CN104486910A - Method used for manufacturing multi-layer circuit board by employing 3D printing technology - Google Patents
Method used for manufacturing multi-layer circuit board by employing 3D printing technology Download PDFInfo
- Publication number
- CN104486910A CN104486910A CN201410626086.9A CN201410626086A CN104486910A CN 104486910 A CN104486910 A CN 104486910A CN 201410626086 A CN201410626086 A CN 201410626086A CN 104486910 A CN104486910 A CN 104486910A
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- Prior art keywords
- circuit board
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- circuit
- powder
- insulating layer
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a method used for manufacturing a multi-layer circuit board by employing the 3D printing technology. The method is additionally provided with a heatproof insulation layer on the basis of an original printed circuit board. Raw material powder of the circuit comprises copper alloy powder and tin powder which are in a certain proportion, the heatproof insulation layer is ceramic powder, the 3D molding method is a laser irradiation molding method. During processing, the computer auxiliary manufacturing (CAM) technology is firstly utilized, circuit board design is accomplished on computer software and is transmitted to a 3D printer. The ceramic powder is fixed on the circuit board to form the heatproof insulation layer by utilizing the laser 3D printer, circuit molding of the powder is directly carried out on the heatproof insulation layer base body by utilizing the 3D printing technology, the steps above are repeated, and thereby the multi-layer circuit board is formed. Compared with a traditional printed circuit board, the multi-layer circuit board can be rapidly produced in a lab or under the small-batch production condition, moreover, the circuit does not easily generate defects, cost is low, response is rapid, equipment investment is small, and the method employing the 3D printing technology provides feasible small-batch customized production.
Description
Technical field:
The present invention relates to a kind of method adopting 3D printing technique to make multilayer circuit board, belong to electronic circuit processing technique field.
Background technology:
3D prints, i.e. the one of rapid shaping technique, and it is a kind of based on mathematical model file, uses powdery metal or plastics etc. can jointing material, is carried out the technology of constructed object by the mode successively printed.3D prints and normally adopts digital technology file printing machine to realize.The field such as Making mold, industrial design of being everlasting is used to modeling, after gradually for the direct manufacture of some products, had the parts using this technology to print.This technology is at jewelry, footwear, industrial design, building, engineering and construction (AEC), automobile, and Aero-Space, dentistry and medical industries, education, GIS-Geographic Information System, civil engineering, gun and other field are applied all to some extent.
Circuit board can be described as printed substrate or printed circuit board (PCB), and English name is (Printed Circuit Board) PCB.Circuit board systems is categorized as following three kinds: single sided board Single-Sided Boards single sided board has many restrictions strictly (because only have one side in designed lines, can not hand between wiring and must around path alone), so only have early stage circuit just to use this kind of plank.There is wiring on the two sides of this circuit board of double sided board Double-Sided Boards.But with the wire on two sides, suitable circuit must be had between two sides to connect." bridge " between this circuit is called guide hole (via).Guide hole is on PCB, and be full of or the duck eye of coated with metal, it can be connected with the wire on two sides.Because the area ratio single sided board of double sided board is large one times, and because wiring can intermesh (can around to another side), it is more suitable for being used on the circuit more complicated than single sided board.When more complicated application demand, circuit can be arranged to the structure of multilayer and press together, and builds each layer circuit of through hole circuit communication at interlayer cloth.Copper clad laminate first cuts into the size of applicable processing.Usually first by the method such as brushing, microetch, plate face Copper Foil need be done suitable roughening treatment before basal plate film pressing, then with suitable temperature and pressure by closely sealed for dry film photoresistance attaching on it.The substrate posting dry film photoresistance is sent in ultraviolet exposure machine and exposes, photoresistance can produce polymerization reaction (dry film in this region will be retained and get off to be used as etching resist in development after a while, erosion copper step) after egative film transmission region is subject to Ultraviolet radiation, and is passed on the dry film photoresistance of plate face by the circuit image on egative film.After tearing the protection glued membrane on face off, first with aqueous sodium carbonate, the area development not by illumination on face is removed, then use hydrochloric acid and hydrogen peroxide mixed solution by exposed Copper Foil erosion removal out, form circuit.Last again with the dry film photoresistance eccysis that sodium hydrate aqueous solution will be retired from political life after winning tremendous successes.Internal layer circuit plate more than six layers (containing) is gone out to the riveted datum hole of interlayer circuit contraposition with Automatic position punching pin hole machine.In order to increase the area that can connect up, more single or two-sided wiring plates used by multi-layer sheet.Multi-layer sheet uses several pieces double sided boards, and glutinous jail (pressing) put a layer insulating between every laminate after.Which floor independently wiring layer is the number of plies of plank just represented, and the usual number of plies is all even number, and comprises outermost two-layer.Most motherboard is all the structure of 4 to 8 layers, but technically can accomplish the pcb board of nearly 100 layers.Large-scale supercomputer uses the motherboard of suitable multilayer mostly, but because this kind of computer can replace with the cluster of many common computer, super multi-layer sheet is not employed gradually.Because each layer in PCB combines all closely, generally not too easily find out actual number, if but you examine motherboard, perhaps can find out.The Automatic Measurement Technique of circuit board is applied along with the introducing of surface mounting technology, and the packaging density of circuit board is rapidly increased.Therefore, even if for the circuit board of not high, the general quantity of density, the automatic detection of circuit board is still not basic, and is economical.In the circuit board detecting of complexity, two kinds of common methods are needle-bar method of testing and two probe or flying probe method.
The research of the domestic automatic checkout system to printed circuit board (PCB) approximately starts from mid-term at the beginning of the nineties, also at the early-stage.What the scientific research institutions being engaged in this respect research also compared lacks, and because be subject to the impact of various factors, the research for the automatic optical detecting system of defect of printed circuit board also rests on the level of a relative infancy.Just because of the automatic checkout system of external printed circuit board (PCB) is too expensive, and the domestic automatic checkout equipment also not developing truly printed circuit board (PCB), so the way that domestic most board production producer still adopts artificial magnifying glass or projecting apparatus to check carries out inspection side.Because hand inspection labour intensity is large, eyes easily produce fatigue, and percentage of omisson of examination is very high.And along with electronic product is towards miniaturized, digital development, printed circuit board also towards high density, high accuracy development, adopts the method for desk checking, substantially cannot realize.To more high density and precision circuits plate (0.12 ~ 0.10mm), oneself cannot check completely.The backwardness of detection means, causes the conforming product rate of current domestic multi-layer sheet (8-12 layer) to be only 50 ~ 60%.
Summary of the invention:
In view of the deficiency of above technology, the invention provides a kind of method adopting 3D printing technique to make multilayer circuit board, first its technical scheme for utilize computer-aided manufacture (CAM) technology, and on computer software, completing circuit plate designs, and is sent to 3D printer.On the basis of original printed circuit board (PCB), on the basis of original printed circuit board (PCB), adopt 3D printing technique to print heat-resistant insulating layer, then on the insulating layer by 3D printing technique print circuit, and so forth, form multilayer board.
Method heat-resistant insulating layer raw material used is ceramic powders, optional aluminium oxide ceramics, magnesia ceramics, silicon nitride ceramics, aluminium nitride ceramics, silicon carbide ceramics etc.
Circuit material powder used is the tin powder of copper alloy powder proportioning some, to improve the formability of alloying component, does not affect its electric conductivity simultaneously.The proportioning of copper alloy and tin is between 99:1 ~ 9:1.
Heat-resistant insulating layer 3D printing shaping method used is selective laser sintering (SLS).Circuit board alloy powder 3D printing shaping method used is direct metal laser sintering (DMLS).
For multilayer circuit, method directly can print second layer heat-resistant insulating layer on circuit board basis, then prints second layer circuit board, and so forth, usedly to process raw material, technique is identical with ground floor.Finally, multilayer circuit board is formed.
After all circuit printings are complete, continue to print one deck ceramic powders at outermost layer, do Wear-resistant Treatment.
Beneficial effect:
The inventive method compares traditional printed circuit board (PCB), multilayer circuit board can be generated fast under the condition of laboratory or small lot batch manufacture, circuit not easily produces defect simultaneously, cost is low, reaction is fast, equipment investment is little, prepares printed circuit board (PCB) provide a kind of feasible small lot customization production method for 3D printing technique.
Accompanying drawing illustrates:
The 3 layer printed circuit version schematic diagrames of Fig. 1 made by 3D printing.
Reference numeral: 1 substrate; 2 heat-resistant insulating layers; 3 print circuits; 4 protection wearing layers.
Embodiment:
For better the present invention being described, be convenient to understand technical scheme of the present invention, typical but non-limiting embodiment of the present invention is as follows.
Use protel DXP software, design 3 layer circuit boards, and convert board design to Gerber data format, be then sent to laser 3D printer.
Heat-resistant insulating layer raw material is alumina ceramic powder; Circuit material powder proportioning is 95%Cu alloy, 5% leypewter.
Adopt laser 3D printer, use selective laser sintering (SLS) method that ceramic powders is shaping, form heat-resistant insulating layer and protective layer, use direct metal laser sintering (DMLS) method shaping circuit.And so forth, finally printing is completed.
Applicant states, above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made, all should be considered as belonging to protection scope of the present invention.
Claims (6)
1. the method adopting 3D printing technique to make multilayer circuit board, it is characterized in that: add and first utilize computer-aided manufacture (CAM) technology man-hour, completing circuit plate design on computer software, and be sent to 3D printer, on the basis of original printed circuit board (PCB), 3D printing technique is adopted to print heat-resistant insulating layer, then on the insulating layer by 3D printing technique print circuit, and so forth, multilayer board is formed.
2. the part preparation method according to right 1, is characterized in that: method heat-resistant insulating layer raw material used is ceramic powders, optional aluminium oxide ceramics, magnesia ceramics, silicon nitride ceramics, aluminium nitride ceramics, silicon carbide ceramics etc.
3. the part preparation method according to right 1, it is characterized in that: circuit material powder used is the tin powder of copper alloy powder proportioning some, to improve the formability of alloying component, do not affect its electric conductivity, the proportioning of copper alloy and tin is between 99:1 ~ 9:1 simultaneously.
4. the part preparation method according to right 1, is characterized in that: heat-resistant insulating layer 3D printing shaping method used is selective laser sintering (SLS), and circuit board alloy powder 3D printing shaping method used is direct metal laser sintering (DMLS).
5. the part preparation method according to right 1, it is characterized in that: for multilayer circuit, method directly can print second layer heat-resistant insulating layer on circuit board basis, then second layer circuit board is printed, and so forth, usedly to process raw material, technique is identical with ground floor, finally, form multilayer circuit board.
6. the part preparation method according to right 1, is characterized in that: after all circuit printings are complete, continue to print one deck ceramic powders, do Wear-resistant Treatment at outermost layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410626086.9A CN104486910A (en) | 2014-11-07 | 2014-11-07 | Method used for manufacturing multi-layer circuit board by employing 3D printing technology |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410626086.9A CN104486910A (en) | 2014-11-07 | 2014-11-07 | Method used for manufacturing multi-layer circuit board by employing 3D printing technology |
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| CN104486910A true CN104486910A (en) | 2015-04-01 |
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| CN201410626086.9A Pending CN104486910A (en) | 2014-11-07 | 2014-11-07 | Method used for manufacturing multi-layer circuit board by employing 3D printing technology |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104959600A (en) * | 2015-06-25 | 2015-10-07 | 武汉大学 | Preparation method for planar-type oxygen sensor based on femtosecond laser composite technology |
| CN105704934A (en) * | 2016-01-28 | 2016-06-22 | 维京精密钢模（惠州）有限公司 | A method of manufacturing a PCB through utilization of 3D printing technology |
| CN106211622A (en) * | 2016-08-05 | 2016-12-07 | 华中科技大学 | A composite 3D printing method for embedded circuit boards |
| CN106507579A (en) * | 2016-11-30 | 2017-03-15 | 上海摩软通讯技术有限公司 | Integrated circuit board manufacturing method and device based on 3D printing technique |
| CN106781269A (en) * | 2017-03-31 | 2017-05-31 | 威洛克（深圳）智能科技有限公司 | Anti- using 3D printing realization frees electronic wrist strap and implementation method |
| CN106885496A (en) * | 2017-03-30 | 2017-06-23 | 中国工程物理研究院化工材料研究所 | Metal bridge transducing unit and its manufacture method |
| CN107199337A (en) * | 2016-03-16 | 2017-09-26 | 华邦电子股份有限公司 | The forming method of metallic conducting wire structure |
| TWI606876B (en) * | 2016-03-16 | 2017-12-01 | 華邦電子股份有限公司 | Method of forming metal line structure |
| CN107466167A (en) * | 2017-08-10 | 2017-12-12 | 上海幂方电子科技有限公司 | A kind of method that inkjet printing prepares flexible printed multilayer circuit board |
| CN109246939A (en) * | 2018-09-26 | 2019-01-18 | 有研粉末新材料（北京）有限公司 | A kind of method of increasing material manufacturing copper circuit board pattern |
| CN109548301A (en) * | 2018-12-25 | 2019-03-29 | 中国电子科技集团公司第三十研究所 | A kind of electronic circuit 3D printing method based on FR-4 substrate |
| CN110572939A (en) * | 2019-08-19 | 2019-12-13 | 深南电路股份有限公司 | 3D printing circuit board and method thereof |
| CN110901071A (en) * | 2019-11-28 | 2020-03-24 | 武汉科技大学 | Method, system and 3D printer for 3D printing circuit board |
| EP3656486A4 (en) * | 2017-07-18 | 2021-01-06 | Fukuda Metal Foil & Powder Co., Ltd. | Copper powder for additive manufacturing, and additive manufactured product |
| CN113290843A (en) * | 2021-05-12 | 2021-08-24 | 上海趣立信息科技有限公司 | Preparation method and system of 3D printing AR/VR equipment circuit board |
| CN113733294A (en) * | 2021-08-25 | 2021-12-03 | 杭州正向增材制造技术有限公司 | Three-dimensional circuit construction method and three-dimensional printer |
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| CN103963138A (en) * | 2013-01-31 | 2014-08-06 | 咸阳陶瓷研究设计院 | Method for forming sanitary ceramics by three-dimensional printing |
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| CN103880478A (en) * | 2012-12-21 | 2014-06-25 | 比亚迪股份有限公司 | Ceramic surface selective metallization method and ceramic |
| CN103963138A (en) * | 2013-01-31 | 2014-08-06 | 咸阳陶瓷研究设计院 | Method for forming sanitary ceramics by three-dimensional printing |
| CN103317590A (en) * | 2013-06-26 | 2013-09-25 | 大连理工大学 | Laser 3D (three-dimensional) printing method of ceramic functional gradient component |
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Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104959600A (en) * | 2015-06-25 | 2015-10-07 | 武汉大学 | Preparation method for planar-type oxygen sensor based on femtosecond laser composite technology |
| CN105704934A (en) * | 2016-01-28 | 2016-06-22 | 维京精密钢模（惠州）有限公司 | A method of manufacturing a PCB through utilization of 3D printing technology |
| CN107199337A (en) * | 2016-03-16 | 2017-09-26 | 华邦电子股份有限公司 | The forming method of metallic conducting wire structure |
| CN107199337B (en) * | 2016-03-16 | 2020-05-01 | 华邦电子股份有限公司 | Method for forming metal wire structure |
| TWI606876B (en) * | 2016-03-16 | 2017-12-01 | 華邦電子股份有限公司 | Method of forming metal line structure |
| CN106211622B (en) * | 2016-08-05 | 2018-08-03 | 华中科技大学 | A kind of compound 3D printing method of embedded circuit board |
| CN106211622A (en) * | 2016-08-05 | 2016-12-07 | 华中科技大学 | A composite 3D printing method for embedded circuit boards |
| CN106507579A (en) * | 2016-11-30 | 2017-03-15 | 上海摩软通讯技术有限公司 | Integrated circuit board manufacturing method and device based on 3D printing technique |
| CN106885496A (en) * | 2017-03-30 | 2017-06-23 | 中国工程物理研究院化工材料研究所 | Metal bridge transducing unit and its manufacture method |
| CN106781269A (en) * | 2017-03-31 | 2017-05-31 | 威洛克（深圳）智能科技有限公司 | Anti- using 3D printing realization frees electronic wrist strap and implementation method |
| US11752556B2 (en) * | 2017-07-18 | 2023-09-12 | Fukuda Metal Foil & Powder Co., Ltd. | Lamination shaping copper powder and laminated and shaped product |
| EP3656486A4 (en) * | 2017-07-18 | 2021-01-06 | Fukuda Metal Foil & Powder Co., Ltd. | Copper powder for additive manufacturing, and additive manufactured product |
| CN107466167A (en) * | 2017-08-10 | 2017-12-12 | 上海幂方电子科技有限公司 | A kind of method that inkjet printing prepares flexible printed multilayer circuit board |
| CN109246939A (en) * | 2018-09-26 | 2019-01-18 | 有研粉末新材料（北京）有限公司 | A kind of method of increasing material manufacturing copper circuit board pattern |
| CN109246939B (en) * | 2018-09-26 | 2020-08-11 | 有研粉末新材料（北京）有限公司 | Method for manufacturing copper circuit board pattern in additive mode |
| CN109548301B (en) * | 2018-12-25 | 2021-02-12 | 中国电子科技集团公司第三十研究所 | Electronic circuit 3D printing method based on FR-4 substrate |
| CN109548301A (en) * | 2018-12-25 | 2019-03-29 | 中国电子科技集团公司第三十研究所 | A kind of electronic circuit 3D printing method based on FR-4 substrate |
| CN110572939A (en) * | 2019-08-19 | 2019-12-13 | 深南电路股份有限公司 | 3D printing circuit board and method thereof |
| CN110901071A (en) * | 2019-11-28 | 2020-03-24 | 武汉科技大学 | Method, system and 3D printer for 3D printing circuit board |
| CN113290843A (en) * | 2021-05-12 | 2021-08-24 | 上海趣立信息科技有限公司 | Preparation method and system of 3D printing AR/VR equipment circuit board |
| CN113733294A (en) * | 2021-08-25 | 2021-12-03 | 杭州正向增材制造技术有限公司 | Three-dimensional circuit construction method and three-dimensional printer |
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Application publication date: 20150401 |