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CL2017002113A1 - Protector de ánodo - Google Patents

Protector de ánodo

Info

Publication number
CL2017002113A1
CL2017002113A1 CL2017002113A CL2017002113A CL2017002113A1 CL 2017002113 A1 CL2017002113 A1 CL 2017002113A1 CL 2017002113 A CL2017002113 A CL 2017002113A CL 2017002113 A CL2017002113 A CL 2017002113A CL 2017002113 A1 CL2017002113 A1 CL 2017002113A1
Authority
CL
Chile
Prior art keywords
anode
sizzle
anode protector
protector
prolonged
Prior art date
Application number
CL2017002113A
Other languages
English (en)
Inventor
Michael Marshall
Jeff Brown
Original Assignee
Vision Ease Lp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vision Ease Lp filed Critical Vision Ease Lp
Publication of CL2017002113A1 publication Critical patent/CL2017002113A1/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3441—Dark space shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32871—Means for trapping or directing unwanted particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3438—Electrodes other than cathode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3447—Collimators, shutters, apertures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/026—Shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3322—Problems associated with coating
    • H01J2237/3323—Problems associated with coating uniformity

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Physical Vapour Deposition (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Cold Cathode And The Manufacture (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Electron Sources, Ion Sources (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

<p>Un sistema de chisporroteo y un montaje de ánodo protector de ánodo que proporciona conexión mejorada a tierra para ciclos prolongados de chisporroteo.</p>
CL2017002113A 2015-03-18 2017-08-17 Protector de ánodo CL2017002113A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201562135057P 2015-03-18 2015-03-18

Publications (1)

Publication Number Publication Date
CL2017002113A1 true CL2017002113A1 (es) 2018-05-11

Family

ID=56920055

Family Applications (1)

Application Number Title Priority Date Filing Date
CL2017002113A CL2017002113A1 (es) 2015-03-18 2017-08-17 Protector de ánodo

Country Status (13)

Country Link
US (1) US20160300700A1 (es)
EP (1) EP3250729A4 (es)
KR (1) KR20170128225A (es)
CN (1) CN107614737A (es)
AU (1) AU2016232864A1 (es)
BR (1) BR112017017781A2 (es)
CA (1) CA2975153A1 (es)
CL (1) CL2017002113A1 (es)
CO (1) CO2017008424A2 (es)
MX (1) MX2017010676A (es)
PE (1) PE20171549A1 (es)
WO (1) WO2016149560A1 (es)
ZA (1) ZA201705082B (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108559966A (zh) * 2018-07-26 2018-09-21 北京铂阳顶荣光伏科技有限公司 一种阳极结构及磁控溅射装置
JP7102323B2 (ja) * 2018-11-19 2022-07-19 株式会社アルバック スパッタリング方法及びスパッタリング装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038171A (en) * 1976-03-31 1977-07-26 Battelle Memorial Institute Supported plasma sputtering apparatus for high deposition rate over large area
US4131533A (en) * 1977-12-30 1978-12-26 International Business Machines Corporation RF sputtering apparatus having floating anode shield
US4362611A (en) * 1981-07-27 1982-12-07 International Business Machines Corporation Quadrupole R.F. sputtering system having an anode/cathode shield and a floating target shield
DE3521053A1 (de) * 1985-06-12 1986-12-18 Leybold-Heraeus GmbH, 5000 Köln Vorrichtung zum aufbringen duenner schichten auf ein substrat
DE4042289A1 (de) * 1990-12-31 1992-07-02 Leybold Ag Verfahren und vorrichtung zum reaktiven beschichten eines substrats
US6296743B1 (en) * 1993-04-02 2001-10-02 Applied Materials, Inc. Apparatus for DC reactive plasma vapor deposition of an electrically insulating material using a shielded secondary anode
JPH08232064A (ja) * 1995-02-24 1996-09-10 Hitachi Ltd 反応性マグネトロンスパッタ装置
JP4656697B2 (ja) * 2000-06-16 2011-03-23 キヤノンアネルバ株式会社 高周波スパッタリング装置
JP4720625B2 (ja) * 2006-06-05 2011-07-13 パナソニック株式会社 スパッタリング装置
JP2010024532A (ja) * 2008-07-24 2010-02-04 Asahi Glass Co Ltd マグネトロンスパッタ装置、成膜方法、及び光学部品の製造方法
US8066857B2 (en) * 2008-12-12 2011-11-29 Fujifilm Corporation Shaped anode and anode-shield connection for vacuum physical vapor deposition
EP2325350A1 (en) * 2009-11-24 2011-05-25 Applied Materials, Inc. Anode rod for a sputtering system
US8591709B1 (en) * 2010-05-18 2013-11-26 WD Media, LLC Sputter deposition shield assembly to reduce cathode shorting
TW201213572A (en) * 2010-09-29 2012-04-01 Hon Hai Prec Ind Co Ltd Sputtering apparatus
DE102012206553A1 (de) * 2012-04-20 2013-10-24 Von Ardenne Anlagentechnik Gmbh Verfahren und Vorrichtung zum Steuern der Schichtdickenverteilung in einer Vakuumbeschichtung

Also Published As

Publication number Publication date
CN107614737A (zh) 2018-01-19
ZA201705082B (en) 2019-07-31
PE20171549A1 (es) 2017-10-27
US20160300700A1 (en) 2016-10-13
KR20170128225A (ko) 2017-11-22
WO2016149560A1 (en) 2016-09-22
BR112017017781A2 (pt) 2018-07-17
CA2975153A1 (en) 2016-09-22
EP3250729A1 (en) 2017-12-06
WO2016149560A9 (en) 2016-11-17
EP3250729A4 (en) 2018-09-26
AU2016232864A1 (en) 2017-08-17
MX2017010676A (es) 2017-11-16
CO2017008424A2 (es) 2017-10-31

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