CN105499079A - Calculating method for glue spreading amount of solvent-free compound machine - Google Patents

Abstract

The invention discloses a calculating method for glue spreading amount of a solvent-free compound machine. The calculating method specifically comprises the following steps: calculating a glue layer thickness HR3 on a transfer roller R3; calculating a glue layer thickness HR4 on a glue spraying roller R4 according to the obtained HR3; calculating a material film glue layer thickness HL according to the obtained HR4; calculating mixing density rho AB of glue A and glue B; and calculating material film glue spreading amount GL according to the obtained rho AB and the HL obtained in the step 3. According to the calculating method for glue spreading amount of the solvent-free compound machine disclosed by the invention, reference is provided for finding the glue spreading amount in practical production, so that the calculating method is convenient for production control.

Description

A kind of computational methods of solvent-free composite machine glue-spread

Technical field

The invention belongs to solventless Laminating Technology field, relate to a kind of computational methods of solvent-free composite machine glue-spread.

Background technology

Along with people further improve the requirement of the aspects such as environment, energy-conservation, reduction of discharging, environmental protection, in the realization of packaging field combination process, solvent-free combination process will more and more be widely used.Solventless Laminating Technology is as the very fast development steadily at present of a kind of package compound technology that is safe, that replace solvent type adhesive.Increasing packaging material producer tends to adopt solventless Laminating Technology in the world, to eliminate the pollution problem caused due to solvent volatilization.Solvent-free composite machine adopts five roller coating units, by the speed difference between each roller, glue is transferred on material film, glue-spread with determine metering roll R1, the gap of dynamic metering roll R2 roller and dynamic metering roll R2, glue spreader R3 roller speed difference relevant, the general relation adopting the method for test to obtain glue-spread and each parameter, and the corresponding table be supplied between client's glue-spread with each parameter, when glue brand switching, after density or the glue rate of transform change, there is certain difference in actual glue-spread and form, brings certain inconvenience to client in the selection of actual glue-spread.

Summary of the invention

The object of this invention is to provide a kind of computational methods of solvent-free composite machine glue-spread, theoretical glue-spread can be calculated according to the relevant parameter of setting, the reference value of glue-spread is provided, solves the problem of making troubles to the selection of actual glue-spread due to glue Parameters variation.

The technical solution adopted in the present invention is, a kind of computational methods of solvent-free composite machine glue-spread, specifically comprise the following steps:

Step 1, calculates the bondline thickness H on transferring roller R3 _r3;

Step 2, according to the H of step 1 gained _r3calculate the bondline thickness H on glue spreader R4 _r4;

Step 3, according to the H of step 2 gained _r4calculate material film bondline thickness H _l;

Step 4, calculates the hybrid density ρ of A glue and B glue _aB;

Step 5, according to the ρ of step 4 gained _aBwith the H of step 3 gained _lcalculate material film glue-spread G _l.

Feature of the present invention is also,

Wherein the detailed process of step 1 is: calculate the bondline thickness on transferring roller R3 by following formula (1)

$H_{R3}=C\×\frac{T_{R2/R3}}{100}\×\frac{{\mathrm{LS}}_{R2/R3}}{100}=\frac{C\×T_{R2/R3}\×{\mathrm{LS}}_{R2/R3}}{10000}---\left(1\right);$

Wherein, C determines the adjusting play between metering roll R1 and dynamic metering roll R2, unit μm; R ₂for the roller footpath of dynamic metering roll R2, unit mm; R ₃for the roller footpath of transferring roller R3, unit mm; T _r2/R3for the glue rate of transform between dynamic metering roll R2 and transferring roller R3; LS _r2/R3for the linear velocity ratio between dynamic metering roll R2 and transferring roller R3.

The scope of wherein determining the adjusting play C between metering roll R1 and dynamic metering roll R2 is 80 μm ~ 100 μm; Dynamic glue rate of transform T between metering roll R2 and transferring roller R3 _r2/R3scope be 85% ~ 98%; Metering roll R2 compares LS with the linear velocity of transferring roller R3 _r2/R3be 8% ~ 20%.

Wherein the detailed process of step 2 is: calculate the bondline thickness on glue spreader R4 by following formula (2)

$H_{R4}=H_{R3}\×\frac{T_{R3/R4}}{100}\×\frac{{\mathrm{LS}}_{R3/R4}}{100}=\frac{H_{R3}\×T_{R3/R4}\×{\mathrm{LS}}_{R3/R4}}{10000}---\left(2\right);$

Wherein, T _r3/R4for the glue rate of transform between transferring roller R3 and glue spreader R4; LS _r3/R4for transferring roller R3 and the linear velocity ratio of glue spreader R4, R ₄for the roller footpath of glue spreader R4, unit mm.

Glue rate of transform T wherein between transferring roller R3 and glue spreader R4 _r3/R4scope be 85% ~ 98%, transferring roller R3 compares LS with the linear velocity of glue spreader R4 _r3/R4scope be 10% ~ 40%.

Wherein the detailed process of step 3 is: calculate material film bondline thickness according to following formula (3)

$H_L=H_{R4}\×\frac{T_{R4/L}}{100}=\frac{H_{R4}\×T_{R4/L}}{100}---\left(3\right);$

Wherein, T _r4/Lfor the glue rate of transform between glue spreader R4 and material film.

Glue rate of transform T wherein between glue spreader R4 and material film _r4/Lscope be 85% ~ 98%.

The detailed process of step 4 is: the hybrid density being calculated A glue and B glue by following formula (4)

${\mathrm{\ρ}}_{AB}=\frac{G_{B/A}+100}{\frac{100}{{\mathrm{\ρ}}_A}+\frac{G_{B/A}}{{\mathrm{\ρ}}_B}}---\left(4\right);$

Wherein, ρ _afor the density of A glue, unit g/cm ³; ρ _bfor the density of B glue, unit g/cm ³; G _b/Afor the weight proportion of B glue and A glue.

Wherein the detailed process of step 5 is: calculate material film glue-spread according to following formula (5)

G _L＝ρ _AB×H _L(5)。

The invention has the beneficial effects as follows, the computational methods of the theoretical glue-spread of the solvent-free composite machine proposed in the present invention, reference frame is provided to glue-spread in actual production, by the actual glue-spread relevant parameter that scene is applied, based on the glue-spread calculated, find out the consistent relationship of the glue-spread in actual production, facilitate production control.

Accompanying drawing explanation

Fig. 1 is solvent-free composite machine five roller coat glue cellular construction schematic diagram.

Detailed description of the invention

Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.

Fig. 1 is solvent-free composite machine coating unit structural representation.Wherein, R1 is for determining metering roll (steel rider), R2 for moving metering roll (steel rider), and R3 is transferring roller (rubber roll), and R4 is glue spreader (steel rider), and R5 is gluing pressure roller (rubber roll).Gap between adjustment R1 roller and R2 roller, forms glue groove between two rollers, solvent-free glue is stored in this glue groove after mixing.When working properly, R1 roller transfixion, R2 roller rotates counterclockwise, and by gap, glue-line is coated onto R2 body surface; R3 roller rotates clockwise, and it is poor that R3 roller and R2 roller adjust speed, and R3 roller linear resonance surface velocity is more a lot of soon than R2 roller linear resonance surface velocity, and, pressure poor by the speed of two rollers is coated to R3 body surface uniformly glue; Same R4 roller rotates counterclockwise, and by speed difference, glue is coated to R4 body surface; R5 is passive rubber roll, combined pressure during normal work, allows and expects film and R4 body of roll close contact, by pressure, glue is transferred to material film coated face completely from the R4 body of roll.

The computational methods of a kind of solvent-free composite machine glue-spread of the present invention, specifically comprise the following steps:

Step 1, calculates the bondline thickness H on transferring roller R3 _r3, unit μm;

Detailed process is: calculate the bondline thickness on transferring roller R3 by following formula (1)

$H_{R3}=C\×\frac{T_{R2/R3}}{100}\×\frac{{\mathrm{LS}}_{R2/R3}}{100}=\frac{C\×T_{R2/R3}\×{\mathrm{LS}}_{R2/R3}}{10000}---\left(1\right);$

Wherein, C determines the adjusting play between metering roll R1 and dynamic metering roll R2, and number range is 80 μm ~ 100 μm; R ₂for the roller footpath of dynamic metering roll R2, unit mm; R ₃for the roller footpath of transferring roller R3, unit mm; LS _r2/R3for the linear velocity ratio between dynamic metering roll R2 and transferring roller R3, number range is 8% ~ 20%; T _r2/R3for the glue rate of transform between dynamic metering roll R2 and transferring roller R3, number range is 85% ~ 98%.

Step 2, according to the H of step 1 gained _r3calculate the bondline thickness H on glue spreader R4 _r4, unit μm;

Detailed process is: calculate the bondline thickness on glue spreader R4 by following formula (2)

$H_{R4}=H_{R3}\×\frac{T_{R3/R4}}{100}\×\frac{{\mathrm{LS}}_{R3/R4}}{100}=\frac{H_{R3}\×T_{R3/R4}\×{\mathrm{LS}}_{R3/R4}}{10000}---\left(2\right);$

Wherein, T _r3/R4for the glue rate of transform between transferring roller R3 and glue spreader R4, number range is 85% ~ 98%; LS _r3/R4for transferring roller R3 and the linear velocity ratio (linear velocity is LineSpeed) of glue spreader R4, number range is 10% ~ 40%; R ₄for the roller footpath of glue spreader R4, unit mm.

Step 3, according to the H of step 2 gained _r4calculate material film bondline thickness H _l, unit μm;

Detailed process is: calculate material film bondline thickness according to following formula (3)

$H_L=H_{R4}\×\frac{T_{R4/L}}{100}=\frac{H_{R4}\×T_{R4/L}}{100}---\left(3\right);$

Wherein, T _r4/Lfor the glue rate of transform between glue spreader R4 and material film, number range is 85% ~ 98%.

Step 4, calculates the hybrid density ρ of A glue and B glue _aB, unit g/cm ³;

Detailed process is: the hybrid density being calculated A glue and B glue by following formula (4)

${\mathrm{\ρ}}_{AB}=\frac{G_{B/A}+100}{\frac{100}{{\mathrm{\ρ}}_A}+\frac{G_{B/A}}{{\mathrm{\ρ}}_B}}---\left(4\right);$

Wherein, ρ _afor the density of A glue, unit g/cm ³; ρ _bfor the density of B glue, unit g/cm ³; G _b/Afor the weight proportion of B glue and A glue.

Step 5, according to the ρ of step 4 gained _aBwith the H of step 3 gained _lcalculate material film glue-spread G _l;

Detailed process is: calculate material film glue-spread according to following formula (5)

G _L＝ρ _AB×H _L(5)。

Known: glue A density p _a, glue B ρ _band the weight proportion G of glue A and glue B _b/A, the volume proportion of glue A and glue B is also calculated by following formula (6)

$V_{B/A}=\frac{\frac{G_{B/A}}{{\mathrm{\ρ}}_B}}{\frac{100}{{\mathrm{\ρ}}_A}}\×100\left(\%\right)---\left(6\right);$

The object calculating volume proportion is that solvent-free glue supplier provides this parameter sometimes, can compare, determining correct mixing ratio parameter further by calculating with the parameter that glue provides.

Known: the roller footpath R of dynamic metering roll R2 ₂, unit mm; The roller footpath R of transferring roller R3 ₃, unit mm; Dynamic glue rate of transform T between metering roll R2 and transferring roller R3 _r2/R3, the rotating ratio set out between metering roll R2 and transferring roller R3 is calculated by following formula (7)

$N_{R2/R3}=\frac{{\mathrm{LS}}_{R2/R3}\×R_3}{R_2}\left(\%\right)---\left(7\right);$

Known: the roller footpath R of transferring roller R3 ₃, unit mm; The roller footpath R of glue spreader R4 ₄, unit mm; Transferring roller R3 compares LS with the linear velocity of glue spreader R4 _r3/R4, calculate the rotating ratio between transferring roller R3 and glue spreader R4 by following formula (8)

$N_{R3/R4}=\frac{{\mathrm{LS}}_{R3/R4}\×R_4}{R_3}\left(\%\right)---\left(8\right).$

Embodiment 1

Step 1, the known adjusting play C determined between metering roll R1 and dynamic metering roll R2 is 80 μm, the roller footpath R of dynamic metering roll R2 ₂for 200mm, the roller footpath R of transferring roller R3 ₃for 160mm, the dynamic glue rate of transform between metering roll R2 and transferring roller R3 is T _r2/R3be 90%, dynamic linear velocity between metering roll R2 and transferring roller R3 compares LS _r2/R3be 10%, calculated the bondline thickness on transferring roller R3 by formula (1)

$H_{R3}=C\×\frac{T_{R2/R3}}{100}\×\frac{{\mathrm{LS}}_{R2/R3}}{100}=\frac{C\×T_{R2/R3}\×{\mathrm{LS}}_{R2/R3}}{10000}=7.2\mathrm{\μ}m;$

Step 2, the glue rate of transform T between known transferring roller R3 and glue spreader R4 _r3/R4be 90%, transferring roller R3 compares LS with the linear velocity of glue spreader R4 _r3/R4be 20%, the roller footpath R of glue spreader R4 ₄for 200mm, the bondline thickness H on the transferring roller R3 of integrating step 1 gained _r3, calculate the bondline thickness on glue spreader R4 by formula (2)

$H_{R4}=H_{R3}\×\frac{T_{R3/R4}}{100}\×\frac{{\mathrm{LS}}_{R3/R4}}{100}=\frac{H_{R3}\×T_{R3/R4}\×{\mathrm{LS}}_{R3/R4}}{10000}=1.296\mathrm{\μ}m;$

Step 3, the glue rate of transform T between known glue spreader R4 and material film _r4/Lbe 90%, the bondline thickness H on the glue spreader R4 of integrating step 2 gained _r4, calculate discharging film bondline thickness by formula (3)

$H_L=H_{R4}\×\frac{T_{R4/L}}{100}=\frac{H_{R4}\×T_{R4/L}}{100}=1.166\mathrm{\μ}m;$

Step 4, the density p of known A glue _ait is the density p of 1.103, B glue _bbe 0.96, the weight proportion of glue A and glue B is 50%, is calculated the hybrid density ρ of A glue and B glue by formula (4) _aB

${\mathrm{\ρ}}_{AB}=\frac{G_{B/A}+100}{\frac{100}{{\mathrm{\ρ}}_A}+\frac{G_{B/A}}{{\mathrm{\ρ}}_B}}=1.051g/cm3;$

Step 5, according to the A glue of step 4 gained and the hybrid density ρ of B glue _aBand the paint film bondline thickness H of step 3 gained _l, calculate discharging film glue-spread by formula (5)

G _L＝ρ _AB×H _L＝1.226g/m ²。

Embodiment 2

Step 1, the known adjusting play C determined between metering roll R1 and dynamic metering roll R2 is 80 μm, the roller footpath R of dynamic metering roll R2 ₂for 200mm, the roller footpath R of transferring roller R3 ₃for 160mm, the dynamic glue rate of transform between metering roll R2 and transferring roller R3 is T _r2/R3be 90%, dynamic linear velocity between metering roll R2 and transferring roller R3 compares LS _r2/R3be 10%, calculated the bondline thickness on transferring roller R3 by formula (1)

$H_{R3}=C\×\frac{T_{R2/R3}}{100}\×\frac{{\mathrm{LS}}_{R2/R3}}{100}=\frac{C\×T_{R2/R3}\×{\mathrm{LS}}_{R2/R3}}{10000}=7.2\mathrm{\μ}m;$

Step 2, the glue rate of transform T between known transferring roller R3 and glue spreader R4 _r3/R4be 90%, transferring roller R3 compares LS with the linear velocity of glue spreader R4 _r3/R4be 30%, the roller footpath R of glue spreader R4 ₄for 200mm, the bondline thickness H on the transferring roller R3 of integrating step 1 gained _r3, calculate the bondline thickness on glue spreader R4 by formula (2)

$H_{R4}=H_{R3}\×\frac{T_{R3/R4}}{100}\×\frac{{\mathrm{LS}}_{R3/R4}}{100}=\frac{H_{R3}\×T_{R3/R4}\×{\mathrm{LS}}_{R3/R4}}{10000}=1.944\mathrm{\μ}m;$

Step 3, the glue rate of transform T between known glue spreader R4 and material film _r4/Lbe 90%, the bondline thickness H on the glue spreader R4 of integrating step 2 gained _r4, calculate discharging film bondline thickness by formula (3)

$H_L=H_{R4}\×\frac{T_{R4/L}}{100}=\frac{H_{R4}\×T_{R4/L}}{100}=1.750\mathrm{\μ}m;$

Step 4, the density p of known A glue _ait is the density p of 1.13, B glue _bbe 0.98, the weight proportion of glue A and glue B is 65%, is calculated the hybrid density ρ of A glue and B glue by formula (4) _aB

${\mathrm{\ρ}}_{AB}=\frac{G_{B/A}+100}{\frac{100}{{\mathrm{\ρ}}_A}+\frac{G_{B/A}}{{\mathrm{\ρ}}_B}}=1.066g/cm3;$

Step 5, according to the A glue of step 4 gained and the hybrid density ρ of B glue _aBand the paint film bondline thickness H of step 3 gained _l, calculate discharging film glue-spread by formula (5)

G _L＝ρ _AB×H _L＝1.865g/m ²。

The result of glue-spread is calculated by the given two groups of different parameters of above two embodiments, embodiment 1 is change glue brand with the difference of embodiment 2, the weight proportion of the density that glue is corresponding, A glue and B glue, R transferring roller R3 and the linear velocity of glue spreader R4 are than also changing in addition.As can be seen from two groups of data, by algorithm of the present invention, can see that different parameters changes the change of rear glue-spread, to providing theoretic support during actual production very intuitively.

If in actual production, the glue-spread of needs is certain, can first by the method in the present invention, in conjunction with actual relevant parameter, calculate theoretical glue-spread, more theoretical glue-spread and the difference implementing required gluing, corresponding adjustment relevant parameter, can finally reach required glue-spread, if there is no method in the present invention as some theoretical reference foundations, then need to measure one by one in actual production, test, so, if after glue Parameters variation, the selection of actual glue-spread then extremely bothers.

In sum, instant invention overcomes prior art glue-spread can only rely on actual test to obtain, support without glue-spread theory calculate that is effective, complete, system, the invention provides computational methods, shown by man-machine interface, change parameter very easily, intuitive display, human-computer interaction function is friendly, has huge application value.

Claims (9)

1. computational methods for solvent-free composite machine glue-spread, is characterized in that: specifically comprise the following steps:

Step 1, calculates the bondline thickness H on transferring roller R3 _r3;

Step 2, according to the H of step 1 gained _r3calculate the bondline thickness H on glue spreader R4 _r4;

Step 3, according to the H of step 2 gained _r4calculate material film bondline thickness H _l;

Step 4, calculates the hybrid density ρ of A glue and B glue _aB;

Step 5, according to the ρ of step 4 gained _aBwith the H of step 3 gained _lcalculate material film glue-spread G _l.

2. the computational methods of a kind of solvent-free composite machine glue-spread according to claim 1, is characterized in that: the detailed process of described step 1 is: calculate the bondline thickness on transferring roller R3 by following formula (1)

$H_{R3}=C\×\frac{T_{R2/R3}}{100}\×\frac{{\mathrm{LS}}_{R2/R3}}{100}=\frac{C\×T_{R2/R3}\×{\mathrm{LS}}_{R2/R3}}{10000}---\left(1\right);$

Wherein, C determines the adjusting play between metering roll R1 and dynamic metering roll R2, unit μm; R ₂for the roller footpath of dynamic metering roll R2, unit mm; R ₃for the roller footpath of transferring roller R3, unit mm; T _r2/R3for the glue rate of transform between dynamic metering roll R2 and transferring roller R3; LS _r2/R3for the linear velocity ratio between dynamic metering roll R2 and transferring roller R3.

3. the computational methods of a kind of solvent-free composite machine glue-spread stated according to claim 2, is characterized in that: described scope of determining adjusting play C between metering roll R1 and dynamic metering roll R2 is 80 μm ~ 100 μm; Dynamic glue rate of transform T between metering roll R2 and transferring roller R3 _r2/R3scope be 85% ~ 98%; Metering roll R2 compares LS with the linear velocity of transferring roller R3 _r2/R3be 8% ~ 20%.

4. the computational methods of a kind of solvent-free composite machine glue-spread according to claim 2, is characterized in that: the detailed process of described step 2 is: calculate the bondline thickness on glue spreader R4 by following formula (2)

$H_{R4}=H_{R3}\×\frac{T_{R3/R4}}{100}\×\frac{{\mathrm{LS}}_{R3/R4}}{100}=\frac{H_{R3}\×T_{R3/R4}\×{\mathrm{LS}}_{R3/R4}}{10000}---\left(2\right);$

Wherein, T _r3/R4for the glue rate of transform between transferring roller R3 and glue spreader R4; LS _r3/R4for transferring roller R3 and the linear velocity ratio of glue spreader R4; R ₄for the roller footpath of glue spreader R4, unit mm.

5. the computational methods of a kind of solvent-free composite machine glue-spread according to claim 4, is characterized in that: the glue rate of transform T between described transferring roller R3 and glue spreader R4 _r3/R4scope be 85% ~ 98%, transferring roller R3 compares LS with the linear velocity of glue spreader R4 _r3/R4scope be 10% ~ 40%.

6. the computational methods of a kind of solvent-free composite machine glue-spread according to claim 4, is characterized in that: the detailed process of described step 3 is: calculate material film bondline thickness according to following formula (3)

$H_L=H_{R4}\×\frac{T_{R4/L}}{100}=\frac{H_{R4}\×T_{R4/L}}{100}---\left(3\right);$

Wherein, T _r4/Lfor the glue rate of transform between glue spreader R4 and material film.

7. the computational methods of a kind of solvent-free composite machine glue-spread according to claim 6, is characterized in that: the glue rate of transform T between described glue spreader R4 and material film _r4/Lscope be 85% ~ 98%.

8. the computational methods of a kind of solvent-free composite machine glue-spread according to claim 6, is characterized in that: the detailed process of described step 4 is: the hybrid density being calculated A glue and B glue by following formula (4)

${\mathrm{\ρ}}_{AB}=\frac{G_{B/A}+100}{\frac{100}{{\mathrm{\ρ}}_A}+\frac{G_{B/A}}{{\mathrm{\ρ}}_B}}---\left(4\right);$

Wherein, ρ _afor the density of A glue, unit g/cm ³; ρ _bfor the density of B glue, unit g/cm ³; G _b/Afor the weight proportion of B glue and A glue.

9. the computational methods of a kind of solvent-free composite machine glue-spread according to claim 8, is characterized in that: the detailed process of described step 5 is: calculate material film glue-spread according to following formula (5)

G _L＝ρ _AB×H _L(5)。