CA2586149A1 - Modular system for improving electro-metallurgical processes - Google Patents
Modular system for improving electro-metallurgical processes Download PDFInfo
- Publication number
- CA2586149A1 CA2586149A1 CA002586149A CA2586149A CA2586149A1 CA 2586149 A1 CA2586149 A1 CA 2586149A1 CA 002586149 A CA002586149 A CA 002586149A CA 2586149 A CA2586149 A CA 2586149A CA 2586149 A1 CA2586149 A1 CA 2586149A1
- Authority
- CA
- Canada
- Prior art keywords
- cathodes
- cathode
- modular system
- reduction
- metallurgical processes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010310 metallurgical process Methods 0.000 title claims 5
- 238000000034 method Methods 0.000 claims abstract 2
- 230000008901 benefit Effects 0.000 claims 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- 238000003306 harvesting Methods 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000000126 substance Substances 0.000 claims 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 239000003792 electrolyte Substances 0.000 claims 2
- 230000008030 elimination Effects 0.000 claims 2
- 238000003379 elimination reaction Methods 0.000 claims 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims 1
- 239000003153 chemical reaction reagent Substances 0.000 claims 1
- 229910000365 copper sulfate Inorganic materials 0.000 claims 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 239000011133 lead Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002994 raw material Substances 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
- 239000011593 sulfur Substances 0.000 claims 1
- 230000008021 deposition Effects 0.000 abstract 1
- ODLMAHJVESYWTB-UHFFFAOYSA-N CCCc1ccccc1 Chemical compound CCCc1ccccc1 ODLMAHJVESYWTB-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
- C25C7/06—Operating or servicing
- C25C7/08—Separating of deposited metals from the cathode
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
A modular system for improving electro-metallurgical systems constituted by a structural Nucleus compatible with the use of additional independent modules, permits the solving of one or more of the problems listed above, attaching specific modules to resolve each one of said problems. Thus, for example, the use of vertical or horizontal modules to distance anodes and cathodes from each other permits the solving of the problem of the deposits on the borders of the cathodes, without having to recur to the application of high frequency currents, simplifying the solution of the problem and at the same time allowing the EW
process to work at higher current densities, without the generation of short circuits, while improving de cathode deposition quality as well as its current efficiency.
process to work at higher current densities, without the generation of short circuits, while improving de cathode deposition quality as well as its current efficiency.
Claims (6)
1. Both the chemical as well as the physical quality of the cathode improves. With regard to the chemical quality, a smaller content of Lead, Sulfur and Iron is reflected. On the other hand, the occlusion of copper sulfate on the borders of the deposit is eliminated because the Modular System for Improving Electro-Metallurgical Processes does not use plastic stripping. With regard to the physical quality, by ensuring the parallelism between anodes and cathodes, the short circuits are eliminated, the grain of the deposit is homogenized and refined, no copper ribbons were observed in any of edges of the copper cathode and a perfectly linear upper border of the cathodic deposit was obtained.
2. Current efficiency increases. How to take advantage of this benefit depends on the metal availability in the electrolyte. That is, the metal production can be increased, the electric power consumption can be reduced, or the harvesting cycle can be shortened.
3. Improves the increase of current density. This benefit is the direct result of confining the cathodes and anodes inside the Modular System for Improving Electro-Metallurgical Processes, that allows, according to the metal content in the electrolyte and without an additional investment, either increase the plant capacity, shorten the harvest cycle or reduce the number of cathodes per cell.
4, It provides an operational path for breaking the paradigm of distance between cathode and anode. This benefit is the direct result of the confinement of cathodes and anodes within the Modular System for Improving Electro-Metallurgical Processes that permits, according to the availability of copper and without an additional investment, either to increase the plant capacity by increasing the number of cathodes per cell, to shorten the harvest cycle, or reduce the number of cells.
5. Equitable distribution of the current through the cathodes. This benefit is translated into a lower variability of the current efficiency, of the weight of the cathodes, and of the chemical and physical quality of the cathodes.
6. Operational Improvements. The operational improvements include multiple benefits that arise from the absence of jacketed cathodes, absence of short circuits and the ease with which the cathodes deposited can be loosened from the stainless cathode substrates with the Modular System for Improving Electro-Metallurgical Processes. The most important of these are: greater availability of equipment, reduction of human resources and reduction of raw materials costs. First, the factors that affect the greater availability of equipment are:
100% detaching in peeling machine, reduction of stripping frequency, increased useful life of the cathode, the anode and the cell, and increased availability of the traveling crane.
Second, the reduction of the Human Resources corresponds to the reduced supervision of short-circuits, manual detachment of plates and rectification of short circuited cathodes.
Finally, the cost reduction associated to the product intake used in the EW process relates to the elimination of plastic borders, the elimination of cathode/anode spacers and the consumption reduction of chemical reagents.
100% detaching in peeling machine, reduction of stripping frequency, increased useful life of the cathode, the anode and the cell, and increased availability of the traveling crane.
Second, the reduction of the Human Resources corresponds to the reduced supervision of short-circuits, manual detachment of plates and rectification of short circuited cathodes.
Finally, the cost reduction associated to the product intake used in the EW process relates to the elimination of plastic borders, the elimination of cathode/anode spacers and the consumption reduction of chemical reagents.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CL1300-2006 | 2006-05-30 | ||
| CL200601300 | 2006-05-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2586149A1 true CA2586149A1 (en) | 2007-11-30 |
| CA2586149C CA2586149C (en) | 2011-03-01 |
Family
ID=38788264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2586149A Expired - Fee Related CA2586149C (en) | 2006-05-30 | 2007-04-20 | Modular system for improving electro-metallurgical processes |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20070284243A1 (en) |
| AU (1) | AU2007201708B2 (en) |
| CA (1) | CA2586149C (en) |
| PE (1) | PE20071262A1 (en) |
| ZA (1) | ZA200704426B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CL2008000032A1 (en) * | 2008-01-07 | 2008-07-04 | New Tech Copper S A | VERTICAL GUIDE OF ELECTRODES THAT INCLUDES A SUPERIOR ALIGNMENT HEAD FOLLOWED BY A LOWER GUIDE WHERE THE HEAD HELPS THE INTRODUCTION OF THE ELECTRODE IN THE GUIDE WHICH HAS PERFORATIONS TO BE FIXED TO THE CELL STRUCTURE AND A PROFILE IN |
| WO2016054754A1 (en) * | 2014-10-06 | 2016-04-14 | New Tech Copper Spa | Sliding cathode guide |
| WO2016054753A1 (en) * | 2014-10-06 | 2016-04-14 | New Tech Copper Spa | Sliding anode guide |
| WO2016054755A1 (en) * | 2014-10-06 | 2016-04-14 | New Tech Copper Spa | System for holding anode and cathode guides |
| WO2020069630A1 (en) * | 2018-10-05 | 2020-04-09 | New Tech Copper Spa | System having a self-supporting structure that can be assembled by pieces and can be adapted to the space for the electrowinning of metals, both in an already operational cell or in a tank (selle ng); assembly method; and sludge removal method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6746581B2 (en) * | 2002-10-22 | 2004-06-08 | William A. Ebert | Edge protector systems for cathode plates and methods of making same |
| CL2004001020A1 (en) * | 2004-05-12 | 2005-02-11 | New Tech Copper S A | PERIMETER CATHODIC DEPOSITATION CONTROL EQUIPMENT, INCLUDES PROFILES GUIDE ENERGIZABLE CATHODS THROUGH ELECTRICAL CONDUCTORS INSERTED IN LONGITUDINAL PROFILE SENSE, FIXED IN OPPOSITE SIDES OF A SUPPORTING STRUCTURE OF ISOLATED MATERIAL |
-
2007
- 2007-01-30 PE PE2007000108A patent/PE20071262A1/en not_active Application Discontinuation
- 2007-04-17 AU AU2007201708A patent/AU2007201708B2/en not_active Ceased
- 2007-04-20 CA CA2586149A patent/CA2586149C/en not_active Expired - Fee Related
- 2007-05-24 US US11/802,672 patent/US20070284243A1/en not_active Abandoned
- 2007-05-29 ZA ZA200704426A patent/ZA200704426B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| AU2007201708A1 (en) | 2007-12-20 |
| AU2007201708B2 (en) | 2011-05-19 |
| ZA200704426B (en) | 2008-06-25 |
| PE20071262A1 (en) | 2008-01-07 |
| US20070284243A1 (en) | 2007-12-13 |
| CA2586149C (en) | 2011-03-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |
Effective date: 20170420 |