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CA2347818A1 - Couche constitutive pour cartes intelligentes constituees d'adhesifs fusibles - Google Patents

Couche constitutive pour cartes intelligentes constituees d'adhesifs fusibles Download PDF

Info

Publication number
CA2347818A1
CA2347818A1 CA002347818A CA2347818A CA2347818A1 CA 2347818 A1 CA2347818 A1 CA 2347818A1 CA 002347818 A CA002347818 A CA 002347818A CA 2347818 A CA2347818 A CA 2347818A CA 2347818 A1 CA2347818 A1 CA 2347818A1
Authority
CA
Canada
Prior art keywords
hot
melt adhesive
smart cards
card
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002347818A
Other languages
English (en)
Inventor
Liane Wustrich
Paul Ranft
Jurgen Grutzner
Uwe Kolb
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2347818A1 publication Critical patent/CA2347818A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0097—Glues or adhesives, e.g. hot melts or thermofusible adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Credit Cards Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne l'utilisation d'adhésifs fusibles thermoplastiques pour la réalisation de couches constitutives de cartes intelligentes ou pour la production de transpondeurs électroniques selon un procédé de moulage par injection basse-pression, sous des pressions comprises entre 1 et 50 bar. On utilise, de préférence, pour la mise en oeuvre de ce procédé, des adhésifs fusibles à base de polyamide, de polyuréthanne, de polyester, de polypropylène atactique, de copolymères EVA ou de copolymères d'éthylène de faible poids moléculaire, ou bien à base de mélange de ceux-ci.
CA002347818A 1998-10-22 1999-10-13 Couche constitutive pour cartes intelligentes constituees d'adhesifs fusibles Abandoned CA2347818A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19848712A DE19848712A1 (de) 1998-10-22 1998-10-22 Komponentenschicht für Smart Cards aus Schmelzklebstoffen
DE19848712.6 1998-10-22
PCT/EP1999/007683 WO2000025264A1 (fr) 1998-10-22 1999-10-13 Couche constitutive pour cartes intelligentes constituees d'adhesifs fusibles

Publications (1)

Publication Number Publication Date
CA2347818A1 true CA2347818A1 (fr) 2000-05-04

Family

ID=7885287

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002347818A Abandoned CA2347818A1 (fr) 1998-10-22 1999-10-13 Couche constitutive pour cartes intelligentes constituees d'adhesifs fusibles

Country Status (6)

Country Link
EP (1) EP1123535A1 (fr)
JP (1) JP2002528907A (fr)
KR (1) KR20010080890A (fr)
CA (1) CA2347818A1 (fr)
DE (1) DE19848712A1 (fr)
WO (1) WO2000025264A1 (fr)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013016130A3 (fr) * 2011-07-22 2013-12-19 H.B. Fuller Company Adhésif thermocollant réactif à utiliser en électronique
CN103965703A (zh) * 2014-05-23 2014-08-06 南通恒隆化工有限公司 一种水泥地板涂料
US9242436B1 (en) 2014-09-08 2016-01-26 Electronic Data Magnetics, Inc. Transaction cards and system
WO2018022755A1 (fr) * 2016-07-27 2018-02-01 Composecure, Llc Composants électroniques surmoulés pour cartes de transaction et leurs procédés de fabrication
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US10885419B2 (en) 2017-09-07 2021-01-05 Composecure, Llc Transaction card with embedded electronic components and process for manufacture
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
US11232341B2 (en) 2017-10-18 2022-01-25 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
US20230365752A1 (en) * 2020-10-07 2023-11-16 Bostik Sa Polyamide composition

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10040762A1 (de) 2000-08-19 2002-03-07 Henkel Kgaa Formteile aus Dimerfettsäurefreie Polyamiden
DE20100158U1 (de) 2001-01-05 2002-05-08 Bundesdruckerei GmbH, 10969 Berlin Identifikations- und Sicherheitskarte aus laminierten und/oder gespritzten Kunststoffen
JP2002259930A (ja) * 2001-03-02 2002-09-13 Hitachi Cable Ltd 非接触ｉｃカードの製造方法
GB0106082D0 (en) 2001-03-13 2001-05-02 Mat & Separations Tech Int Ltd Method and equipment for removing volatile compounds from air
JP4706117B2 (ja) * 2001-03-26 2011-06-22 凸版印刷株式会社 Ｉｃカードの製造方法
FI117331B (fi) * 2001-07-04 2006-09-15 Rafsec Oy Menetelmä ruiskuvaletun tuotteen valmistamiseksi
DE10135595C1 (de) * 2001-07-20 2003-02-13 Optimel Schmelzgustechnik Gmbh Verfahren zum kontinuierlichen Herstellen von dünnen, beidseitig mit Isoliermaterialien umhüllten Transpondern
WO2003034333A1 (fr) * 2001-10-18 2003-04-24 Trüb AG Procede de production d'un support de donnees et support de donnees produit selon ce procede
DE10205914A1 (de) * 2002-02-13 2003-08-21 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Polyesterfolien mit Transponderantennenspule
US8010405B1 (en) 2002-07-26 2011-08-30 Visa Usa Inc. Multi-application smart card device software solution for smart cardholder reward selection and redemption
US8626577B2 (en) 2002-09-13 2014-01-07 Visa U.S.A Network centric loyalty system
US8015060B2 (en) 2002-09-13 2011-09-06 Visa Usa, Inc. Method and system for managing limited use coupon and coupon prioritization
US9852437B2 (en) 2002-09-13 2017-12-26 Visa U.S.A. Inc. Opt-in/opt-out in loyalty system
US7121456B2 (en) 2002-09-13 2006-10-17 Visa U.S.A. Inc. Method and system for managing token image replacement
US6920611B1 (en) 2002-11-25 2005-07-19 Visa U.S.A., Inc. Method and system for implementing a loyalty merchant component
US7827077B2 (en) 2003-05-02 2010-11-02 Visa U.S.A. Inc. Method and apparatus for management of electronic receipts on portable devices
US8554610B1 (en) 2003-08-29 2013-10-08 Visa U.S.A. Inc. Method and system for providing reward status
US7104446B2 (en) 2003-09-03 2006-09-12 Visa U.S.A., Inc. Method, system and portable consumer device using wildcard values
US7051923B2 (en) 2003-09-12 2006-05-30 Visa U.S.A., Inc. Method and system for providing interactive cardholder rewards image replacement
US8407083B2 (en) 2003-09-30 2013-03-26 Visa U.S.A., Inc. Method and system for managing reward reversal after posting
US8005763B2 (en) 2003-09-30 2011-08-23 Visa U.S.A. Inc. Method and system for providing a distributed adaptive rules based dynamic pricing system
US7653602B2 (en) 2003-11-06 2010-01-26 Visa U.S.A. Inc. Centralized electronic commerce card transactions
EP2298830B1 (fr) * 2009-09-18 2011-11-09 Henkel AG & Co. KGaA Polyamide stable pendant l'hydrolyse
US20110145082A1 (en) 2009-12-16 2011-06-16 Ayman Hammad Merchant alerts incorporating receipt data
US8429048B2 (en) 2009-12-28 2013-04-23 Visa International Service Association System and method for processing payment transaction receipts
FR3077025B1 (fr) * 2018-01-25 2021-01-22 Les Bouchages Delage Procede d’integration d’un composant rfid dans un dispositif
SG10201906867RA (en) 2019-07-25 2021-02-25 Pci Private Ltd Method for manufacturing electronic device

Family Cites Families (9)

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Publication number Priority date Publication date Assignee Title
JP3087386B2 (ja) * 1991-10-17 2000-09-11 三菱化学株式会社 熱可塑性樹脂組成物および電子部品封止成形品
DE4446027A1 (de) * 1994-12-23 1996-07-04 Henkel Kgaa Formteile aus PU-Schmelzklebstoffen
DE19519499B4 (de) * 1995-05-27 2005-05-25 Tesa Ag Thermoplastische Klebstoffolie und deren Verwendung
WO1997048562A1 (fr) * 1996-06-17 1997-12-24 Mitsubishi Denki Kabushiki Kaisha Procede de production de carte de circuits imprimes fines, et construction de ces dernieres
DE19709985A1 (de) * 1997-03-11 1998-09-17 Pav Card Gmbh Chipkarte, Verbindungsanordnung und Verfahren zum Herstellen einer Chipkarte
JPH11134465A (ja) * 1997-10-31 1999-05-21 Konica Corp Ｉｃカード
WO1999029797A1 (fr) * 1997-12-09 1999-06-17 Toagosei Co., Ltd. Composition adhesive thermofusible et cartes a circuit integre stratifiees par la resine
JPH11175682A (ja) * 1997-12-12 1999-07-02 Hitachi Maxell Ltd Ｉｃカード及びその製造方法
JP3951409B2 (ja) * 1998-02-12 2007-08-01 日立化成工業株式会社 Ｉｃカードとその製造法

Cited By (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013016130A3 (fr) * 2011-07-22 2013-12-19 H.B. Fuller Company Adhésif thermocollant réactif à utiliser en électronique
CN103717688A (zh) * 2011-07-22 2014-04-09 H.B.富勒公司 在电子器件上使用的反应性热熔粘合剂
US9659832B2 (en) 2011-07-22 2017-05-23 H.B. Fuller Company Reactive hot-melt adhesive for use on electronics
CN103965703A (zh) * 2014-05-23 2014-08-06 南通恒隆化工有限公司 一种水泥地板涂料
US9242436B1 (en) 2014-09-08 2016-01-26 Electronic Data Magnetics, Inc. Transaction cards and system
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US11247371B2 (en) 2016-07-27 2022-02-15 Composecure, Llc Overmolded electronic components for transaction cards and methods of making thereof
US10583594B2 (en) 2016-07-27 2020-03-10 Composecure, Llc Overmolded electronic components for transaction cards and methods of making thereof
EP3491584A4 (fr) * 2016-07-27 2020-04-08 Composecure LLC Composants électroniques surmoulés pour cartes de transaction et leurs procédés de fabrication
WO2018022755A1 (fr) * 2016-07-27 2018-02-01 Composecure, Llc Composants électroniques surmoulés pour cartes de transaction et leurs procédés de fabrication
US10406734B2 (en) 2016-07-27 2019-09-10 Composecure, Llc Overmolded electronic components for transaction cards and methods of making thereof
US10926439B2 (en) 2016-07-27 2021-02-23 Composecure, Llc Overmolded electronic components for transaction cards and methods of making thereof
US11461608B2 (en) 2016-07-27 2022-10-04 Composecure, Llc RFID device
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
US11267172B2 (en) 2016-07-27 2022-03-08 Composecure, Llc Overmolded electronic components for transaction cards and methods of making thereof
US11829826B2 (en) 2016-07-27 2023-11-28 Composecure, Llc RFID device
US12079681B2 (en) 2016-07-27 2024-09-03 Composecure, Llc RFID device
US10885419B2 (en) 2017-09-07 2021-01-05 Composecure, Llc Transaction card with embedded electronic components and process for manufacture
US12254367B2 (en) 2017-09-07 2025-03-18 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
US11669708B2 (en) 2017-09-07 2023-06-06 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
US11315002B2 (en) 2017-09-07 2022-04-26 Composecure, Llc Transaction card with embedded electronic components and process for manufacture
US11501128B2 (en) 2017-09-07 2022-11-15 Composecure, Llc Transaction card with embedded electronic components and process for manufacture
US12086669B2 (en) 2017-10-18 2024-09-10 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
US11232341B2 (en) 2017-10-18 2022-01-25 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US11301743B2 (en) 2018-01-30 2022-04-12 Composecure, Llc Di capacitive embedded metal card
US11710024B2 (en) 2018-01-30 2023-07-25 Composecure, Llc Di capacitive embedded metal card
USD944322S1 (en) 2018-01-30 2022-02-22 Composecure, Llc Layer of a transaction card
USD944323S1 (en) 2018-01-30 2022-02-22 Composecure, Llc Layer of a transaction card
USD943669S1 (en) 2018-01-30 2022-02-15 Composecure, Llc Layer of a transaction card
US12093772B2 (en) 2018-01-30 2024-09-17 Composecure, Llc DI capacitive embedded metal card
USD943670S1 (en) 2018-01-30 2022-02-15 Composecure, Llc Layer of a transaction card
US12481860B2 (en) 2018-01-30 2025-11-25 Composecure, Llc Transaction card having a metal layer and a method for making the transaction card
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card
US20230365752A1 (en) * 2020-10-07 2023-11-16 Bostik Sa Polyamide composition

Also Published As

Publication number Publication date
WO2000025264A1 (fr) 2000-05-04
EP1123535A1 (fr) 2001-08-16
JP2002528907A (ja) 2002-09-03
DE19848712A1 (de) 2000-04-27
KR20010080890A (ko) 2001-08-25

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