2015-01-04 Sensor Active CN105819390B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510000425.7A CN105819390B (en) 2015-01-04 2015-01-04 Sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510000425.7A CN105819390B (en) 2015-01-04 2015-01-04 Sensor

Publications (2)

Publication Number Publication Date
CN105819390A CN105819390A (en) 2016-08-03
CN105819390B true CN105819390B (en) 2019-05-21

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8555719B2 (en) * 2011-01-24 2013-10-15 Freescale Semiconductor, Inc. MEMS sensor with folded torsion springs
US8710597B1 (en) * 2010-04-21 2014-04-29 MCube Inc. Method and structure for adding mass with stress isolation to MEMS structures
CN103797331A (en) * 2011-09-16 2014-05-14 因文森斯公司 Micromachined gyroscope including guided mass system
EP2811260A1 (en) * 2013-06-07 2014-12-10 MCube, Inc. Method and structure of an integrated mems inertial sensor device using electrostatic quadrature-cancellation

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9097524B2 (en) * 2009-09-11 2015-08-04 Invensense, Inc. MEMS device with improved spring system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8710597B1 (en) * 2010-04-21 2014-04-29 MCube Inc. Method and structure for adding mass with stress isolation to MEMS structures
US8555719B2 (en) * 2011-01-24 2013-10-15 Freescale Semiconductor, Inc. MEMS sensor with folded torsion springs
CN103797331A (en) * 2011-09-16 2014-05-14 因文森斯公司 Micromachined gyroscope including guided mass system
EP2811260A1 (en) * 2013-06-07 2014-12-10 MCube, Inc. Method and structure of an integrated mems inertial sensor device using electrostatic quadrature-cancellation

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Address after: 200000 room 307, floor 3, No. 1328, Dingxi Road, Changning District, Shanghai

Patentee after: Shanghai Sirui Technology Co.,Ltd.

Address before: 201815 room 3157, building 3, No. 1368, Xingxian Road, Jiading District, Shanghai

Patentee before: Shanghai Silicon Technology Co.,Ltd.