CN105778582A - High-heat-conductivity heat-radiating nano composite coating - Google Patents
High-heat-conductivity heat-radiating nano composite coating Download PDFInfo
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- CN105778582A CN105778582A CN201610160059.6A CN201610160059A CN105778582A CN 105778582 A CN105778582 A CN 105778582A CN 201610160059 A CN201610160059 A CN 201610160059A CN 105778582 A CN105778582 A CN 105778582A
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- 238000000576 coating method Methods 0.000 title claims abstract description 17
- 239000011248 coating agent Substances 0.000 title claims abstract description 16
- 239000002114 nanocomposite Substances 0.000 title claims abstract description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000945 filler Substances 0.000 claims abstract description 11
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000002131 composite material Substances 0.000 claims abstract description 10
- 229920001903 high density polyethylene Polymers 0.000 claims abstract description 9
- 239000004700 high-density polyethylene Substances 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000001816 cooling Methods 0.000 claims abstract description 7
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims abstract description 5
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims abstract description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000839 emulsion Substances 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims abstract description 5
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims abstract description 5
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims abstract description 5
- JUWGUJSXVOBPHP-UHFFFAOYSA-B titanium(4+);tetraphosphate Chemical compound [Ti+4].[Ti+4].[Ti+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O JUWGUJSXVOBPHP-UHFFFAOYSA-B 0.000 claims abstract description 5
- 230000005855 radiation Effects 0.000 claims description 27
- 229910017083 AlN Inorganic materials 0.000 claims description 8
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 8
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 8
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Substances [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 8
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 8
- 229920000058 polyacrylate Polymers 0.000 claims description 8
- 229910000077 silane Inorganic materials 0.000 claims description 8
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 6
- 239000002105 nanoparticle Substances 0.000 claims description 6
- 125000005396 acrylic acid ester group Chemical group 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 4
- 102100023116 Sodium/nucleoside cotransporter 1 Human genes 0.000 claims description 3
- 101710123675 Sodium/nucleoside cotransporter 1 Proteins 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- 239000002041 carbon nanotube Substances 0.000 abstract 1
- 229910021393 carbon nanotube Inorganic materials 0.000 abstract 1
- 238000009472 formulation Methods 0.000 abstract 1
- 102100021470 Solute carrier family 28 member 3 Human genes 0.000 description 1
- 101710186856 Solute carrier family 28 member 3 Proteins 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Paints Or Removers (AREA)
Abstract
The invention discloses a high-heat-conductivity heat-radiating nano composite coating which comprises, by weight, 50-60 parts of nano alumina sol, 30-40 parts of high-density polyethylene, 1-3 parts of carbon nano tube, 5-10 parts of titanium phosphate, 10-15 parts of composite filler, 2-3 parts of polyvinylpyrrolidone, 5-9 parts of methyl methacrylate, 2-5 parts of ethyl acetate, 10-15 parts of isopropanol, 5-8 parts of acrylate emulsion, 3-5 parts of nano copper powder and 1-3 parts of triethanolamine. Through reasonable formulation designing, the composite coating has excellent adhesiveness and coating hardness, is efficient in heat radiating after being coated on the surface of an electronic device and is conducive to guiding out heat generated by the electronic device timely and efficiently, so that heat radiating rate is increased, cooling effect is improved, and the composite coating has excellent comprehensive performance and wide market prospect.
Description
Technical field
The present invention relates to paint field, particularly relate to a kind of high heat conduction and heat radiation nano composite dope.
Background technology
Development along with electron trade, electronic original part constantly develops towards miniaturization and the direction that runs up, components and parts raw heat in use also gradually steps up, therefore, one of heat dissipation problem technical bottleneck becoming restriction electron trade development improving or increasing electronic devices and components, excellent radiating effect is to ensure that the powerful guarantee that electronic product efficiently and accurately runs.
Traditional heat-dissipating mode includes at heat-generating electronic elements back side closed assembly fin and installs electronic fan additional, but two ways all can largely increase the volume of electronic product, thus the requirement of the microminiaturization of current electronic device, miniaturization and precise treatment cannot be met.
Heat radiation coating is the wide variety of radiating mode of current industry.But there are the following problems for existing heat radiation coating: 1, heat conductivility is relatively poor;2, tackness is not enough.
Summary of the invention
The technical problem that present invention mainly solves is to provide a kind of high heat conduction and heat radiation nano composite dope, it is possible to solve the problems referred to above that existing heat radiation coating exists.
For solving above-mentioned technical problem, the technical scheme that the present invention adopts is: provide a kind of high heat conduction and heat radiation composite coating, including following parts by weight of component: nano alumina sol 50~60 parts, high density polyethylene (HDPE) 30~40 parts, CNT 1~3 part, titanium phosphate 5~10 parts, compounded mix 10~15 parts, polyvinylpyrrolidone 2~3 parts, methyl methacrylate 5~9 parts, ethyl acetate 2~5 parts, isopropanol 10~15 parts, acrylic acid ester emulsion 5~8 parts, copper nanoparticle 3~5 parts, triethanolamine 1~3 part.
In a preferred embodiment of the present invention, described heat radiation filler includes following parts by weight of component: aluminium nitride 5~7 parts, carborundum 4~6 parts, nano-calcium carbonate 10~13 parts, pyrophillite 13~25 parts, butyl polyacrylate 0.5~1.5 part and silane coupler 5~10 parts.
In a preferred embodiment of the present invention, the preparation method of described heat radiation filler is: above-mentioned pyrophillite is calcined 1.5~2h at 550~580 DEG C, the aluminium nitride of formula ratio, carborundum, nano-calcium carbonate and silane coupler mixed grinding 1~3h after discharging cooling, it is subsequently adding the butyl polyacrylate of formula ratio, mixed at high speed grinds 10~30min under certain condition, obtains described heat radiation filler after drying.
In a preferred embodiment of the present invention, the condition of described mixed grinding is: temperature 50~55 DEG C, rotating speed 1800~2200r/min;Described drying condition is: vacuum 0.01~0.03MPa, 70~80 DEG C, 1~3h.
In a preferred embodiment of the present invention, the caliber 10~13nm of described CNT, length 5~10um, monolayer.
In a preferred embodiment of the present invention, the particle diameter of described copper nanoparticle is 10~50nm.
The invention has the beneficial effects as follows: a kind of high heat conduction and heat radiation composite coating of the present invention, designed by rational formula, composite coating is made to have adhesive performance and the film hardness of excellence, after it is coated in electronic devices and components surface, while high efficiency and heat radiation, additionally aiding the heat by electronic devices and components produce derives in time efficiently, thus adding rate of heat dispation, improve radiating and cooling effect, excellent combination property, wide market.
Detailed description of the invention
Below presently preferred embodiments of the present invention is described in detail, so that advantages and features of the invention can be easier to be readily appreciated by one skilled in the art, thus protection scope of the present invention being made apparent clear and definite defining.
The embodiment of the present invention includes:
Embodiment 1
A kind of high heat conduction and heat radiation composite coating, including following parts by weight of component: nano alumina sol 50 parts, high density polyethylene (HDPE) 30 parts, CNT 1 part, titanium phosphate 5 parts, compounded mix 10 parts, polyvinylpyrrolidone 2 parts, methyl methacrylate 5 parts, ethyl acetate 2 parts, isopropanol 10 parts, acrylic acid ester emulsion 5 parts, particle diameter are the copper nanoparticle 3 parts of 10~50nm, triethanolamine 1 part, wherein, described CNT is single layer structure, its caliber 10~13nm, length 5~10um.
Described heat radiation filler includes following parts by weight of component: aluminium nitride 5 parts, carborundum 4 parts, nano-calcium carbonate 10 parts, pyrophillite 13 parts, butyl polyacrylate 0.5 part and silane coupler 5 parts, its preparation method is: above-mentioned pyrophillite is calcined 1.5h at 550~580 DEG C, the aluminium nitride of formula ratio after discharging cooling, carborundum, nano-calcium carbonate and silane coupler mixed grinding 3h, it is subsequently adding the butyl polyacrylate of formula ratio, at 50~55 DEG C, 30min is ground with the speed mixed at high speed of 1800r/min, being subsequently placed in vacuum is 0.01~0.03MPa, temperature is the drying oven interior drying 1h of 80 DEG C, obtain described heat radiation filler.
Embodiment 2
A kind of high heat conduction and heat radiation composite coating, including following parts by weight of component: nano alumina sol 60 parts, high density polyethylene (HDPE) 40 parts, CNT 3 parts, titanium phosphate 10 parts, compounded mix 15 parts, polyvinylpyrrolidone 3 parts, methyl methacrylate 9 parts, ethyl acetate 5 parts, isopropanol 15 parts, acrylic acid ester emulsion 8 parts, particle diameter are the copper nanoparticle 5 parts of 10~50nm, triethanolamine 3 parts.Wherein, described CNT is single layer structure, its caliber 10~13nm, length 5~10um.
Described heat radiation filler includes following parts by weight of component: aluminium nitride 7 parts, carborundum 6 parts, nano-calcium carbonate 13 parts, pyrophillite 25 parts, butyl polyacrylate 1.5 parts and silane coupler 10 parts, its preparation method is: above-mentioned pyrophillite is calcined 2h at 550~580 DEG C, the aluminium nitride of formula ratio after discharging cooling, carborundum, nano-calcium carbonate and silane coupler mixed grinding 1h, it is subsequently adding the butyl polyacrylate of formula ratio, at 50~55 DEG C, 10min is ground with the speed mixed at high speed of 2200r/min, being subsequently placed in vacuum is 0.01~0.03MPa, temperature is the drying oven interior drying 3h of 70 DEG C, obtain described heat radiation filler.
Above-mentioned composite coating, the flat appearance of film is smooth, and without shrinkage cavity and pin-hole phenomena, the test of 2H hardness pencil is without scratching, and the initial viscosity under room temperature is 315Pa s.When coating thickness is 39 μm, the cooling temperature difference of thermal dispersant coatings is maximum, is 14.5 DEG C.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure utilizing description of the present invention to make or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical fields, all in like manner include in the scope of patent protection of the present invention.
Claims (6)
1. one kind high heat conduction and heat radiation composite coating, it is characterized in that, including following parts by weight of component: nano alumina sol 50~60 parts, high density polyethylene (HDPE) 30~40 parts, CNT 1~3 part, titanium phosphate 5~10 parts, compounded mix 10~15 parts, polyvinylpyrrolidone 2~3 parts, methyl methacrylate 5~9 parts, ethyl acetate 2~5 parts, isopropanol 10~15 parts, acrylic acid ester emulsion 5~8 parts, copper nanoparticle 3~5 parts, triethanolamine 1~3 part.
2. high heat conduction and heat radiation nano composite dope according to claim 1, it is characterized in that, described heat radiation filler includes following parts by weight of component: aluminium nitride 5~7 parts, carborundum 4~6 parts, nano-calcium carbonate 10~13 parts, pyrophillite 13~25 parts, butyl polyacrylate 0.5~1.5 part and silane coupler 5~10 parts.
3. high heat conduction and heat radiation nano composite dope according to claim 2, it is characterized in that, the preparation method of described heat radiation filler is: above-mentioned pyrophillite is calcined 1.5~2h at 550~580 DEG C, the aluminium nitride of formula ratio, carborundum, nano-calcium carbonate and silane coupler mixed grinding 1~3h after discharging cooling, it is subsequently adding the butyl polyacrylate of formula ratio, mixed at high speed grinds 10~30min under certain condition, obtains described heat radiation filler after drying.
4. high heat conduction and heat radiation nano composite dope according to claim 3, it is characterised in that the condition of described mixed grinding is: temperature 50~55 DEG C, rotating speed 1800~2200r/min;Described drying condition is: vacuum 0.01~0.03MPa, 70~80 DEG C, 1~3h.
5. high heat conduction and heat radiation nano composite dope according to claim 1, it is characterised in that the caliber 10~13nm of described CNT, length 5~10um, monolayer.
6. high heat conduction and heat radiation nano composite dope according to claim 1, it is characterised in that the particle diameter of described copper nanoparticle is 10~50nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610160059.6A CN105778582A (en) | 2016-03-21 | 2016-03-21 | High-heat-conductivity heat-radiating nano composite coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610160059.6A CN105778582A (en) | 2016-03-21 | 2016-03-21 | High-heat-conductivity heat-radiating nano composite coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105778582A true CN105778582A (en) | 2016-07-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610160059.6A Pending CN105778582A (en) | 2016-03-21 | 2016-03-21 | High-heat-conductivity heat-radiating nano composite coating |
Country Status (1)
| Country | Link |
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| CN (1) | CN105778582A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106519757A (en) * | 2016-11-21 | 2017-03-22 | 郑州源冉生物技术有限公司 | Thermal conductive coating for heat dissipation of electronic device |
| CN109216548A (en) * | 2018-10-22 | 2019-01-15 | 东莞理工学院 | A kind of blade coating preparation method of perovskite solar cell |
| CN111440493A (en) * | 2019-12-24 | 2020-07-24 | 宁波激智科技股份有限公司 | Heat-conducting antistatic coating liquid and heat-conducting antistatic silver reflective film |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6166123A (en) * | 1997-10-07 | 2000-12-26 | H. B. Fuller Company | Reflective composition of particles with resinous binder and process for preparing same |
| CN103756432A (en) * | 2014-01-15 | 2014-04-30 | 芜湖市宝艺游乐科技设备有限公司 | A New Type of High Thermal Conductivity and Heat Dissipation Coating |
| CN103965672A (en) * | 2014-05-19 | 2014-08-06 | 宁波市爱使电器有限公司 | Paint with strong adhesion for cooling surface for LED (light emitting diode) radiator |
| CN103965671A (en) * | 2014-05-19 | 2014-08-06 | 宁波市爱使电器有限公司 | Coating for cooling surface of light-emitting diode (LED) radiator |
| CN105111846A (en) * | 2015-08-14 | 2015-12-02 | 安徽艳阳电气集团有限公司 | Polyethylene and epoxy resin compound led radiating coating and preparation method therefor |
-
2016
- 2016-03-21 CN CN201610160059.6A patent/CN105778582A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6166123A (en) * | 1997-10-07 | 2000-12-26 | H. B. Fuller Company | Reflective composition of particles with resinous binder and process for preparing same |
| CN103756432A (en) * | 2014-01-15 | 2014-04-30 | 芜湖市宝艺游乐科技设备有限公司 | A New Type of High Thermal Conductivity and Heat Dissipation Coating |
| CN103965672A (en) * | 2014-05-19 | 2014-08-06 | 宁波市爱使电器有限公司 | Paint with strong adhesion for cooling surface for LED (light emitting diode) radiator |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106519757A (en) * | 2016-11-21 | 2017-03-22 | 郑州源冉生物技术有限公司 | Thermal conductive coating for heat dissipation of electronic device |
| CN109216548A (en) * | 2018-10-22 | 2019-01-15 | 东莞理工学院 | A kind of blade coating preparation method of perovskite solar cell |
| CN111440493A (en) * | 2019-12-24 | 2020-07-24 | 宁波激智科技股份有限公司 | Heat-conducting antistatic coating liquid and heat-conducting antistatic silver reflective film |
| CN111440493B (en) * | 2019-12-24 | 2021-10-26 | 宁波激智科技股份有限公司 | Heat-conducting antistatic coating liquid and heat-conducting antistatic silver reflective film |
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Application publication date: 20160720 |