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CN104377289B - Packaging structure for two transistors and power supply circuit comprising same - Google Patents

Packaging structure for two transistors and power supply circuit comprising same Download PDF

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Publication number
CN104377289B
CN104377289B CN201310350529.1A CN201310350529A CN104377289B CN 104377289 B CN104377289 B CN 104377289B CN 201310350529 A CN201310350529 A CN 201310350529A CN 104377289 B CN104377289 B CN 104377289B
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transistor
pin
dual
function
power supply
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CN104377289A (en
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彭勃
苏聪贤
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Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls

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  • Dc-Dc Converters (AREA)

Abstract

一种双晶体管的封装结构,包括一本体及第一至第五功能引脚,所述第一至第三功能引脚构成所述双晶体管中第一晶体管的栅极、漏极及源极,所述第三至第五功能引脚构成所述双晶体管中第二晶体管的漏极、栅极及源极;所述第一及第二功能引脚设置于所述本体的第一侧边,所述第三及第四功能引脚设置于相对于所述本体第一侧边的第二侧边上,所述第五功能引脚设置于所述本体的底部。本发明还提供一种使用该封装结构的供电电路。上述双晶体管的封装结构中将第三功能引脚设置于本体的第二侧边上,进而使得在多相供电电路布线时节约了空间。

A package structure of a double transistor, comprising a body and first to fifth functional pins, the first to third functional pins constitute the gate, drain and source of the first transistor in the double transistor, The third to fifth function pins form the drain, gate and source of the second transistor in the dual transistor; the first and second function pins are arranged on the first side of the body, The third and fourth function pins are arranged on the second side relative to the first side of the body, and the fifth function pin is arranged on the bottom of the body. The invention also provides a power supply circuit using the packaging structure. In the package structure of the above-mentioned double transistors, the third function pin is arranged on the second side of the body, thereby saving space when wiring the multi-phase power supply circuit.

Description

双晶体管的封装结构及使用该封装结构的供电电路Package structure of double transistor and power supply circuit using the package structure

技术领域technical field

本发明涉及一种双晶体管的封装结构及使用该封装结构的供电电路。The invention relates to a package structure of double transistors and a power supply circuit using the package structure.

背景技术Background technique

现有的双晶体管(DUAL MOSFET)11的封装结构如图1所示,引脚G1、D1及S1构成第一晶体管的栅极、漏极及源极;引脚G2、D2及S2构成第二晶体管的栅极、漏极及源极。其中,第一晶体管的源极与第二晶体管的漏极封装为同一个引脚S1/D2,即交换节点(switchnode)引脚。The package structure of existing double transistor (DUAL MOSFET) 11 is as shown in Figure 1, and pin G1, D1 and S1 constitute the gate, drain and source of the first transistor; Pin G2, D2 and S2 constitute the second The gate, drain and source of a transistor. Wherein, the source of the first transistor and the drain of the second transistor are packaged as the same pin S1/D2, that is, a switch node pin.

图2中10为一多相供电电路中连接在脉冲宽度调制(Pulse Width Modulation,PWM)控制器20及中央处理器(Central Processing Unit,CPU)30之间第一相供电电路的电路图,其中,场效应管Q1的源极及场效应管Q2的漏极通过一电感L1连接于CPU 30以为CPU30供电。10 in FIG. 2 is a circuit diagram of a first-phase power supply circuit connected between a pulse width modulation (Pulse Width Modulation, PWM) controller 20 and a central processing unit (Central Processing Unit, CPU) 30 in a multi-phase power supply circuit, wherein, The source of the field effect transistor Q1 and the drain of the field effect transistor Q2 are connected to the CPU 30 through an inductor L1 to provide power for the CPU 30 .

请参考图3,由于双晶体管11中的交换节点引脚S1/D2位于双晶体管11本体的中间,为尽可能节约印刷电路板的空间,布线时,将电感L1的第一端靠近双晶体管11无引脚的两相对边的其中一边,电感L1的另一端靠近CPU30,使得双晶体管11中交换节点引脚S1/D2与电感L1的第一端尽量减少走线。双晶体管11及电感L1构成第一相供电电路10,其中双晶体管11中第一晶体管的引脚G1连接PWM控制器20的第一高通驱动引脚Hgate10,第一晶体管的引脚D1连接于一电压源Vin,引脚S1连接电感L1的第一端。双晶体管11中第二晶体管的引脚G2连接PWM控制器20的第一低通驱动引脚Lgate10,第二晶体管的引脚D2连接电感L1的第一端,引脚S2接地。即所述PWM控制器20通过第一晶体管的引脚S1及第二晶体管的引脚D2,即通过双晶体管11中交换节点引脚S1/D2及电感L1给CPU供电。Please refer to Figure 3, since the switching node pin S1/D2 in the dual transistor 11 is located in the middle of the dual transistor 11 body, in order to save the space of the printed circuit board as much as possible, when wiring, the first end of the inductor L1 is close to the dual transistor 11 On one of the two opposite sides without pins, the other end of the inductor L1 is close to the CPU 30 , so that the switching node pin S1 / D2 in the dual transistor 11 and the first end of the inductor L1 minimize wiring. The double transistor 11 and the inductor L1 constitute the first phase power supply circuit 10, wherein the pin G1 of the first transistor in the double transistor 11 is connected to the first high-pass drive pin Hgate10 of the PWM controller 20, and the pin D1 of the first transistor is connected to a The voltage source Vin, the pin S1 is connected to the first end of the inductor L1. The pin G2 of the second transistor in the dual transistor 11 is connected to the first low-pass driving pin Lgate10 of the PWM controller 20 , the pin D2 of the second transistor is connected to the first end of the inductor L1 , and the pin S2 is grounded. That is, the PWM controller 20 supplies power to the CPU through the pin S1 of the first transistor and the pin D2 of the second transistor, that is, the switching node pin S1/D2 of the dual transistor 11 and the inductor L1.

当供电电路为多相供电电路,如两相供电电路时,即PWM控制器20与CPU 30之间还存在第二相供电电路40。布线时,所述第二相供电电路40中的双晶体管12靠近所述第一相供电电路10中双晶体管11有引脚的两相对边的其中一边,其中,双晶体管12中第一晶体管的引脚G1连接PWM控制器20的第二高通驱动引脚Hgate20,第一晶体管的引脚D1连接于一电压源Vin,引脚S1连接电感L2的第一端。双晶体管12中第二晶体管的引脚G2连接PWM控制器20的第二低通驱动引脚Lgate20,第二晶体管的引脚D2连接电感L2的第一端,引脚S2接地。When the power supply circuit is a multi-phase power supply circuit, such as a two-phase power supply circuit, that is, there is a second-phase power supply circuit 40 between the PWM controller 20 and the CPU 30 . When wiring, the double transistor 12 in the second phase power supply circuit 40 is close to one of the two opposite sides of the double transistor 11 in the first phase power supply circuit 10, wherein the first transistor in the double transistor 12 The pin G1 is connected to the second high-pass driving pin Hgate20 of the PWM controller 20 , the pin D1 of the first transistor is connected to a voltage source Vin, and the pin S1 is connected to the first end of the inductor L2 . The pin G2 of the second transistor in the dual transistor 12 is connected to the second low-pass driving pin Lgate20 of the PWM controller 20 , the pin D2 of the second transistor is connected to the first end of the inductor L2 , and the pin S2 is grounded.

此时,双晶体管11及双晶体管12之间存在四条线路,即,双晶体管11中第二晶体管的引脚G2连接PWM控制器20的第一低通驱动引脚Lgate10的线路、双晶体管11中第二晶体管的引脚S2接地的线路、双晶体管12中第一晶体管的引脚G1连接PWM控制器20的第二高通驱动引脚Hgate20的线路以及双晶体管12中第一晶体管的引脚D1连接所述电压源Vin的线路。如此在印刷电路板上将需要较大的空间来对多相供电电路进行布局,以避免线路之间的干扰。At this time, there are four lines between the double transistor 11 and the double transistor 12, that is, the pin G2 of the second transistor in the double transistor 11 is connected to the line of the first low-pass drive pin Lgate10 of the PWM controller 20; The pin S2 of the second transistor is grounded, the pin G1 of the first transistor in the double transistor 12 is connected to the second high-pass drive pin Hgate20 of the PWM controller 20, and the pin D1 of the first transistor in the double transistor 12 is connected line of the voltage source Vin. In this way, a larger space is required on the printed circuit board to lay out the multi-phase power supply circuit, so as to avoid interference between lines.

发明内容Contents of the invention

鉴于以上内容,有必要提供一种双晶体管的封装结构及使用该封装结构的供电电路,以在多相供电电路布线时充分利用印刷电路板的空间。In view of the above, it is necessary to provide a double-transistor packaging structure and a power supply circuit using the packaging structure, so as to make full use of the space on the printed circuit board when wiring the multi-phase power supply circuit.

一种双晶体管的封装结构,包括一本体及第一至第五功能引脚,所述第一至第三功能引脚构成所述双晶体管中第一晶体管的栅极、漏极及源极,所述第三至第五功能引脚构成所述双晶体管中第二晶体管的漏极、栅极及源极;所述第一及第二功能引脚设置于所述本体的第一侧边,所述第三及第四功能引脚设置于相对于所述本体第一侧边的第二侧边上,所述第五功能引脚设置于所述本体的底部。A package structure of a double transistor, comprising a body and first to fifth functional pins, the first to third functional pins constitute the gate, drain and source of the first transistor in the double transistor, The third to fifth function pins form the drain, gate and source of the second transistor in the dual transistor; the first and second function pins are arranged on the first side of the body, The third and fourth function pins are arranged on the second side relative to the first side of the body, and the fifth function pin is arranged on the bottom of the body.

一种使用所述双晶体管的封装结构的供电电路,在供电电路布线区域内,所述双晶体管设置于一脉冲宽度调制控制器及一电感之间,所述脉冲宽度调制控制器通过所述双晶体管及所述电感给一中央处理器供电,所述脉冲宽度调制控制器靠近所述双晶体管本体的第一侧边,所述电感的第一端靠近所述双晶体管本体的第二侧边;所述双晶体管的第一功能引脚连接所述脉冲宽度调制控制器的第一高通驱动引脚,所述双晶体管的第二功能引脚连接于一电压源,所述双晶体管的第三功能引脚连接所述电感的第一端,所述双晶体管的第四功能引脚连接所述脉冲宽度调制控制器的第一低通驱动引脚,所述双晶体管的第五功能引脚接地,所述电感的第二端连接所述中央处理器。A power supply circuit using the package structure of the dual transistors, in the wiring area of the power supply circuit, the dual transistors are arranged between a pulse width modulation controller and an inductor, and the pulse width modulation controller passes through the dual The transistor and the inductor supply power to a central processing unit, the pulse width modulation controller is close to the first side of the dual-transistor body, and the first end of the inductor is close to the second side of the dual-transistor body; The first function pin of the double transistor is connected to the first high-pass drive pin of the pulse width modulation controller, the second function pin of the double transistor is connected to a voltage source, and the third function pin of the double transistor is The pin is connected to the first end of the inductor, the fourth function pin of the dual transistor is connected to the first low-pass drive pin of the pulse width modulation controller, and the fifth function pin of the dual transistor is grounded, The second end of the inductor is connected to the CPU.

上述双晶体管的封装结构中将第三功能引脚设置于本体的第二侧边上,进而使得在多相供电电路布线时节约了空间。In the package structure of the above-mentioned double transistors, the third function pin is arranged on the second side of the body, thereby saving space when wiring the multi-phase power supply circuit.

附图说明Description of drawings

图1是现有的双晶体管的封装结构示意图。FIG. 1 is a schematic diagram of a package structure of an existing dual transistor.

图2是多相供电电路的电路图。Fig. 2 is a circuit diagram of a multi-phase power supply circuit.

图3是现有的多相供电电路的布线图。Fig. 3 is a wiring diagram of a conventional multi-phase power supply circuit.

图4是本发明双晶体管的封装结构示意图。Fig. 4 is a schematic diagram of the packaging structure of the double transistor of the present invention.

图5是使用本发明双晶体管的封装结构的多相供电电路的布线图。FIG. 5 is a wiring diagram of a multi-phase power supply circuit using the package structure of the dual transistors of the present invention.

主要元件符号说明Description of main component symbols

双晶体管 11、12、100、200Dual Transistor 11, 12, 100, 200

第一相供电电路 10、123First phase power supply circuit 10, 123

PWM控制器 20PWM controller 20

CPU 30、900CPU 30, 900

电感 L1、L2、L10、L20Inductors L1, L2, L10, L20

第二相供电电路 40、223Second phase power supply circuit 40, 223

本体 110Body 110

底面 111Bottom 111

第一侧边 1first side 1

第二侧边 2second side 2

如下具体实施方式将结合上述附图进一步说明本发明。The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

具体实施方式detailed description

下面结合附图及较佳实施方式对本发明作进一步详细描述:Below in conjunction with accompanying drawing and preferred embodiment the present invention is described in further detail:

请参考图4,本发明双晶体管100的封装结构包括一本体110、位于本体110底面111的功能引脚D1、S2以及位于本体110两相对边的功能引脚D1、G1、S1/D2及G2,其中,位于本体110两相对边的功能引脚D1及G1设置于本体110的第一侧边1,功能引脚S1/D2及G2设置于相对于本体110第一侧边1的第二侧边2上,功能引脚G1、D1及S1构成第一晶体管的栅极、漏极及源极;功能引脚G2、D2及S2构成第二晶体管的栅极、漏极及源极。其中,每个功能引脚的数量可根据需要设置,本实施方式中,共设有四个功能引脚D1且其中三个功能引脚D1设置于本体110的第一侧边1上,另外一个功能引脚D1设置于本体110的底面111,共设有三个功能引脚S1/D2且设置于本体110的第二侧边2上。Please refer to FIG. 4 , the packaging structure of the dual transistor 100 of the present invention includes a body 110 , function pins D1 and S2 located on the bottom surface 111 of the body 110 and function pins D1, G1, S1/D2 and G2 located on two opposite sides of the body 110 , wherein the function pins D1 and G1 located on two opposite sides of the body 110 are arranged on the first side 1 of the body 110, and the function pins S1/D2 and G2 are arranged on the second side relative to the first side 1 of the body 110 On side 2, the functional pins G1, D1 and S1 form the gate, drain and source of the first transistor; the functional pins G2, D2 and S2 form the gate, drain and source of the second transistor. Wherein, the number of each function pin can be set according to needs. In this embodiment, there are four function pins D1 and three function pins D1 are arranged on the first side 1 of the body 110, and the other one The function pin D1 is disposed on the bottom surface 111 of the body 110 , and three function pins S1 / D2 are disposed on the second side 2 of the body 110 .

请参考图5,多相供电电路如两相供电电路中,脉冲宽度调制(Pulse WidthModulation,PWM)控制器(图未示)的第一高通驱动引脚Hgate1及第一低通驱动引脚Lgate1通过所述双晶体管100及一电感L10连接于中央处理器(Central Processing Unit,CPU)900以为CPU 900供电。所述PWM控制器20的第二高通驱动引脚Hgate2及第二低通驱动引脚Lgate2通过一双晶体管200及一电感L20连接于中央处理器(Central Processing Unit,CPU)900以为CPU 900供电。其中,所述双晶体管200的封装结构与所述双晶体管100的封装结构相同。Please refer to FIG. 5, in a multi-phase power supply circuit such as a two-phase power supply circuit, the first high-pass drive pin Hgate1 and the first low-pass drive pin Lgate1 of the pulse width modulation (Pulse WidthModulation, PWM) controller (not shown) pass through The dual transistors 100 and an inductor L10 are connected to a central processing unit (CPU) 900 for powering the CPU 900 . The second high-pass driving pin Hgate2 and the second low-pass driving pin Lgate2 of the PWM controller 20 are connected to a central processing unit (CPU) 900 through a pair of transistors 200 and an inductor L20 to provide power for the CPU 900 . Wherein, the packaging structure of the dual transistor 200 is the same as that of the dual transistor 100 .

布线时,将所述电感L10的第一端靠近所述双晶体管100的第二侧边2,所述电感L10的另一端靠近所述CPU 900并连接CPU 900,所述电感L10及所述双晶体管100构成第一相供电电路123,其中所述双晶体管100的功能引脚G1连接PWM控制器20的第一高通驱动引脚Hgate1,所述双晶体管100功能引脚D1连接于一电压源Vin,所述双晶体管100的功能引脚S1/D2连接所述电感L10的第一端;所述双晶体管100的功能引脚G2连接PWM控制器20的第一低通驱动引脚Lgate1,所述双晶体管100的功能引脚S2接地。即所述PWM控制器20通过所述双晶体管100中功能引脚S1/D2及电感L10给所述CPU 900供电。When wiring, the first end of the inductor L10 is close to the second side 2 of the dual transistor 100, the other end of the inductor L10 is close to the CPU 900 and connected to the CPU 900, the inductor L10 and the dual The transistor 100 constitutes the first phase power supply circuit 123, wherein the functional pin G1 of the dual transistor 100 is connected to the first high-pass drive pin Hgate1 of the PWM controller 20, and the functional pin D1 of the dual transistor 100 is connected to a voltage source Vin , the function pin S1/D2 of the dual transistor 100 is connected to the first end of the inductor L10; the function pin G2 of the dual transistor 100 is connected to the first low-pass drive pin Lgate1 of the PWM controller 20, the The function pin S2 of the dual transistor 100 is grounded. That is, the PWM controller 20 supplies power to the CPU 900 through the function pins S1 / D2 of the dual transistor 100 and the inductor L10 .

同样的,第二相供电电路223中的双晶体管200及所述电感L20的布线方式与所述第一相供电电路123的布线方式相同。即所述电感L20的第一端靠近所述双晶体管200的第二侧边2,所述电感L20的另一端靠近所述CPU 900并连接所述CPU 900,其中所述双晶体管200的功能引脚G1连接PWM控制器20的第二高通驱动引脚Hgate2,所述双晶体管200功能引脚D1连接于所述电压源Vin,所述双晶体管200的功能引脚S1/D2连接所述电感L20的第一端;所述双晶体管200的功能引脚G2连接PWM控制器20的第二低通驱动引脚Lgate2,所述双晶体管200的功能引脚S2接地。即所述PWM控制器20通过所述双晶体管200中功能引脚S1/D2及电感L20给所述CPU 900供电。Similarly, the wiring manner of the dual transistor 200 and the inductor L20 in the second phase power supply circuit 223 is the same as that of the first phase power supply circuit 123 . That is, the first end of the inductor L20 is close to the second side 2 of the dual transistor 200, and the other end of the inductor L20 is close to the CPU 900 and connected to the CPU 900, wherein the function of the dual transistor 200 is Pin G1 is connected to the second high-pass drive pin Hgate2 of the PWM controller 20, the function pin D1 of the dual transistor 200 is connected to the voltage source Vin, and the function pin S1/D2 of the dual transistor 200 is connected to the inductor L20 The first end of the first terminal; the function pin G2 of the dual transistor 200 is connected to the second low-pass drive pin Lgate2 of the PWM controller 20, and the function pin S2 of the dual transistor 200 is grounded. That is, the PWM controller 20 supplies power to the CPU 900 through the function pins S1 / D2 of the dual transistor 200 and the inductor L20 .

此时,所述双晶体管100及所述双晶体管200之间仅存在一条线路,即所述双晶体管200中功能引脚G2连接PWM控制器20的第二低通驱动引脚Lgate2的线路。将不需要较大的空间来对多相供电电路进行布局,节约了空间。At this time, there is only one line between the dual transistor 100 and the dual transistor 200 , that is, the line connecting the function pin G2 of the dual transistor 200 to the second low-pass driving pin Lgate2 of the PWM controller 20 . A large space is not needed to lay out the multi-phase power supply circuit, which saves space.

Claims (4)

1.一种双晶体管的封装结构,包括一本体及第一至第五功能引脚,所述第一至第三功能引脚构成所述双晶体管中第一晶体管的栅极、漏极及源极,所述第三至第五功能引脚构成所述双晶体管中第二晶体管的漏极、栅极及源极;所述第一及第二功能引脚设置于所述本体的第一侧边,所述第三及第四功能引脚设置于相对于所述本体第一侧边的第二侧边上,所述第五功能引脚设置于所述本体的底部。1. A package structure of a double transistor, comprising a body and first to fifth function pins, the first to third function pins constitute the gate, drain and source of the first transistor in the double transistor The third to fifth function pins constitute the drain, gate and source of the second transistor in the dual transistor; the first and second function pins are arranged on the first side of the body The third and fourth function pins are arranged on the second side relative to the first side of the body, and the fifth function pin is arranged on the bottom of the body. 2.如权利要求1所述的双晶体管的封装结构,其特征在于:所述第二功能引脚的数量为四个,其中三个第二功能引脚设置于所述本体的第一侧边上,其余一个第二功能引脚设置于所述本体的底部。2. The package structure of dual transistors according to claim 1, characterized in that: the number of the second function pins is four, and three of the second function pins are arranged on the first side of the body , and the other second function pin is set at the bottom of the body. 3.如权利要求2所述的双晶体管的封装结构,其特征在于:所述第三功能引脚的数量为三个,均设置于所述本体的第二侧边上。3 . The package structure of dual transistors according to claim 2 , wherein there are three third function pins, all of which are arranged on the second side of the body. 4 . 4.一种使用如权利要求1所述的双晶体管的封装结构的供电电路,其特征在于:在供电电路布线区域内,所述双晶体管设置于一脉冲宽度调制控制器及一电感之间,所述脉冲宽度调制控制器通过所述双晶体管及所述电感给一中央处理器供电,所述脉冲宽度调制控制器靠近所述双晶体管本体的第一侧边,所述电感的第一端靠近所述双晶体管本体的第二侧边;所述双晶体管的第一功能引脚连接所述脉冲宽度调制控制器的第一高通驱动引脚,所述双晶体管的第二功能引脚连接于一电压源,所述双晶体管的第三功能引脚连接所述电感的第一端,所述双晶体管的第四功能引脚连接所述脉冲宽度调制控制器的第一低通驱动引脚,所述双晶体管的第五功能引脚接地,所述电感的第二端连接所述中央处理器。4. A power supply circuit using a package structure of dual transistors as claimed in claim 1, characterized in that: in the wiring area of the power supply circuit, the dual transistors are arranged between a pulse width modulation controller and an inductor, The pulse width modulation controller supplies power to a central processing unit through the dual transistor and the inductor, the pulse width modulation controller is close to the first side of the dual transistor body, and the first end of the inductor is close to The second side of the dual-transistor body; the first functional pin of the dual-transistor is connected to the first high-pass drive pin of the pulse width modulation controller, and the second functional pin of the dual-transistor is connected to a A voltage source, the third function pin of the dual transistor is connected to the first end of the inductor, and the fourth function pin of the dual transistor is connected to the first low-pass drive pin of the pulse width modulation controller, so The fifth function pin of the dual transistor is grounded, and the second end of the inductor is connected to the central processing unit.
CN201310350529.1A 2013-08-13 2013-08-13 Packaging structure for two transistors and power supply circuit comprising same Expired - Fee Related CN104377289B (en)

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CN101663749A (en) * 2007-11-21 2010-03-03 万国半导体股份有限公司 Stacked die package for battery power management
CN202084540U (en) * 2011-04-02 2011-12-21 四川大雁微电子有限公司 Surface-mount type power transistor module
CN102931182A (en) * 2012-11-12 2013-02-13 杭州士兰微电子股份有限公司 Packaging device of compact single-phase integrated drive circuit and single-phase integrated drive circuit
CN102969290A (en) * 2011-08-29 2013-03-13 富晶电子股份有限公司 Packaging structure

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JP4101096B2 (en) * 2003-03-31 2008-06-11 三洋電機株式会社 MOS transistor device

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Publication number Priority date Publication date Assignee Title
CN101663749A (en) * 2007-11-21 2010-03-03 万国半导体股份有限公司 Stacked die package for battery power management
CN202084540U (en) * 2011-04-02 2011-12-21 四川大雁微电子有限公司 Surface-mount type power transistor module
CN102969290A (en) * 2011-08-29 2013-03-13 富晶电子股份有限公司 Packaging structure
CN102931182A (en) * 2012-11-12 2013-02-13 杭州士兰微电子股份有限公司 Packaging device of compact single-phase integrated drive circuit and single-phase integrated drive circuit

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