CN104425897B - Cross type transmission module and combination method thereof - Google Patents

Abstract

A cross transmission module and a combination method of the cross transmission module. The combination method of the cross transmission module comprises: providing a first circuit board and a second circuit board, wherein the first circuit board comprises a first antenna, and the second circuit board comprises a first groove and a second antenna; and partially passing the first circuit board through the first groove along an insertion direction so that the first circuit board is combined with the second circuit board, wherein the first circuit board is located on a first plane, and the second circuit board is located on a second plane, and there is an angle between the insertion direction and the second plane, and the angle is not zero. The present invention can provide a significant gain value improvement at a low cost.

Description

Crossover transmission module and combination method of crossover transmission module

technical field

The invention relates to a cross-type transmission module and a combination method of the cross-type transmission module, in particular to a cross-type transmission module with relatively high gain and a combination method of the cross-type transmission module.

Background technique

The Long Term Evolution (LTE) technology mostly uses a directional dipole antenna (directional dipole antenna) for signal transmission, and the directional dipole antenna is mainly arranged on a cross-type transmission module. The cross transmission module generally has two circuit boards crossing each other and a reflector, and the circuit board is fixed on the reflector. In the known technology, a groove extending along the length direction of the circuit board is formed on the circuit board, and the groove is located at the center of the circuit board, whereby two circuit boards can be cross-bonded with each other. However, the location of the trench limits space usage on the circuit board, creating design challenges.

Therefore, it is necessary to provide a cross-connect transmission module and a method for combining the cross-transmission modules to solve the above problems.

Contents of the invention

In order to solve the problems of the known technologies, the present invention provides a method for combining cross-transmission modules, which includes the following steps. First, a first circuit board and a second circuit board are provided, wherein the first circuit board includes a first antenna, and the second circuit board includes a first groove and a second antenna; secondly, the second circuit board A circuit board partially passes through the first groove along an insertion direction, so that the first circuit board is combined with the second circuit board, wherein the first circuit board is located on a first plane, and the second circuit board Located on a second plane, there is an included angle between the insertion direction and the second plane, and the included angle is not zero degrees.

The present invention also provides a method for assembling a cross-type transmission module. The method for assembling the cross-type transmission module includes: providing a first circuit board and a second circuit board, wherein the first circuit board includes a first antenna, The second circuit board includes a first groove and a second antenna; and the first circuit board is partially passed through the first groove along an insertion direction, so that the first circuit board is combined with the second circuit board , wherein, the first circuit board is located on a first plane, the second circuit board is located on a second plane, there is an included angle between the insertion direction and the second plane, and the included angle is not zero degrees .

The present invention also provides a cross-type transmission module, the cross-type transmission module includes: a first circuit board, the first circuit board includes a first antenna and a first pointer; and a second circuit board, the first circuit board The two circuit boards include a first groove, a second antenna and a second pointer, wherein the first circuit board partially passes through the first groove, so that the first circuit board is combined with the second circuit board , wherein the first circuit board is located on a first plane, the second circuit board is located on a second plane, wherein the first director is parallel to the first antenna, and the second director is parallel to the The second antenna, the first director and the second director are respectively continuous microstrip structures.

Applying the cross-type transmission module and the combination method thereof according to the embodiments of the present invention, the first circuit board partially passes through the first groove along the insertion direction, so that the first circuit board is combined with the second circuit board, and the The insertion direction is perpendicular to the surface of the second circuit board. Compared with the traditional up-and-down cross-bonding design, the embodiment of the present invention adopts a lateral cross-bonding design, whereby the size and position of the first groove (combining groove) on the circuit board can be appropriately designed , the present invention provides greater design flexibility. In addition, in the traditional design of cross-joint up and down, due to the long length of the joint groove, it is impossible to set the pointer (the pointer will be cut off by the joint groove). In the embodiment of the present invention, due to the design of lateral cross-bonding, a pointer can be provided, and the length of the pointer can be close to the width of the circuit board. The setting of the pointer can increase the gain value of the cross transmission module. The interleaved transmission module of the embodiment of the present invention can provide a large gain value improvement at a low cost.

Description of drawings

Fig. 1A shows the interleaved transmission module of the embodiment of the present invention;

FIG. 1B shows another perspective of the cross-transmission module of the embodiment of the present invention;

Fig. 2 shows the assembly situation of the first circuit board and the second circuit board of the cross transmission module of the embodiment of the present invention;

FIG. 3 shows an assembly situation of a first circuit board, a second circuit board and a reflector of a cross transmission module according to an embodiment of the present invention;

Fig. 4 shows the interleaved transmission module of a variation embodiment of the present invention; And

FIG. 5 shows the combination method of the cross-connect transmission module according to the embodiment of the present invention.

Description of main component symbols:

detailed description

Referring to FIG. 1A , FIG. 1B , and FIG. 2 , they show a cross-connect transmission module according to an embodiment of the present invention, including a first circuit board 10 and a second circuit board 20 . The first circuit board 10 includes a first antenna 11 and a first director 12 . The second circuit board 20 includes a first groove 23 ( FIG. 2 ), a second antenna 21 and a second director 22 . Wherein, the first circuit board 10 partially passes through the first groove 23, so that the first circuit board 10 is combined with the second circuit board 20, wherein the first circuit board 10 is located on a first plane P1 , the second circuit board 20 is located on a second plane P2, wherein the first director 12 is parallel to the first antenna 11, the second director 22 is parallel to the second antenna 21, and the first direction The device 12 and the second director 22 are respectively continuous microstrip structures.

Referring to FIG. 1A and FIG. 1B, the crossover transmission module generally also has a first cable 19 and a second cable 29, the first cable 19 is electrically connected to the first antenna 11, and the second cable 29 is electrically connected to the first antenna 11. Two antennas 21.

In the above embodiment, the second plane P2 is perpendicular to the first plane P1.

In the foregoing embodiments, the cross-type transmission module may be a dual-polarization transmission module, a circular polarization transmission module, or a transmission module based on other principles.

Referring to FIG. 1A, FIG. 1B, and FIG. 2, the first circuit board 10 includes a first joint portion 13, the first joint portion 13 passes through the first groove 23, and the first antenna 11 is partially located at the first joint part 13 and pass through the first groove 23 (in this embodiment, the first antenna 11 is located at the lower edge of the first joint part 13), the second antenna 21 is adjacent to one end of the first groove 23 (lower end in this example).

The first circuit board 10 also includes a second bonding portion 14, the second circuit board 20 also includes a second groove 24, the second bonding portion 14 passes through the second groove 24, and the first pointer 12 is located above the second joint 14 and passes through the second groove 24 (in this embodiment, the first pointer 12 is located at the lower edge of the second joint 14), the second pointer 22 Adjacent to one end (the lower end in this embodiment) of the second trench 24 .

In one embodiment, the first circuit board 10 further includes a third bonding portion 15, the second circuit board 20 further includes a third groove 25, and the third bonding portion 15 passes through the third groove 25. . A third pointer 16 is partially located on the third joint portion 15 and passes through the third groove 25 (in this embodiment, the third pointer 16 is located at the lower edge of the third joint portion 15), a The fourth pointer 26 is adjacent to one end (the lower end in this embodiment) of the third groove 25 . The increase in the number of pointers can further improve the gain value of the cross transmission module.

In the above embodiment, there may be a first gap 171 between the second combining portion 14 and the third combining portion 15 , and there may be a second gap 172 between the third combining portion 15 and the first combining portion 13 . The first circuit board 10 may further include a first base portion 18 , and there may be a third gap 173 between the first base portion 18 and the first combining portion 13 .

Referring to FIG. 3, a cross transmission module according to an embodiment of the present invention further includes a reflector 30 having a reflective surface 31, wherein the first circuit board 10 and the second circuit board 20 are inserted into the Above the reflector 30 , the first circuit board 10 and the second circuit board 20 are perpendicular to the reflective surface 31 .

The first antenna 11 is located between the first pointer 12 and the reflective surface 31 , and the second antenna 21 is located between the second pointer 22 and the reflective surface 31 .

1A, 1B, the first antenna (for example, dual-polarized antenna) 11 includes a first radiator 111 and a second radiator 112, the second radiator 112 is formed on the first joint 13 Above, the position of the second circuit board 20 on the first plane P1 is between the first radiator 111 and the second radiator 112 .

4, in a variant embodiment, the first circuit board 10 includes a first surface 101 and a second surface 102, the first surface 101 is opposite to the second surface 102, the first radiator 111 forms On the first surface 101 , the second radiator 112 is formed on the second surface 102 . Similarly, the first antenna may also include a third radiator and a fourth radiator, and the third radiator and the fourth radiator may be respectively disposed on opposite surfaces of the second circuit board.

Referring to FIG. 2 and FIG. 5 , it shows the combination method of the cross transmission module according to the embodiment of the present invention, including the following steps. Firstly, a first circuit board and a second circuit board are provided, wherein the first circuit board includes a first antenna, and the second circuit board includes a first groove and a second antenna (S1); then, Partially passing the first circuit board through the first groove along an insertion direction T, so that the first circuit board is combined with the second circuit board, wherein the first circuit board is located on a first plane, the The second circuit board is located on a second plane, an included angle θ exists between the insertion direction T and the second plane, and the included angle θ is not zero ( S2 ). In this embodiment, the included angle is 90 degrees, and the second plane is perpendicular to the first plane.

Referring to FIG. 3 , the method for assembling the above-mentioned cross transmission module may further include the steps of: providing a reflector, the reflector has a reflective surface; and inserting the assembled first circuit board and the second circuit board into the Above the reflector, wherein the first circuit board and the second circuit board are perpendicular to the reflective surface.

Applying the cross-type transmission module and the combination method thereof according to the embodiments of the present invention, the first circuit board partially passes through the first groove along the insertion direction, so that the first circuit board is combined with the second circuit board, and the The insertion direction is perpendicular to the surface of the second circuit board. Compared with the traditional up-and-down cross-bonding design, the embodiment of the present invention adopts a lateral cross-bonding design, whereby the size and position of the first groove (combining groove) on the circuit board can be appropriately designed , the present invention provides greater design flexibility. In addition, in the traditional design of cross-joint up and down, due to the long length of the joint groove, it is impossible to set the pointer (the pointer will be cut off by the joint groove). In the embodiment of the present invention, due to the design of lateral cross-bonding, a pointer can be provided, and the length of the pointer can be close to the width of the circuit board. The setting of the pointer can increase the gain value of the cross transmission module. The interleaved transmission module of the embodiment of the present invention can provide a large gain value improvement at a low cost.

Although the present invention has been disclosed above with specific preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can still make some changes and modifications without departing from the spirit and scope of the present invention. , so the scope of protection of the present invention should be defined by the scope of the appended claims.

Claims (17)

1. A combination method of a cross-transmission module, the combination method of the cross-transmission module comprises: providing a first circuit board and a second circuit board, wherein the first circuit board includes a first antenna, and the second circuit board includes a first groove and a second antenna; and Partially passing the first circuit board through the first groove along an insertion direction, so that the first circuit board is combined with the second circuit board, wherein the first circuit board is located on a first plane, the first circuit board The two circuit boards are located on a second plane, and there is an included angle between the insertion direction and the second plane, and the included angle is not zero degrees; Wherein, the first circuit board includes a first joint part, the first joint part passes through the first groove, the first antenna part is located on the first joint part and passes through the first groove, the the second antenna is adjacent to one end of the first groove; Wherein the first groove is a closed groove. 2 . The method for assembling cross transmission modules according to claim 1 , wherein the included angle is 90 degrees, and the second plane is perpendicular to the first plane. 3. The method for combining cross-type transmission modules according to claim 1, wherein the cross-type transmission module is a dual-polarization transmission module or a circular polarization transmission module. 4. The assembling method of the cross transmission module as claimed in claim 1, wherein, the first circuit board further comprises a first pointer, the second circuit board further comprises a second pointer, and the first pointer Parallel to the first antenna, the second director is parallel to the second antenna, and the first director and the second director are respectively continuous microstrip structures. 5. The method for assembling cross-type transmission modules according to claim 4, wherein the first circuit board further comprises a second joint portion, the second circuit board further comprises a second groove, and the second joint portion Passing through the second groove, the first pointer portion is located above the second joint part and passing through the second groove, the second pointer is adjacent to an end of the second groove. 6. The combination method of the crossover transmission module as claimed in claim 4, the combination method of the crossover transmission module further comprising: providing a reflector having a reflective surface; Inserting the assembled first circuit board and the second circuit board on the reflector, wherein the first circuit board and the second circuit board are perpendicular to the reflective surface. 7. The combination method of cross transmission modules according to claim 6, wherein the first antenna is located between the first pointer and the reflective surface, and the second antenna is located between the second pointer and the reflective surface between surfaces. 8. The method for combining crossover transmission modules according to claim 1, wherein the first antenna comprises a first radiator and a second radiator, and the second radiator is formed on the first bonding portion , the position of the second circuit board on the first plane is between the first radiator and the second radiator. 9. The method for combining cross-type transmission modules as claimed in claim 8, wherein the first circuit board comprises a first surface and a second surface, the first surface is opposite to the second surface, and the first radiation The body is formed on the first surface, and the second radiator is formed on the second surface. 10. A crossover transmission module, the crossover transmission module comprising: a first circuit board including a first antenna and a first director; and A second circuit board, the second circuit board includes a first groove, a second antenna and a second pointer, wherein the first circuit board part passes through the first groove so that the first The circuit board is combined with the second circuit board, wherein the first circuit board is located on a first plane, and the second circuit board is located on a second plane, wherein the first director is parallel to the first antenna , the second director is parallel to the second antenna, the first director and the second director are respectively continuous microstrip structures; Wherein, the first circuit board includes a first joint part, the first joint part passes through the first groove, the first antenna part is located on the first joint part and passes through the first groove, the the second antenna is adjacent to one end of the first groove; Wherein the first groove is a closed groove. 11. The cross transmission module of claim 10, wherein the second plane is perpendicular to the first plane. 12. The cross transmission module according to claim 11, wherein the cross transmission module is a dual polarization transmission module or a circular polarization transmission module. 13. The cross transmission module as claimed in claim 10, wherein the first circuit board further comprises a second joint part, the second circuit board further comprises a second groove, and the second joint part passes through the A second groove, the first pointer part is located on the second joint portion and passes through the second groove, the second pointer is adjacent to one end of the second groove. 14. The cross transmission module according to claim 13, further comprising: A reflector, the reflector has a reflective surface, wherein the first circuit board and the second circuit board are inserted on the reflector, the first circuit board and the second circuit board are perpendicular to the reflective surface . 15. The cross transmission module as claimed in claim 14, wherein the first antenna is located between the first pointer and the reflective surface, and the second antenna is located between the second pointer and the reflective surface. 16. The cross transmission module as claimed in claim 10, wherein the first antenna comprises a first radiator and a second radiator, the second radiator is formed on the first joint portion, the first radiator The positions of the two circuit boards on the first plane are located between the first radiator and the second radiator. 17. The cross transmission module as claimed in claim 16, wherein the first circuit board comprises a first surface and a second surface, the first surface is opposite to the second surface, and the first radiator is formed on On the first surface, the second radiator is formed on the second surface.