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CN104766919A - Light emitting device and display - Google Patents

Light emitting device and display Download PDF

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Publication number
CN104766919A
CN104766919A CN201510151205.4A CN201510151205A CN104766919A CN 104766919 A CN104766919 A CN 104766919A CN 201510151205 A CN201510151205 A CN 201510151205A CN 104766919 A CN104766919 A CN 104766919A
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Prior art keywords
light
encapsulation
layer
emitting device
light extraction
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詹啟舜
黄丰裕
洪仕馨
李孟庭
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AUO Corp
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AU Optronics Corp
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开了一种发光装置,包含基板、光源组件、光取出层和第一光学粒子,光源组件包含发光元件与封装结构。光取出层设置于封装结构上,其中第一光学粒子突出于光取出层的第一表面。第一光学粒子具第一折射率,光取出层具一第二折射率,且封装结构具一第三折射率。第一折射率大于空气的折射率,且第二折射率大于第一折射率与第三折射率。藉此,有助于避免光线自光取出层入射至发光装置外部时产生全反射,进一步提升发光装置的光取出效率。

The invention discloses a light-emitting device, which includes a substrate, a light source component, a light extraction layer and first optical particles. The light source component includes a light-emitting element and a packaging structure. The light extraction layer is disposed on the packaging structure, wherein the first optical particles protrude from the first surface of the light extraction layer. The first optical particles have a first refractive index, the light extraction layer has a second refractive index, and the packaging structure has a third refractive index. The first refractive index is greater than the refractive index of air, and the second refractive index is greater than the first refractive index and the third refractive index. This helps to avoid total reflection when light is incident from the light extraction layer to the outside of the light-emitting device, further improving the light extraction efficiency of the light-emitting device.

Description

发光装置和显示器Lighting devices and displays

技术领域technical field

本发明揭露一种发光装置和显示器,特别是一种包含提高光取出率光学粒子的发光装置以及具有此发光装置的显示器。The invention discloses a light-emitting device and a display, in particular a light-emitting device containing optical particles for improving light extraction rate and a display with the light-emitting device.

背景技术Background technique

显示器的发光元件可以是一种由半导体材料制作而成的发光二极管(Light Emitting Diode,LED),也可以是另一种由有机材料制作而成的有机发光二极管(Organic Light Emitting Diode,OLED)。其中,发光二极管因其具有耗电量低、元件寿命长、反应时间短(fast response time)、体积小等优点,因此随着技术不断地进步,发光二极管被广泛地应用于显示器的背光模块。而有机发光二极管则具有广视角、高对比度、低耗电、高反应速率、全彩化、可挠性等优点,故被视为运用于显示器的最具有潜力的发光元件。The light-emitting element of the display can be a light-emitting diode (Light Emitting Diode, LED) made of semiconductor materials, or another organic light-emitting diode (Organic Light Emitting Diode, OLED) made of organic materials. Among them, light-emitting diodes are widely used in backlight modules of displays due to their advantages such as low power consumption, long component life, short fast response time, and small size. Organic light-emitting diodes have the advantages of wide viewing angle, high contrast, low power consumption, high response rate, full-color, and flexibility, so they are regarded as the most potential light-emitting elements for display.

然而,目前使用发光二极管或有机发光二极管作为发光元件的显示器普遍存在发光效率不佳而导致亮度偏低的问题。其中造成发光效率不佳的原因,乃是由于发光元件所发射的光线仅有少部分可以出射至显示器外部,而其余的光线则会因为被显示器内的封装结构反射而被吸收。However, current displays that use light-emitting diodes or organic light-emitting diodes as light-emitting elements generally have the problem of poor luminous efficiency, resulting in low brightness. The reason for the poor luminous efficiency is that only a small part of the light emitted by the light-emitting element can be emitted to the outside of the display, while the rest of the light will be absorbed due to reflection by the packaging structure inside the display.

目前虽有部分业者在封装结构上增加一光取出层来避免光线被封装结构反射,然而由于光取出层和显示器外部的折射率变化过大,因而大幅阻碍光线自光取出层出射至显示器外部。At present, although some manufacturers add a light extraction layer to the packaging structure to prevent light from being reflected by the packaging structure, the refractive index between the light extraction layer and the outside of the display varies greatly, which greatly hinders the light from exiting the light extraction layer to the outside of the display.

发明内容Contents of the invention

鉴于以上的问题,本发明提供一种发光装置和包含此发光装置的显示器,藉以改善光取出层和显示器外部的折射率变化过大而大幅阻碍光线自光取出层出射至显示器外部的问题。In view of the above problems, the present invention provides a light-emitting device and a display including the light-emitting device, so as to solve the problem that the refractive index of the light extraction layer and the outside of the display changes too much, which greatly hinders the light from exiting the light extraction layer to the outside of the display.

本发明所揭露的发光装置包含基板、光源组件、光取出层和第一光学粒子。光源组件包含发光元件与封装结构。发光元件设置于基板。发光元件具出光面,且封装结构设置于出光面。光取出层设置于光源组件的封装结构。光取出层具相对的第一表面和第二表面,且第二表面面向光源组件。第一光学粒子嵌设于光取出层并且突出于第一表面。第一光学粒子具第一折射率,光取出层具一第二折射率,且封装结构具一第三折射率。第一折射率大于空气的折射率,且第二折射率大于第一折射率与第三折射率。The light-emitting device disclosed in the present invention includes a substrate, a light source component, a light extraction layer and first optical particles. The light source component includes a light emitting element and a packaging structure. The light emitting element is arranged on the substrate. The light-emitting element has a light-emitting surface, and the encapsulation structure is arranged on the light-emitting surface. The light extraction layer is arranged on the encapsulation structure of the light source component. The light extraction layer has opposite first surface and second surface, and the second surface faces the light source component. The first optical particles are embedded in the light extraction layer and protrude from the first surface. The first optical particle has a first refractive index, the light extraction layer has a second refractive index, and the packaging structure has a third refractive index. The first refractive index is greater than that of air, and the second refractive index is greater than the first refractive index and the third refractive index.

本发明所另揭露的显示器包含前述的发光装置、黏着层以及偏光片,黏着层设置于光取出层的第一表面。偏光片设置于黏着层。The display further disclosed by the present invention includes the aforementioned light-emitting device, an adhesive layer and a polarizer, and the adhesive layer is disposed on the first surface of the light extraction layer. The polarizer is disposed on the adhesive layer.

根据本发明所揭露的发光装置以及包含此发光装置的显示器,当光源组件产生的光线自光取出层出射至发光装置外部时,部分光线先自光取出层入射至第一光学粒子中,接着再从第一光学粒子入射至发光装置外部。由于光取出层的第二折射率大于第一光学粒子的第一折射率,且第一折射率大于空气的折射率,因此发光装置于第一表面具有较为缓和的折射率变化,有助于避免光线自光取出层入射至发光装置外部时产生全反射,进一步提升发光装置的光取出效率。According to the light-emitting device and the display including the light-emitting device disclosed in the present invention, when the light generated by the light source component exits from the light-extracting layer to the outside of the light-emitting device, part of the light first enters the first optical particle from the light-extracting layer, and then Incident from the first optical particle to the outside of the light emitting device. Since the second refractive index of the light extraction layer is greater than the first refractive index of the first optical particle, and the first refractive index is greater than the refractive index of air, the light-emitting device has relatively moderate refractive index changes on the first surface, which helps to avoid When the light is incident from the light extraction layer to the outside of the light emitting device, total reflection occurs, which further improves the light extraction efficiency of the light emitting device.

以上的关于本发明内容的说明及以下的实施方式的说明用以示范与解释本发明的原理,并且提供本发明所附的权利要求的保护范围更进一步的解释。The above descriptions about the content of the present invention and the following descriptions of the embodiments are used to demonstrate and explain the principles of the present invention, and provide further explanations of the scope of protection of the appended claims of the present invention.

附图说明Description of drawings

图1为根据本发明第一实施例的发光装置的剖切示意图;1 is a schematic cross-sectional view of a light emitting device according to a first embodiment of the present invention;

图2为第1图的局部放大示意图;Figure 2 is a partially enlarged schematic diagram of Figure 1;

图3为根据本发明第一实施例的发光元件产生的光线出射至发光装置外部光路径示意图;3 is a schematic diagram of the light path from the light generated by the light-emitting element to the outside of the light-emitting device according to the first embodiment of the present invention;

图4为根据本发明第二实施例的发光装置的剖切示意图;4 is a schematic cross-sectional view of a light emitting device according to a second embodiment of the present invention;

图5为根据本发明第三实施例的发光装置的剖切示意图;5 is a schematic cross-sectional view of a light emitting device according to a third embodiment of the present invention;

图6为根据本发明第四实施例的发光装置的剖切示意图;6 is a schematic cross-sectional view of a light emitting device according to a fourth embodiment of the present invention;

图7为根据本发明第五实施例的发光装置的剖切示意图;7 is a schematic cross-sectional view of a light emitting device according to a fifth embodiment of the present invention;

图8为根据本发明第六实施例的发光装置的剖切示意图;8 is a schematic cross-sectional view of a light emitting device according to a sixth embodiment of the present invention;

图9为根据本发明第七实施例的发光装置的剖切示意图;9 is a schematic cross-sectional view of a light emitting device according to a seventh embodiment of the present invention;

图10为根据本发明第八实施例的发光装置的剖切示意图;10 is a schematic cross-sectional view of a light emitting device according to an eighth embodiment of the present invention;

图11为应用本发明任一实施例的发光装置的显示器的立体示意图。FIG. 11 is a three-dimensional schematic diagram of a display applying the light emitting device according to any embodiment of the present invention.

其中,附图标记:Among them, reference signs:

1    显示器1 monitor

10   发光装置10 light emitting device

10a  基板10a Substrate

20   偏光片20 Polarizers

30   黏着层30 adhesive layer

100  光源组件100 light source components

110  发光元件110 light emitting elements

111  出光面111 light emitting surface

120  封装结构120 package structure

121  第一封装层121 The first encapsulation layer

122  第二封装层122 second encapsulation layer

121a 第一顶面121a first top surface

1210 抗反射结构1210 anti-reflection structure

122a 第二顶面122a second top surface

123  缓冲层123 buffer layer

200  光取出层200 light extraction layers

210  第一表面210 first surface

220  第二表面220 second surface

300  第一光学粒子300 First Optical Particles

400  第二光学粒子400 second optical particle

500  侧边500 sides

B    光线B light

P    第一光学粒子的粒径P the particle size of the first optical particle

V1   第一光学粒子的本体积V1 The intrinsic volume of the first optical particle

V2   第一光学粒子的突出体积V2 Prominent volume of the first optical particle

具体实施方式Detailed ways

以下在实施方式中详细叙述本发明的详细特征以及优点,其内容足以使任何熟悉本领域的相关技术人员了解本发明的技术内容并据以实施,且根据本说明书所揭露的内容、权利要求的保护范围及图式,任何熟悉本领域的相关技术人员可轻易地理解本发明相关的目的及优点。以下的实施例进一步详细说明本发明的观点,但非以任何观点限制本发明的范畴。The detailed features and advantages of the present invention are described in detail below in the embodiments, the content of which is sufficient to enable any person familiar with the relevant technical field to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification and the claims With the scope of protection and drawings, anyone familiar with the art can easily understand the related objects and advantages of the present invention. The following examples further illustrate the concept of the present invention in detail, but do not limit the scope of the present invention in any way.

请参照图1。图1为根据本发明第一实施例的发光装置的剖切示意图。在本实施例中,发光装置10包含一基板10a、一光源组件100、一光取出层200和多个第一光学粒子300。Please refer to Figure 1. FIG. 1 is a schematic cross-sectional view of a light emitting device according to a first embodiment of the present invention. In this embodiment, the light emitting device 10 includes a substrate 10 a , a light source component 100 , a light extraction layer 200 and a plurality of first optical particles 300 .

基板10a的材质例如为塑料或玻璃。The material of the substrate 10a is, for example, plastic or glass.

光源组件100设置于基板10a,并且包含一发光元件110和一封装结构120。发光元件110例如为有机发光二极管,其具有一出光面111。封装结构120设置于发光元件110的出光面111,并且包覆发光元件110。详细来说,封装结构120包含多个第一封装层121以及多个第二封装层122。这些第一封装层121和这些第二封装层122交互堆栈,并且相邻的第一封装层121与第二封装层122直接接触。最靠近发光元件110的第一封装层121设置于出光面111并且完全包覆发光元件110。在本实施例中,封装结构120为无机膜和有机膜相互多层堆栈而形成的一薄膜封装结构(Thin Film Encapsulation,TFE),并且封装结构120的厚度大于等于1微米(μm),并小于等于5微米。进一步来说,在本实施例中,封装结构120为了满足良好除水氧效果的需求而包含多个第一封装层121以及多个第二封装层122,但本发明并不以此为限。在其他实施例中,第一封装层121以及第二封装层122的数量可作调整,其详细内容将于后续进一步说明。The light source assembly 100 is disposed on the substrate 10 a and includes a light emitting element 110 and a packaging structure 120 . The light-emitting element 110 is, for example, an organic light-emitting diode, which has a light-emitting surface 111 . The encapsulation structure 120 is disposed on the light emitting surface 111 of the light emitting element 110 and covers the light emitting element 110 . In detail, the encapsulation structure 120 includes a plurality of first encapsulation layers 121 and a plurality of second encapsulation layers 122 . The first encapsulation layers 121 and the second encapsulation layers 122 are stacked alternately, and adjacent first encapsulation layers 121 are in direct contact with the second encapsulation layers 122 . The first encapsulation layer 121 closest to the light-emitting element 110 is disposed on the light-emitting surface 111 and completely covers the light-emitting element 110 . In this embodiment, the encapsulation structure 120 is a thin film encapsulation structure (Thin Film Encapsulation, TFE) formed by stacking inorganic films and organic films in multiple layers, and the thickness of the encapsulation structure 120 is greater than or equal to 1 micron (μm) and less than Equal to 5 microns. Further, in this embodiment, the encapsulation structure 120 includes a plurality of first encapsulation layers 121 and a plurality of second encapsulation layers 122 in order to meet the requirement of good water and oxygen removal effect, but the present invention is not limited thereto. In other embodiments, the quantities of the first encapsulation layer 121 and the second encapsulation layer 122 can be adjusted, and details thereof will be further described later.

光取出层200的材料例如为环氧树脂(Epoxy)、聚甲基丙烯酸甲酯(acrylic,PMMA)、硅(Silicon)、对苯二甲酸乙二酯(PET)、聚萘酸乙酯(PEN)、聚碳酸酯(PC)、聚酰亚胺(PI)、或氧化铟锡(ITO)。又或者,光取出层200的材料可为一有机无机复合材料,且该有机无机复合材料为氧化钛-三甲氧基甲硅烷基丙基丙烯酸酯(TiOx-MSMA)。另外,光取出层200的厚度大于等于0.1微米,且小于等于30微米。The material of the light extraction layer 200 is, for example, epoxy resin (Epoxy), polymethyl methacrylate (acrylic, PMMA), silicon (Silicon), ethylene terephthalate (PET), polyethylene naphthalate (PEN ), polycarbonate (PC), polyimide (PI), or indium tin oxide (ITO). Alternatively, the material of the light extraction layer 200 may be an organic-inorganic composite material, and the organic-inorganic composite material is titanium oxide-trimethoxysilylpropyl acrylate (TiOx-MSMA). In addition, the thickness of the light extraction layer 200 is greater than or equal to 0.1 μm and less than or equal to 30 μm.

光取出层200具有相对的一第一表面210和一第二表面220。第二表面220面向光源组件100,且封装结构120的一外表面直接接触光取出层200的第二表面220。详细来说,最靠近光取出层200的第一封装层121和最靠近光取出层200的第二封装层122分别具有朝向光取出层200的一第一顶面121a和一第二顶面122a。最靠近光取出层200的第一封装层121直接接触最靠近光取出层200的第二封装层122的第二顶面122a,并且完全覆盖第二顶面122a。光取出层200的第二表面220直接接触最靠近光取出层200的第一封装层121的第一顶面121a。在本实施例中,这些第一封装层121皆为有机材料(例如为一有机阻水氧膜,此折射率大约为1.5),而这些第二封装层122皆为无机材料(例如为一无机阻水氧膜,此折射率大约为1.65)。藉此,第一封装层121为有机材料有助于防止光取出层200从第一顶面121a脱落。在本实施例中,最靠近光取出层200的第一封装层121完全覆盖最靠近光取出层200的第二封装层122的第二顶面122a,使光取出层200形成于封装结构120上时能较为平坦,以及厚度能较为均匀,但其并非用以限制本发明。在其他实施例中,也可不考虑光取出层200表面平坦度和厚度均匀度而使最靠近光取出层200的第一封装层121不完全覆盖最靠近光取出层200的第二封装层122的第二顶面122a,其详细内容将于后续进一步说明。The light extraction layer 200 has a first surface 210 and a second surface 220 opposite to each other. The second surface 220 faces the light source module 100 , and an outer surface of the encapsulation structure 120 directly contacts the second surface 220 of the light extraction layer 200 . In detail, the first encapsulation layer 121 closest to the light extraction layer 200 and the second encapsulation layer 122 closest to the light extraction layer 200 respectively have a first top surface 121a and a second top surface 122a facing the light extraction layer 200 . The first encapsulation layer 121 closest to the light extraction layer 200 directly contacts the second top surface 122a of the second encapsulation layer 122 closest to the light extraction layer 200 and completely covers the second top surface 122a. The second surface 220 of the light extraction layer 200 directly contacts the first top surface 121 a of the first encapsulation layer 121 closest to the light extraction layer 200 . In this embodiment, the first encapsulation layers 121 are all organic materials (for example, an organic water and oxygen blocking film, the refractive index is about 1.5), and the second encapsulation layers 122 are all inorganic materials (for example, an inorganic Water and oxygen blocking film, the refractive index is about 1.65). In this way, the organic material of the first encapsulation layer 121 helps to prevent the light extraction layer 200 from falling off from the first top surface 121a. In this embodiment, the first encapsulation layer 121 closest to the light extraction layer 200 completely covers the second top surface 122a of the second encapsulation layer 122 closest to the light extraction layer 200, so that the light extraction layer 200 is formed on the encapsulation structure 120 The time can be relatively flat, and the thickness can be relatively uniform, but it is not intended to limit the present invention. In other embodiments, the first encapsulation layer 121 closest to the light extraction layer 200 may not completely cover the surface of the second encapsulation layer 122 closest to the light extraction layer 200 regardless of the surface flatness and thickness uniformity of the light extraction layer 200. The details of the second top surface 122a will be further described later.

在本实施例中,第一封装层121和第二封装层122的材料并非用以限制本发明。在其他实施例中,第一封装层121可为一无机材料(例如为一无机阻水氧膜,此折射率大约为1.65),且第二封装层122可为一有机材料(例如为一有机阻水氧膜,此折射率大约为1.5)。因此,于以下说明中封装结构120的第三折射率将视为约1.65,实际上封装层小于等于1.65,应都将在本发明的保护范围中。In this embodiment, the materials of the first encapsulation layer 121 and the second encapsulation layer 122 are not intended to limit the present invention. In other embodiments, the first encapsulation layer 121 can be an inorganic material (for example, an inorganic water and oxygen barrier film, the refractive index is about 1.65), and the second encapsulation layer 122 can be an organic material (for example, an organic Water and oxygen blocking film, the refractive index is about 1.5). Therefore, in the following description, the third refractive index of the encapsulation structure 120 will be regarded as about 1.65, but actually the encapsulation layer is less than or equal to 1.65, which should be within the protection scope of the present invention.

第一光学粒子300嵌设于光取出层200并且突出于第一表面210。第一光学粒子300的材料例如为无机材料,且该无机材料可包含氟化镁(MgFx)、氧化硅(SiOx)、氧化铝(AlOx)、氧化锌(ZnOx)、氧化钛(TiOx)、硒化锌(ZnSe)或氧化锆(ZrOx)。The first optical particle 300 is embedded in the light extraction layer 200 and protrudes from the first surface 210 . The material of the first optical particle 300 is, for example, an inorganic material, and the inorganic material may include magnesium fluoride (MgFx), silicon oxide (SiOx), aluminum oxide (AlOx), zinc oxide (ZnOx), titanium oxide (TiOx), selenium Zinc oxide (ZnSe) or zirconium oxide (ZrOx).

以下将描述光取出层、第一光学粒子和封装层的光学性质和细部结构特征。请一并参照图2。图2为图1的局部放大示意图。The optical properties and detailed structural features of the light extraction layer, the first optical particles, and the encapsulation layer will be described below. Please also refer to Figure 2. FIG. 2 is a partially enlarged schematic diagram of FIG. 1 .

第一光学粒子300具有一第一折射率(n1),且第一折射率大于空气的折射率(nair=1)。The first optical particle 300 has a first refractive index (n1), and the first refractive index is greater than the refractive index of air (nair=1).

光取出层200具有一第二折射率(n2),且第二折射率(n2)大于第一光学粒子300的第一折射率。第一折射率与第二折射率的差值大于0.01,且第二折射率大于等于1.65。The light extraction layer 200 has a second refractive index ( n2 ), and the second refractive index ( n2 ) is greater than the first refractive index of the first optical particle 300 . The difference between the first refractive index and the second refractive index is greater than 0.01, and the second refractive index is greater than or equal to 1.65.

封装结构120具有一第三折射率,且光取出层200的第二折射率大于第三折射率。藉此,有助于将发光元件110所产生的光提取至光取出层200中。The encapsulation structure 120 has a third refractive index, and the second refractive index of the light extraction layer 200 is greater than the third refractive index. Thereby, it is helpful to extract the light generated by the light emitting element 110 into the light extraction layer 200 .

当光取出层200的第二折射率大于第一光学粒子300的第一折射率时,通过第一光学粒子300至空气中的光线较不易产生全反射,而有助于提高发光装置10的光取出效率(Light Extraction Efficiency)。举例来说,如表一所示,当光取出层200的第二折射率n2=1.7并且第一光学粒子300的第一折射率n1=1.6时,发光装置10具有较高亮度(亮度单位为坎德拉每平方米,candelaper square meter,cd/m2)。When the second refractive index of the light extraction layer 200 is greater than the first refractive index of the first optical particle 300, the light passing through the first optical particle 300 into the air is less likely to undergo total reflection, which helps to improve the light output of the light emitting device 10. Take out efficiency (Light Extraction Efficiency). For example, as shown in Table 1, when the second refractive index n2 of the light extraction layer 200 = 1.7 and the first refractive index n1 of the first optical particle 300 = 1.6, the light emitting device 10 has a relatively high brightness (the brightness unit is Candela per square meter, candelaper square meter, cd/m2).

当发光装置10配有第一光学粒子300时,发光效率较未配置第一光学粒子300的发光装置10来得高。举例来说,如表二所示,对于第二折射率n2=1.7以及第三折射率n3=1.5的发光装置10而言,当未配置第一光学粒子300时,发光装置10的亮度为42.6cd/m2。当配置粒径150nm且材质为氧化硅的第一光学粒子300时,发光装置10的亮度为56.5cd/m2。经实验结果证明,具有第一光学粒子300的发光装置10可至少提升18%的亮度。When the light emitting device 10 is equipped with the first optical particles 300 , the luminous efficiency is higher than that of the light emitting device 10 without the first optical particles 300 . For example, as shown in Table 2, for the light-emitting device 10 with the second refractive index n2=1.7 and the third refractive index n3=1.5, when the first optical particle 300 is not configured, the brightness of the light-emitting device 10 is 42.6 cd/m 2 . When the first optical particles 300 with a particle diameter of 150 nm and made of silicon oxide are disposed, the brightness of the light emitting device 10 is 56.5 cd/m 2 . Experimental results prove that the light emitting device 10 with the first optical particle 300 can increase the brightness by at least 18%.

除了配置第一光学粒子300外,调整光取出层200的第二折射率能更进一步提升发光装置10的光取出效率。举例来说,如表二所示,对于第一折射率n1=1.5以及第三折射率n3=1.5的发光装置10而言,当第二折射率n2=1.6时,发光装置10的亮度为56.5cd/m2。当第二折射率n2=1.7时,发光装置10的亮度为58.3cd/m2。当第二折射率n2=2.53时,发光装置10的亮度为74.5cd/m2。经实验结果证明,当配置第一光学粒子300时,较高的第二折射率更有助于进一步提升发光装置10的光取出效率。In addition to disposing the first optical particles 300 , adjusting the second refractive index of the light extraction layer 200 can further improve the light extraction efficiency of the light emitting device 10 . For example, as shown in Table 2, for the light emitting device 10 with the first refractive index n1=1.5 and the third refractive index n3=1.5, when the second refractive index n2=1.6, the brightness of the light emitting device 10 is 56.5 cd/m 2 . When the second refractive index n2=1.7, the brightness of the light emitting device 10 is 58.3 cd/m 2 . When the second refractive index n2=2.53, the brightness of the light emitting device 10 is 74.5 cd/m 2 . Experimental results prove that when the first optical particles 300 are configured, the higher second refractive index is more helpful to further improve the light extraction efficiency of the light emitting device 10 .

在本实施例中,第一光学粒子300的粒径P并不以上述数值为限。进一步而言,粒径P大于等于0.1微米,且小于等于20微米。藉此,可适当调整第一光学粒子300的尺寸而有助于使更多光线能从光取出层200入射至第一光学粒子300。In this embodiment, the particle size P of the first optical particle 300 is not limited to the above numerical value. Furthermore, the particle diameter P is greater than or equal to 0.1 micron and less than or equal to 20 microns. Thereby, the size of the first optical particle 300 can be properly adjusted to facilitate more light from the light extraction layer 200 to enter the first optical particle 300 .

此外,第一光学粒子300具有一本体积V1。第一光学粒子300突出于光取出层200的第一表面210而具有一突出体积V2(如图3所示)。突出体积V2和本体积V1的比值大于0且小于1。藉此,第一光学粒子300可于第一表面210有足够的截面积,有助于进一步使光线从光取出层200入射至第一光学粒子300。较佳地,突出体积V2和本体积V1的比值可大于0.2且小于等于0.8。更佳地,突出体积V2和本体积V1的比值可为0.5。In addition, the first optical particle 300 has a volume V1. The first optical particle 300 protrudes from the first surface 210 of the light extraction layer 200 to have a protruding volume V2 (as shown in FIG. 3 ). The ratio of the protruding volume V2 to the native volume V1 is greater than 0 and less than 1. In this way, the first optical particle 300 can have a sufficient cross-sectional area on the first surface 210 , which is helpful to further make the light incident from the light extraction layer 200 to the first optical particle 300 . Preferably, the ratio of the protruding volume V2 to the main volume V1 may be greater than 0.2 and less than or equal to 0.8. More preferably, the ratio of the protruding volume V2 to the main volume V1 may be 0.5.

在本实施例中,第一光学粒子300突出于光取出层200的第一表面210的制作方式如下:于光源组件100涂布上光取出层200,再利用喷吐机(spraycoater)喷洒第一光学粒子300于光取出层200的第一表面210,之后再固化光取出层200而固定第一光学粒子300固定于光取出层200。上述制作方式有助于避免第一光学粒子300聚集于光取出层200的内部,进而避免产生光线散射不均匀的问题。In this embodiment, the first optical particles 300 protruding from the first surface 210 of the light extraction layer 200 are manufactured as follows: the light source assembly 100 is coated with the light extraction layer 200, and then the first optical particle 300 is sprayed by a spraycoater. The particles 300 are placed on the first surface 210 of the light extraction layer 200 , and then the light extraction layer 200 is cured to fix the first optical particles 300 on the light extraction layer 200 . The above-mentioned manufacturing method helps to prevent the first optical particles 300 from gathering inside the light extraction layer 200 , thereby avoiding the problem of uneven light scattering.

请参照图3。图3为根据本发明第一实施例的发光元件产生的光线出射至发光装置外部光路径示意图。在图3中,为方便说明只绘示了发光元件110发出的部分光线,但此光线路径仅辅助示意说明,并非用以限制此发明。Please refer to Figure 3. 3 is a schematic diagram of the light path from the light generated by the light-emitting element to the outside of the light-emitting device according to the first embodiment of the present invention. In FIG. 3 , for convenience of illustration, only part of the light emitted by the light emitting element 110 is shown, but the light path is only for schematic illustration, and is not intended to limit the present invention.

当发光元件110发出至少一光线B时,光线B经过发光元件110的出光面111和封装结构120而入射至光取出层200中。由于光取出层200的第二折射率n2大于封装结构120的第三折射率n3,藉此光取出层200有助于避免光线B自封装结构120入射回至光取出层200而产生全反射(Total internalreflection)。When the light emitting element 110 emits at least one light B, the light B passes through the light emitting surface 111 of the light emitting element 110 and the encapsulation structure 120 and is incident into the light extraction layer 200 . Since the second refractive index n2 of the light extraction layer 200 is greater than the third refractive index n3 of the encapsulation structure 120, the light extraction layer 200 helps prevent the light B from entering the encapsulation structure 120 back to the light extraction layer 200 and causing total reflection ( Total internal reflection).

当光线B自光取出层200射出至发光装置10外部时,光线B先自光取出层200入射至第一光学粒子300中,接着光线B再从第一光学粒子300入射至发光装置10外部。值得注意的是,光取出层200的第二折射率n2大于第一光学粒子300的第一折射率n1,且第一折射率n1大于空气的折射率。藉此,发光装置10于光取出层200的第一表面210具有较为缓和的折射率变化。When the light B is emitted from the light extraction layer 200 to the outside of the light emitting device 10 , the light B first enters the first optical particle 300 from the light extraction layer 200 , and then the light B enters from the first optical particle 300 to the outside of the light emitting device 10 . It should be noted that the second refractive index n2 of the light extraction layer 200 is greater than the first refractive index n1 of the first optical particle 300 , and the first refractive index n1 is greater than the refractive index of air. Thereby, the light emitting device 10 has relatively moderate refractive index changes on the first surface 210 of the light extraction layer 200 .

上述实施例提供的发光装置和并非用以限制本发明。以下将提供本发明的其他实施例。The light emitting devices provided in the above embodiments are not intended to limit the present invention. Other embodiments of the present invention will be provided below.

在第一实施例中,封装结构包含多个第一封装层和多个第二封装层,但其并非用以限制本发明。请参照图4。图4为根据本发明第二实施例的发光装置的剖切示意图。在本实施例中,封装结构120仅包含二第一封装层121和一第二封装层122。较靠近基板10a的第一封装层121直接接触发光元件110的出光面111。第二封装层122远离光取出层200的一侧直接接触下方的第一封装层121,并且远离基板10a的第一封装层121直接接触第二封装层122的第二顶面122a。光取出层200的第二表面220直接接触上方的第一封装层121。In the first embodiment, the encapsulation structure includes a plurality of first encapsulation layers and a plurality of second encapsulation layers, but it is not intended to limit the present invention. Please refer to Figure 4. FIG. 4 is a schematic cross-sectional view of a light emitting device according to a second embodiment of the present invention. In this embodiment, the encapsulation structure 120 only includes two first encapsulation layers 121 and one second encapsulation layer 122 . The first encapsulation layer 121 closer to the substrate 10 a directly contacts the light emitting surface 111 of the light emitting element 110 . The side of the second encapsulation layer 122 away from the light extraction layer 200 directly contacts the lower first encapsulation layer 121 , and the first encapsulation layer 121 away from the substrate 10 a directly contacts the second top surface 122 a of the second encapsulation layer 122 . The second surface 220 of the light extraction layer 200 directly contacts the upper first encapsulation layer 121 .

在第一实施例中,最靠近光取出层的第一封装层完全覆盖最靠近光取出层的第二封装层的第二顶面,但其并非用以限制本发明。请参照图5。图5为根据本发明第三实施例的发光装置的剖切示意图。在本实施例中,最靠近光取出层的200第一封装层121不完全覆盖最靠近光取出层200的第二封装层122的第二顶面122a。In the first embodiment, the first encapsulation layer closest to the light extraction layer completely covers the second top surface of the second encapsulation layer closest to the light extraction layer, but this is not intended to limit the present invention. Please refer to Figure 5. FIG. 5 is a schematic cross-sectional view of a light emitting device according to a third embodiment of the present invention. In this embodiment, the first encapsulation layer 121 closest to the light extraction layer 200 does not completely cover the second top surface 122a of the second encapsulation layer 122 closest to the light extraction layer 200 .

另外,在本实施例中,封装结构120包含多个第一封装层121以及多个第二封装层122,但本发明并不以此为限。在其他实施例中,第一封装层121以及第二封装层122的数量可视需求而作调整。In addition, in this embodiment, the encapsulation structure 120 includes a plurality of first encapsulation layers 121 and a plurality of second encapsulation layers 122 , but the present invention is not limited thereto. In other embodiments, the quantities of the first encapsulation layer 121 and the second encapsulation layer 122 can be adjusted according to requirements.

请参照图6。图6为根据本发明第四实施例的发光装置的剖切示意图。由于本实施例和第一实施例相近,故以下各实施例仅针对相异处作说明。Please refer to Figure 6. 6 is a schematic cross-sectional view of a light emitting device according to a fourth embodiment of the present invention. Since this embodiment is similar to the first embodiment, the following embodiments only describe the differences.

在本实施例中,光取出层200完全包覆光源组件100的发光元件110以及封装结构120。藉此,有助于提高发光装置10于一侧边500的光取出效率。In this embodiment, the light extraction layer 200 completely covers the light emitting element 110 and the encapsulation structure 120 of the light source assembly 100 . Thereby, it is helpful to improve the light extraction efficiency of the light emitting device 10 at one side 500 .

另外,在本实施例中,封装结构120包含多个第一封装层121以及多个第二封装层122,但本发明并不以此为限。在其他实施例中,第一封装层121以及第二封装层122的数量可视需求而作调整。In addition, in this embodiment, the encapsulation structure 120 includes a plurality of first encapsulation layers 121 and a plurality of second encapsulation layers 122 , but the present invention is not limited thereto. In other embodiments, the quantities of the first encapsulation layer 121 and the second encapsulation layer 122 can be adjusted according to requirements.

请参照图7。图7为根据本发明第五实施例的发光装置的剖切示意图。由于本实施例和第四实施例相近,故以下各实施例仅针对相异处作说明。Please refer to Figure 7. 7 is a schematic cross-sectional view of a light emitting device according to a fifth embodiment of the present invention. Since the present embodiment is similar to the fourth embodiment, the following embodiments only describe the differences.

在本实施例中,发光装置10更包含一缓冲层123。缓冲层123直接接触第一封装层121,并且缓冲层123完全包覆封装结构120。第一封装层121的材质为无机材质,且第二封装层122和缓冲层123的材质为有机材质。光取出层200的第二表面220直接接触缓冲层123。由于光取出层200一般而言含有有机材料,故和无机材料的附着性较差。是以,当第一封装层121为无机材质时不利于光取出层200牢固地贴附于第一顶面121a,故另增设缓冲层123以避免光取出层200直接接触无机材料的第一封装层121。藉此,光取出层200形成于封装结构120上时能较为平坦,厚度能较为均匀,并且附着性也能较佳。In this embodiment, the light emitting device 10 further includes a buffer layer 123 . The buffer layer 123 directly contacts the first encapsulation layer 121 , and the buffer layer 123 completely covers the encapsulation structure 120 . The material of the first encapsulation layer 121 is an inorganic material, and the materials of the second encapsulation layer 122 and the buffer layer 123 are organic materials. The second surface 220 of the light extraction layer 200 directly contacts the buffer layer 123 . Since the light extraction layer 200 generally contains organic materials, it has poor adhesion to inorganic materials. Therefore, when the first encapsulation layer 121 is made of an inorganic material, it is not conducive to the firm attachment of the light extraction layer 200 to the first top surface 121a, so a buffer layer 123 is added to prevent the light extraction layer 200 from directly contacting the first encapsulation of the inorganic material. Layer 121. Thereby, when the light extraction layer 200 is formed on the encapsulation structure 120, it can be relatively flat, the thickness can be relatively uniform, and the adhesion can also be better.

另外,在本实施例中,缓冲层123完全包覆这些第一封装层121和这些第二封装层122,但本发明并不以此为限。在其他实施例中,缓冲层123的覆盖区域取决于光取出层200的覆盖区域,因此缓冲层123可仅覆盖部分第一封装层121。In addition, in this embodiment, the buffer layer 123 completely covers the first encapsulation layers 121 and the second encapsulation layers 122 , but the present invention is not limited thereto. In other embodiments, the coverage area of the buffer layer 123 depends on the coverage area of the light extraction layer 200 , so the buffer layer 123 may only cover part of the first encapsulation layer 121 .

再者,在本实施例中,封装结构120包含多个第一封装层121以及多个第二封装层122,但本发明并不以此为限。在其他实施例中,第一封装层121以及第二封装层122的数量可视需求而作调整。Furthermore, in this embodiment, the encapsulation structure 120 includes a plurality of first encapsulation layers 121 and a plurality of second encapsulation layers 122 , but the present invention is not limited thereto. In other embodiments, the quantities of the first encapsulation layer 121 and the second encapsulation layer 122 can be adjusted according to requirements.

请参照图8。图8为根据本发明第六实施例的发光装置的剖切示意图。由于本实施例和第一实施例相近,故以下各实施例仅针对相异处作说明。Please refer to Figure 8. 8 is a schematic cross-sectional view of a light emitting device according to a sixth embodiment of the present invention. Since this embodiment is similar to the first embodiment, the following embodiments only describe the differences.

在本实施例中,发光装置10更包含多个第二光学粒子400。第二光学粒子400设置于光取出层200中而与第一表面210保持一距离。第二光学粒子400具有一第四折射率,第四折射率异于光取出层200的第二折射率,且第四折射率可与第一折射率相同。藉此,部分光线可被第二光学粒子400散射,有助于调整这些部分光线自光取出层200入射至发光装置10外部的入射角度,进一步避免这些部分光线于第一表面210产生全反射。In this embodiment, the light emitting device 10 further includes a plurality of second optical particles 400 . The second optical particle 400 is disposed in the light extraction layer 200 and keeps a distance from the first surface 210 . The second optical particle 400 has a fourth refractive index, the fourth refractive index is different from the second refractive index of the light extraction layer 200, and the fourth refractive index may be the same as the first refractive index. Thereby, part of the light can be scattered by the second optical particle 400 , which helps to adjust the incident angle of the part of the light from the light extraction layer 200 to the outside of the light-emitting device 10 , and further prevents the total reflection of the part of the light on the first surface 210 .

另外,在本实施例中,封装结构120包含多个第一封装层121以及多个第二封装层122,但本发明并不以此为限。在其他实施例中,第一封装层121以及第二封装层122的数量可视需求而作调整。In addition, in this embodiment, the encapsulation structure 120 includes a plurality of first encapsulation layers 121 and a plurality of second encapsulation layers 122 , but the present invention is not limited thereto. In other embodiments, the quantities of the first encapsulation layer 121 and the second encapsulation layer 122 can be adjusted according to requirements.

请参照图9。图9为根据本发明第七实施例的发光装置的剖切示意图。由于本实施例和第六实施例相近,故以下各实施例仅针对相异处作说明。Please refer to Figure 9. FIG. 9 is a schematic cross-sectional view of a light emitting device according to a seventh embodiment of the present invention. Since the present embodiment is similar to the sixth embodiment, the following embodiments only describe the differences.

在本实施例中,设置于光取出层200中的第二光学粒子400和光取出层200的第二表面220相切。藉此,发光装置10于光取出层200的第二表面220具有较为缓和的折射率变化,有助于避免部分光线自封装结构120入射至光取出层200时产生全反射,进一步提升发光装置10的光取出效率。In this embodiment, the second optical particles 400 disposed in the light extraction layer 200 are in contact with the second surface 220 of the light extraction layer 200 . In this way, the light-emitting device 10 has relatively moderate refractive index changes on the second surface 220 of the light extraction layer 200, which helps to avoid total reflection of part of the light from the encapsulation structure 120 when it enters the light-extraction layer 200, and further improves the light-emitting device 10. light extraction efficiency.

另外,在本实施例中,封装结构120包含多个第一封装层121以及多个第二封装层122,但本发明并不以此为限。在其他实施例中,第一封装层121以及第二封装层122的数量可视需求而作调整。In addition, in this embodiment, the encapsulation structure 120 includes a plurality of first encapsulation layers 121 and a plurality of second encapsulation layers 122 , but the present invention is not limited thereto. In other embodiments, the quantities of the first encapsulation layer 121 and the second encapsulation layer 122 can be adjusted according to requirements.

请参照图10。图10为根据本发明第八实施例的发光装置的剖切示意图。由于本实施例和第一实施例相近,故以下各实施例仅针对相异处作说明。Please refer to Figure 10. 10 is a schematic cross-sectional view of a light emitting device according to an eighth embodiment of the present invention. Since this embodiment is similar to the first embodiment, the following embodiments only describe the differences.

在本实施例中,和光取出层200的第二表面220直接接触的第一封装层121的第一顶面121a具有一抗反射结构1210。抗反射结构1210例如为微透镜数组或是锥状数组等次波长结构(Sub-wavelength Structure)。藉此,有助于提高发光装置10的光取出效率。In this embodiment, the first top surface 121 a of the first encapsulation layer 121 directly contacting the second surface 220 of the light extraction layer 200 has an anti-reflection structure 1210 . The anti-reflection structure 1210 is, for example, a sub-wavelength structure such as a microlens array or a cone array. This contributes to improving the light extraction efficiency of the light emitting device 10 .

另外,在本实施例中,封装结构120包含多个第一封装层121以及多个第二封装层122,但本发明并不以此为限。在其他实施例中,第一封装层121以及第二封装层122的数量可视需求而作调整。In addition, in this embodiment, the encapsulation structure 120 includes a plurality of first encapsulation layers 121 and a plurality of second encapsulation layers 122 , but the present invention is not limited thereto. In other embodiments, the quantities of the first encapsulation layer 121 and the second encapsulation layer 122 can be adjusted according to requirements.

上述各实施例以及其他实施例所揭露的发光装置皆可搭载于显示器中。请参照图11。图11为根据本发明的包含发光装置的显示器的立体示意图。如图11所示,一显示器1包含上述各实施例以及其他实施例中任一实施例提及的发光装置10、一偏光片20和一黏着层30。黏着层30设置于光取出层200的第一表面210。偏光片20设置于黏着层30而固定于第一表面210。黏着层30例如为光学胶(Optical Clear Adhensive,OCA)。显示器1例如为一主动矩阵有机发光二极管(Active-matrix organic light-emitting diode,AMOLED)显示器。The light-emitting devices disclosed in the above embodiments and other embodiments can all be mounted in a display. Please refer to Figure 11. FIG. 11 is a schematic perspective view of a display including a light emitting device according to the present invention. As shown in FIG. 11 , a display 1 includes the light emitting device 10 mentioned in any of the above embodiments and other embodiments, a polarizer 20 and an adhesive layer 30 . The adhesive layer 30 is disposed on the first surface 210 of the light extraction layer 200 . The polarizer 20 is disposed on the adhesive layer 30 and fixed on the first surface 210 . The adhesive layer 30 is, for example, optical clear adhesive (OCA). The display 1 is, for example, an active-matrix organic light-emitting diode (AMOLED) display.

综上所述,本发明揭露的发光装置以及包含此发光装置的显示器中,当光源组件产生的光线自光取出层入射至发光装置外部时,部分光线先自光取出层入射至第一光学粒子中,接着再从第一光学粒子入射至发光装置外部。由于光取出层的第二折射率大于第一光学粒子的第一折射率,且第一折射率大于空气的折射率,因此发光装置于第一表面具有较为缓和的折射率变化,有助于避免光线自光取出层入射至发光装置外部时产生全反射,进一步提升发光装置的光取出效率。To sum up, in the light-emitting device and the display including the light-emitting device disclosed in the present invention, when the light generated by the light source component enters the outside of the light-emitting device from the light-extracting layer, part of the light first enters the first optical particle from the light-extracting layer , and then incident from the first optical particle to the outside of the light-emitting device. Since the second refractive index of the light extraction layer is greater than the first refractive index of the first optical particle, and the first refractive index is greater than the refractive index of air, the light-emitting device has relatively moderate refractive index changes on the first surface, which helps to avoid When the light is incident from the light extraction layer to the outside of the light emitting device, total reflection occurs, which further improves the light extraction efficiency of the light emitting device.

虽然本发明以前述的较佳实施例揭露如上,然其并非用以限定本发明,任何熟悉本领域的相关技术人员,在不脱离本发明的精神和范围内,当可作些许的更动与润饰,但这些相应的更动与润饰都应属于本发明所附的权利要求的保护范围。Although the present invention is disclosed above with the foregoing preferred embodiments, it is not intended to limit the present invention. Any person familiar with the art may make some changes and modifications without departing from the spirit and scope of the present invention. Retouching, but these corresponding changes and modifications should belong to the scope of protection of the appended claims of the present invention.

Claims (21)

1.一种发光装置,其特征在于,包含:1. A lighting device, characterized in that it comprises: 一基板;a substrate; 一光源组件,包含一发光元件与一封装结构,该发光元件设置于该基板,该发光元件具有一出光面,且该封装结构设置于该出光面;A light source assembly, including a light emitting element and a packaging structure, the light emitting element is arranged on the substrate, the light emitting element has a light-emitting surface, and the packaging structure is arranged on the light-emitting surface; 一光取出层,设置于该光源组件的该封装结构,该光取出层具有相对的一第一表面和一第二表面,且该第二表面面向该光源组件;以及a light extraction layer disposed on the packaging structure of the light source module, the light extraction layer has a first surface and a second surface opposite to each other, and the second surface faces the light source module; and 多个第一光学粒子,嵌设于该光取出层并且突出于该第一表面;a plurality of first optical particles embedded in the light extraction layer and protruding from the first surface; 其中,该些第一光学粒子具有一第一折射率,该光取出层具有一第二折射率,该封装结构具有一第三折射率,该第一折射率大于空气的折射率,且该第二折射率大于该第一折射率与该第三折射率。Wherein, the first optical particles have a first refractive index, the light extraction layer has a second refractive index, the encapsulation structure has a third refractive index, the first refractive index is greater than the refractive index of air, and the first The second refractive index is greater than the first refractive index and the third refractive index. 2.如权利要求1所述的发光装置,其特征在于,该封装结构具有一外表面,且该外表面直接接触该光取出层的该第二表面。2. The light emitting device according to claim 1, wherein the encapsulation structure has an outer surface, and the outer surface directly contacts the second surface of the light extraction layer. 3.如权利要求1所述的发光装置,其特征在于,该封结构包含一第一封装层和一第二封装层,该第一封装层直接接触该第二封装层,且该光取出层的该第二表面直接接触该第一封装层。3. The light-emitting device according to claim 1, wherein the encapsulation structure comprises a first encapsulation layer and a second encapsulation layer, the first encapsulation layer directly contacts the second encapsulation layer, and the light extraction layer The second surface directly contacts the first encapsulation layer. 4.如权利要求1所述的发光装置,其特征在于,该封装结构包含多个第一封装层和多个第二封装层,该些第一封装层和该些第二封装层交互堆栈,且相邻的该第一封装层与该第二封装层直接接触,该光取出层的该第二表面直接接触最靠近该光取出层的该第一封装层。4. The light-emitting device according to claim 1, wherein the packaging structure comprises a plurality of first packaging layers and a plurality of second packaging layers, and the first packaging layers and the second packaging layers are stacked alternately, And the adjacent first encapsulation layer is in direct contact with the second encapsulation layer, and the second surface of the light extraction layer directly contacts the first encapsulation layer closest to the light extraction layer. 5.如权利要求4所述的发光装置,其特征在于,最靠近该光取出层的该第一封装层具有朝向该光取出层的一第一顶面,该光取出层的该第二表面直接接触该第一顶面,且该第一顶面具有一抗反射结构。5. The light-emitting device according to claim 4, wherein the first encapsulation layer closest to the light extraction layer has a first top surface facing the light extraction layer, and the second surface of the light extraction layer directly contacting the first top surface, and the first top surface has an anti-reflection structure. 6.如权利要求4所述的发光装置,其特征在于,最靠近该光取出层的该第二封装层具有朝向该光取出层的一第二顶面,且最靠近该光取出层的该第一封装层完全覆盖该第二顶面。6. The light-emitting device according to claim 4, wherein the second encapsulation layer closest to the light extraction layer has a second top surface facing the light extraction layer, and the second encapsulation layer closest to the light extraction layer The first encapsulation layer completely covers the second top surface. 7.如权利要求4所述的发光装置,其特征在于,该些第一封装层的材质皆为无机材质,且该些第二封装层的材质皆为有机材质。7. The light-emitting device according to claim 4, wherein the materials of the first encapsulation layers are all inorganic materials, and the materials of the second encapsulation layers are all organic materials. 8.如权利要求4所述的发光装置,其特征在于,该些第一封装层的材质皆为有机材质,且该些第二封装层的材质皆为无机材质。8. The light-emitting device according to claim 4, wherein the materials of the first encapsulation layers are all organic materials, and the materials of the second encapsulation layers are all inorganic materials. 9.如权利要求1所述的发光装置,其特征在于,更包含一缓冲层,其中该封装结构包含多个第一封装层和多个第二封装层,该些第一封装层和该些第二封装层交互堆栈,相邻的该第一封装层与该第二封装层直接接触,该缓冲层直接接触最靠近该光取出层的该第一封装层,且该光取出层的该第二表面直接接触该缓冲层。9. The light-emitting device according to claim 1, further comprising a buffer layer, wherein the encapsulation structure comprises a plurality of first encapsulation layers and a plurality of second encapsulation layers, the first encapsulation layers and the The second encapsulation layers are alternately stacked, the adjacent first encapsulation layer is in direct contact with the second encapsulation layer, the buffer layer is in direct contact with the first encapsulation layer closest to the light extraction layer, and the first encapsulation layer of the light extraction layer is The two surfaces directly contact the buffer layer. 10.如权利要求9所述的发光装置,其特征在于,该缓冲层完全包覆该封装结构。10. The light emitting device according to claim 9, wherein the buffer layer completely covers the encapsulation structure. 11.如权利要求9所述的发光装置,其特征在于,该些第一封装层的材质皆为无机材质,且该些第二封装层与该缓冲层的材质皆为有机材质。11. The light-emitting device according to claim 9, wherein the materials of the first encapsulation layers are all inorganic materials, and the materials of the second encapsulation layers and the buffer layer are both organic materials. 12.如权利要求1所述的发光装置,其特征在于,该光取出层完全包覆该光源组件。12. The light emitting device according to claim 1, wherein the light extraction layer completely covers the light source component. 13.如权利要求1所述的发光装置,其特征在于,该些第一光学粒子分别具有一粒径,该粒径大于等于0.1微米,且小于等于20微米。13 . The light-emitting device according to claim 1 , wherein the first optical particles each have a particle diameter greater than or equal to 0.1 micrometers and less than or equal to 20 micrometers. 14.如权利要求1所述的发光装置,其特征在于,该些第一光学粒子的材料为无机材料,且该无机材料包括氟化镁、氧化硅、氧化铝、氧化锌、氧化钛、硒化锌或氧化锆。14. The light-emitting device according to claim 1, wherein the material of the first optical particles is an inorganic material, and the inorganic material includes magnesium fluoride, silicon oxide, aluminum oxide, zinc oxide, titanium oxide, selenium Zinc or Zirconia. 15.如权利要求1所述的发光装置,其特征在于,该光取出层的材料为一有机无机复合材料,且该第二折射率大于等于1.65。15. The light-emitting device according to claim 1, wherein the material of the light extraction layer is an organic-inorganic composite material, and the second refractive index is greater than or equal to 1.65. 16.如权利要求1所述的发光装置,其特征在于,该些第一光学粒子分别具有一本体积,且分别突出于该第一表面而具有一突出体积,其中该突出体积和该本体积的比值大于0,且小于1。16. The light-emitting device according to claim 1, wherein the first optical particles each have a volume, and respectively protrude from the first surface to have a protruding volume, wherein the protruding volume and the protruding volume The ratio is greater than 0 and less than 1. 17.如权利要求16所述的发光装置,其特征在于,该突出体积和该本体积的比值为0.5。17. The light emitting device according to claim 16, wherein the ratio of the protruding volume to the intrinsic volume is 0.5. 18.如权利要求1所述的发光装置,其特征在于,更包含多个第二光学粒子,其中该些第二光学粒子设置于该光取出层中而与该第一表面保持一距离。18. The light-emitting device according to claim 1, further comprising a plurality of second optical particles, wherein the second optical particles are disposed in the light extraction layer and keep a distance from the first surface. 19.如权利要求18所述的发光装置,其特征在于,该些第二光学粒子具有一第四折射率,其中该第四折射率相异于该光取出层的该第二折射率。19. The light-emitting device according to claim 18, wherein the second optical particles have a fourth refractive index, wherein the fourth refractive index is different from the second refractive index of the light extraction layer. 20.如权利要求18所述的发光装置,其特征在于,该些第二光学粒子与该光取出层的该第二表面相切。20. The light emitting device according to claim 18, wherein the second optical particles are tangent to the second surface of the light extraction layer. 21.一种显示器,其特征在于,包含:21. A display, characterized in that it comprises: 一如权利要求1至20的任意一项所述的发光装置;A light emitting device as claimed in any one of claims 1 to 20; 一黏着层,设置于该第一表面;以及an adhesive layer disposed on the first surface; and 一偏光片,设置于该黏着层。A polarizer is arranged on the adhesive layer.
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