CA2018113A1 - Resistance a film epais multicouches et methode de fabrication desdites resistances - Google Patents
Resistance a film epais multicouches et methode de fabrication desdites resistancesInfo
- Publication number
- CA2018113A1 CA2018113A1 CA 2018113 CA2018113A CA2018113A1 CA 2018113 A1 CA2018113 A1 CA 2018113A1 CA 2018113 CA2018113 CA 2018113 CA 2018113 A CA2018113 A CA 2018113A CA 2018113 A1 CA2018113 A1 CA 2018113A1
- Authority
- CA
- Canada
- Prior art keywords
- dielectric
- substrate
- thick film
- resistor
- dielectric platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 85
- 239000000919 ceramic Substances 0.000 claims abstract description 30
- 239000004020 conductor Substances 0.000 claims abstract description 29
- 238000007639 printing Methods 0.000 claims abstract description 11
- 238000000465 moulding Methods 0.000 claims abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000010304 firing Methods 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 15
- 239000010410 layer Substances 0.000 description 26
- 239000000463 material Substances 0.000 description 15
- 238000012360 testing method Methods 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 7
- 230000008859 change Effects 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 238000012216 screening Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910004541 SiN Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical compound [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- JUWSSMXCCAMYGX-UHFFFAOYSA-N gold platinum Chemical compound [Pt].[Au] JUWSSMXCCAMYGX-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA 2018113 CA2018113A1 (fr) | 1989-08-07 | 1990-06-01 | Resistance a film epais multicouches et methode de fabrication desdites resistances |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US390,047 | 1989-08-07 | ||
| CA 2018113 CA2018113A1 (fr) | 1989-08-07 | 1990-06-01 | Resistance a film epais multicouches et methode de fabrication desdites resistances |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2018113A1 true CA2018113A1 (fr) | 1991-02-07 |
Family
ID=4145123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2018113 Abandoned CA2018113A1 (fr) | 1989-08-07 | 1990-06-01 | Resistance a film epais multicouches et methode de fabrication desdites resistances |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2018113A1 (fr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009012239A3 (fr) * | 2007-07-18 | 2009-03-05 | Watlow Electric Mfg | Procédés de fabrication à temps de cycle réduit pour dispositifs résistifs à film épais |
| WO2009012369A3 (fr) * | 2007-07-18 | 2009-07-30 | Watlow Electric Mfg | Dispositif résisitif comportant des couches de films minces stratifiées faisant intervenir une bande diélectrique |
| US8061402B2 (en) | 2008-04-07 | 2011-11-22 | Watlow Electric Manufacturing Company | Method and apparatus for positioning layers within a layered heater system |
-
1990
- 1990-06-01 CA CA 2018113 patent/CA2018113A1/fr not_active Abandoned
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009012239A3 (fr) * | 2007-07-18 | 2009-03-05 | Watlow Electric Mfg | Procédés de fabrication à temps de cycle réduit pour dispositifs résistifs à film épais |
| WO2009012369A3 (fr) * | 2007-07-18 | 2009-07-30 | Watlow Electric Mfg | Dispositif résisitif comportant des couches de films minces stratifiées faisant intervenir une bande diélectrique |
| US8089337B2 (en) | 2007-07-18 | 2012-01-03 | Watlow Electric Manufacturing Company | Thick film layered resistive device employing a dielectric tape |
| US8557082B2 (en) | 2007-07-18 | 2013-10-15 | Watlow Electric Manufacturing Company | Reduced cycle time manufacturing processes for thick film resistive devices |
| US9486988B2 (en) | 2007-07-18 | 2016-11-08 | Watlow Electric Manufacturing Company | Reduced cycle time manufacturing processes for thick film resistive devices |
| US8061402B2 (en) | 2008-04-07 | 2011-11-22 | Watlow Electric Manufacturing Company | Method and apparatus for positioning layers within a layered heater system |
| US8070899B2 (en) | 2008-04-07 | 2011-12-06 | Watlow Electric Manufacturing Company | Method and apparatus for positioning layers within a layered heater system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Dead |