CN104610925A - 一种石墨烯和液态金属复合式散热方法 - Google Patents
一种石墨烯和液态金属复合式散热方法 Download PDFInfo
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- CN104610925A CN104610925A CN201510042684.6A CN201510042684A CN104610925A CN 104610925 A CN104610925 A CN 104610925A CN 201510042684 A CN201510042684 A CN 201510042684A CN 104610925 A CN104610925 A CN 104610925A
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- liquid metal
- alloy
- graphene
- gallium
- indium
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- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 63
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 55
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 30
- 230000017525 heat dissipation Effects 0.000 title abstract 4
- 239000002905 metal composite material Substances 0.000 title abstract 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 16
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 15
- 239000000956 alloy Substances 0.000 claims abstract description 15
- 229910002056 binary alloy Inorganic materials 0.000 claims abstract description 5
- 229910052738 indium Inorganic materials 0.000 claims abstract description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000005516 engineering process Methods 0.000 claims description 17
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000012986 modification Methods 0.000 claims description 5
- 230000004048 modification Effects 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- PSMFTUMUGZHOOU-UHFFFAOYSA-N [In].[Sn].[Bi] Chemical compound [In].[Sn].[Bi] PSMFTUMUGZHOOU-UHFFFAOYSA-N 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 150000002736 metal compounds Chemical class 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 229910000645 Hg alloy Inorganic materials 0.000 claims description 2
- 229910000846 In alloy Inorganic materials 0.000 claims description 2
- 229910000978 Pb alloy Inorganic materials 0.000 claims description 2
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 2
- ROXNIEULHPKYMP-UHFFFAOYSA-N [Cu].[Bi].[In] Chemical compound [Cu].[Bi].[In] ROXNIEULHPKYMP-UHFFFAOYSA-N 0.000 claims description 2
- WGCXSIWGFOQDEG-UHFFFAOYSA-N [Zn].[Sn].[In] Chemical compound [Zn].[Sn].[In] WGCXSIWGFOQDEG-UHFFFAOYSA-N 0.000 claims description 2
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical group [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 claims description 2
- 238000005229 chemical vapour deposition Methods 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 238000009501 film coating Methods 0.000 claims description 2
- 238000002513 implantation Methods 0.000 claims description 2
- 238000005240 physical vapour deposition Methods 0.000 claims description 2
- 238000007750 plasma spraying Methods 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 230000008018 melting Effects 0.000 abstract description 3
- 238000002844 melting Methods 0.000 abstract description 3
- 239000002131 composite material Substances 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 229910002804 graphite Inorganic materials 0.000 description 6
- 239000010439 graphite Substances 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000002041 carbon nanotube Substances 0.000 description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510042684.6A CN104610925A (zh) | 2015-01-28 | 2015-01-28 | 一种石墨烯和液态金属复合式散热方法 |
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| CN201510042684.6A CN104610925A (zh) | 2015-01-28 | 2015-01-28 | 一种石墨烯和液态金属复合式散热方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104610925A true CN104610925A (zh) | 2015-05-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201510042684.6A Pending CN104610925A (zh) | 2015-01-28 | 2015-01-28 | 一种石墨烯和液态金属复合式散热方法 |
Country Status (1)
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| CN (1) | CN104610925A (zh) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108251063A (zh) * | 2016-12-28 | 2018-07-06 | 北京有色金属研究总院 | 一种高性能复合相变材料及其制备方法 |
| CN108644631A (zh) * | 2018-06-16 | 2018-10-12 | 复旦大学 | 石墨烯掺杂液态金属散热的高功率密度紫外led光源模组 |
| CN108738284A (zh) * | 2018-06-28 | 2018-11-02 | 深圳中讯源科技有限公司 | 一种石墨烯复合散热叠层结构及其制造方法 |
| CN110331405A (zh) * | 2019-07-18 | 2019-10-15 | 深圳前海量子翼纳米碳科技有限公司 | 一种液态金属与石墨复合散热膜及其制备方法 |
| KR102047831B1 (ko) * | 2019-07-09 | 2019-11-22 | 한국생산기술연구원 | 전자파 차폐 기능 및 방열 기능을 갖는 액체 금속 입자 코팅 시트 부재 및 그 제조 방법 |
| CN110607167A (zh) * | 2019-10-14 | 2019-12-24 | 苏州大学 | 一种含液态金属的三维复合散热浆料及由其制备的散热膜 |
| CN110660762A (zh) * | 2018-06-29 | 2020-01-07 | Abb瑞士股份有限公司 | 热传递结构、电力电子模块及其制造方法以及冷却元件 |
| TWI745774B (zh) * | 2019-11-01 | 2021-11-11 | 宏碁股份有限公司 | 分離式熱交換模組與複合式薄層導熱結構 |
| CN114628342A (zh) * | 2022-02-28 | 2022-06-14 | 东南大学 | 一种复合液态金属和热管的芯片散热器 |
| CN114901049A (zh) * | 2022-05-27 | 2022-08-12 | 东莞市光钛科技有限公司 | 一种在水平与垂直方向都为高导热的薄膜及其制备方法 |
| CN114921676A (zh) * | 2022-05-27 | 2022-08-19 | 江阴镓力材料科技有限公司 | 一种液态金属原位复合石墨烯热界面材料及其制备方法 |
| CN115084055A (zh) * | 2022-05-25 | 2022-09-20 | 东莞市光钛科技有限公司 | 一种极低热阻弹性导热复合体及其制备方法 |
| CN115503266A (zh) * | 2022-09-15 | 2022-12-23 | 安徽宇航派蒙健康科技股份有限公司 | 石墨烯液态金属复合硅胶垫片及其制备方法 |
| CN118879285A (zh) * | 2024-08-26 | 2024-11-01 | 山东高等技术研究院 | 一种低接触热阻导热薄膜及其制备方法与应用 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101418210A (zh) * | 2007-10-26 | 2009-04-29 | 中国科学院理化技术研究所 | 一种具有高传热性能的混有颗粒的金属液体的制备方法 |
| CN102569226A (zh) * | 2010-12-28 | 2012-07-11 | 上海杰远环保科技有限公司 | 一种便于固定的高散热涂材及其制造方法 |
| CN104218010A (zh) * | 2014-09-10 | 2014-12-17 | 北京依米康科技发展有限公司 | 一种金属热界面材料 |
-
2015
- 2015-01-28 CN CN201510042684.6A patent/CN104610925A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101418210A (zh) * | 2007-10-26 | 2009-04-29 | 中国科学院理化技术研究所 | 一种具有高传热性能的混有颗粒的金属液体的制备方法 |
| CN102569226A (zh) * | 2010-12-28 | 2012-07-11 | 上海杰远环保科技有限公司 | 一种便于固定的高散热涂材及其制造方法 |
| CN104218010A (zh) * | 2014-09-10 | 2014-12-17 | 北京依米康科技发展有限公司 | 一种金属热界面材料 |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108251063A (zh) * | 2016-12-28 | 2018-07-06 | 北京有色金属研究总院 | 一种高性能复合相变材料及其制备方法 |
| CN108644631A (zh) * | 2018-06-16 | 2018-10-12 | 复旦大学 | 石墨烯掺杂液态金属散热的高功率密度紫外led光源模组 |
| CN108644631B (zh) * | 2018-06-16 | 2023-10-03 | 复旦大学 | 石墨烯掺杂液态金属散热的高功率密度紫外led光源模组 |
| CN108738284A (zh) * | 2018-06-28 | 2018-11-02 | 深圳中讯源科技有限公司 | 一种石墨烯复合散热叠层结构及其制造方法 |
| CN108738284B (zh) * | 2018-06-28 | 2024-06-07 | 深圳中讯源科技有限公司 | 一种石墨烯复合散热叠层结构及其制造方法 |
| CN110660762A (zh) * | 2018-06-29 | 2020-01-07 | Abb瑞士股份有限公司 | 热传递结构、电力电子模块及其制造方法以及冷却元件 |
| KR102047831B1 (ko) * | 2019-07-09 | 2019-11-22 | 한국생산기술연구원 | 전자파 차폐 기능 및 방열 기능을 갖는 액체 금속 입자 코팅 시트 부재 및 그 제조 방법 |
| CN110331405B (zh) * | 2019-07-18 | 2022-02-25 | 深圳前海量子翼纳米碳科技有限公司 | 一种液态金属与石墨复合散热膜及其制备方法 |
| CN110331405A (zh) * | 2019-07-18 | 2019-10-15 | 深圳前海量子翼纳米碳科技有限公司 | 一种液态金属与石墨复合散热膜及其制备方法 |
| CN110607167A (zh) * | 2019-10-14 | 2019-12-24 | 苏州大学 | 一种含液态金属的三维复合散热浆料及由其制备的散热膜 |
| TWI745774B (zh) * | 2019-11-01 | 2021-11-11 | 宏碁股份有限公司 | 分離式熱交換模組與複合式薄層導熱結構 |
| CN114628342A (zh) * | 2022-02-28 | 2022-06-14 | 东南大学 | 一种复合液态金属和热管的芯片散热器 |
| CN114628342B (zh) * | 2022-02-28 | 2025-04-08 | 东南大学 | 一种复合液态金属和热管的芯片散热器 |
| CN115084055A (zh) * | 2022-05-25 | 2022-09-20 | 东莞市光钛科技有限公司 | 一种极低热阻弹性导热复合体及其制备方法 |
| CN114901049A (zh) * | 2022-05-27 | 2022-08-12 | 东莞市光钛科技有限公司 | 一种在水平与垂直方向都为高导热的薄膜及其制备方法 |
| CN114921676A (zh) * | 2022-05-27 | 2022-08-19 | 江阴镓力材料科技有限公司 | 一种液态金属原位复合石墨烯热界面材料及其制备方法 |
| CN115503266A (zh) * | 2022-09-15 | 2022-12-23 | 安徽宇航派蒙健康科技股份有限公司 | 石墨烯液态金属复合硅胶垫片及其制备方法 |
| CN118879285A (zh) * | 2024-08-26 | 2024-11-01 | 山东高等技术研究院 | 一种低接触热阻导热薄膜及其制备方法与应用 |
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Address after: 100040, room 368, Yuquan building, 3 Shijingshan Road, Beijing, Shijingshan District Applicant after: BEIJING TAIJIN TECHNOLOGY CO., LTD. Address before: 100040, room 368, Yuquan building, 3 Shijingshan Road, Beijing, Shijingshan District Applicant before: Beijing Emikon Science & Technology Development Co., Ltd. |
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Address after: 100040 Beijing Road, Shijingshan, Yuquan, No. 3, building on the west side of the building on the 9 floor Applicant after: BEIJING TAIJIN TECHNOLOGY CO., LTD. Address before: 100040, room 368, Yuquan building, 3 Shijingshan Road, Beijing, Shijingshan District Applicant before: BEIJING TAIJIN TECHNOLOGY CO., LTD. |
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