CN104810303A - Probe card printed circuit board and its testing system and testing method - Google Patents

Abstract

The invention relates to a probe card printed circuit board with temperature sensor and its test system and test method, which can be used to measure the temperature of the bearing plate, comprising: a probe card printed circuit board and a plurality of temperature sensors. The probe card printed circuit board comprises a first surface and a second surface which are connected, wherein the first surface is fixedly provided with a port, and the second surface is fixedly provided with a plurality of accommodating grooves; the temperature sensors are respectively and fixedly arranged in the accommodating grooves correspondingly, each temperature sensor is provided with a measuring contact and a temperature signal wire, each measuring contact is attached and contacted on the bearing disc, and each temperature signal wire is electrically connected to the port. Therefore, the temperature of a plurality of positions on the bearing plate can be measured at one time in a closed environment, the temperature change of the bearing plate can be accurately known, and the measuring time and the labor force are greatly saved.

Description

Probe card printed circuit board and its testing system and testing method

technical field

The present invention relates to a probe card printed circuit board with a temperature sensor and its testing system and testing method, especially a probe card printed circuit board with a temperature sensor suitable for testing various semiconductor components and its testing method. systems and test methods.

Background technique

The existing test system provides test signals such as specific current and voltage, and transmits specific current and voltage to the semiconductor element wafer through test interfaces such as probe cards to confirm whether the electrical properties of the semiconductor element wafer are normal, and the semiconductor element wafer In the round test, the test system often needs to test the product performance in a specific environment, such as high temperature and low temperature working environment, so how to provide accurate test temperature for the test system is also a major issue.

At present, a heater is generally provided in the chuck for placing semiconductor element wafers to be tested. Chuck) diameter must be larger than the diameter of the wafer, that is, the diameter of the susceptor will be greater than 8 o'clock or 12 o'clock. In order to measure the temperature uniformity and accuracy of the susceptor, the more points are measured, the more accurate the average temperature of the susceptor can be obtained. Generally, at least 5 to 12 points need to be measured, but because external instruments are needed to measure and so many points need to be measured, it takes 75 to 180 minutes to measure the average temperature of a carrier plate each time, which consumes a lot of manpower and working hours. .

In addition, when measuring the average temperature of the carrier plate in the current existing technology, it is necessary to use an external instrument for measurement, which causes the carrier plate to be exposed to the normal temperature environment instead of simulating the airtight environment in real mass production, which will lead to the uncertainty of the measured temperature. Reliability and accuracy are reduced, which indirectly affects test production efficiency, which is not very ideal.

In addition, if the temperature sensor is directly mounted on the wafer to measure its temperature, it needs to be connected to the external processing with wires. If multiple temperature sensors are mounted at the same time, the multiple wires will be very complicated in the test bench, and Many wires are also easy to get knotted in the limited space of the test bench, which is not very ideal, and there is still room for improvement.

Furthermore, the current method for measuring the average temperature of the carrier plate needs to use an external instrument to provide power for the temperature sensor, and at the same time, it needs to measure 5 to 12 points. That is to say, the existing method of measuring the average temperature of the carrier plate needs to provide the power supply of each temperature sensor through an external instrument, and then return the voltage value measured by each temperature sensor to the external instrument one by one, and then convert the temperature of each point one by one. Finally, the average temperature of the carrier plate needs to be calculated on average, which consumes a lot of manpower and man-hours, and because of the need to use external instruments, the carrier plate is exposed to a normal temperature environment instead of simulating the airtight environment in real mass production, which will also affect its performance. The reliability and accuracy of the measured temperature, so the existing method of measuring the average temperature of the carrier plate is not very ideal, and there is still room for improvement.

Moreover, the probe card printed circuit board with temperature sensor can be directly nested and electrically connected to a specific test system according to different requirements. For example, the probe card for general wafer measurement can be replaced with a probe card with temperature sensor. The printed circuit board can directly measure the temperature of the carrier plate or heating plate, simplifying the working time of pre-production.

For this reason, the inventor, based on the spirit of active invention and creation, desperately thought of a "probe card printed circuit board with temperature sensor and its test system and test method" that can solve the above problems. After several researches and experiments, he finally completed this paper. invention.

Contents of the invention

The main purpose of the present invention is to provide a probe card (Probe Card) printed circuit board (PCB: Printed Circuit Board) with a temperature sensor (TemperatureSensors), so as to be able to measure the carrier plate (chunk) at the same time in a closed environment. The temperature of multiple locations on the screen can accurately know the temperature change of the carrier plate, and can simulate the airtight environment during mass production, which can greatly save measurement time and manpower.

Another object of the present invention is to provide a test system using a probe card printed circuit board with a temperature sensor, so that a specific current can be provided to a plurality of temperature sensors via a tester, and the plurality of temperature sensors can simultaneously turn on all the temperature sensors. The measured voltage difference is sent back to the testing machine, and the measurement result is sent to the controller for calculation, and then the actual temperature of the heating plate can be obtained, which can save the time spent on measuring the temperature of multiple points, that is, it can greatly save the measurement time and manpower. In addition, the test system can also display the actual temperature value of the heating plate through the user interface (User Interface) for the operator to interpret.

In order to achieve the above object, the probe card printed circuit board with temperature sensor of the present invention can be used to measure the temperature of a carrier placed in a closed environment, including: a probe card printed circuit board and a plurality of temperature sensors . Wherein, the probe card printed circuit board includes a first surface and a second surface which are connected, the first surface is fixed with a port, and the second surface is fixed with a plurality of accommodating slots; It is arranged in a plurality of accommodating slots on the printed circuit board of the probe card, and each temperature sensor has a measurement contact and a temperature signal line, each measurement contact is attached and contacted on the carrier plate, and each temperature signal line is electrically connected to the port on the probe card printed circuit board.

Each of the above-mentioned temperature sensors can be a thermal resistance temperature sensor or other types of temperature sensors, all of which can achieve the functions of the present invention, which can measure the temperature change of the carrier plate accurately and save the measurement time and manpower greatly.

The plurality of accommodating slots of the probe card printed circuit board are equiangularly distributed on the second surface of the probe card printed circuit board, thereby, the temperature change of the entire carrier plate can be measured on average.

The first surface of the printed circuit board of the probe card can be fixed with a weight frame, and the weight frame can be used to increase the pressure of the measuring contacts of each temperature sensor attached to the carrier plate, so that the measuring contacts are not easy to fall off.

The above-mentioned counterweight frame may include a plurality of engaging blocks, at least one counterweight and a handle, and each engaging block has an engaging groove, which can be directly engaged with the periphery of the probe card printed circuit board; in addition, at least A counterweight can be fixed on a plurality of engaging blocks, and the handle can be fixed on at least one counterweight. Thereby, the printed circuit board of the probe card can be conveniently and easily directly held by hand.

The above-mentioned multiple engaging blocks can be equiangularly distributed on the periphery of the printed circuit board of the probe card, and the engaging force can be averaged.

In addition, the testing system using the probe card printed circuit board with temperature sensor of the present invention includes: a classifier, a heating plate, a probe card printed circuit board and a testing machine. Wherein, the classifier has a controller and a user interface; the heating plate has a heater, and the heating plate is electrically connected to the controller of the classifier.

The printed circuit board of the probe card has a first surface and a second surface connected to each other, the first surface is fixed with a port, the second surface is fixed with a plurality of accommodating grooves, and the plurality of accommodating grooves respectively correspond to fixed A plurality of temperature sensors are provided, each temperature sensor has a measuring contact and a temperature signal line, each measuring contact is attached and contacted on the heating plate, and each temperature signal line is electrically connected to the port. The testing machine has a testing interface, and the testing machine is electrically connected to the port of the printed circuit board of the probe card and the controller of the sorting machine.

In this way, the test system of the present invention can directly obtain the actual temperature of the heating plate, which saves the time spent on measuring multiple points of temperature, and can also display the actual temperature value of the heating plate through the user interface of the classifier for the operator to interpret.

In addition, another test system using a probe card printed circuit board with a temperature sensor of the present invention includes: a test base, a test cover, a carrier plate, a probe card printed circuit board and a testing machine. Wherein, a support seat is provided in the space formed by the test base and the test cover plate, the carrying plate is arranged on the support seat, and a heater is provided inside the carrying plate.

The printed circuit board of the probe card has a first surface and a second surface connected to each other, the first surface is fixed with a port, the second surface is fixed with a plurality of accommodating grooves, and the plurality of accommodating grooves respectively correspond to fixed A plurality of temperature sensors are provided, each temperature sensor has a measuring contact and a temperature signal line, each measuring contact is attached and contacted on the carrier plate, and each temperature signal line is electrically connected to the port. In addition, a testing interface is provided in the testing machine. The testing interface, the testing base and the testing cover form a closed space, and the testing interface is electrically connected to the port and the heater.

Thereby, the test system of the present invention can measure the temperature of multiple positions on the carrier plate at the same time in a closed environment, and directly obtain the actual temperature of the carrier plate, saving the time spent on measuring the temperature of multiple points. Moreover, the testing machine of the present invention can also be electrically connected to a computer, and can be displayed through the user interface of the computer to provide the actual temperature value of the carrier plate for the operator to interpret.

In addition, the test method of the present invention using a probe card printed circuit board with a temperature sensor can be used to measure the temperature of a carrier plate, wherein the carrier plate is fixed in a test machine with a closed space, including the following steps :

(A) The testing machine provides a specific current to a plurality of temperature sensors, and the plurality of temperature sensors are fixed on a probe card printed circuit board having a connected first surface and a second surface, and the first surface is fixed with a Port, the second surface is fixed with a plurality of accommodating grooves, and a plurality of temperature sensors are respectively fixed in the plurality of accommodating grooves, and each temperature sensor has a measurement contact point and a temperature signal line, and each temperature signal line is electrically connected to To the port, each measuring contact is attached and contacted on the carrier plate;

(B) Each temperature signal line returns its voltage difference to the testing machine through the port; and

(C) Provide the temperature value of the carrier tray for the operator to interpret through a computer electrically connected with the testing machine.

The testing machine of the above testing method may have a test base and a test cover, and the test base and the test cover form a closed space.

The test method of the present invention can not only directly provide a specific current directly from the testing machine, without providing the power supply of each temperature sensor through an external instrument, but also can measure the temperature of multiple positions on the carrier plate at the same time in a closed environment, and directly obtain The actual temperature of the carrier plate saves the time spent on measuring the temperature of multiple points. In addition, the test method of the present invention can also be displayed through the user interface of the computer, providing the actual temperature value of the carrier plate for operators to interpret.

The test machine used in the above test method can also be a sorter or other test machine for testing different wafers. It only needs to provide a closed space, and can directly provide a specific current to multiple temperature sensors. The above-mentioned functions of the present invention save the time spent in measuring the temperature of multiple points.

Description of drawings

FIG. 1 is a perspective view of a printed circuit board of a probe card according to a preferred embodiment of the present invention.

FIG. 2 is an exploded view of a printed circuit board of a probe card according to a preferred embodiment of the present invention.

FIG. 3 is a perspective view of another viewing angle of the printed circuit board of the probe card according to a preferred embodiment of the present invention.

FIG. 4 is a schematic diagram of a test system using a perspective view of a printed circuit board of a probe card according to the first preferred embodiment of the present invention.

FIG. 5 is a schematic diagram of a test system using a perspective view of a printed circuit board of a probe card according to a second preferred embodiment of the present invention.

FIG. 6 is a flowchart of a testing method using a probe card printed circuit board with a temperature sensor according to a preferred embodiment of the present invention.

【Symbol Description】

20 Probe card printed circuit board 21 First side

22 Second side 25 Ports

28 Storage tank 29 Temperature sensor

291 Measuring contact point 292 Temperature signal line

30 counterweight frame 31 snap block

311 Engagement slot 32 Counterweight

33 Counterweight 35 Handle

38 Bolts 40 Sorting machine

41 Controller 42 User Interface

50 heating plate 51 heater

60 testing machine 61 testing interface

62 Carrier 63 Wafer to be tested

70 Test base 71 Test cover

72 Fixed seat 75 Support seat

77 carrying tray 8 testing machine

80 testing machine 81 testing interface

85 Wafers to be tested 88 Computers

SA,SB,SC steps

Detailed ways

Please refer to FIG. 1 , FIG. 2 and FIG. 3 , which are respectively a perspective view, an exploded view and a perspective view from another perspective of a printed circuit board of a probe card according to a preferred embodiment of the present invention. The probe card printed circuit board 20 with temperature sensor of the present embodiment includes: a probe card printed circuit board 20 and a plurality of temperature sensors 29 arranged on the probe card printed circuit board 20, the probe card printed circuit board 20 has a connected first surface 21 and a second surface 22, the first surface 21 is fixed with a port 25, and the second surface 22 is fixed with a plurality of accommodating grooves 28; a plurality of temperature sensors 29 correspond to fixed It is arranged in a plurality of accommodating grooves 28 on the second surface 22, and each temperature sensor 29 has a measuring contact 291 and a temperature signal line 292. When measuring, each measuring contact 291 is attached to the sensor to be measured. Each temperature signal line 292 is electrically connected to the port 25 of the first surface 21 .

In this embodiment, the printed circuit board 20 of the probe card is fixed with twelve temperature sensors 29 , all of which are Pt100 platinum thermal resistance temperature sensors 29 . In addition, twelve temperature sensors 29 are evenly arranged in the four accommodating slots 28 on the second surface 22 of the probe card printed circuit board 20 , that is, each accommodating slot 28 is provided with three temperature sensors 29 . In addition, the four accommodating slots 28 are equiangularly distributed on the second surface 22 of the probe card printed circuit board 20 , that is, one accommodating slot 28 is provided every ninety degrees apart.

The probe card printed circuit board 20 of this embodiment can be used to measure the temperature of a carrier plate 77 (chuck) (shown in FIG. 5 ) placed in a closed environment, that is, the probe card printed circuit board 20 of this embodiment When the circuit board 20 measures the temperature of the carrier plate 77, the measuring contacts 291 of each temperature sensor 29 are attached and contacted on the carrier plate 77. Because of the two surfaces 22, the temperature change of the entire carrier plate 77 can be measured on average and at the same time.

Thereby, the probe card printed circuit board 20 of this embodiment can measure the temperature of multiple positions on the carrier plate 77 to be tested at the same time in a closed environment, and the temperature change of the carrier plate 77 can be accurately known, and the quantity can be simulated. The closed environment during production can greatly save measurement time and manpower.

The probe card printed circuit board 20 of this embodiment can be used to measure the items to be measured separately, and a counterweight frame 30 can also be fixed on the first surface 21, and the counterweight frame 30 can be used to increase the measurement of each temperature sensor 29. The contact point 291 is attached to the pressure of the object to be measured, so that the measurement contact point 291 can closely contact the carrier plate 77, thereby increasing the accuracy of temperature measurement.

The assembly method of the counterweight frame 30 and the probe card printed circuit board 20, as shown in FIG. There is an engaging groove 311, and the engaging block 31 is directly engaged with the periphery of the probe card printed circuit board 20 by using the engaging groove 311 on it, and a plurality of counterweights 32 are screwed on the three engaging blocks 31 Finally, the handle 35 is screwed on the uppermost counterweight 32, so that the probe card printed circuit board 20 can be easily and directly held by hand.

In this embodiment, the three engaging blocks 31 are equiangularly distributed on the periphery of the probe card printed circuit board 20, that is, a three-pronged design is adopted, and an engaging block 31 is provided every one hundred and twenty degrees, which can be evenly distributed. The power of snapping. In addition, in this embodiment, the plurality of counterweights 32 includes four overlapping main counterweights 32 and fifteen fine-tuning counterweights 33 that are divided into three groups and overlap. The fine-tuning counterweights 33 are screwed on the main On the counterweights 32, the number of these counterweights 32 can be adjusted in response to the items to be measured, and all the main counterweights 32, fine-tuning counterweights 33, handles 35 and engaging blocks 31 are provided with internal screw holes , and then utilize bolts 38 to be screwed into an integrated counterweight frame 30 .

Please refer to FIG. 4 , which is a schematic diagram of a testing system using a perspective view of a probe card printed circuit board according to a first preferred embodiment of the present invention. Please refer to FIGS. 1 and 3 together. The test system of this embodiment can be used to test integrated circuit components, including: a sorter 40 , a heating plate 50 , a probe card printed circuit board 20 and a tester 60 . Wherein, the classifier 40 has a controller 41 and a user interface (User Interface) 42, the heating plate 50 is provided with a heater 51 therein, and the heating plate 50 is electrically connected to the controller 41 of the classifier 40.

The probe card printed circuit board 20 has a connected first surface 21 and a second surface 22, the first surface 21 is fixedly provided with a port 25, and the second surface 22 is fixedly provided with a plurality of accommodating slots 28, a plurality of accommodating A plurality of temperature sensors 29 are correspondingly fixed in the groove 28, each temperature sensor 29 has a measuring contact 291 and a temperature signal line 292, each measuring contact 291 is attached and contacted on the surface of the heating plate 50, and each The temperature signal line 292 is electrically connected to the port 25 of the first surface 21 . The testing machine 60 is provided with a test interface 61 in it, and the test interface 61 is provided with a bearing seat 62, and an integrated circuit element to be tested is placed on the bearing seat 62, such as a packaging element 63 to be tested, and the testing machine 60 is electrically connected to the The port 25 of the probe card printed circuit board 20 and the controller 41 of the sorter 40 .

The probe card printed circuit board 20 of the present embodiment directly measures the temperature of the heating plate 50, and the counterweight frame 30 is not fixed thereon. Of course, the counterweight frame 30 can also be fixed, regardless of whether the probe card printed circuit board 20 is The counterweight frame 30 is fixed, and there is no difference in connection between the components of the above-mentioned testing system.

Thereby, this embodiment can provide a specific current, such as 1mA, to multiple temperature sensors 29 through the testing machine 60, and multiple temperature sensors 29 can simultaneously return the measured voltage difference to the sorting machine 40, and The measurement results are sent to the controller 41 of the classifier 40 for calculation, and then the actual temperature of the surface of the heating plate 50 is obtained, which can greatly save measurement time and manpower. In addition, the test system of this embodiment can also be displayed through the user interface (User Interface) 42 of the classifier 40, which can accurately provide the actual temperature value of the heating plate 50 for the operator to interpret.

In this embodiment, the probe card printed circuit board 20 is fixed with twelve temperature sensors 29, which are all Pt100 platinum thermal resistance temperature sensors 29, and the voltage values measured by the temperature sensors 29 are sent to the classification The actual temperature distribution on the surface of the heating plate 50 can be obtained through calculation by the controller 41 of the heating plate 40, and can be displayed through the user interface 42 for the operator to interpret.

Please refer to FIG. 5 , which is a schematic diagram of a testing system using a perspective view of a probe card printed circuit board according to a second preferred embodiment of the present invention. Please refer to FIGS. 1 and 3 together. The test system of this embodiment can be used to test integrated circuit components, including: a test base 70 , a test cover 71 , a carrier plate 77 , a probe card printed circuit board 20 , a tester 80 and a computer 88 . Wherein, a support seat 75 is fixedly provided on the test base 70, the carrier plate 77 is placed on the support seat 75, and a heater (not shown) is arranged in the carrier plate 77, and the wafer 85 to be tested is placed on the carrier plate 77. superior. The testing machine 80 is provided with a testing interface 81 , and the testing machine 80 is electrically connected to the computer 88 . The testing cover 71 is provided with a fastening seat 72 on which the probe card printed circuit board 20 is fixed.

The probe card printed circuit board 20 of this embodiment is also the same as the first embodiment, and has a first surface 21 and a second surface 22 connected to each other. The first surface 21 is fixed with a port 25, and the second surface 22 is fixed with a port 25. There are a plurality of accommodating grooves 28, and a plurality of temperature sensors 29 are respectively fixed in the plurality of accommodating grooves 28, and each temperature sensor 29 has a measuring contact 291 and a temperature signal line 292, and each measuring contact 291 is attached Each temperature signal line 292 is electrically connected to the port 25 of the first surface 21 and is in contact with the surface of the carrier plate 77 .

In this way, the present embodiment can provide a specific current through the testing machine 80, and supply 1 mA to the multiple temperature sensors 29 of the probe card printed circuit board 20 through the test interface 81, and the multiple temperature sensors 29 can simultaneously measure the measured current. The voltage difference is sent back to the computer 88, and then the actual temperature on the surface of the carrier plate 77 is obtained. The formula for converting the measured voltage value into temperature is R(T)=R(0)+αT, wherein R(T) is The resistance value of the temperature to be measured (in this embodiment, the object to be measured is the surface of the carrier plate 77), R(0) is the resistance value (100ohm) at 0 degrees, and α is the temperature coefficient (Ω/℃), T is the temperature to be measured. Therefore, this embodiment can greatly save measurement time and manpower. In addition, the test system of this embodiment can also be displayed by the computer 88, which can accurately provide the actual temperature value of the carrier plate 77 for the operator to interpret.

Please refer to FIG. 6 , which is a flowchart of a testing method using a probe card printed circuit board with a temperature sensor according to a preferred embodiment of the present invention, and please refer to FIG. 1 , FIG. 3 and FIG. 5 together. The test method of this embodiment is used to measure the temperature of a carrier plate 77, which is fixed on a support seat 75 in a testing machine 8, and the wafer 85 to be tested is placed on the carrier plate 77, and the testing machine 8 has a test base 70 and a test cover 71, the test base 70 and the test cover 71 form a closed space, and the test machine 8 has a test machine 80 and a test interface 81, and the test machine 8 is electrically connected to a computer 88.

The test method of the present embodiment includes the following steps: first, the testing machine 8 provides a specific current to a plurality of temperature sensors 29 (step SA), and the plurality of temperature sensors 29 are fixed on a first surface 21 with a connected one and a On the probe card printed circuit board 20 of the second surface 22, the first surface 21 is fixedly provided with a port 25, and the second surface 22 is fixedly provided with a plurality of accommodating grooves 28. A temperature sensor 29, each temperature sensor 29 has a measuring contact 291 and a temperature signal line 292, each temperature signal line 292 is electrically connected to the port 25, each measuring contact 291 is attached and contacted on the carrier plate 77. In addition, the probe card printed circuit board 20 is fixed on the fixing seat 72 .

Next, each temperature signal line 292 transmits its voltage difference back to the testing machine 8 through the port 25 of the probe card printed circuit board 20 (step SB). Finally, through the computer 88, the temperature value of the carrier plate 77 can be provided for the operator to interpret (step SC).

In this way, the test method of this embodiment can not only provide a specific current directly from the testing machine 8, without providing the power supply of each temperature sensor through an external instrument, but also can measure multiple temperature sensors on the carrier plate 77 at the same time in a closed environment. The temperature at the location can directly obtain the actual temperature of the carrier plate 77, saving the time and time spent in measuring the temperature of multiple points. In addition, the test method of this embodiment can also be displayed through the user interface of the computer 88 to provide the actual temperature value of the carrier plate 77 for the operator to interpret.

The above-mentioned embodiments are only examples for convenience of description, and the scope of rights claimed by the present invention should be determined by the claims, rather than limited to the above-mentioned embodiments.

Claims (17)

1. A probe card printed circuit board with a temperature sensor, used to measure the temperature of a carrier tray arranged in a closed environment, comprising: A probe card printed circuit board, including a connected first surface and a second surface, the first surface is fixed with a port, and the second surface is fixed with a plurality of accommodation slots; and A plurality of temperature sensors are respectively fixed in the plurality of accommodating tanks. Each temperature sensor has a measuring contact and a temperature signal line. Each measuring contact is attached and contacted on the carrier plate. Each temperature The signal line is electrically connected to the port. 2. The probe card printed circuit board with temperature sensors according to claim 1, wherein each temperature sensor is a thermal resistance temperature sensor. 3. The probe card printed circuit board with a temperature sensor according to claim 1, wherein the plurality of accommodating grooves are equiangularly distributed on the second surface. 4. The probe card printed circuit board with temperature sensor according to claim 1, wherein, the first surface is also fixed with a counterweight frame, in order to increase the sticking contact of each measuring contact on the carrier plate pressure. 5. The probe card printed circuit board with temperature sensor according to claim 4, wherein the counterweight frame includes a plurality of engaging blocks, at least one counterweight and a handle, and the plurality of engaging blocks engage On the periphery of the printed circuit board of the probe card, the at least one weight block is fixed on the plurality of engaging blocks, and the handle is fixed on the at least one weight block. 6 . The probe card printed circuit board with temperature sensors according to claim 5 , wherein the plurality of engaging blocks are equiangularly distributed on the periphery of the probe card printed circuit board. 7. A test system using a probe card printed circuit board with a temperature sensor, characterized in that it includes: A sorting machine having a controller therein; a heating plate with a heater inside, the heating plate is electrically connected to the controller; A probe card printed circuit board, including a first surface and a second surface connected, the first surface is fixed with a port, the second surface is fixed with a plurality of accommodating grooves, the plurality of accommodating grooves A plurality of temperature sensors are correspondingly fixed inside, and each temperature sensor has a measuring contact and a temperature signal line, and each measuring contact is attached and contacted on the heating plate, and each temperature signal line is electrically connected to the heating plate. port; and A test machine is provided with a test interface, and the test machine is electrically connected to the port and the controller. 8 . The testing system according to claim 7 , wherein a weight frame is fixed on the first surface to increase the pressure of each measuring contact point attached to the heating plate. 9 . 9. The test system according to claim 8, wherein the counterweight frame includes a plurality of engaging blocks, at least one counterweight and a handle, and the plurality of engaging blocks are engaged with the probe card printed circuit board The at least one counterweight is fixed on the plurality of engaging blocks, and the handle is fixed on the at least one counterweight. 10. A test system using a probe card printed circuit board with a temperature sensor, characterized in that it includes: A test base and a test cover with a support seat inside; A carrying plate is arranged on the supporting seat, and the carrying plate has a heater; A probe card printed circuit board includes a connected first surface and a second surface, the first surface is fixed with a port, the second surface is fixed with a plurality of accommodation grooves, and the plurality of accommodation grooves A plurality of temperature sensors are correspondingly fixed inside, and each temperature sensor has a measuring contact and a temperature signal line, and each measuring contact is attached and contacted on the carrier plate, and each temperature signal line is electrically connected to the port; and A test machine is provided with a test interface, the test interface, the test base and the test cover form a closed space, and the test interface is electrically connected to the port and the heater. 11 . The testing system according to claim 10 , wherein a counterweight frame is fixed on the first surface to increase the pressure of each measuring contact point attached to and in contact with the carrier plate. 12 . 12. The test system according to claim 11, wherein the counterweight frame includes a plurality of engaging blocks, at least one counterweight and a handle, and the plurality of engaging blocks are engaged with the probe card printed circuit board The at least one counterweight is fixed on the plurality of engaging blocks, and the handle is fixed on the at least one counterweight. 13. The testing system according to claim 10, wherein the testing machine is electrically connected to a computer for providing the temperature value of the carrier plate for operators to interpret. 14. A test method using a probe card printed circuit board with a temperature sensor, characterized in that it is used to measure the temperature of a carrier plate, the carrier plate is fixed in a testing machine with a closed space, comprising: The following steps: (A) The testing machine provides a specific current to a plurality of temperature sensors, and the plurality of temperature sensors are fixed on a probe card printed circuit board having a connected first surface and a second surface, the first surface A port is fixed, the second surface is fixed with a plurality of accommodating grooves, and the plurality of accommodating grooves are respectively fixed with the plurality of temperature sensors, and each temperature sensor has a measuring contact and a temperature signal line, Each of the temperature signal lines is electrically connected to the port, and each of the measuring contacts is attached and contacted on the carrier plate; (B) each temperature signal line returns its voltage difference to the testing machine through the port; and (C) Provide the temperature value of the carrier plate for the operator to interpret through a computer electrically connected with the testing machine. 15 . The testing method according to claim 14 , wherein the computer is provided with a user interface to provide the temperature value of the carrier plate for operators to interpret. 16 . 16. The test method according to claim 14, wherein, the first surface of the probe card printed circuit board is also fixed with a counterweight frame for increasing the attachment and contact of each measuring contact on the carrier plate pressure. 17. The testing method according to claim 16, wherein the counterweight frame includes a plurality of engaging blocks, at least one counterweight and a handle, and the plurality of engaging blocks are engaged on the probe card printed circuit board The at least one counterweight is fixed on the plurality of engaging blocks, and the handle is fixed on the at least one counterweight.