CN104302100A - Pad structure and printed circuit board and memory storage device using the same - Google Patents

Abstract

The invention provides a welding pad structure, a printed circuit board using the welding pad structure and a memory storage device. The welding pad structure is suitable for configuring the electronic element on the printed circuit board. The welding pad structure comprises a first welding pad and a plurality of second welding pads. The first bonding pad is suitable for being electrically connected with one end of the electronic element. Each second welding pad is suitable for being electrically connected with the other end of the electronic element. The first bonding pad and the plurality of second bonding pads are electrically independent from each other, and the second bonding pads are electrically independent from each other.

Description

Pad structure and printed circuit board and memory storage device using the same

technical field

The invention relates to a circuit layout, and in particular to a welding pad structure and a printed circuit board and a memory storage device using the same.

Background technique

With the advancement of printed circuit board (PCB) and electronic component manufacturing technology, the design of printed circuit board and electronic components is also designed in the direction of small size to meet the current needs of miniaturization of electronic products. However, the reduction in the size of the printed circuit board also means that the layout design of the printed circuit board is becoming more and more difficult.

Generally speaking, in the layout design of the printed circuit board, the solder pad structure conforming to the size of the electronic component is usually used to electrically connect the electronic component to other components/circuits on the printed circuit board. As far as the traditional soldering pad structure is concerned, usually only a single soldering pad is used to electrically connect terminals of electronic components. For example, when the electronic component is a double-terminal electronic component, the pad structure is generally designed to have two pads for electrically connecting the terminals of the electronic component respectively.

However, because the traditional pad structure can only establish a single connection node for electronic components to electrically connect other circuits on the printed circuit board, in some printed circuit board layout designs, if two different circuits are to be electrically connected to each other In order to connect, it is often necessary to add additional electronic components (such as low-impedance resistors), and design pad structures and traces that conform to the additional electronic components as a connection path between two different circuits. In this way, the overall layout area of the printed circuit board will be increased, and the layout density of the printed circuit board will be increased, thereby greatly increasing the difficulty of circuit layout design.

Contents of the invention

Exemplary embodiments of the present invention provide a bonding pad structure and a printed circuit board and a memory storage device using the same, which can reduce the layout area of circuit design.

The pad structure according to an exemplary embodiment of the present invention is suitable for disposing electronic components on a printed circuit board. The pad structure includes a first pad and a plurality of second pads. The first pad is suitable for electrically connecting one end of the electronic component. Each second pad is adapted to be electrically connected to the other end of the electronic component, wherein the first pad and the plurality of second pads are electrically independent from each other, and these second pads are also electrically independent from each other.

In an exemplary embodiment, the second pads are disposed on the same side of the pad structure, and the first pads are disposed on the other side of the pad structure opposite to the second pads. In an exemplary embodiment, the electronic component is a surface mount device (SMD) including a plurality of solder joints. The solder joints include a first solder joint and a second solder joint. The first solder joint is disposed on one end of the electronic component, and the second solder joint is disposed on the other end of the electronic component. The first pad is adapted to be electrically connected to the end of the electronic component via the first solder joint, and the second pad is adapted to be electrically connected to the other end of the electronic component via the second solder joint.

In an exemplary embodiment, the above-mentioned second pad includes a third pad and a fourth pad. The third pad is electrically connected to a first circuit. The fourth pad is electrically connected to a second circuit, and the first circuit and the second circuit are electrically independent from each other. When the above-mentioned electronic components are arranged in the bonding pad structure, the third bonding pad and the fourth bonding pad are electrically connected to each other through the above-mentioned second solder joint, so that the first circuit and the second circuit are electrically connected to each other to enable second circuit.

An exemplary embodiment of the invention provides a printed circuit board including at least one first pad structure. Each first pad structure includes a first pad and a plurality of second pads. The first pad is suitable for electrically connecting one end of an electronic component. Each second pad is adapted to be electrically connected to the other end of the electronic component, wherein the first pad and the plurality of second pads are electrically independent from each other, and the second pads are electrically independent from each other.

In an exemplary embodiment, the above-mentioned printed circuit board further includes the electronic component. The electronic component is disposed in the above-mentioned first pad structure. Wherein, one end of the electronic component is connected to the first pad, and the other end of the electronic component is connected to the second pad.

In an exemplary embodiment, the above-mentioned printed circuit board further includes a second pad structure. The second pad structure includes two fifth pads. One of the fifth pads is suitable for electrically connecting one end of a first electronic component, and the other fifth pad is suitable for electrically connecting the other end of the first electronic component. The fifth pads are electrically independent from each other, and the number of solder joints of the first electronic component is the same as the number of solder joints of the above-mentioned electronic components.

In an exemplary embodiment, the layout area of the first pad structure and the layout area of the second pad structure are substantially the same.

From another perspective, an exemplary embodiment of the present invention provides a memory storage device, including a connector, a rewritable non-volatile memory module, and a memory controller. The connector is used to electrically connect to a host system. The rewritable non-volatile memory module includes multiple physical erasing units. The memory controller is electrically connected to the connector and the rewritable non-volatile memory module. The connector or the memory controller is disposed on a printed circuit board, and the printed circuit board includes at least one first pad structure. Each first pad structure includes a first pad and a plurality of second pads. The first pad is suitable for electrically connecting one end of an electronic component. Each second pad is adapted to be electrically connected to the other end of the electronic component, wherein the first pad and the plurality of second pads are electrically independent from each other, and the second pads are electrically independent from each other.

Based on the above, exemplary embodiments of the present invention provide a bonding pad structure and a printed circuit board and a memory storage device using the same. In the pad structure, it includes at least two pads for electrically connecting the same end of the electronic component, so as to establish an additional connection node of the electronic component. Therefore, the designer can directly use the extra connection node to connect two different circuits when designing the circuit layout, thereby reducing the layout area of the circuit design on the printed circuit board, and improving the versatility and flexibility of the circuit layout design .

In order to make the above-mentioned features and advantages of the present invention more comprehensible, exemplary embodiments are exemplified below and described in detail with accompanying drawings.

Description of drawings

FIG. 1 is a schematic diagram of a bonding pad structure and electronic components according to an exemplary embodiment.

FIG. 2A is a schematic diagram of a printed circuit board and its layout structure.

FIG. 2B is a schematic diagram illustrating an equivalent circuit of the printed circuit board shown in FIG. 2A .

FIG. 3A is a schematic diagram of a printed circuit board and its layout structure according to an exemplary embodiment.

FIG. 3B is a schematic diagram illustrating an equivalent circuit of the printed circuit board shown in FIG. 3A .

FIG. 4A is a diagram illustrating a host system and a memory storage device according to an exemplary embodiment.

FIG. 4B is a schematic diagram of a computer, an input/output device and a memory storage device according to an exemplary embodiment.

FIG. 4C is a schematic diagram of a host system and a memory storage device according to an exemplary embodiment.

FIG. 5 is a schematic block diagram illustrating the memory storage device shown in FIG. 4A .

【Symbol Description】

10, 10_1, 10_2, 10_3: electronic components

100, 210, 220, 230, 310, 320: pad structure

200, 300: printed circuit board

CKT1: first circuit

CKT2: second circuit

P1: First pad

P2_1, P2_2: Second pad

P211, P212, P221, P222, P231, P232, P311_1, P311_2, P312, P321, P322: solder pads

T1: first end

T2: second end

S1, S2: solder joint surface

N1, N2: connection points

GND: ground voltage

1000: host system

1100: computer

1102: Microprocessor

1104: random access memory

1106: Input/Output Device

1108: System bus

1110: data transmission interface

1202: mouse

1204: keyboard

1206: display

1208: Printer

1212: Pen drive

1214: memory card

1216: SSD

1310: Digital camera

1312: SD card

1314: MMC card

1316: memory stick

1318: CF card

1320: Embedded storage device

400: memory storage device

402: Connector

404: Memory Controller

406: Rewritable non-volatile memory module

408(0)～408(R): physical erasing unit

Detailed ways

In order to make the content of the present disclosure more comprehensible, the following exemplary embodiments are specifically cited as examples on which the present disclosure can actually be implemented. However, the present invention is not limited to the illustrated exemplary embodiments, and appropriate combinations are also allowed between the exemplary embodiments. In addition, wherever possible, elements/components/steps with the same reference numerals are used in the drawings and embodiments to represent the same or similar parts.

FIG. 1 is a schematic diagram of a bonding pad structure and electronic components according to an exemplary embodiment. Please refer to FIG. 1. In this exemplary embodiment, the pad structure 100 is suitable for disposing the electronic component 10 on a printed circuit board, so that the electronic component 10 can communicate with other components/components on the printed circuit board through the pad structure 100. The circuits are electrically connected to each other, so that the electronic components 10 can realize corresponding functions in the circuits. Wherein, the electronic component 10 can be an active component or a passive component, and the present invention is not limited thereto. For example, the electronic component 10 may be a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET), a bipolar junction transistor (BJT), a capacitor, a resistor or an inductor. In this exemplary embodiment, the bonding pad structure 100 is applied to a double-terminal electronic component 10 . The pad structure 100 includes a first pad P1 and second pads P2_1 and P2_2 . The first welding pad P1 is suitable for electrically connecting the first end T1 of the electronic component 10, and the second welding pads P2_1 and P2_2 are suitable for electrically connecting the second terminal T2 of the electronic component 10, wherein the first welding pad P1 and the second The pads P2_1 and P2_2 are electrically independent from each other, and the second pads P2_1 and P2_2 are also electrically independent from each other.

In an exemplary embodiment, the electronic device 10 is a surface mount device (SMD) having solder joints S1 and S2 . When the designer wants to configure the electronic component 10 on a printed circuit board (not shown) through the pad structure 100, the designer can solder the solder joint surface S1 on the first pad P1, and solder the solder joint surface S2 is welded on the second pads P2_1 and P2_2. In other words, the first pad P1 in the pad structure 100 is electrically connected to the first end T1 of the electronic component 10 via the solder joint S1, and the second pads P2_1 and P2_2 are electrically connected to the solder joint S2. Connect to the second terminal T2 of the electronic component 10 . In the configuration where the electronic component 10 is soldered in the pad structure 100 , the second pads P2_1 and P2_2 are electrically connected to each other via the solder joint S2 of the electronic component 10 .

In this exemplary embodiment, the second pads P2_1 and P2_2 are disposed on the same side of the pad structure 100 according to the position of the second terminal T2 of the electronic component 10 , and the first pad P1 is based on the position of the electronic component 10 The position of the first end T1 is disposed on the other side opposite to the second pads P2_1 and P2_2 , but the invention is not limited thereto. In another exemplary embodiment, the position and number of solder pads can be set differently according to the position and number of terminals/pins/joints of the electronic component 10, so that the electronic component 10 is suitable for bonding through the solder pad structure 100. configured on a printed circuit board.

For example, if the electronic component 10 is a three-terminal surface mount component, in addition to the first pad P1 and the second pad P2_1 and P2_2, the designer can also determine the A third pad (not shown) is disposed in the pad structure 100 . Thereby, the third end of the electronic component 10 can be electrically connected to other components/circuits on the printed circuit board through the third pad. In other words, in this exemplary embodiment, the bonding pad structure 100 further includes a third bonding pad, which is suitable for electrically connecting the third terminal of the electronic component. In particular, the first pad P1 , the second pad P2_1 , the second pad P2_2 and the third pad are electrically independent from each other. However, if the electronic component 10 has more terminals, the bonding pad structure 100 may also have more bonding pads.

Moreover, although the two second pads P2_1 and P2_2 are electrically connected to the second terminal T2 of the electronic component 10 in FIG. 1 . However, in another exemplary embodiment, the designer may also design more than three second pads in the pad structure 100, and these second pads are electrically connected to the same end of the electronic component 10 (eg , the second terminal T2), so as to provide more than three connection nodes at the same time.

Based on this, the bonding pad structure of this exemplary embodiment can actually adjust the position of the bonding pad and the number of bonding pads adaptively based on the type of electronic components used (such as electronic components with two terminals, three terminals or more than three terminals). configuration, the present invention is not limited to this. In other words, as long as there are more than two solder pads in the same solder pad structure, they are used to electrically connect to the same end of the electronic component, and the two or more solder pads are connected to each other when they are not electrically connected to the electronic component. Electrical independence does not depart from the scope of the pad structure to be protected by the present invention.

2A-3B are further used below to illustrate the difference between the pad structure 100 of this exemplary embodiment and the conventional pad structure applied to the layout design of a printed circuit board.

FIG. 2A is a schematic diagram of a printed circuit board and its layout structure. FIG. 2B is a schematic diagram illustrating an equivalent circuit of the printed circuit board shown in FIG. 2A . Please refer to FIG. 2A and FIG. 2B at the same time. The printed circuit board 200 includes a first circuit CKT1 , a second circuit CKT2 , a plurality of pad structures 210 , 220 and 230 , and electronic components 10_1 - 10_3 . Among them, the printed circuit board 200 can be applied to any type of electronic device.

The welding pad structures 210 , 220 and 230 are traditional welding pad structures, which respectively use two welding pads to electrically connect electronic components. For example, the welding pad P211 and the welding pad P212 are electrically connected to the two ends of the electronic component 10_1; the welding pad P221 and the welding pad P222 are electrically connected to the two ends of the electronic component 10_2; Sexually connected to both ends of the electronic component 10_3. Wherein, before the electronic component 10_3 is not disposed on the pad structure 230 , the pad P231 and the pad P232 are electrically independent from each other. Here, the electronic components 10_1 and 10_2 are capacitors as an example, and the electronic component 10_3 is a resistor as an example.

In detail, in the printed circuit board 200, the first circuit CKT1 is the main functional circuit (that is, the circuit required for the normal operation of the printed circuit board 200), and the second circuit CKT2 is the auxiliary function circuit (that is, the circuit that provides additional functions). Circuit, can be decided by the designer whether to join). The designer can decide whether to add the second circuit CKT2 according to the specifications of the electronic device used in the printed circuit board 200 , and design the corresponding layout structure of the printed circuit board 200 accordingly.

For example, the first circuit CKT1 may be, for example, a controller circuit, and the second circuit CKT2 may, for example, be an external power supply circuit for providing external power. If the designer intends to design the electronic device to work with the internal power supply of the first circuit CKT1 , the designer does not need to consider the layout structure of the second circuit CKT2 to the first circuit CKT1 . Conversely, if the designer intends to design the electronic device to work with an external power supply, the designer needs to design a corresponding printed circuit board layout structure so that the second circuit CKT2 can be electrically connected to the first circuit CKT1 .

More specifically, in the embodiment without adding the second circuit CKT2, the designer only needs to consider the configuration of the pad structures 210 and 220, and the routing configuration of the electronic components 10_1 and 10_2 to the first circuit CKT1 to complete Layout design of the printed circuit board 200 . On the contrary, in the embodiment of adding the second circuit CKT2 , the designer needs to further design the wiring layout so that the second circuit CKT2 will be electrically connected to the first circuit CKT1 . In this embodiment, since the printed circuit board 200 uses the traditional pad structure 230 , the designer must configure additional resistors 10_3 and wires as the connection path between the second circuit CKT2 and the first circuit CKT1 .

It can be seen from the above that, in the layout structure design of the printed circuit board using the traditional pad structure, the designer must design two different layout structures of the printed circuit board for electronic devices with different specifications. In addition, in the implementation manner of adding the second circuit CKT2, the printed circuit board 200 must increase the layout area of a pad structure 230 (this is based on the exemplary embodiment of FIGS. 2A and 2B , the actually required additional pad The number of structures depends on the circuit design on the printed circuit board), so that the layout space of other components/circuits on the printed circuit board 200 is bound to be relatively restricted, thereby limiting the overall circuit layout design of the printed circuit board 200 to a certain extent. degree of limitation.

FIG. 3A is a schematic diagram of a printed circuit board and its layout structure according to an exemplary embodiment. FIG. 3B is a schematic diagram illustrating an equivalent circuit of the printed circuit board shown in FIG. 3A . Please refer to FIG. 3A and FIG. 3B at the same time. The printed circuit board 300 includes a first circuit CKT1 , a second circuit CKT2 , pad structures 310 and 320 , and electronic components 10_1 and 10_2 . Wherein, the printed circuit board 300 can also be applied to any type of electronic device, and the electronic components 10_1 and 10_2 are also capacitors as examples.

In this exemplary embodiment, the functions of the first circuit CKT1 and the second circuit CKT2 have been described above, and thus will not be repeated. The difference between the printed circuit board 300 and the printed circuit board 200 of FIGS. 2A and 2B is that the printed circuit board 300 is applied with the pad structure 100 (ie, the pad structure 310 ) described in FIG. 1 . In detail, in the printed circuit board 300, one end of the electronic component 10_1 is electrically connected to the first circuit CKT1 and the second circuit CKT2 through the pad structure 310, and the other end of the electronic component 10_1 is electrically connected to the ground voltage. GND. One end of the electronic component 10_2 is electrically connected to the first circuit CKT1 through the traditional pad structure 320 , and the other end of the electronic component 10_2 is electrically connected to the ground voltage GND. The pad P311_2 (also called the third pad) is electrically connected to the first circuit CKT1 , and the pad P311_1 (also called the fourth pad) is electrically connected to the second circuit CKT2 . When the electronic component 10_1 is disposed in the pad structure 310 , the pads P311_1 and P311_2 are electrically connected to each other through the solder joint on the electronic component 10_1 . In other words, the pads P311_1 and P311_2 can make one end of the electronic component 10_1 equivalently have two connection nodes N1 and N2 (as shown in FIG. 3B ). Therefore, in this exemplary embodiment, the designer only needs to arrange a trace from the second circuit CKT2 to the second pad P311_1 to electrically connect the second circuit CKT2 to the first circuit CKT1 . When the second circuit CKT2 is electrically connected to the first circuit CKT1, the second circuit CKT2 will be enabled, thereby using an external power source to work.

In other words, since the pad P311_1 can be used to establish an additional connection node N1 at one end of the electronic component 10_1, the designer only needs to lay out a trace from the second circuit CKT2 to the pad P311_1 to connect the second circuit CKT2 Electrically connected to the first circuit CKT1. Therefore, compared with the printed circuit board 200 using the traditional pad structure, the printed circuit board 300 of this exemplary embodiment does not need to add additional electronic components 10_3, even in the embodiment of adding the second circuit CKT2. The bonding pad structure 230 and the corresponding wires serve as a connection path between the first circuit CKT1 and the second circuit CKT2 .

Furthermore, in this exemplary embodiment, since there is no need to add additional electronic components as connection paths based on different implementations, no matter whether the second circuit CKT2 is added or not, the printed circuit board All 300 can be implemented by using the same layout structure, thereby improving the design versatility of the printed circuit board.

In addition, the number of solder joints of the electronic component 10_1 is the same as the number of solder joints of the electronic component 10_2 (both are two). Since the sum of the layout area of the pads P311_1 and P311_2 is similar to the pad P312 (slightly smaller than the pad P312), and the layout area of the pad P312 is similar to or the same as the pad P321 or P322 in the pad structure 320, so overall , the layout area of the pad structure 310 is substantially the same as the layout area of the pad structure 320 . Therefore, in the embodiment of adding the second circuit CKT2 , the layout density of the printed circuit board 300 using the pad structure 310 will be significantly smaller than that of the printed circuit board 200 (the layout area of the pad structure 230 is reduced by one). In other words, in the printed circuit board 300 using the pad structure 310 , the layout area of the overall circuit design is substantially reduced, thereby improving the flexibility of the circuit layout design.

It should be noted that, in FIGS. 3A and 3B , the layout structure of the printed circuit board 300 shown is only an example, and the actual layout structure of the printed circuit board 300 depends on the corresponding circuit design. This is the limit. In other words, as long as the printed circuit board and the layout structure using the pad structure described in this exemplary embodiment (such as the pad structure 100 or 310) do not deviate from the printed circuit board and layout structure to be protected by the present invention scope. In an exemplary embodiment, the pad structure 100 or 310 proposed above can be used in a memory storage device, and the memory storage device can be used with a host system.

FIG. 4A is a diagram illustrating a host system and a memory storage device according to an exemplary embodiment.

Referring to FIG. 4A , the host system 1000 generally includes a computer 1100 and an input/output (I/O) device 1106 . The computer 1100 includes a microprocessor 1102 , a random access memory (random access memory, RAM) 1104 , a system bus 1108 and a data transmission interface 1110 . The input/output device 1106 includes a mouse 1202, a keyboard 1204, a monitor 1206 and a printer 1208 as shown in FIG. 4B. It must be understood that the device shown in FIG. 4B is not limited to the input/output device 1106, and the input/output device 1106 may also include other devices.

The memory storage device 400 is electrically connected with other components of the host system 1000 through the data transmission interface 1110 . Data can be written into or read from the memory storage device 400 through the operation of the microprocessor 1102 , the random access memory 1104 and the input/output device 1106 . For example, the memory storage device 400 may be a rewritable non-volatile memory storage device such as a flash drive 1212, a memory card 1214, or a solid state drive (Solid State Drive, SSD) 1216 as shown in FIG. 4B.

In general, host system 1000 is any system that can cooperate substantially with memory storage device 100 to store data. Although in this exemplary embodiment, the host system 1000 is illustrated as a computer system, however, in another exemplary embodiment of the present invention, the host system 1000 may be a digital camera, video camera, communication device, audio player or video player and other systems. For example, when the host system is a digital camera (video camera) 1310, the rewritable non-volatile memory storage device is an SD card 1312, an MMC card 1314, a memory stick (memory stick) 1316, a CF card 1318 or The embedded storage device 1320 (as shown in FIG. 4C ). The embedded storage device 1320 includes an embedded multimedia card (Embedded MMC, eMMC). It is worth mentioning that the embedded multimedia card is directly electrically connected to the substrate of the host system.

FIG. 5 is a schematic block diagram illustrating the memory storage device shown in FIG. 4A .

Referring to FIG. 5 , the memory storage device 400 includes a connector 502 , a memory controller 504 and a rewritable non-volatile memory module 506 .

In this exemplary embodiment, the connector 502 is compatible with the Serial Advanced Technology Attachment (SATA) standard. However, it must be understood that the present invention is not limited thereto, and the connector 502 may also be a high-speed, high-speed Peripheral Component Interconnect Express (PCI Express) standard, Universal Serial Bus (Universal Serial Bus, USB) standard, Secure Digital (Secure Digital, SD) interface standard, Ultra High Speed-I (UHS-I ) interface standard, Ultra High Speed-II (UHS-II) interface standard, memory stick (Memory Stick, MS) interface standard, multimedia memory card (MultiMedia Card, MMC) interface standard, embedded multimedia storage Card (Embedded MultimediaCard, eMMC) interface standard, Universal Flash Storage (UFS) interface standard, Compact Flash (CF) interface standard, Integrated Device Electronics (IDE) standard or other suitable criteria.

The memory controller 504 is used to execute a plurality of logic gates or control instructions implemented in hardware or firmware, and write and read data in the rewritable non-volatile memory module 506 according to the instructions of the host system 1000. Fetch and erase operations.

The rewritable non-volatile memory module 506 is electrically connected to the memory controller 504 and used for storing data written by the host system 1000 . The rewritable non-volatile memory module 506 has physical erasing units 508(0)˜508(R). For example, the physical erase units 508(0)˜508(R) may belong to the same memory die or belong to different memory dies. Each physical erasing unit has a plurality of physical programming units, and the physical programming units belonging to the same physical erasing unit can be written independently and erased simultaneously. For example, each physical erasing unit is composed of 128 physical programming units. However, it must be understood that the present invention is not limited thereto, and each physical erasing unit may be composed of 64 physical programming units, 256 physical programming units, or any other number of physical programming units.

In more detail, the physical erasing unit is the smallest unit of erasing. That is, each physical erase unit contains a minimum number of memory cells that are erased. The physical programming unit is the smallest unit of programming. That is, the physical programming unit is the minimum unit for writing data. Each physical programming unit generally includes a data bit field and a redundant bit field. The data bit area contains multiple physical access addresses to store user data, and the redundant bit area is used to store system data (eg, control information and error correction code). In this exemplary embodiment, the data bit area of each physical programming unit includes 4 physical access addresses, and the size of one physical access address is 512 bytes (byte, B). However, in other exemplary embodiments, the data bit area may also include 8, 16 or more or less physical access addresses, and the present invention does not limit the size and number of physical access addresses. For example, the physical erasing unit is a physical block, and the physical programming unit is a physical page or a physical sector.

In this exemplary embodiment, the rewritable non-volatile memory module 506 is a multi-level cell (Multi Level Cell, MLC) NAND flash memory module, that is, at least 2 bits of data can be stored in one memory cell. However, the present invention is not limited thereto, and the rewritable nonvolatile memory module 506 may also be a single-level memory cell (Single Level Cell, SLC) NAND flash memory module, a multi-level memory cell (Trinary Level Cell, TLC) NAND type flash memory modules, other flash memory modules, or other memory modules with the same characteristics.

In the exemplary embodiment of FIG. 5 , the connector 502 and the memory controller 504 are disposed on the same printed circuit board, and the printed circuit board includes the aforementioned pad structure 100 or 310 . However, in another exemplary embodiment, the connector 502 and the memory controller 504 may also be disposed on different printed circuit boards, and one of the printed circuit boards includes the aforementioned pad structure 100 or 310 .

To sum up, the exemplary embodiments of the present invention provide a bonding pad structure and a printed circuit board and a memory storage device using the same. In the pad structure, it includes at least two pads for electrically connecting the same end of the electronic component, so as to establish an additional connection node of the electronic component. Therefore, the designer can directly use the extra connection node to connect two different circuits when designing the circuit layout, thereby reducing the layout area of the circuit design on the printed circuit board, and improving the versatility and flexibility of the circuit layout design .

Although the present invention has been disclosed as above with exemplary embodiments, it is not intended to limit the present invention. Those skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention, so the protection of the present invention The scope shall be determined as defined by the appended claims.

Claims (18)

1. a welding pad structure, it is suitable for an electronic component arrangements on a printed circuit board (PCB), it is characterized in that, this welding pad structure comprises:

One first weld pad, is suitable for the one end being electrically connected this electronic component; And

Multiple second weld pad, respectively this second weld pad is suitable for the other end being electrically connected this electronic component, and wherein this first weld pad and these the second weld pads are electrically independent each other, and electrically independent each other between these second weld pads.

2. welding pad structure as claimed in claim 1, it is characterized in that, wherein these second weld pads are arranged at the same side in this welding pad structure, and this first weld pad is arranged at opposite side relative with these the second weld pads in this welding pad structure.

3. welding pad structure as claimed in claim 1, it is characterized in that, wherein this electronic component is the element pasted on surface comprising multiple scolding tin junction, and these scolding tin junctions comprise:

One first scolding tin junction, is arranged at this end of this electronic component; And

One second scolding tin junction, is arranged at this other end of this electronic component,

Wherein, this first weld pad is suitable for this end being connected to this electronic component via this first scolding tin electric characteristics on contact surface, and these second weld pads are suitable for this other end connecting this electronic component via this second scolding tin electric characteristics on contact surface.

4. welding pad structure as claimed in claim 3, it is characterized in that, wherein these second weld pads comprise:

One the 3rd weld pad, is electrically connected to one first circuit; And

One the 4th weld pad, is electrically connected to a second circuit, and this first circuit and this second circuit are electrically independent each other;

Wherein, when this electronic component arrangements is in this welding pad structure, the 3rd weld pad and the 4th weld pad are electrically connected mutually via this second scolding tin junction, and this first circuit and this second circuit are electrically connected mutually with this second circuit of activation.

5. a printed circuit board (PCB), is characterized in that, comprising:

One first welding pad structure, wherein this first welding pad structure comprises:

One first weld pad, is suitable for one end of electric connection one electronic component; And

Multiple second weld pad, respectively this second weld pad is suitable for the other end being electrically connected this electronic component, and wherein this first weld pad and these the second weld pads are electrically independent each other, and these second weld pads are electrically independent each other.

6. printed circuit board (PCB) as claimed in claim 5, it is characterized in that, wherein these second weld pads are arranged at the same side in this first welding pad structure, and this first weld pad is arranged at opposite side relative with these the second weld pads in this first welding pad structure.

7. printed circuit board (PCB) as claimed in claim 5, it is characterized in that, wherein this electronic component is the element pasted on surface comprising multiple scolding tin junction, and these scolding tin junctions at least comprise:

One first scolding tin junction, is located at this end of this electronic component; And

One second scolding tin junction, is located at this other end of this electronic component,

Wherein, this first weld pad is suitable for this end being connected to this electronic component via this first scolding tin electric characteristics on contact surface, and these second weld pads are suitable for this other end connecting this electronic component via this second scolding tin electric characteristics on contact surface.

8. printed circuit board (PCB) as claimed in claim 7, it is characterized in that, wherein these second weld pads comprise:

One the 3rd weld pad, is electrically connected to one first circuit; And

One the 4th weld pad, is electrically connected to a second circuit, and this first circuit and this second circuit are electrically independent each other,

Wherein, when this electronic component arrangements is in this welding pad structure, the 3rd weld pad and the 4th weld pad are electrically connected mutually via this second scolding tin junction, and this first circuit and this second circuit are electrically connected mutually with this second circuit of activation.

9. printed circuit board (PCB) as claimed in claim 5, is characterized in that, also comprise:

This electronic component, be arranged in this first welding pad structure, wherein this end of this electronic component is connected to this first weld pad, and this other end of this electronic component is connected to these the second weld pads.

10. printed circuit board (PCB) as claimed in claim 5, is characterized in that, also comprise:

One second welding pad structure, wherein this second welding pad structure comprises:

2 the 5th weld pads, these the 5th weld pads one end being suitable for electric connection one first electronic component wherein, these the 5th weld pads wherein another is suitable for the other end being electrically connected this first electronic component, wherein these the 5th weld pads are electrically independent each other, and the number of the scolding tin junction of this first electronic component is same as the number of the scolding tin junction of this electronic component.

11. as claim 10 the printed circuit board (PCB) that counts, it is characterized in that, wherein the layout area of this first welding pad structure is identical in fact with the layout area of this second welding pad structure.

12. 1 kinds of memory storage apparatus, is characterized in that, comprising:

A connector, in order to be electrically connected to a host computer system;

One reproducible nonvolatile memorizer module, comprises multiple physics erased cell; And

One Memory Controller, is electrically connected to this connector and this reproducible nonvolatile memorizer module,

Wherein, this connector or this Memory Controller are arranged on a printed circuit board (PCB), and this printed circuit board (PCB) comprises:

One first welding pad structure, wherein this first welding pad structure comprises:

One first weld pad, is suitable for one end of electric connection one electronic component; And

Multiple second weld pad, wherein respectively this second weld pad is suitable for the other end being electrically connected this electronic component,

Wherein this first weld pad and these the second weld pads are electrically independent each other, and these second weld pads are electrically independent each other.

13. memory storage apparatus as claimed in claim 12, it is characterized in that, wherein these second weld pads are arranged at the same side in this first welding pad structure, and this first weld pad is arranged at opposite side relative with these the second weld pads in this first welding pad structure.

14. memory storage apparatus as claimed in claim 12, is characterized in that, wherein this electronic component is the element pasted on surface comprising multiple scolding tin junction, and these scolding tin junctions comprise:

One first scolding tin junction, is located at this end of this electronic component; And

One second scolding tin junction, is located at this other end of this electronic component,

Wherein, this first weld pad is suitable for this end being connected to this electronic component via this first scolding tin electric characteristics on contact surface, and these second weld pads are suitable for this other end connecting this electronic component via this second scolding tin electric characteristics on contact surface.

15. memory storage apparatus as claimed in claim 14, it is characterized in that, wherein these second weld pads comprise:

One the 3rd weld pad, is electrically connected to one first circuit; And

One the 4th weld pad, is electrically connected to a second circuit, and this first circuit and this second circuit are electrically independent each other,

Wherein, when this electronic component arrangements is in this welding pad structure, the 3rd weld pad and the 4th weld pad are electrically connected mutually via this second scolding tin junction, and this first circuit and this second circuit are electrically connected mutually with this second circuit of activation.

16. memory storage apparatus as claimed in claim 12, it is characterized in that, wherein this printed circuit board (PCB) also comprises:

This electronic component, be arranged in this first welding pad structure, wherein this end of this electronic component is connected to this first weld pad, and this other end of this electronic component is connected to these the second weld pads.

17. memory storage apparatus as claimed in claim 12, it is characterized in that, wherein this printed circuit board (PCB) also comprises:

One second welding pad structure, wherein this second welding pad structure comprises:

2 the 5th weld pads, these the 5th weld pads one end being suitable for electric connection one first electronic component wherein, these the 5th weld pads wherein another is suitable for the other end being electrically connected this first electronic component, wherein these the 5th weld pads are electrically independent each other, and the number of the scolding tin junction of this first electronic component is same as the number of the scolding tin junction of this electronic component.

18. memory storage apparatus as claimed in claim 17, is characterized in that, wherein the layout area of this first welding pad structure is identical in fact with the layout area of this second welding pad structure.