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CA2860909C - Decalage de protection et amelioration de couplage de cartes a puce metallisees - Google Patents

Decalage de protection et amelioration de couplage de cartes a puce metallisees Download PDF

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Publication number
CA2860909C
CA2860909C CA2860909A CA2860909A CA2860909C CA 2860909 C CA2860909 C CA 2860909C CA 2860909 A CA2860909 A CA 2860909A CA 2860909 A CA2860909 A CA 2860909A CA 2860909 C CA2860909 C CA 2860909C
Authority
CA
Canada
Prior art keywords
antenna
module
smart card
contact pads
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CA2860909A
Other languages
English (en)
Other versions
CA2860909A1 (fr
Inventor
David Finn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Feinics Amatech Teoranta Ltd
Original Assignee
Feinics Amatech Teoranta Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/600,140 external-priority patent/US8991712B2/en
Priority claimed from US13/730,811 external-priority patent/US9165240B2/en
Application filed by Feinics Amatech Teoranta Ltd filed Critical Feinics Amatech Teoranta Ltd
Publication of CA2860909A1 publication Critical patent/CA2860909A1/fr
Application granted granted Critical
Publication of CA2860909C publication Critical patent/CA2860909C/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0239—Signal transmission by AC coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)

Abstract

L'invention concerne une carte à puce à interface double ayant une antenne d'amplification (BA) à bobine de couplage (CC) dans son corps de carte (CB), et une plaque de face métallisée (202, 302) ayant une ouverture en fenêtre (220, 320) pour le module d'antenne (AM). La performance peut être améliorée par au moins la fabrication de l'ouverture en fenêtre sensiblement plus grande que le module d'antenne, la disposition de perforations à travers la plaque de face, la disposition de matériau ferrite entre la plaque de face et l'antenne d'amplification. De plus, par au moins la modification de plots de contact (CP) sur le module d'antenne (AM), la disposition d'une boucle de compensation (CL) sous l'antenne d'amplification, le décalage du module d'antenne par rapport à la bobine de couplage, l'agencement de l'antenne d'amplification en tant que quasi-dipôle, la disposition de l'antenne de module (MA) avec des bras de réactance capacitifs, et la disposition d'un élément en ferrite (FE) dans le module d'antenne, entre l'antenne de module et les plots de contact.
CA2860909A 2012-01-23 2013-01-23 Decalage de protection et amelioration de couplage de cartes a puce metallisees Active CA2860909C (fr)

Applications Claiming Priority (19)

Application Number Priority Date Filing Date Title
US201261589434P 2012-01-23 2012-01-23
US61/589,434 2012-01-23
US201261619951P 2012-04-04 2012-04-04
US61/619,951 2012-04-04
US201261624384P 2012-04-15 2012-04-15
US61/624,384 2012-04-15
US201261693262P 2012-08-25 2012-08-25
US61/693,262 2012-08-25
US13/600,140 US8991712B2 (en) 2010-08-12 2012-08-30 Coupling in and to RFID smart cards
US13/600,140 2012-08-30
US201261697825P 2012-09-07 2012-09-07
US61/697,825 2012-09-07
US201261732414P 2012-12-03 2012-12-03
US61/732,414 2012-12-03
US201261737746P 2012-12-15 2012-12-15
US61/737,746 2012-12-15
US13/730,811 US9165240B2 (en) 2009-10-15 2012-12-28 Coupling in and to RFID smart cards
US13/730,811 2012-12-28
PCT/EP2013/051175 WO2013110625A1 (fr) 2012-01-23 2013-01-23 Décalage de protection et amélioration de couplage de cartes à puce métallisées

Publications (2)

Publication Number Publication Date
CA2860909A1 CA2860909A1 (fr) 2013-08-01
CA2860909C true CA2860909C (fr) 2021-11-16

Family

ID=47722223

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2860909A Active CA2860909C (fr) 2012-01-23 2013-01-23 Decalage de protection et amelioration de couplage de cartes a puce metallisees

Country Status (9)

Country Link
EP (1) EP2807700A1 (fr)
JP (1) JP2015513712A (fr)
KR (1) KR20140117614A (fr)
CN (1) CN104471791A (fr)
AU (1) AU2013211649A1 (fr)
BR (1) BR112014018042A8 (fr)
CA (1) CA2860909C (fr)
MX (1) MX2014008936A (fr)
WO (1) WO2013110625A1 (fr)

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US9475086B2 (en) 2013-01-18 2016-10-25 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US10518518B2 (en) 2013-01-18 2019-12-31 Féinics Amatech Teoranta Smart cards with metal layer(s) and methods of manufacture
US10733494B2 (en) 2014-08-10 2020-08-04 Féinics Amatech Teoranta Contactless metal card constructions
US10824931B2 (en) 2012-08-30 2020-11-03 Féinics Amatech Teoranta Contactless smartcards with multiple coupling frames
US10552722B2 (en) 2014-08-10 2020-02-04 Féinics Amatech Teoranta Smartcard with coupling frame antenna
US11386317B2 (en) 2013-01-18 2022-07-12 Amatech Group Limited Transponder chip module with module antenna(s) and coupling frame(s)
US11354558B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Contactless smartcards with coupling frames
US10977542B2 (en) 2013-01-18 2021-04-13 Amtech Group Limited Industrial Estate Smart cards with metal layer(s) and methods of manufacture
US10599972B2 (en) 2013-01-18 2020-03-24 Féinics Amatech Teoranta Smartcard constructions and methods
US11551051B2 (en) 2013-01-18 2023-01-10 Amatech Group Limiied Coupling frames for smartcards with various module opening shapes
US11354560B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Smartcards with multiple coupling frames
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ES3007784T3 (en) * 2013-11-13 2025-03-20 Feinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
EP3754554A1 (fr) * 2014-03-26 2020-12-23 Féinics Amatech Teoranta Bande de module et module de puce de transpondeur
EP3748543B1 (fr) * 2014-09-22 2023-07-12 Féinics Amatech Teoranta Cartes à puce métalliques hybrides
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FR3047101B1 (fr) * 2016-01-26 2022-04-01 Linxens Holding Procede de fabrication d’un module de carte a puce et d’une carte a puce
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
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MX395538B (es) 2016-07-27 2025-03-25 Composecure Llc Componentes electrónicos sobremoldeados para tarjetas de transacción y métodos para hacer los mismos.
KR101868478B1 (ko) * 2016-08-17 2018-07-23 주식회사 아이씨케이 비접촉식 카드 기능을 갖는 메탈 카드
JP6888402B2 (ja) * 2017-05-01 2021-06-16 凸版印刷株式会社 基板モジュール
KR102208865B1 (ko) * 2017-08-25 2021-01-27 씨피아이 카드 그룹-콜로라도, 인크. 가중 거래 카드
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Also Published As

Publication number Publication date
CA2860909A1 (fr) 2013-08-01
AU2013211649A1 (en) 2014-07-31
KR20140117614A (ko) 2014-10-07
BR112014018042A8 (pt) 2017-07-11
WO2013110625A1 (fr) 2013-08-01
BR112014018042A2 (fr) 2017-06-20
CN104471791A (zh) 2015-03-25
EP2807700A1 (fr) 2014-12-03
JP2015513712A (ja) 2015-05-14
MX2014008936A (es) 2015-06-02

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