CN104613440B - A kind of heat abstractor of remote LED light fixture - Google Patents

Abstract

The invention relates to a heat dissipation device for a remote LED lamp, which includes an evaporator, a steam pipeline, a liquid pipeline and a condenser, wherein the evaporator is provided with a steam outflow interface and a liquid inflow interface, and the steam pipeline and the liquid The pipelines are remotely connected to the condenser through the steam outflow interface and the liquid inflow interface respectively, forming a closed heat dissipation circuit; the evaporator includes a heat-taking body and a liquid-absorbing wick, and the heat-taking body is provided with an accommodating space , the accommodating space is used for arranging the liquid-absorbing core, the shape of the heat-taking body is square, and the cross-section of the accommodating space is circular or oval. The cooling device can realize the separation of the condenser and the evaporator to realize long-distance heat dissipation, so that the ideal heat dissipation effect can also be achieved when the installation space around the LED lamp is limited, the temperature difference at the heat dissipation end is small, and the heat dissipation is long-distance.

Description

A cooling device for long-distance LED lamps

technical field

The invention belongs to the technical field of heat dissipation of electronic products, in particular to a heat dissipation device for long-distance LED lamps.

Background technique

The cooling of high-power electronic chips is a very important technical link in electronics, computers, communications and optoelectronic equipment. At present, the commonly used methods for heat dissipation of high-power electronic devices in the market include the following: (1) fan + radiator; (2) fan + heat pipe + radiator; (3) fan + liquid cooling technology. Although these methods can solve the heat dissipation problem of high-power devices to a certain extent, there are still the following disadvantages: (1) fan + heat sink, in order to enhance the heat dissipation capacity of the heat dissipation device, only by increasing the area of the heat dissipation fins and Increase the fan speed, resulting in loud noise, large and heavy cooling device, which is not conducive to installation and will generate great pressure on electronic devices; (2) fan + heat pipe + radiator, although it can solve the shortcomings in method 1 , but it will increase the complexity of the mechanism itself, the design and installation of heat pipes are often limited by the actual structure, and under the action of limited heat pipes, its heat dissipation capacity is still limited; 3) Liquid cooling technology surpasses the above two in terms of performance This way, and the potential of liquid cooling heat dissipation technology is very high. If a small liquid cooling heat dissipation device is optimized in performance, it can already dissipate 1kW of heat under the premise of controlling noise (the overall thermal resistance of the liquid cooling radiator can be as low as below 0.12°C/W). However, the mechanism of liquid cooling technology is extremely complicated. The pumps that drive the circulation of liquid working fluid and the lack of a pipeline connection technology that can completely guarantee no leakage will affect the actual service life of the liquid cooling device. The cost of the liquid cooling heat sink is the highest, which is more than 3 times that of the ordinary heat pipe radiator (under the same heat dissipation capacity).

As such, there is a loop heat pipe technology that can solve the above-mentioned deficiencies. Loop heat pipe technology was invented in 1974 and has been widely used in the aerospace field. In recent years, loop heat pipe technology has gradually entered the field of electronic chip heat dissipation. The loop heat pipe is a heat dissipation method that combines the advantages of heat pipes and liquid cooling technology while discarding their respective shortcomings. The heat dissipation potential is the same as that of liquid cooling technology. A compact micro-loop heat pipe can easily achieve 500W and above Excellent heat dissipation (the overall thermal resistance of the loop heat pipe can be as low as below 0.15°C/W), and its cost is much lower than that of liquid cooling technology. The loop heat pipe radiator also has the following advantages: (1) The performance is less affected by gravity than ordinary heat pipes; the structural shape can be diversified to meet different use requirements. Since the manufacturing process of the loop heat pipe is similar to that of ordinary heat pipes, its reliability and service life are the same as those of ordinary heat pipes and can be widely used in some demanding environments.

The traditional loop heat pipe radiator mainly includes an evaporator with a capillary structure, a steam pipe and a liquid pipe that provide working medium circulation, and a condenser that releases heat to the environment. When working, the bottom surface of the evaporator receives the heat transferred from the heat-generating device (for example, an electronic chip), the working medium evaporates inside the capillary structure, the steam leaves the evaporator, flows through the steam pipe to the finned condenser, and the steam is condensed Through the condenser, the heat is released to the ambient medium (such as air) flowing through the condenser, and the steam is transformed into a liquid after natural cooling or forced cooling by a fan, and the liquid returns to the evaporator through the liquid pipe under the action of capillary force, completing a thermodynamic The cycle, according to which the cycle goes on and on, continuously releases heat from the heating device to the surrounding air.

At present, there are also some patents on the use of loop heat pipes in the field of electronic heat dissipation, as disclosed in patent documents such as Chinese patent application numbers: 01259718.X, 200810028106.7 and 200910077583.7. The existing patent relates to the design of the evaporator, and its basic structure basically includes the following two forms: (1) cylinder type; (2) flat plate type. Among them, the cylindrical structure is the basic structure of the traditional loop heat pipe. There are currently two forms of flat plate structure: (1) disk type (disk type); (2) plate type (ZL01259718.X) made by micro-processing technology; (3) split plate type with bottom plate and cover structure (ZL200910077583.7).

Since the shape of an ordinary electronic chip is basically a square (cube or cuboid), the cylindrical evaporator is not conducive to contact with the flat surface of the chip due to the diameter of the cylinder, and the heat transfer effect is poor. The heat dissipation performance of the loop heat pipes of flat plate evaporators made by micro-processing technology has not yet reached the requirements for commercial use. However, the existing disc-shaped plate forms are complicated due to the manufacturing process of the evaporator, and additional space will be taken up during installation. Among them, the split plate structure of the bottom plate and the cover structure not only requires high processing accuracy and installation, but also is prone to problems with air tightness.

Moreover, at present, most of the heat dissipation for high-power electronic devices is to install the heat sink in the space where the heat-generating electronic devices are located for local heat dissipation. In this way, when the installation space around the heat-generating electronic device is limited, the temperature difference at the heat-dissipating end is small, and the heat is dissipated over a long distance, it is often impossible to meet the installation requirements of the heat-dissipating device and achieve an ideal heat-dissipating effect.

Contents of the invention

The technical problem to be solved by the present invention is to provide a heat dissipation device for long-distance LED lamps with simple structure, convenient processing and good airtightness.

In order to solve the above technical problems, the present invention provides a heat dissipation device for remote LED lamps, including an evaporator, a steam pipeline, a liquid pipeline and a condenser, wherein the evaporator is provided with a steam outflow interface and a liquid inflow interface, The steam pipeline and the liquid pipeline are connected to the condenser remotely through the steam outflow interface and the liquid inflow interface respectively, forming a closed cooling circuit; the evaporator includes a heat-taking body and a liquid-absorbing wick, The heating body is provided with an accommodating space for arranging the liquid-absorbing core, the shape of the heating body is square, and the cross-section of the accommodating space is circular or oval.

Optionally, a channel for steam discharge is provided on the wall of the accommodating space of the heat-taking body or on the liquid-absorbing core.

Optionally, the cross section of the channel is arched, rectangular, zigzag, circular, honeycomb or polygonal.

Optionally, there are two or more channels, and the two channels are directly provided with communicating channels.

Optionally, the cross-section of the liquid-absorbing core is circular or elliptical, and the liquid-absorbing core is in interference fit with the wall of the accommodating space of the heat-taking body.

Optionally, the liquid-absorbent core includes at least two layers, and the outermost layer of the liquid-absorbent core has a denser capillary diameter or channel than other layers.

Optionally, the wall of the accommodating space of the heat-taking body is provided with a zigzag or sharp knife-shaped steam discharge channel, and when the liquid-absorbing core is assembled into the accommodating space of the heat-taking body, the steam discharge channel The wall grooves are partially embedded in the outermost layer of the wick.

Optionally, a base is provided at one end of the liquid-absorbing core, the perimeter of the cross-section of the base is larger than the perimeter of the cross-section of the liquid-absorbing core, and a step is provided on the accommodating space wall at one end of the heat-taking body, so that The base of the liquid-absorbing core is arranged in the cavity formed by the step of the heat-taking body.

Optionally, the cross-section of the base of the liquid-absorbing core is circular or oval, and the base is in interference fit with the wall of the accommodation space of the heat-taking body.

Optionally, the evaporator also includes a bottom cover, the bottom cover is arranged on the end of the heat-taking body close to the base of the liquid-absorbing core, and the bottom cover, the base of the liquid-absorbing core and the heat-taking body contain A liquid storage chamber is arranged between the walls of the space.

Optionally, the evaporator further includes a bottom cover, the bottom cover is arranged on the end of the heat-taking body close to the base of the liquid-absorbing core, and a liquid storage chamber is provided between the bottom cover and the base of the liquid-absorbing core .

Optionally, the evaporator further includes a bottom cover, the bottom cover is arranged at an end of the heat-taking body close to the base of the liquid-absorbing core, and a liquid storage chamber is arranged in the bottom cover.

Optionally, a heat insulating block is further arranged between the base of the liquid-absorbing core and the liquid storage chamber.

Optionally, a heat insulating cavity is also provided between the heat insulating block and the base of the liquid-absorbing core.

Optionally, the bottom cover is provided with an interface connected with the liquid pipeline.

Optionally, the bottom cover is fixed to the heat-taking body by welding, screws and/or threads.

Optionally, the evaporator further includes a top cover, the top cover is arranged on the side where the heat-taking body is connected to the steam pipeline, and the top cover is provided with an interface connected to the steam pipeline.

Optionally, the liquid-absorbing core is a porous material made of metal powder, metal mesh or ceramic powder.

Optionally, the shape of the liquid-absorbent core is a revolving structure.

Optionally, a side of the liquid-absorbing core close to its base is provided with a blind hole, and one end of the liquid pipeline is arranged in the blind hole.

Optionally, the upper part of the liquid-absorbing core is provided with a concave liquid storage chamber.

Optionally, the pipe diameter of the steam outflow port is larger than the pipe diameter of the liquid inflow port.

Optionally, the steam pipeline and/or liquid pipeline is a bendable, deformable, stretchable or collapsible tube.

Optionally, the condenser is a cooling fin, the steam pipeline and/or the liquid pipeline is a slot structure, and the cooling fin can be nested in the slot structure.

The heat dissipation device of the remote LED lamp provided by the present invention includes an evaporator, a steam pipeline, a liquid pipeline and a condenser, wherein the evaporator is provided with a steam outflow interface and a liquid inflow interface, and the steam pipeline and the liquid pipeline The road is connected to the condenser remotely through the steam outflow interface and the liquid inflow interface respectively, forming a closed heat dissipation circuit; the evaporator includes a heat-taking body and a liquid-absorbing core, and the heat-taking body is provided with an accommodating space, The accommodating space is used for arranging the liquid-absorbing core, the shape of the heat-taking body is square, and the cross-section of the accommodating space is circular or oval. Since the shape of the heat-taking body adopts a square shape, it can closely fit with the quadrilateral (cube or cuboid) of an ordinary LED chip to realize real fusion. Simultaneously, the cross-section of the accommodation space of the heating body adopts a circular or elliptical shape, which can easily realize the sealing between the liquid-absorbing core and the heating body. It is convenient for processing, easy for industrialization, and can truly realize safe operation under high heat flux density. At the same time, since the evaporator is remotely connected to the condenser through a steam pipeline and a liquid pipeline, the condenser and the evaporator can be separated to realize long-distance heat dissipation. In this way, the installation space around the LED lamp is limited, and the heat dissipation end The ideal heat dissipation effect can also be achieved in the case of small temperature difference and long-distance heat dissipation. The heat dissipation device of the long-distance LED lamp is especially suitable for the situation where the space occupied by the evaporation surface is limited, and the condensation end has a heat dissipation space and a heat sink for natural cooling or forced cooling. For example, the heat dissipation device of the LED car headlight is this A typical application of the invention of the heat dissipation device of the long-distance LED lamp.

In a further technical solution, the cross-section of the liquid-absorbing core may be circular or elliptical, and the interference fit between the liquid-absorbing core and the wall of the accommodating space of the heat-taking body may be realized by machining. In order to realize complete sealing and no air leakage between the liquid-absorbing core and the space wall of the heat-taking body.

In another further technical solution, the liquid-absorbent core may comprise at least two layers, and the outermost layer of the liquid-absorbent core adopts a denser structure than the capillary apertures or channels of other layers, so as to generate sufficient capillary pressure head. The wall of the accommodating space of the heat-taking body may be provided with a zigzag or sharp knife-shaped steam discharge passage, and when the liquid-absorbing core is assembled into the accommodating space of the heat-taking body, the wall groove part of the steam discharge passage Embedded in the outermost layer of the liquid-absorbing core, it can also ensure that the space between the liquid-absorbing core and the heat-taking body is completely sealed without air leakage.

In a further technical solution, a base is provided at one end of the liquid-absorbing core, the perimeter of the cross-section of the base is larger than the perimeter of the cross-section of the liquid-absorbing core, and the wall of the accommodating space at one end of the heat-taking body is provided with Step, the base of the liquid-absorbing core is arranged in the cavity formed by the step of the heat-taking body, and the base is in interference fit with the wall of the accommodating space of the heat-taking body. The liquid reservoir is arranged outside the base, so that the liquid-absorbing core and the liquid reservoir can be completely sealed without air leakage, thereby overcoming the problem of the accommodating space wall between the liquid-absorbing core and the heat-taking body, and the completeness of the liquid-absorbing core and the liquid reservoir. The contradiction of sealing without air leakage makes the loop heat pipe evaporator have high thermal control performance, and at the same time realizes the organic fusion of the heat-taking body and the LED chip, and truly realizes safe operation under high heat flux density.

In a further technical solution, a heat insulating block may also be arranged between the base of the liquid-absorbing core and the liquid storage chamber. Further, a heat insulating cavity may also be provided between the heat insulating block and the base of the liquid-absorbing core. This can prevent the heat in the storage space of the heating body from being transferred to the liquid storage chamber to form heat leakage, which will cause the temperature of the liquid in the liquid storage chamber to rise, thereby reducing the heat dissipation effect, and even causing the system to collapse and fail.

In a further technical solution, the upper part of the liquid-absorbent core may be provided with a concave liquid storage chamber. When the loop heat pipe is not activated, liquid working fluid is stored in the concave liquid storage chamber. When the loop heat pipe is activated, the temperature of the evaporator rises, and before the effective circulation of the working fluid is formed, the liquid working medium stored in the concave liquid storage chamber can supplement the liquid-absorbing core to avoid the temperature of the evaporator rising continuously Too high to form an effective circulation of the working fluid, and even cause damage to the object being radiated.

Description of drawings

Fig. 1-Fig. 3 are structural diagrams showing the heat dissipation device of the long-distance LED lamp involved in this embodiment;

4 is a cross-sectional view of an evaporator showing the heat sink according to the present embodiment;

5-10 are cross-sectional views showing different kinds of liquid-absorbing cores of the evaporator involved in this embodiment;

FIG. 11 is a cross-sectional view of another evaporator showing the heat dissipation device according to this embodiment;

12 to 14 are cross-sectional views showing other types of evaporators according to this embodiment.

In the picture:

1 heating body 11 accommodation space 110 steps 121 steam outflow interface

122 Liquid inflow interface 13 Steam discharge channel 14 Groove 2 Liquid-absorbing core

21 The outermost layer of the liquid-absorbing core 22 The base of the liquid-absorbing core 23 Blind hole 24 Concave liquid storage chamber

3 Steam pipeline 4 Liquid pipeline 5 Bottom cover 6 Liquid storage chamber

7 heat insulation block 8 heat insulation cavity 9 top cover 100 evaporator 200 condenser

300 LED chips

detailed description

The present invention will be described in detail below in conjunction with the accompanying drawings. The description in this part is only exemplary and explanatory, and should not have any limiting effect on the protection scope of the present invention. In addition, those skilled in the art can make corresponding combinations of features in the embodiments in this document and in different embodiments according to the descriptions in this document.

Please refer to FIG. 1 to FIG. 14 , in which FIG. 1 , FIG. 2 and FIG. 3 are several different structural diagrams of the heat dissipation device of the remote LED lamp involved in this embodiment. The heat dissipation device includes an evaporator 100, a steam pipeline 3, a liquid pipeline 4 and a condenser 200, wherein the evaporator 100 is provided with a steam outflow interface 121 and a liquid inflow interface 122, and the steam pipeline 3 and the liquid The pipeline 4 is remotely connected to the condenser 200 through the steam outflow interface 121 and the liquid inflow interface 122 respectively, forming a closed cooling circuit. Wherein, the evaporator 100 includes a heat-taking body 1 and a liquid-absorbing core 2, and an accommodating space 11 may be provided in the heat-taking body 1, and the accommodating space 11 is used for setting the liquid-absorbing core 2, Both sides of the heat-taking body 1 are provided with interfaces, which are respectively used to connect the steam pipeline 3 and the liquid pipeline 4 (as shown in FIG. 9 ). The shape of the heat-taking body 1 is square, and the accommodating space 11 has a circular or elliptical cross section. The part of the evaporator 100 with sawtooth grooves is fastened with the LED chip 300 by heat-conducting silica gel and threads, so as to absorb the heat emitted by the LED chip 300 . The evaporator of the loop heat pipe is often used in the heat dissipation system of the LED chip. Since the shape of the general LED chip is a square, the existing cylindrical structure evaporator or flat plate structure evaporator cannot realize the heat-taking body and the liquid-absorbing core. Complete fusion of LED chips. However, the shape of the heat-taking body 1 in the present invention adopts a square shape, which can closely fit with the quadrangular body (cube or cuboid) of an ordinary LED chip, so as to realize real fusion. At the same time, the cross-section of the accommodation space 11 of the heat-taking body is designed to be circular or elliptical, so that it is easy to realize the sealing between the liquid-absorbing core and the heat-taking body, and also realize complete integration, so that the heat absorption under high heat flux can be truly realized. safe operation. At the same time, since the evaporator is remotely connected to the condenser through a steam pipeline and a liquid pipeline, the condenser and the evaporator can be separated to realize long-distance heat dissipation. In this way, the installation space around the LED lamp is limited, and the heat dissipation end The ideal heat dissipation effect can also be achieved in the case of small temperature difference and long-distance heat dissipation. For example, it can meet the heat dissipation requirements of LED headlights. Preferably, the liquid-absorbing core 2 can be made of porous material made of metal powder, metal mesh or ceramic powder, such as copper powder or aluminum powder. In addition, the outline of the liquid-absorbing core 2 can be a rotary structure, such as a cylinder or a cylinder-like body, which is easy to assemble and is more conducive to the cooperation and sealing between heat-taking bodies. When working, the evaporator 100 receives the heat transferred from the heat-generating device, the working medium evaporates inside the evaporator, the steam leaves the evaporator 100, flows to the condenser 200 through the steam pipeline 3, and the steam passes through the condenser 200 to dissipate the heat Released into the ambient medium (such as air) flowing through the condenser 200, the steam is condensed into a liquid after natural cooling or forced cooling by a fan, and the liquid is under the action of capillary force (provided by the wick of the evaporator) Return to the evaporator 100 via the liquid pipeline 3 to complete the second thermodynamic cycle, and the heat is continuously released from the heating device to the surrounding air according to the cycle. At the same time, since the cooling device of the loop heat pipe according to the present invention has the above-mentioned evaporator of the loop heat pipe, it can also produce corresponding technical effects, which will not be repeated here.

It should be noted that the condenser 200 can adopt flexible forms, which are also described in prior art documents, and will not be repeated here. The evaporator 100 and the coiled tube can be sealed well, and the goal of strengthening the heat dissipation by expanding the heat dissipation surface of the condenser 200 can also be used to enhance the heat dissipation by using the condenser 200 with an expanded area. Of course, it is also possible to connect the liquid pipeline with the liquid circuit connection pipe of the evaporator, and connect the steam pipeline with the steam outlet pipeline of the evaporator through a specific pipeline connection.

Please refer to FIG. 5 to FIG. 8 , in this embodiment, a steam discharge channel 13 may be provided on the wall of the accommodating space of the heat-taking body 1 or on the liquid-absorbing core 2 . When the evaporator is heated, the liquid working substance in the evaporator changes into a vapor state, and the vapor state working substance can be transported to the steam pipeline 3 through the steam discharge channel 13 . Preferably, the cross section of the steam discharge channel 13 may be arched, rectangular, zigzag, circular, honeycomb or polygonal. The number of the steam discharge passages 13 may be two or more, and a communicating channel 14 may also be provided between the two passages. This is more conducive to the circulation of the gaseous working medium, because when the gaseous working medium circulates in the steam discharge channel 13, if there are air bubbles in it, the problem of channel blockage will occur. It will stay and collapse at the channel 14 , so it can be seen that the provided channel 14 can prevent the problem of channel blockage due to the presence of air bubbles in the steam discharge channel 13 . It should be noted that the liquid working medium can be a liquid working medium under normal temperature and pressure, such as water, acetone, methanol and ethanol; it can also be a gaseous working medium under normal temperature and pressure, such as Freon R11, R22, R -134a, liquid ammonia, etc., can certainly be the combination of the above two or more liquid working fluids. It can be understood that as long as it is compatible with the environment and the material of the heat-absorbing device: it has the ability to control temperature, that is, it can achieve a large heat flux and absorb heat at a relatively low working temperature (such as evaporation at about 50°C). It can be used as the filling working medium of this system. Of course, the working fluid and its filling quantity will also affect the cooling device, for example, it may affect the stability of the cooling device, its adaptability to the environment, and the performance of safe operation. Therefore, it is necessary to select the corresponding type of working fluid according to the needs of the specific environment, and at the same time control the filling amount of the working fluid within a reasonable range, so as to improve the stability of the heat sink.

In this embodiment, the cross-section of the liquid-absorbing core 2 may be circular or oval, and the liquid-absorbing core 2 and the wall of the accommodating space of the heat-taking body 1 adopt an interference fit, which can be machined accomplish. In this way, the vaporous working medium can only flow to the steam pipeline 3 through the steam discharge channel 13, and prevent the vaporous working medium from flowing back through the gap between the liquid-absorbing core 2 and the accommodating space wall of the heat-taking body 1, causing steam Flowing chaos and crosstalk.

Please refer to Fig. 10, Fig. 11 and Fig. 12. In this embodiment, the liquid-absorbent core 2 may include at least two layers, and the outermost layer 21 of the liquid-absorbent core adopts the capillary diameter or channel of other layers. A denser structure to generate sufficient capillary pressure head. For example, the outermost layer 21 of the liquid-absorbent core is made of a softer material. Moreover, the outermost layer 21 of the liquid-absorbing core can adopt a material or structure with a larger pore size or a better liquid-absorbing capacity, which can improve the liquid-absorbing capacity of the liquid-absorbing core 2 . Preferably, the accommodating space wall of the heat-taking body 1 is provided with a zigzag or sharp knife-shaped steam discharge channel 13, when the liquid-absorbing core 2 is assembled into the accommodating space 11 of the heat-taking body 1, The wall grooves of the vapor escape channels 13 are partially embedded in the outermost layer 21 of the wick. In this way, structurally, the interference fit between the liquid-absorbing core 2 and the wall of the accommodating space of the heat-taking body 1 is realized, the processing cost is reduced, and the airtightness is better. At the same time, because the wall groove of the vapor discharge channel 13 is partially embedded in the outermost layer 21 of the liquid-absorbent core, the liquid in the liquid-absorbent core will be transported to the wall of the vapor discharge channel 13 faster and more In the groove, the heat dissipation efficiency of the heat dissipation system is further improved.

Please refer to Fig. 9, Fig. 10 and Fig. 12, in this embodiment, one end of the liquid-absorbing core 2 is provided with a base, and the cross-sectional perimeter of the base is larger than the cross-sectional perimeter of the liquid-absorbing core 2, A step 110 is provided on the wall of the accommodating space at one end of the heat-taking body 1 , and the liquid-absorbing core base 22 is set in the cavity formed by the step of the heat-taking body. Since the step 110 is provided, the airtightness between the base 22 of the liquid-absorbing core and the heat-taking body 1 will be better, so as to prevent the gaseous working medium from leaking from the base 22 of the liquid-absorbing core. Preferably, the cross-section of the liquid-absorbing core base 22 is circular or oval, and the liquid-absorbing core base 22 is in interference fit with the wall of the accommodation space of the heat-taking body 1 . In this way, the sealing performance between the base 22 of the liquid-absorbing core and the heat-taking body 1 can be further improved.

Please refer to Fig. 12, Fig. 13 and Fig. 14, in this embodiment, the evaporator may also include a bottom cover 5, and the bottom cover 5 is arranged on the heat-taking body 1 close to the base of the liquid-absorbing core 22, a liquid storage chamber 6 is provided between the bottom cover 5, the liquid-absorbing core base 22 and the space wall of the heat-taking body 1. In this way, during the working process, the liquid-absorbing core 2 can continuously absorb the liquid working medium from the liquid storage chamber 6, evaporate through the micro-liquid film, and generate phase change to absorb heat. The evaporator of the loop heat pipe in the present invention, the interference fit between the liquid-absorbing core 2 and the bottom cover 5 and the wall of the accommodating space of the heat-taking body 1, the gaseous working medium communicates with the steam pipeline 3 through the steam discharge channel 13, The liquid-absorbing core 2 and/or the bottom cover 5 completely isolate the steam discharge channel from the liquid storage chamber 6, so as to realize the one-way flow of the working medium inside the evaporator. In another embodiment of the present invention, the liquid storage chamber 6 can also be provided between the bottom cover 5 and the base 22 of the liquid-absorbing core, or the liquid storage chamber 6 can be provided in the bottom cover 5 .

Please refer to FIG. 9 , in this embodiment, a heat insulating block 7 may also be provided between the liquid-absorbing core base 22 and the liquid storage chamber 6 . Preferably, a heat insulating cavity 8 (as shown in FIG. 11 ) is also provided between the heat insulating block 7 and the liquid-absorbing core base 22 . In this way, the heat of the high-temperature vapor working medium in the accommodating space 11 can be prevented from being transferred to the liquid working medium in the liquid storage chamber 6, which will cause the temperature of the liquid working medium to rise and reduce the heat dissipation efficiency. In addition, the bottom cover 5 can be fixed to the heat-taking body 1 by welding, screws and/or threads. With the sealing between the existing bottom cover 5 and the heat-taking body 1, it is also convenient for disassembly and assembly.

Please refer to Fig. 12, in this embodiment, the evaporator may further include a top cover 9, the top cover 9 is arranged on the side where the heat-taking body 1 is connected to the steam pipeline 3, and the top cover 9 The cover 9 is provided with an interface connected with the steam pipeline 3 . The bottom cover 5 is provided with an interface connected with the liquid pipeline 4 . In this way, the connection and installation of the steam pipeline 3 and the liquid pipeline 4 will be more convenient.

Please refer to Fig. 9 and Fig. 10, in this embodiment, the side of the liquid-absorbing core 2 close to its base can be provided with a blind hole 23, and one end of the liquid pipeline 4 is arranged in the blind hole 23 . In this way, the liquid working medium can be directly delivered to the blind hole of the liquid-absorbing core 2, which is more conducive to the liquid-absorbing core to absorb the liquid working medium, keeps the liquid-absorbing core in a wet state at all times, and supplies liquid to the heating surface at any time, thereby improving heat dissipation efficiency.

Please refer to FIG. 13 , in this embodiment, the upper part of the liquid-absorbent core 2 may also be provided with a concave liquid storage cavity 24 . In this way, when the loop heat pipe is not activated, liquid working fluid is stored in the concave liquid storage chamber 24 . When the loop heat pipe is activated, the temperature of the evaporator rises, and before the effective circulation of the working fluid is formed, the liquid working medium stored in the concave liquid storage chamber 24 can supplement the liquid-absorbing core, so as to prevent the temperature of the evaporator from constantly increasing. If it rises, it cannot form an effective circulation of the working fluid, and even cause damage to the object to be radiated.

In addition, in this embodiment, the pipe diameter of the steam outflow port 121 is larger than the pipe diameter of the liquid inflow port 122 . In this way, the pipe diameter of the externally connected steam pipeline 3 is larger than the pipe diameter of the liquid pipeline 4, for example, the pipe diameter of the steam pipeline 3 is 10-20mm, and the pipe diameter of the liquid pipeline 4 is 4-9mm. Since the gaseous working medium has low density and large volume, and the liquid working medium has high density and small volume, this design will be more conducive to the thermodynamic cycle of the entire working medium. Moreover, in this embodiment, the material of the evaporator, the steam pipeline, the liquid pipeline and the condenser can all be made of aluminum, that is to say, the evaporator 100 is an aluminum shell, and the condenser 200 is made of an aluminum tube , The thermal diffusion surface of the condenser adopts aluminum fins, and the material of the entire heat dissipation device adopts an aluminum structure, which is convenient for manufacturing and can also reduce costs. Preferably, the steam pipeline 3 and/or the liquid pipeline 4 can be made of bendable, deformable, stretchable or foldable materials. The condenser 200 can be a heat dissipation fin, the steam pipeline 3 and/or the liquid pipeline 4 is a slot structure, and the heat dissipation fin can be nested in the slot structure (as shown in Fig. 2 and Fig. 3), the heat dissipation fins can be removed during storage, and the occupied space will be smaller. When in use, the heat dissipation fins can be nested in the slot structure, and the installation is also very convenient.

The above is only a preferred embodiment of the present invention, and it should be pointed out that for those of ordinary skill in the art, some improvements and modifications can be made without departing from the principle of the present invention. It should be regarded as the protection scope of the present invention.

Claims (22)

1. A cooling device for long-distance LED lamps, comprising an evaporator, a steam pipeline, a liquid pipeline and a condenser, wherein the evaporator is provided with a steam outflow interface and a liquid inflow interface, and the steam pipeline and the liquid pipeline are remotely connected to the condenser through the steam outflow interface and the liquid inflow interface respectively, forming a closed cooling circuit; The evaporator includes a heat-taking body and a liquid-absorbing core. The heat-taking body is provided with an accommodating space for setting the liquid-absorbing core. The shape of the heat-taking body is square. The cross-section of the accommodation space is circular or oval; The liquid-absorbing core includes at least two layers, the outermost layer of the liquid-absorbing core has a denser capillary aperture or channel than other layers, and the outermost layer of the liquid-absorbing core is made of a softer material; The wall of the accommodating space of the heat-taking body is provided with a zigzag or sharp knife-shaped steam discharge channel. When the liquid-absorbing core is assembled into the accommodating space of the heat-taking body, the wall groove part of the steam discharge channel Embedded in the outermost layer of the wick. 2 . The heat dissipation device according to claim 1 , wherein a passage for steam to drain is provided on the wall of the accommodating space of the heat-taking body or on the liquid-absorbing core. 3 . 3 . The heat dissipation device according to claim 2 , wherein the cross section of the channel is arched, rectangular, zigzag, quasi-circular, honeycomb or polygonal. 4 . 4. The heat dissipation device according to claim 2 or 3, wherein there are two or more channels, and the two channels are directly provided with communicating channels. 5. The heat dissipation device according to claim 2, wherein the cross-section of the liquid-absorbing core is circular or oval, and the liquid-absorbing core is in interference fit with the wall of the accommodation space of the heat-taking body . 6. The heat dissipation device according to claim 1, wherein a base is provided at one end of the liquid-absorbing core, the cross-sectional perimeter of the base is larger than the cross-sectional perimeter of the liquid-absorbing core, and the heat-taking body A step is arranged on the wall of the accommodating space at one end, and the base of the liquid-absorbing core is arranged in the cavity formed by the step of the heat-taking body. 7. The heat dissipation device according to claim 6, characterized in that, the cross section of the base of the liquid-absorbing core is circular or oval, and the base is in an interference fit with the accommodating space wall of the heat-taking body . 8. The heat dissipation device according to claim 7, wherein the evaporator further comprises a bottom cover, the bottom cover is arranged on the end of the heat-taking body close to the base of the liquid-absorbing core, and the bottom cover 1. A liquid storage chamber is arranged between the base of the liquid-absorbing core and the wall of the space for accommodating the heat-taking body. 9. The heat dissipation device according to claim 7, wherein the evaporator further comprises a bottom cover, the bottom cover is arranged on the end of the heat-taking body close to the base of the liquid-absorbing core, and the bottom cover A liquid storage cavity is arranged between the base of the liquid-absorbing core and the liquid-absorbing core. 10. The heat dissipation device according to claim 7, characterized in that, the evaporator further comprises a bottom cover, the bottom cover is arranged at the end of the heat-taking body close to the base of the liquid-absorbing core, and the bottom cover A liquid storage chamber is arranged inside. 11. The heat dissipation device according to any one of claims 8 to 10, characterized in that, a heat insulating block is further arranged between the base of the liquid-absorbing core and the liquid storage chamber. 12 . The heat dissipation device according to claim 11 , wherein a heat insulating cavity is further provided between the heat insulating block and the base of the liquid-absorbing core. 13 . 13. The heat dissipation device according to any one of claims 8 to 10, wherein an interface connected to the liquid pipeline is provided on the bottom cover. 14. The heat dissipation device according to claim 13, wherein the bottom cover is fixed to the heat-taking body by welding, screws and/or threads. 15. The heat dissipation device according to any one of claims 8 to 10, wherein the evaporator further comprises a top cover, and the top cover is arranged on the side where the heat-taking body is connected to the steam pipeline , the top cover is provided with an interface connected with the steam pipeline. 16. The heat dissipation device according to claim 15, characterized in that, the liquid-absorbing core is made of a porous material made of metal powder, metal mesh or ceramic powder. 17. The heat dissipation device according to claim 16, wherein the shape of the liquid-absorbing core is a revolving structure. 18 . The heat dissipation device according to claim 17 , wherein a blind hole is arranged on a side of the liquid-absorbing core close to its base, and one end of the liquid pipeline is arranged in the blind hole. 19. The heat dissipation device according to claim 1, characterized in that, a concave liquid storage cavity is provided on the upper part of the liquid-absorbing core. 20 . The heat dissipation device according to claim 1 , wherein a pipe diameter of the steam outflow port is larger than a pipe diameter of the liquid inflow port. 21 . 21. The heat dissipation device according to claim 1, wherein the steam pipeline and/or the liquid pipeline is a bendable, deformable, stretchable or foldable pipe. 22. The heat dissipation device according to claim 1, wherein the condenser is a heat dissipation fin, the steam pipeline and/or liquid pipeline is a slot structure, and the heat dissipation fin is nested in the In the slot structure described above.