CN105086836A - Cerium oxide polishing solution and preparation method thereof - Google Patents
Cerium oxide polishing solution and preparation method thereof Download PDFInfo
- Publication number
- CN105086836A CN105086836A CN201510510778.1A CN201510510778A CN105086836A CN 105086836 A CN105086836 A CN 105086836A CN 201510510778 A CN201510510778 A CN 201510510778A CN 105086836 A CN105086836 A CN 105086836A
- Authority
- CN
- China
- Prior art keywords
- parts
- polishing
- cerium oxide
- xanthan gum
- edta
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 79
- 229910000420 cerium oxide Inorganic materials 0.000 title claims abstract description 28
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title claims description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims abstract description 30
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 22
- 239000000725 suspension Substances 0.000 claims abstract description 22
- 229920001285 xanthan gum Polymers 0.000 claims abstract description 18
- 229940082509 xanthan gum Drugs 0.000 claims abstract description 18
- 235000010493 xanthan gum Nutrition 0.000 claims abstract description 18
- 239000000230 xanthan gum Substances 0.000 claims abstract description 18
- 235000019832 sodium triphosphate Nutrition 0.000 claims abstract description 16
- 235000011187 glycerol Nutrition 0.000 claims abstract description 15
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229940048842 sodium xylenesulfonate Drugs 0.000 claims abstract description 13
- QUCDWLYKDRVKMI-UHFFFAOYSA-M sodium;3,4-dimethylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1C QUCDWLYKDRVKMI-UHFFFAOYSA-M 0.000 claims abstract description 13
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 claims abstract description 11
- 238000003756 stirring Methods 0.000 claims description 13
- 239000006185 dispersion Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- -1 poly(oxyethylene glycol) Polymers 0.000 claims description 4
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 101710194948 Protein phosphatase PhpP Proteins 0.000 claims 3
- HWGNBUXHKFFFIH-UHFFFAOYSA-I pentasodium;[oxido(phosphonatooxy)phosphoryl] phosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])(=O)OP([O-])([O-])=O HWGNBUXHKFFFIH-UHFFFAOYSA-I 0.000 claims 3
- 239000002002 slurry Substances 0.000 claims 3
- 229910052708 sodium Inorganic materials 0.000 claims 3
- 239000011734 sodium Substances 0.000 claims 3
- UNXRWKVEANCORM-UHFFFAOYSA-I triphosphate(5-) Chemical compound [O-]P([O-])(=O)OP([O-])(=O)OP([O-])([O-])=O UNXRWKVEANCORM-UHFFFAOYSA-I 0.000 claims 3
- 229960004418 trolamine Drugs 0.000 claims 3
- WMGSQTMJHBYJMQ-UHFFFAOYSA-N aluminum;magnesium;silicate Chemical compound [Mg+2].[Al+3].[O-][Si]([O-])([O-])[O-] WMGSQTMJHBYJMQ-UHFFFAOYSA-N 0.000 claims 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 2
- 229910001051 Magnalium Inorganic materials 0.000 claims 1
- 239000002994 raw material Substances 0.000 claims 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims 1
- 239000000843 powder Substances 0.000 abstract description 18
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 abstract description 11
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 abstract description 10
- 229940068918 polyethylene glycol 400 Drugs 0.000 abstract description 5
- 230000000704 physical effect Effects 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 15
- 238000000227 grinding Methods 0.000 description 9
- 229910052761 rare earth metal Inorganic materials 0.000 description 7
- 239000002202 Polyethylene glycol Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229920001223 polyethylene glycol Polymers 0.000 description 6
- 150000002910 rare earth metals Chemical class 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 239000003082 abrasive agent Substances 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000011550 stock solution Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000005304 optical glass Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000001246 colloidal dispersion Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000000375 suspending agent Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
本发明公开了一种氧化铈抛光液。其主体成分及用量包括:黄原胶0.1-0.3份,三聚磷酸钠0.5-3份,二甲苯磺酸钠3-7份,EDTA-2Na0.1-0.3份,甘油3-7份,聚乙二醇400?2-5份,硅酸镁铝1-3份,硫脲0.1-0.5份,三乙醇胺1-5份,氧化铈抛光粉50-60份,水20-35份。本发明氧化铈抛光液,抛光速度快,抛光精度高,划伤减少,悬浮性能好。本发明抛光液具有较优的化学与物理性能,在工业制品抛光中获得了广泛的应用,在各种光学玻璃器件、电视机显像管、光学眼镜片、示波管、平板玻璃、半导体晶片和金属精密制品等的抛光应用。The invention discloses a cerium oxide polishing liquid. Its main components and dosage include: 0.1-0.3 parts of xanthan gum, 0.5-3 parts of sodium tripolyphosphate, 3-7 parts of sodium xylene sulfonate, 0.1-0.3 parts of EDTA-2Na, 3-7 parts of glycerin, poly Ethylene glycol 400? 2-5 parts, magnesium aluminum silicate 1-3 parts, thiourea 0.1-0.5 parts, triethanolamine 1-5 parts, cerium oxide polishing powder 50-60 parts, water 20-35 parts. The cerium oxide polishing liquid of the invention has high polishing speed, high polishing precision, reduced scratches and good suspension performance. The polishing solution of the present invention has better chemical and physical properties, and has been widely used in the polishing of industrial products. Polishing applications for precision products, etc.
Description
技术领域technical field
本发明涉及一种稀土抛光液,属于研磨抛光领域。The invention relates to a rare earth polishing liquid, which belongs to the field of grinding and polishing.
技术背景technical background
随着稀土工业的发展,稀土抛光粉很快在抛光精密光学仪器方面获得成功。由于稀土抛光粉具有抛光效率高、质量好、污染小等优点,迅速发展成为市场上最受欢迎的精密抛光材料。尤其以氧化铈抛光粉最为优越,由于铈系稀土抛光粉具有较优的化学与物理性能,所以在工业制品抛光中获得了广泛的应用,如在各种光学玻璃器件、电视机显像管、光学眼镜片、示波管、平板玻璃、半导体晶片和金属精密制品等的抛光。为了赋予抛光粉优越的性能,抛光粉在液体介质中的分散性能和悬浮稳定性能是十分重要的影响因素。With the development of the rare earth industry, rare earth polishing powders soon succeeded in polishing precision optical instruments. Due to the advantages of high polishing efficiency, good quality, and low pollution, rare earth polishing powder has rapidly developed into the most popular precision polishing material on the market. In particular, cerium oxide polishing powder is the most superior. Due to the excellent chemical and physical properties of cerium-based rare earth polishing powder, it has been widely used in the polishing of industrial products, such as various optical glass devices, TV picture tubes, and optical glasses. Polishing of wafers, oscilloscope tubes, flat glass, semiconductor wafers and metal precision products. In order to endow the polishing powder with superior performance, the dispersion performance and suspension stability of the polishing powder in the liquid medium are very important influencing factors.
目前市售的抛光液大多采用氧化钛,氧化铁,二氧化硅作为磨料,辅以其他分散助剂得到抛光液,该类抛光液抛光精度低,研磨速度慢,远远满足不了现有生产技术需求。也有少数厂家采用稀土氧化铈作为磨料制成抛光液,但由于分散悬浮性能不佳,离子较易团聚,导致工件划伤,同时由于悬浮清洗性能不好,抛光液磨料损耗快,容易粘附在工件及机台表面,使磨料沉底结块,研磨抛光效率降低。抛光后,工件表面残留抛光粉多,难以清洗,为后段正常生产带来困难。未能达到标准化、系列化,还不能完全满足各种工业领域的抛光要求。因此开发一款研磨抛光效率高,划伤少,分散悬浮稳定性好的氧化铈抛光液具有重要意义。At present, most of the commercially available polishing liquids use titanium oxide, iron oxide, and silicon dioxide as abrasives, supplemented by other dispersing aids to obtain polishing liquids. This type of polishing liquid has low polishing precision and slow grinding speed, which is far from satisfying the existing production technology. need. There are also a few manufacturers who use rare earth cerium oxide as abrasive to make polishing fluid, but due to poor dispersion and suspension performance, ions are easy to agglomerate, resulting in scratches on the workpiece. The surface of the workpiece and the machine will cause the abrasive to sink to the bottom and agglomerate, reducing the efficiency of grinding and polishing. After polishing, there is a lot of polishing powder remaining on the surface of the workpiece, which is difficult to clean, which brings difficulties to the normal production in the later stage. It has failed to achieve standardization and serialization, and cannot fully meet the polishing requirements of various industrial fields. Therefore, it is of great significance to develop a cerium oxide polishing fluid with high grinding and polishing efficiency, less scratches, and good dispersion and suspension stability.
发明内容Contents of the invention
本发明的目的在于克服现有抛光液的诸多弊端,提供一种研磨抛光效率高,划伤少,分散悬浮稳定性好的氧化铈抛光液。The purpose of the present invention is to overcome many disadvantages of the existing polishing liquid, and provide a cerium oxide polishing liquid with high grinding and polishing efficiency, less scratches and good dispersion and suspension stability.
为了实现上述目的,本发明采用如下技术方案:In order to achieve the above object, the present invention adopts the following technical solutions:
一种氧化铈抛光液,其主体成分及用量包括:黄原胶0.1-0.3份,三聚磷酸钠0.5-3份,二甲苯磺酸钠3-7份,EDTA-2Na0.1-0.3份,甘油3-7份,聚乙二醇4002-5份,硅酸镁铝1-3份,硫脲0.1-0.5份,三乙醇胺1-5份,氧化铈抛光粉50-60份,水20-35份。A cerium oxide polishing solution, the main components and dosage of which include: 0.1-0.3 parts of xanthan gum, 0.5-3 parts of sodium tripolyphosphate, 3-7 parts of sodium xylene sulfonate, 0.1-0.3 parts of EDTA-2Na, Glycerin 3-7 parts, polyethylene glycol 4002-5 parts, magnesium aluminum silicate 1-3 parts, thiourea 0.1-0.5 parts, triethanolamine 1-5 parts, cerium oxide polishing powder 50-60 parts, water 20- 35 servings.
本发明采用氧化铈作为抛光液磨料,其主要技术指标为:w(REO)=90%,w(CeO2)=80%~85%;,稀土回收率约95%,平均粒经D501.2-1.8μm,D902.6-2.8μm,D100≤3.2μm。该磨料粒度分布合理,抛光精度高及抛光速度快。晶型完好,耐磨性,流动性及悬浮性俱佳,适用于高速抛光。The present invention adopts cerium oxide as the polishing liquid abrasive material, and its main technical index is: w (REO)=90%, w (CeO2)=80%~85%; The recovery rate of rare earth is about 95%, and the average particle diameter is D501.2- 1.8μm, D902.6-2.8μm, D100≤3.2μm. The abrasive particle size distribution is reasonable, the polishing precision is high and the polishing speed is fast. The crystal form is intact, the wear resistance, fluidity and suspension are excellent, and it is suitable for high-speed polishing.
本发明为了实现抛光液长期的悬浮稳定性,采用黄原胶和硅酸镁铝协同配合来提高悬浮稳定性。黄原胶对不溶性固体具有良好的悬浮作用。黄原胶溶胶分子能形成超结合带状的螺旋共聚体,构成脆弱的类似胶的网状结构,所以能够支持固体颗粒的形态,显示出很强的稳定作用和高悬浮能力。黄原胶水溶液在静态或低的剪切作用下具有高粘度,在高剪切作用下表现为粘度急剧下降,但分子结构不变。而当剪切力消除时,则立即恢复原有的粘度。剪切力和粘度的关系是完全可塑的。黄原胶假塑性非常突出,这种假塑性对稳定悬浮液极为有效。硅酸镁铝在水中可膨胀成胶态分散体具有独特的三维空间链式结构及特殊的针、棒状晶体结构,因而有不同寻常的胶体和吸附性能。以其优异的增稠性、悬浮性、胶体摇融性能。在水介质中形成“卡片宫”式的缔合网络结构,因此将二者结合使用,能够大大提高抛光液的悬浮稳定性,提高了抛光液的稀释比,即使原液稀释10倍以上,也能保持长时间的悬浮。In order to realize the long-term suspension stability of the polishing liquid, the present invention adopts xanthan gum and magnesium aluminum silicate to cooperate to improve the suspension stability. Xanthan gum has a good suspending effect on insoluble solids. Xanthan gum sol molecules can form super-bonded ribbon-shaped helical copolymers, forming a fragile glue-like network structure, so they can support the shape of solid particles, showing strong stabilizing effect and high suspension capacity. Xanthan gum aqueous solution has high viscosity under static or low shearing action, and the viscosity drops sharply under high shearing action, but the molecular structure remains unchanged. And when the shear force is removed, the original viscosity will be restored immediately. The relationship between shear force and viscosity is completely plastic. The pseudoplasticity of xanthan gum is very prominent, and this pseudoplasticity is extremely effective for stabilizing suspensions. Magnesium aluminum silicate can expand into a colloidal dispersion in water, with a unique three-dimensional space chain structure and a special needle and rod crystal structure, so it has unusual colloidal and adsorption properties. With its excellent thickening, suspending, and colloid shake-melt properties. A "card palace"-like association network structure is formed in the water medium, so the combination of the two can greatly improve the suspension stability of the polishing solution and increase the dilution ratio of the polishing solution. Even if the original solution is diluted by more than 10 times, it can also Maintain a long suspension.
本发明为了使磨料分散均匀,离子不团聚,不沉底结块。采用三聚磷酸钠和二甲苯磺酸钠作为分散剂,该分散剂分散效果佳,几乎无泡沫。能够使抛光液在使用过程中长时间分散稳定。机台在循环供液无泡沫外溢,供液系统稳定。In the present invention, the abrasive is uniformly dispersed, the ions are not agglomerated, and the bottom is not agglomerated. Sodium tripolyphosphate and sodium xylene sulfonate are used as dispersants, which have good dispersing effect and almost no foam. It can make the polishing liquid dispersed and stable for a long time during use. There is no foam overflow in the circulating liquid supply of the machine, and the liquid supply system is stable.
本发明为了降低抛光液在使用过程中,机台上的金属铁屑对系统的污染,采用EDTA-2Na作为螯合剂。同时采用硫脲作为缓蚀剂,降低机台的腐蚀,以提高整个抛光过程的稳定性。The present invention adopts EDTA-2Na as the chelating agent in order to reduce the pollution of the metal iron filings on the machine platform to the system during the use of the polishing liquid. At the same time, thiourea is used as a corrosion inhibitor to reduce the corrosion of the machine and improve the stability of the entire polishing process.
本发明加入了甘油,对操作人员直接接触的部位有一定的防护作用,同时甘油的加入是悬浮剂黄原胶分散更加均匀,进一步提高了悬浮稳定性。聚乙二醇400的引入,配合甘油使用,在研磨抛光过程中起到了润滑作用,加快了抛光速度和精度,聚乙二醇400还有一定的清洗作用,有利于抛光后段的抛光粉清洗。The present invention adds glycerin, which has a certain protective effect on the parts directly contacted by operators. At the same time, the addition of glycerin makes the suspension agent xanthan gum disperse more uniformly, and further improves the suspension stability. The introduction of polyethylene glycol 400, used in conjunction with glycerin, plays a lubricating role in the grinding and polishing process, speeding up the polishing speed and precision. Polyethylene glycol 400 also has a certain cleaning effect, which is beneficial to the cleaning of the polishing powder after polishing .
本发明采用三乙醇胺作为增效剂及pH调节剂,能长时间保持系统微碱性,据研究表明,微碱性环境能够提高抛光粉的切削力,加快抛光速度。The present invention uses triethanolamine as a synergist and a pH regulator, which can keep the system slightly alkaline for a long time. According to research, the slightly alkaline environment can increase the cutting force of the polishing powder and accelerate the polishing speed.
所述的抛光液的制备方法,包括如下步骤:The preparation method of described polishing fluid, comprises the steps:
1)将黄原胶用甘油溶解分散,然后加入聚乙二醇400继续搅拌分散备用。1) Dissolve and disperse xanthan gum with glycerin, then add polyethylene glycol 400 to continue stirring and dispersing for later use.
2)用一半量水溶解三聚磷酸钠,二甲苯磺酸钠,EDTA-2Na,硫脲,得溶液备用。2) Dissolve sodium tripolyphosphate, sodium xylene sulfonate, EDTA-2Na, and thiourea with half the amount of water to obtain a solution for later use.
3)用另一半量水溶解分散硅酸镁铝,充分搅拌得到粘稠胶体。3) Use the other half of the amount of water to dissolve and disperse the magnesium aluminum silicate, and stir thoroughly to obtain a viscous colloid.
4)将上述步骤1)2)3)中的所有物料混合均匀,并加入氧化铈充分搅拌分散均匀。4) Mix all the materials in the above steps 1) 2) 3) evenly, and add cerium oxide to fully stir and disperse evenly.
5)向步骤4)中加入三乙醇胺继续搅拌,得到均一的氧化铈悬浮抛光液。5) Add triethanolamine to step 4) and continue stirring to obtain a uniform cerium oxide suspension polishing solution.
本发明为一种氧化铈抛光液,与现有市售抛光液相比具有如下显著优点:The present invention is a kind of cerium oxide polishing liquid, has following remarkable advantage compared with existing commercially available polishing liquid:
1.悬浮分散性能佳,长期保持均一悬浮状态,磨料不团聚,不沉淀结底。1. Excellent suspension and dispersion performance, long-term maintenance of uniform suspension state, no agglomeration of abrasives, no sedimentation and bottoming.
2.抛光效率高,切削力强,表面划伤少,常规抛光机抛光10分钟就能减薄3μm以上。2. The polishing efficiency is high, the cutting force is strong, and the surface is less scratched. The conventional polishing machine can reduce the thickness by more than 3 μm in 10 minutes.
3.抛光液抛光后表面残留少,抛光粉易清洗。3. After polishing, the polishing liquid has little residue on the surface, and the polishing powder is easy to clean.
4.使用寿命长,稀释比例高,该抛光液用去离子水稀释10倍以上仍能保持原使用效果。4. The service life is long and the dilution ratio is high. The polishing liquid can still maintain the original effect after being diluted more than 10 times with deionized water.
具体实施方式Detailed ways
实施例1Example 1
黄原胶0.2份,三聚磷酸钠2份,二甲苯磺酸钠5份,EDTA-2Na0.2份,甘油4份,聚乙二醇4002份,硅酸镁铝2份,硫脲0.3份,三乙醇胺3份,氧化铈抛光粉55份,水26.3份。0.2 parts of xanthan gum, 2 parts of sodium tripolyphosphate, 5 parts of sodium xylene sulfonate, 0.2 parts of EDTA-2Na, 4 parts of glycerin, 4002 parts of polyethylene glycol, 2 parts of magnesium aluminum silicate, 0.3 parts of thiourea , 3 parts of triethanolamine, 55 parts of cerium oxide polishing powder, and 26.3 parts of water.
实施例2Example 2
黄原胶0.1份,三聚磷酸钠3份,二甲苯磺酸钠4份,EDTA-2Na0.1份,甘油3份,聚乙二醇4003份,硅酸镁铝1.5份,硫脲0.1份,三乙醇胺2份,氧化铈抛光粉50份,水33.2份。0.1 part of xanthan gum, 3 parts of sodium tripolyphosphate, 4 parts of sodium xylene sulfonate, 0.1 part of EDTA-2Na, 3 parts of glycerin, 4003 parts of polyethylene glycol, 1.5 parts of magnesium aluminum silicate, 0.1 part of thiourea , 2 parts of triethanolamine, 50 parts of cerium oxide polishing powder, and 33.2 parts of water.
实施例3Example 3
黄原胶0.3份,三聚磷酸钠1份,二甲苯磺酸钠7份,EDTA-2Na0.2份,甘油7份,聚乙二醇4002份,硅酸镁铝1份,硫脲0.2份,三乙醇胺5份,氧化铈抛光粉51份,水25.3份。0.3 parts of xanthan gum, 1 part of sodium tripolyphosphate, 7 parts of sodium xylene sulfonate, 0.2 parts of EDTA-2Na, 7 parts of glycerin, 4002 parts of polyethylene glycol, 1 part of magnesium aluminum silicate, 0.2 parts of thiourea , 5 parts of triethanolamine, 51 parts of cerium oxide polishing powder, and 25.3 parts of water.
实施例4Example 4
黄原胶0.2份,三聚磷酸钠0.5份,二甲苯磺酸钠6份,EDTA-2Na0.3份,甘油4份,聚乙二醇4003份,硅酸镁铝3份,硫脲0.2份,三乙醇胺3份,氧化铈抛光粉53份,水26.8份。0.2 parts of xanthan gum, 0.5 parts of sodium tripolyphosphate, 6 parts of sodium xylene sulfonate, 0.3 parts of EDTA-2Na, 4 parts of glycerin, 4003 parts of polyethylene glycol, 3 parts of magnesium aluminum silicate, 0.2 parts of thiourea , 3 parts of triethanolamine, 53 parts of cerium oxide polishing powder, and 26.8 parts of water.
实施例5Example 5
黄原胶0.2份,三聚磷酸钠3份,二甲苯磺酸钠3份,EDTA-2Na0.2份,甘油5份,聚乙二醇4002份,硅酸镁铝1份,硫脲0.3份,三乙醇胺5份,氧化铈抛光粉60份,水20.3份。0.2 parts of xanthan gum, 3 parts of sodium tripolyphosphate, 3 parts of sodium xylene sulfonate, 0.2 parts of EDTA-2Na, 5 parts of glycerin, 4002 parts of polyethylene glycol, 1 part of magnesium aluminum silicate, 0.3 parts of thiourea , 5 parts of triethanolamine, 60 parts of cerium oxide polishing powder, and 20.3 parts of water.
上述实施例的制备方法:The preparation method of above-mentioned embodiment:
1)将黄原胶用甘油溶解分散,然后加入聚乙二醇400继续搅拌分散备用。1) Dissolve and disperse xanthan gum with glycerin, then add polyethylene glycol 400 to continue stirring and dispersing for later use.
2)用一半量水溶解三聚磷酸钠,二甲苯磺酸钠,EDTA-2Na,硫脲,得溶液备用。2) Dissolve sodium tripolyphosphate, sodium xylene sulfonate, EDTA-2Na, and thiourea with half the amount of water to obtain a solution for later use.
3)用另一半量水溶解分散硅酸镁铝,充分搅拌得到粘稠胶体。3) Use the other half of the amount of water to dissolve and disperse the magnesium aluminum silicate, and stir thoroughly to obtain a viscous colloid.
4)将上述步骤1)2)3)中的所有物料混合均匀,并加入氧化铈充分搅拌分散均匀。4) Mix all the materials in the above steps 1) 2) 3) evenly, and add cerium oxide to fully stir and disperse evenly.
5)向步骤4)中加入三乙醇胺继续搅拌,得到均一的氧化铈悬浮抛光液。5) Add triethanolamine to step 4) and continue stirring to obtain a uniform cerium oxide suspension polishing solution.
上述实施例的使用方法:The usage method of above-mentioned embodiment:
用量杯量取2体积份本发明氧化铈抛光液原液,用8-15体积份去离子水稀释本发明氧化铈抛光液,充分搅拌均匀,用比重计检测稀释液比重,达到核定指标后,加入到研磨抛光机中采用循环泵循坏供液使用。用比重计监控稀释液浓度,当浓度下降到一定指标或者明显感觉研磨抛光效率下降,向供液槽中补加少量原液,继续使用。Measure 2 parts by volume of the cerium oxide polishing solution stock solution of the present invention with a measuring cup, dilute the cerium oxide polishing solution of the present invention with 8-15 parts by volume of deionized water, fully stir evenly, detect the specific gravity of the diluted solution with a hydrometer, and after reaching the approved index, add Use a circulation pump to circulate the liquid supply to the grinding and polishing machine. Use a hydrometer to monitor the concentration of the diluent. When the concentration drops to a certain index or the grinding and polishing efficiency is obviously reduced, add a small amount of stock solution to the liquid supply tank and continue to use it.
为了验证本发明的使用效果,在双面研磨抛光机上对手机盖板玻璃进行效果验证,结果如下:In order to verify the use effect of the present invention, the effect verification is carried out on the mobile phone cover glass on a double-sided grinding and polishing machine, and the results are as follows:
注:原液稳定性评级标准(54℃恒温箱热贮14天):Note: Rating criteria for the stability of the stock solution (14 days of thermal storage in a thermostat at 54°C):
甲级:均一稳定,底部无沉淀结块,上层无析水;Grade A: Uniform and stable, no sedimentation and agglomeration at the bottom, and no water separation in the upper layer;
乙级:均一稳定,底部无明显沉淀,上部轻微析水;Grade B: Uniform and stable, no obvious precipitation at the bottom, slight water separation at the top;
丙级:较稳定,底部轻微结块,上部析出少量水,摇晃能重新分散均匀;Grade C: Relatively stable, slightly agglomerated at the bottom, and a small amount of water precipitates from the upper part, which can be re-dispersed evenly by shaking;
丁级:不稳定,底部结块,磨料和水分层,摇晃不能恢复分散。Grade D: Unstable, agglomerated at the bottom, abrasive and water layers, shaking can not restore the dispersion.
工作液稳定性评级标准(常温静置24h):Working fluid stability rating standard (stand at room temperature for 24 hours):
一级:均一稳定,下层无明显沉淀,上层无析水,轻微摇晃能恢复均一悬浮;Level 1: Uniform and stable, no obvious precipitation in the lower layer, no water separation in the upper layer, uniform suspension can be restored by slight shaking;
二级:较稳定,下层有少量沉淀,上层有轻微析水,摇晃可以恢复均一悬浮;Level 2: relatively stable, with a small amount of precipitation in the lower layer, and slight water separation in the upper layer, and the uniform suspension can be restored by shaking;
三级:下层有较多沉淀,上层较多析水,摇晃能部分恢复悬浮,底部有结块难以再分散悬浮;Level 3: There is more precipitation in the lower layer, more water in the upper layer, the suspension can be partially restored by shaking, and there are agglomerates at the bottom that are difficult to disperse and suspend;
四级:严重分层,底部严重结块,摇晃不能恢复悬浮。Grade 4: Severe stratification, severe caking at the bottom, shaking cannot restore suspension.
减薄厚度采用电子厚度计进行检测。Thinning thickness is detected by electronic thickness gauge.
表面划伤检测采用触摸液晶屏玻璃瑕疵(划痕)自动检测仪进行测定。The surface scratch detection is measured by an automatic detector for glass defects (scratches) on the touch LCD screen.
抛光后清洗难易程度检测为在自动清洗线上针对抛光粉残留及玻璃屑去除难易度,表面洁净度来进行评价。The ease of cleaning after polishing is tested on the automatic cleaning line to evaluate the polishing powder residue, the difficulty of removing glass shavings, and the surface cleanliness.
最后说明的是,以上实施例仅用以说明本发明的技术方案而非限制,尽管参照较佳实施例对本发明进行了详细说明,本领域的普通技术人员应当理解,可以对本发明的技术方案进行修改或者等同替换,而不脱离本发明技术方案的宗旨和范围,其均应涵盖在本发明的权利要求范围当中。Finally, it is noted that the above embodiments are only used to illustrate the technical solutions of the present invention without limitation. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be carried out Modifications or equivalent replacements without departing from the spirit and scope of the technical solution of the present invention shall be covered by the claims of the present invention.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510510778.1A CN105086836A (en) | 2015-08-19 | 2015-08-19 | Cerium oxide polishing solution and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510510778.1A CN105086836A (en) | 2015-08-19 | 2015-08-19 | Cerium oxide polishing solution and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105086836A true CN105086836A (en) | 2015-11-25 |
Family
ID=54568201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510510778.1A Pending CN105086836A (en) | 2015-08-19 | 2015-08-19 | Cerium oxide polishing solution and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105086836A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106584230A (en) * | 2016-09-30 | 2017-04-26 | 惠州市德莱仕科技有限公司 | Glass scratch polishing agent and use method thereof, as well as polishing head for polishing agent |
| CN106867413A (en) * | 2017-02-06 | 2017-06-20 | 包头市金杰稀土纳米材料有限公司 | A kind of high concentration cerium oxide polishing slurry and preparation method thereof |
| RU2624317C1 (en) * | 2016-06-29 | 2017-07-03 | Константин Борисович Голубев | Liquid polishing paste for processing of products based on aluminium |
| CN110499102A (en) * | 2018-05-20 | 2019-11-26 | 深圳市得益达电子科技有限公司 | A kind of cerium oxide liquid suspension polishing liquid for glass polishing |
| CN111718658A (en) * | 2020-07-29 | 2020-09-29 | 江西庞泰环保股份有限公司 | Semiconductor cerium dioxide grinding slurry |
| CN114892174A (en) * | 2022-05-20 | 2022-08-12 | 镇江纳润特高新科技发展有限公司 | Ferrous metal polishing solution with rust removal function and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09143455A (en) * | 1995-09-21 | 1997-06-03 | Mitsubishi Chem Corp | Hard disk substrate polishing composition and polishing method using the same |
| CN1370207A (en) * | 1999-08-13 | 2002-09-18 | 卡伯特微电子公司 | Polishing system and method of its use |
| GB2382818A (en) * | 2001-09-27 | 2003-06-11 | Fujimi Inc | Polishing composition for a magnetic disc substrate and polishing process using the same |
| CN1735671A (en) * | 2002-12-10 | 2006-02-15 | 高级技术材料公司 | Passivating chemical mechanical polishing composition for planarization of copper films |
| CN101367189A (en) * | 2007-08-15 | 2009-02-18 | 江苏海迅实业集团股份有限公司 | Silicon slice glazed surface scuffing control method |
| CN102337084A (en) * | 2011-07-25 | 2012-02-01 | 郑州磨料磨具磨削研究所 | Grinding fluid for processing LED (light-emitting diode) substrate and preparation method thereof |
-
2015
- 2015-08-19 CN CN201510510778.1A patent/CN105086836A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09143455A (en) * | 1995-09-21 | 1997-06-03 | Mitsubishi Chem Corp | Hard disk substrate polishing composition and polishing method using the same |
| CN1370207A (en) * | 1999-08-13 | 2002-09-18 | 卡伯特微电子公司 | Polishing system and method of its use |
| GB2382818A (en) * | 2001-09-27 | 2003-06-11 | Fujimi Inc | Polishing composition for a magnetic disc substrate and polishing process using the same |
| CN1735671A (en) * | 2002-12-10 | 2006-02-15 | 高级技术材料公司 | Passivating chemical mechanical polishing composition for planarization of copper films |
| CN101367189A (en) * | 2007-08-15 | 2009-02-18 | 江苏海迅实业集团股份有限公司 | Silicon slice glazed surface scuffing control method |
| CN102337084A (en) * | 2011-07-25 | 2012-02-01 | 郑州磨料磨具磨削研究所 | Grinding fluid for processing LED (light-emitting diode) substrate and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| R. C. 罗等: "《药用辅料手册》", 31 January 2005, 北京工业出版社 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2624317C1 (en) * | 2016-06-29 | 2017-07-03 | Константин Борисович Голубев | Liquid polishing paste for processing of products based on aluminium |
| CN106584230A (en) * | 2016-09-30 | 2017-04-26 | 惠州市德莱仕科技有限公司 | Glass scratch polishing agent and use method thereof, as well as polishing head for polishing agent |
| CN106867413A (en) * | 2017-02-06 | 2017-06-20 | 包头市金杰稀土纳米材料有限公司 | A kind of high concentration cerium oxide polishing slurry and preparation method thereof |
| CN106867413B (en) * | 2017-02-06 | 2021-06-04 | 包头市杰明纳光电科技有限公司 | High-concentration cerium oxide polishing solution and preparation method thereof |
| CN110499102A (en) * | 2018-05-20 | 2019-11-26 | 深圳市得益达电子科技有限公司 | A kind of cerium oxide liquid suspension polishing liquid for glass polishing |
| CN111718658A (en) * | 2020-07-29 | 2020-09-29 | 江西庞泰环保股份有限公司 | Semiconductor cerium dioxide grinding slurry |
| CN114892174A (en) * | 2022-05-20 | 2022-08-12 | 镇江纳润特高新科技发展有限公司 | Ferrous metal polishing solution with rust removal function and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105086836A (en) | Cerium oxide polishing solution and preparation method thereof | |
| CN109135580B (en) | Polishing solution for glass and preparation method thereof | |
| CN108239484B (en) | Alumina polishing solution for sapphire polishing and preparation method thereof | |
| CN103937414B (en) | Fine polishing solution for computer hard disk substrate | |
| CN106867413B (en) | High-concentration cerium oxide polishing solution and preparation method thereof | |
| JP2019110285A (en) | Cmp polishing liquid, preparation method therefor, and application | |
| CN109929460A (en) | A kind of glass polishing water base cerium oxide polishing slurry and preparation method thereof | |
| CN103992743A (en) | Polishing liquid containing cerium dioxide powder and colloidal silicon dioxide mixed abrasive and its preparation process | |
| CN108587474A (en) | Alumina micro powder polishing solution and preparation method thereof | |
| CN110003798A (en) | A kind of polishing fluid and its preparation method and application | |
| CN107936847A (en) | A kind of optical effect correction high stability Magnetorheologicai polishing liquid and preparation method thereof | |
| CN101368070A (en) | Nano-silicon dioxide abrasive material polishing solution for processing crystallizing glass | |
| CN107523220A (en) | Magnetorheologicai polishing liquid for GaAs polishing and preparation method thereof | |
| CN108559602A (en) | A kind of aqueous diamond wire silicon chip cutting fluid | |
| CN115895452A (en) | Composite polishing liquid and preparation method thereof | |
| CN101781524A (en) | Wafer precise polishing solution | |
| Liu et al. | Angstrom surface with high material removal rate for quartz glass induced by silk dissolved novel green chemical mechanical polishing | |
| CN101781525A (en) | Wafer rough polishing solution | |
| CN102827672A (en) | Cutting liquid and preparation method thereof | |
| CN115386301B (en) | CMP polishing solution for gallium oxide single crystal wafer processing and preparation method thereof | |
| CN106433478A (en) | Magnetic fluid polishing solution suitable for ultra-smooth processing of CaF 2 material and preparation method thereof | |
| CN108822738B (en) | A kind of glass chemical polishing liquid | |
| CN115926747B (en) | Concentrated aqueous grinding aid and preparation method thereof | |
| CN104556061A (en) | Preparation method for modified silicon dioxide colloid | |
| CN106939145B (en) | A kind of water base lapping liquid suspension additive |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151125 |
|
| RJ01 | Rejection of invention patent application after publication |