CA2005978A1 - Free-flowing granular formulation - Google Patents
Free-flowing granular formulationInfo
- Publication number
- CA2005978A1 CA2005978A1 CA 2005978 CA2005978A CA2005978A1 CA 2005978 A1 CA2005978 A1 CA 2005978A1 CA 2005978 CA2005978 CA 2005978 CA 2005978 A CA2005978 A CA 2005978A CA 2005978 A1 CA2005978 A1 CA 2005978A1
- Authority
- CA
- Canada
- Prior art keywords
- mixture
- curable
- filler
- granular formulation
- single component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 78
- 238000009472 formulation Methods 0.000 title claims abstract description 27
- 239000007788 liquid Substances 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 15
- 239000011256 inorganic filler Substances 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims abstract description 12
- 239000007787 solid Substances 0.000 claims abstract description 10
- 239000000725 suspension Substances 0.000 claims abstract description 7
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 238000005507 spraying Methods 0.000 claims abstract description 6
- 239000000945 filler Substances 0.000 claims description 20
- 229920000647 polyepoxide Polymers 0.000 claims description 17
- 239000003822 epoxy resin Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 9
- 238000002360 preparation method Methods 0.000 claims description 5
- 239000010453 quartz Substances 0.000 claims description 5
- 239000012764 mineral filler Substances 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 4
- 239000005995 Aluminium silicate Substances 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 235000012211 aluminium silicate Nutrition 0.000 claims description 3
- 239000010440 gypsum Substances 0.000 claims description 3
- 229910052602 gypsum Inorganic materials 0.000 claims description 3
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000010445 mica Substances 0.000 claims description 3
- 229910052618 mica group Inorganic materials 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 239000010454 slate Substances 0.000 claims description 3
- 239000000454 talc Substances 0.000 claims description 3
- 229910052623 talc Inorganic materials 0.000 claims description 3
- 235000012222 talc Nutrition 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 2
- 239000000440 bentonite Substances 0.000 claims description 2
- 229910000278 bentonite Inorganic materials 0.000 claims description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 2
- 239000010954 inorganic particle Substances 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 239000011146 organic particle Substances 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 239000010456 wollastonite Substances 0.000 claims description 2
- 229910052882 wollastonite Inorganic materials 0.000 claims description 2
- 239000000306 component Substances 0.000 claims 13
- 239000012467 final product Substances 0.000 claims 1
- 239000012766 organic filler Substances 0.000 abstract description 6
- 238000000465 moulding Methods 0.000 abstract description 2
- -1 melamine ureas Chemical class 0.000 description 12
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 239000004848 polyfunctional curative Substances 0.000 description 8
- 150000002170 ethers Chemical class 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 5
- 150000002989 phenols Chemical class 0.000 description 5
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910015900 BF3 Inorganic materials 0.000 description 4
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 4
- JXCGFZXSOMJFOA-UHFFFAOYSA-N chlorotoluron Chemical compound CN(C)C(=O)NC1=CC=C(C)C(Cl)=C1 JXCGFZXSOMJFOA-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 150000002924 oxiranes Chemical class 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 229960001124 trientine Drugs 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 239000005494 Chlorotoluron Substances 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 235000013339 cereals Nutrition 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 235000013877 carbamide Nutrition 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000007499 fusion processing Methods 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 239000008240 homogeneous mixture Substances 0.000 description 2
- 239000006194 liquid suspension Substances 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- JGUXXFPMOABQHJ-UHFFFAOYSA-N (2,6-dichlorophenyl)-(2-phenylimidazol-1-yl)methanone Chemical compound ClC1=CC=CC(Cl)=C1C(=O)N1C(C=2C=CC=CC=2)=NC=C1 JGUXXFPMOABQHJ-UHFFFAOYSA-N 0.000 description 1
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- VBDYRRJQXUOMHF-LURJTMIESA-N (4S)-3,3,4-trimethyloxepane-2,7-dione Chemical compound C[C@H]1CCC(=O)OC(=O)C1(C)C VBDYRRJQXUOMHF-LURJTMIESA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- JPSKCQCQZUGWNM-UHFFFAOYSA-N 2,7-Oxepanedione Chemical compound O=C1CCCCC(=O)O1 JPSKCQCQZUGWNM-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- MLMGJTAJUDSUKA-UHFFFAOYSA-N 2-ethenyl-1h-imidazole Chemical compound C=CC1=NC=CN1 MLMGJTAJUDSUKA-UHFFFAOYSA-N 0.000 description 1
- OVEUFHOBGCSKSH-UHFFFAOYSA-N 2-methyl-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound CC1=CC=CC=C1N(CC1OC1)CC1OC1 OVEUFHOBGCSKSH-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- VKTKFTYFNDNPTD-UHFFFAOYSA-N 3-(2-hydroxy-4-nitrophenyl)-1,1-dimethylurea Chemical compound CN(C)C(=O)NC1=CC=C([N+]([O-])=O)C=C1O VKTKFTYFNDNPTD-UHFFFAOYSA-N 0.000 description 1
- VYKYSTWKUAETPR-UHFFFAOYSA-N 3-(2-hydroxyphenyl)-1,1-dimethylurea Chemical compound CN(C)C(=O)NC1=CC=CC=C1O VYKYSTWKUAETPR-UHFFFAOYSA-N 0.000 description 1
- UWERUIGPWOVNGG-MDZDMXLPSA-N 3-[(e)-dec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCC\C=C\C1CC(=O)OC1=O UWERUIGPWOVNGG-MDZDMXLPSA-N 0.000 description 1
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 1
- HDPBBNNDDQOWPJ-UHFFFAOYSA-N 4-[1,2,2-tris(4-hydroxyphenyl)ethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 HDPBBNNDDQOWPJ-UHFFFAOYSA-N 0.000 description 1
- BDBZTOMUANOKRT-UHFFFAOYSA-N 4-[2-(4-aminocyclohexyl)propan-2-yl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1C(C)(C)C1CCC(N)CC1 BDBZTOMUANOKRT-UHFFFAOYSA-N 0.000 description 1
- CDBAMNGURPMUTG-UHFFFAOYSA-N 4-[2-(4-hydroxycyclohexyl)propan-2-yl]cyclohexan-1-ol Chemical compound C1CC(O)CCC1C(C)(C)C1CCC(O)CC1 CDBAMNGURPMUTG-UHFFFAOYSA-N 0.000 description 1
- FAUAZXVRLVIARB-UHFFFAOYSA-N 4-[[4-[bis(oxiran-2-ylmethyl)amino]phenyl]methyl]-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC(CC=2C=CC(=CC=2)N(CC2OC2)CC2OC2)=CC=1)CC1CO1 FAUAZXVRLVIARB-UHFFFAOYSA-N 0.000 description 1
- AXXCMMDHXJCEON-UHFFFAOYSA-N 5,5-dimethyl-1,3-bis(oxiran-2-ylmethyl)-6-propan-2-yl-1,3-diazinane-2,4-dione Chemical compound O=C1N(CC2OC2)C(=O)C(C)(C)C(C(C)C)N1CC1CO1 AXXCMMDHXJCEON-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- FKBMTBAXDISZGN-UHFFFAOYSA-N 5-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1C(C)CCC2C(=O)OC(=O)C12 FKBMTBAXDISZGN-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- RREANTFLPGEWEN-MBLPBCRHSA-N 7-[4-[[(3z)-3-[4-amino-5-[(3,4,5-trimethoxyphenyl)methyl]pyrimidin-2-yl]imino-5-fluoro-2-oxoindol-1-yl]methyl]piperazin-1-yl]-1-cyclopropyl-6-fluoro-4-oxoquinoline-3-carboxylic acid Chemical compound COC1=C(OC)C(OC)=CC(CC=2C(=NC(\N=C/3C4=CC(F)=CC=C4N(CN4CCN(CC4)C=4C(=CC=5C(=O)C(C(O)=O)=CN(C=5C=4)C4CC4)F)C\3=O)=NC=2)N)=C1 RREANTFLPGEWEN-MBLPBCRHSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- KZMGYPLQYOPHEL-UHFFFAOYSA-N Boron trifluoride etherate Chemical class FB(F)F.CCOCC KZMGYPLQYOPHEL-UHFFFAOYSA-N 0.000 description 1
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- DYRDKSSFIWVSNM-UHFFFAOYSA-N acetoacetanilide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1 DYRDKSSFIWVSNM-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- IUNMPGNGSSIWFP-UHFFFAOYSA-N dimethylaminopropylamine Chemical compound CN(C)CCCN IUNMPGNGSSIWFP-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000006081 fluorescent whitening agent Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 229940083124 ganglion-blocking antiadrenergic secondary and tertiary amines Drugs 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000004658 ketimines Chemical class 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 150000002688 maleic acid derivatives Chemical class 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- BMLIZLVNXIYGCK-UHFFFAOYSA-N monuron Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C=C1 BMLIZLVNXIYGCK-UHFFFAOYSA-N 0.000 description 1
- 239000000206 moulding compound Substances 0.000 description 1
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 1
- TXXWBTOATXBWDR-UHFFFAOYSA-N n,n,n',n'-tetramethylhexane-1,6-diamine Chemical compound CN(C)CCCCCCN(C)C TXXWBTOATXBWDR-UHFFFAOYSA-N 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- UQKAOOAFEFCDGT-UHFFFAOYSA-N n,n-dimethyloctan-1-amine Chemical compound CCCCCCCCN(C)C UQKAOOAFEFCDGT-UHFFFAOYSA-N 0.000 description 1
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- YOURXVGYNVXQKT-UHFFFAOYSA-N oxacycloundecane-2,11-dione Chemical compound O=C1CCCCCCCCC(=O)O1 YOURXVGYNVXQKT-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000012262 resinous product Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/04—Physical treatment, e.g. grinding, treatment with ultrasonic vibrations
- C09C3/045—Agglomeration, granulation, pelleting
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/03—Powdery paints
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Epoxy Resins (AREA)
Abstract
K-17377/=/CGW 18 Free-flowing granular formulation Abstract of the Disclosure The invention relates to a free-flowing granular formulation which is obtained by charging to a fluidised bed a finely particulate inorganic or organic filler by itself or together with a solid component of a curable mixture or a part thereof, and then spray coating the particles with a curable mixture, the other components or the remaining portion of the curable mixture, as single component system, in the form of a liquid or suspension. The formulation so obtained is preferably used as moulding or coating powder, in particular for coating electrical or electronic components.
Description
2~)~)59~3 K-17377/=/~GW 18 Free-flowin~ granular forrnulation The present invention relates to a free-flowing granular formulation consisting of an agglomerate of finely divided inorganic or organic filler particles which contain a curable mixture as single component system, the mixture components being homogeneously coated on said filler particles.
Free-flowing single component powder mixtures or single component granular forrnula-tions obtained fro~ curable epoxy resin granular forrnulations can be prepared in known manner by the dry blending or melt fusion process. In the dry blending process the individual components are either first ground separately and then - after they have the appropriate granular size - homogenised by a blending process, or they are immediately mixed together and jointly comminuted and homogenised during the grinding procedure.
In a powder mixture obtained in this manner, the individual cornponents such as resin, curing agent or curing catalyst, filler, dye and other additives, are present in the form of discrete particles, so that this mixture may be terrned heterogeneous. In the melt fusion process the substantially solid components are premixed dry in a mixing apparatus, for example in a Henschel mixer, and the blend is subsequently fused, for example in an extruder or on a two-roll mill, such that the solid and infusible mixture components are wetted very thoroughly with the melting mixture components which are dissolved in this melt. The cooled melt is then ground and sieved. The individual grains of this powder formulation contain in the core as well as on the surface a completely homogeneous mixture in the original concentration.
A free-flowing resinous product having a high concentration of inorganic ~lllers is prepared in European patent 38 292 by suspending and stirring the finely particulate ~lller together with a crystallised synthetic calcium silicate of specific size in the liquid resin or hardener. The free-flowing resin mixture obtained in Example 12 of this patent by using a liquid curable epoxy resin mixture is prepared in two steps and has a storage stability of only about one month.
. " ~
, :- . . . ~ . . ~ .
;~()()..a~
It has now been found that a granular formulation with a high concentration of filler and having enhanced processing properties, especially enhanced flow properties, is obtained by flu;dising, in a fluidised bed, a finely particulate inorganic or organic filler and spray coating the particles with a curable mixture in the form of a single component system. In addition, formulations having a particularly low content of fine dust are obtained.
Accordingly, the present invention relates to a free-flowing granular formulation comprising an agglomerate of finely divided inorganic or organic particles on to which a curable mixture is spray coated in the form of a single component system, in which curable mixture at least one mixture component is liquid at temperatures below 150C, and the mixture components are homogeneously coated on the filler particles.
The individual grains of the single component system are homogeneously coated only on the surface with the individual components of the single component system. The core of the individual grains of the agglomerate consists essentially of the filler.
The fillers which may be coated in the fluidised bed are finely particulate fillers, for example fibrous, granular or powdered fillers. Suitable finely particulate fillers are all those which can be fluidised in the fluidised bed.
Examples of organic fillers suitable for the granular formulation of this invention are natural or synthetic polymeric materials such as cellulose, preferably cotton fibres or wood flour, saturated polyesters, polyamides or melamine ureas.
Eligible inorganic fillers are, for example, quartz powder, mica, talcum, asbestos, powdered slate, kaolin, wollastonite, chalk powder, dolomite, magnesium carbonate, gypsum, barites, alumina, bentonite, silica aerosol, lithopone, titanium dioxide, carbon black, carbon fibres, graphite, metal powders, especially aluminium powder, metal oxides, glass powder, glass beads, glass ~lbres, zinc sulfide, silicon carbide, cristoballite, or a mixture of fillers. Preferred fillers for the granular formulation are inorganic fillers, especially mineral fillers such as, preferably, quartz powder, especially fused silica powder, mica, powdered slate, kaolin, wollastvnite, gypsum, barites, alumina, aluminium hydroxide, magnesium hydroxide, talcum, silica or bèntonite.
The fillers can further be treated with primers which promote the adhesion of the polymer to the filler particles. It is furthermore preferred to use those finely particulate fillers . .. . . . .
: . . . -,: , . . . ..
.. . . . ..
.
- . ,. - . ~. . .
... ~ . . . .. .
: , , . :~ ,, 3~97~3 which have a high surface activity, fo} example the finely pa~ticulate cured melamine/forrnaldehyde condensates disclosed in GB patent specification 1 043 ~37.
Curable mixtures present in ~he formulations of this invention may suitably be in general those which, under the influence of ligh~, heat, hardeners, catalyst or curing accelerators, can be cured during the processing to thermosetting final products. Such mixtures are essentially self-crosslinking synthetic resins which are normally precondensates, preadducts, or a mixture of curable, i.e. crosslinkable, monomers. At least one component of the curable rnixtures will be liquid at temperatures below 150C, so that the mixture is in the forrn of a liquid or ernulsion when sprayed into the fluidised bed compartment. The curable rnixture prefereably contains at least one component which is liquid at temperatures below 150C, preferably at room temperature. The liquid component can be, for example, the resin itself or a part thereof, the hardener, the catalyst or the accelerator, as well as a reactive diluent or a processing auxiliary such as a flow control agent or mould release agent.
The following self-crosslinking plastics may be used as single component system for the preparation of the granular formulations of this invention-Phenolic plastics from aldehydes and phenols or alkylated phenols which are prepared in basic medium, aminoplasts such as urea/formaldehyde resins or melamine/forrnaldehyde resins, alkyd resins and oil-modified alkyd resins, unsaturated polyesters, preferably maleic acid derivatives, epoxy resins, preferably derivatives of bisphenol A, polyurethanes and unsaturated polyimides, preferably derivatives of C-alkylated bismaleimides.curable epoxy resin mixture will preferably be used as single component system.
Particularly suitable epoxy resins are those containing on average more than one glycidyl, ~B-methylglycidyl or 2,3-epoxycyclopentyl group attached to a hetero atom (for example sulfur, preferably oxygen or nitrogen). Such epoxy resins are preferably bis(2,3-epoxy^
cyclopentyl) ethers; diglycidyl and polyglycidyl ethers of polyhydric aliphatic alcohols such as 1,4-butanediol, or polyalkylene glycols such as polypropylene gylcols; diglycidyl or polyglycidyl ethers of cycloaliphatic polyols such as 2,2-bis(4-hydroxycyclohexyl)-propane; diglycidyl or polyglycidyl ethers of polyhydric phenols such as resorcinol, bis(p-hydroxyphenyl)methane, 2,2-bis(p-hydroxyphenyl)propane (diomethane), 2,2-bis-(4'-hydroxy-3 ' ,5 '-dibromophenyl)propane, 1,1 ,2,2-tetrakis(p-hydroxyphenyl)ethane, or condensates of phenol with ~ormaldehyde obtained under acid conditions, for example . -', ~
3~ 3'i'B
phenol novolaks and cresol novolaks; bis- and poly~,~-methylglycidyl) ethers of the above listed polyhydric alcohols or polyhydric phenols; polyglycidyl esters of polybasic carbo-xylic acids such as phthalic acid, terephthalic acid, ~'I-tetrahydrophthalic acid and hexa-hydrophthalic acid; N-glycidyl derivatives of amines, amides and heterocyclic nitrogen bases such as N,N-diglycidylaniline, N,N-diglycidyltoluidine, N,N,N',N'-tetraglycidylbis-(p-aminophenyl)methane; triglycidylisocyanurate; N,N'-diglycidylethyleneurea; N,N-di-glycidyl-5,5-dimethylhydantoin, N,N'-diglycidyl-S-isopropylhydantoin; N,N'-diglycidyl-5 ,5-dimethyl-6-isopropyl-5 ,6-dihydrouracil.
Further suitable epoxy resins are prereacted adducts of such epoxy resins with hardeners, which adducts are liquid or are fusible at temperatures below 15()C. It is prefeIred to use prereacted adducts which are liquid or fusible at temperatures below 50C, most preferably the prereacted adducts which are liquid at room temperature.
The functional group containing synthetic resins may also be components of a plastics material and may be crosslinked with suitable hardeners or modified with suitable comonomers. The liquid reaction components may also be monomers for the preparation of polymers, and are for example polyepoxide compounds, polyisocyanates and ethylenically unsaturated compounds.
Suitable hardeners for epoxy resins are acid or basic compounds. Examples of suitable hardeners are typically: amines or amides such as aliphatic, cycloaliphatic or aromatic primary, secondary and tertiary amines, for example monoethanolamine, diethylenetri-amine, triethylenetetramine, trimethylhexamethylenediamine, diethylenetriamine, tri-ethylenetetramine, tetraethylenepentamine, N,N-dimethylpropylene-1,3-diamine, N,N-di-ethylene-1,3-propylenediamine, 2,2-bis(4'-aminocyclohexyl)propane, 3,5,5-trimethyl-3-(aminomethyl)cyclohexylamine (isophoronediamine), Mannich bases such as 2,4,6-tris(di-methylaminomethyl)phenol; m-phenylenediamine, p-phenylenediamine, bis(4-amino-phenyl)methane, bis(4-aminophenyl)sulfone, m-xylylenediamine; adducts of acrylonitrile or monoepoxides, such as ethylene oxide or propylene oxide, with polyalkylenepoly-amines such as diethylenetriamine or triethylenetetramine; adducts of polyamines such as diethylenetriamine or triethyltetramine, in excess, and polyepoxides such as diomethane polyglycidyl ethers; ketimines, for example from acetone or methyl ketone and bis(p-aminophenyl)methane; adducts of monophenols or polyphenols and polyamides; poly-amides, especially those from aliphatic polyamines such as diethylenetriamine or tri-ethylenetetramine, and dimerised or trimerised unsaturated fatty acids, such as dimerised . .. . ............................. .
- ' ; .
3~7a linseed oil fatty acid (VERSAMID(~); polymeric polysulfides (1 HIOKOL~); dicyandi-amide (1-cyanoguanidine), aniline/formaldehyde resins; polyhydric phenols, for example resorcinol, 2,2-bis(4-hydroxyphenyl)propane or phenol/formaldehyde resins; boron tri-fluoride and its complexes with organic compounds such as BF3 ether complexes and BF3 amine complexes, for example BF3 monoethylamine complex; acetoacetanilide BF3 com-plex; phosphoric acid; tr~phenylphosphite; polybasic carboxylic acids and their an-hydrides, for example phthalic anhydride, A4-tetrahydrophthalic anhydride, hexahydro-phthalic anhydride, 4-methylhexahydrophthalic anhydride, 3,6-endomethylene-~4-tetra-hydrophthalic anhydride, 4-methyl-3,6-endomethylene-~4-tetrahydrophthalic anhydride (methylnadic anhydride), 3,4,5,6,7-hexachloro-3,6-endomethylene-~4-tetrahydrophthalic anhydride, succinic anhydride, adipic anhydride, trimethyladipic anhydride, azelaic an-hydride, sebacic anhydride, maleic anhydride, decenylsuccinic anhydride, pyromellitic di-anhydride or mixtures of such anhydrides.
Compounds which are known per se may also be used as accelerators, for example:
complexes of amines, preferably tertiary amines such as monoethylamine, trimethylamine and octyldimethylene, with boron trifiuoride or boron trichloride, tertiary amines such as benzyldimethylamine, tris(dimethylaminomethyl)phenol, hexamethylenetetramine or 1,6-bis(dimethylamino)hexane; urea derivatives such as N-4-chlorophenyl-N',N'-di-methylurea(monuron), N-3-chloro-4-methylphenyl-N',N'-dimethylurea (chlorotoluron), N-(2-hydroxyphenyl)-N',N'-dimethylurea and N-(2-hydroxy-4-nitrophenyl)-N',N'-di-methylurea, unsubstituted or substituted imidazoles such as imidazole, benzimidazole, 1-methylirnidazole, 3-methylimidazole, 2-ethyl-4-methylimidazole, 2-vinylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-(2,6-dichlorobenzoyl)-2-phenyl-imidazole and 1-2,4,6-trimethylbenzoyl)-2-phenylimidazole, as well as phosphines.
Examples of suitable hardeners for polyisocyanates are liquid branched polyesters, linear polyesters, polyacetals, polyethers and polythioethers.
Examples of suitable comonomers for unsaturated polyimides are ethylenically unsaturated compounds such as styrene, acrylates or methacrylates.
The curable mixtures may further contain the customary rnodifiers such as pigments, flame retardants, antioxidants, fluorescent whitening agents, plasticisers or stabilisers against light- or heat-induced degradation.
~ , . ..
)5~3~
The granular formulation of this invention can be prepared by fluidising, in a fluidised bed, a finely particulate inorganic or inorganic filler by itself or together with a solid component of a curable rnixture or a part thereof, and then spray coating the particles with a curable mixture, the remaining components or the remaining portion of the curable mixture, as single component system, in the form of a liquid or suspension.
Hence the present invention also relates to the above described process for the prepara~ion of the granular formulation of this invention.
The curable mixture can be spray coated on to the organic or inorganic filler in any fluidised bed apparatus, for example in a fluidised bed granulator or in a spray fluidised bed granulator. The mode of operation of such apparatus is known. Fluidised beds are used, for example, for drying solutions, for recovering solids from solutions, for drying and agglomerating solids as well as for coating objects or solid parti~les with other materials (q.v. "~nlagen-Technik", CAV January, 1973).
The preparation of the granular formulation of this invention can normally be carried out at room temperature as well as at elevated temperature, i.e. in the temperature range up to ca. 100C, and is contingent, on the one hand, on the reactivity of the curable mixture and, on the other, on the condition from which temperature below 50C at least one of the mixture components is liquid. It is preferred to carry out the process of the invention in the temperature range from 25-70C.
The process of this invention thus affords the advantage that, aside from using mixture components which are liquid at room temperature, it is also possible to use low melting components, i.e. those that melt at temperatures below 50C, for the curable mixture.
The amount of the curable mixture which can be sprayed into the fluidised bed over a specific period of time - the so-called feed concentration - may vary within wide limits and depends, inter alia, on the mechanical parameters and on the process temperature. For example, in pilot batches of up to ca. 5 kg the feed concentration is usually from 10 to 100 g per minute. In production batches, the feed concentration is higher.
In accordance with the preferred composition of the granular forrnulation, organic fillers will preferably be used in the process of this invention, especially mineral fillers, and a curable epoxy resin mixture will preferably be used as curable single component system.
. . . . . . ... . .
'~:
The granular formulation of this invention has the advantage that it is virtually free from impurities, as its preparation in a fluidised bed granulator is substantially able to prevent abrasion of metal, ceramics or other materials.
The granular formuiation of this invention mainly finds utility as moulding, impregnating and coating powder as well as free-flowing adhesive, and is used in particular ~or coating electrical or electronic components. The granular formulation can be compressed to block material, i.e. to material which can be processed mechanically as moulding compound.
Example 1: 2025 g of quartz powder (50:50 mixture of "W 12" and "M 500" ex Quartz-Werke, D-5020 Frechen) and 37.5 g of wax (OP Wachs, ex Hoechst AG) are charged to a fluidised bed granulator (type "WSG 5" supplied by Glatt, ~-7859 Haltingen) and fluidised. Into this fluidised bed is sprayed a homogeneous mixture itl the form of a prewarmed (T = 30C) liquid reaction resin product consisting of 173 g of bisphenol A
di~lycidyl ether having an epoxide equivalent weight of 178 and a viscosity of 6 500 mPa-s, 263 g of dodecenylsuccinic anhydride and 2.6 g of a BCI3/N,N-dimethyl-N-octyl-amine adduct. The average feed concentration is 25 g/min, such that after ca. 18 minutes a dry, free-flowing granular formulation with the following properties is obtained in 99%
yield:
filler content: 78 - 83 % by weight gel time at T = 175C
(measured with a gelling time plate) 110 sec.
spiral flow length at T = 175C:1300 mm ASTM Test Method D 312/72) Example 2: 2000 g of quartz powder ("M 500", ex Quartz-Werke) and 42 g of wax (OP
Wachs, ex Hoechst AG) are charged to a fluidised bed granulator ("Type WSG 5") and fluidised. Into this fluidised bed is sprayed a liquid suspension which has been preheated to 65C. This suspension has been premixed from 836.5 g of bisphenol A diglycidyl ether having an epoxide equivalent weight of 178 and a viscosity of 6 500 rnPa-s, 54.5 g of dicyandiamide (1-cyanoguanidine) and 15.() g of chlorotoluron [3-(3-chloro-4-methyl-phenyl)-1,1-dimethylurea]. The average feed concentration is 28 g/min, such that after ca.
33 minutes a dry, free-flowing granular forrnulation with the following properties is ob-.
.. .
- : , .
tained in 99% yield:
ller content: 6~ - 70 % by weight gel time at T = 175C
(measured with a gelling time plate)110 sec.
spiral flow length at T = 175C: 1900 mm ASTM Test Method D 312/72) Example 3: 2500 g of a dry mixture consisting of 1617.65 g of barites powder ("Type 115", ex Bassermann & Co., D-6800 Mannheim) and 882.35 g of a solid epoxyresin based on bisphenol A having an epoxide equivalent weight of 740 and a softening point of T = 90-100C are charged to a fluidised bed granulator ("Type WSG S") and fluidised. Into this fluidised bed is sprayed a liquid suspension which has been preheated to 43C. This suspension is premixed from 381.2 g of bisphenol A diglycidyl ether having an epoxide equivalent weight of 178 and a viscosity of 6500 mPa s, 44.1 g of dicyandi-amide and lS.9 g of chlorotoluron. The average feed concentration is 45 g/min, such that after ca. 10 minutes a dry, free-flowing granular formulation with the following properties is obtained in 97% yield:
filler content: 53-55% by weight gelling time at T = 175C
(measured with a gelling time plate) 142 sec.
':
. ~ ~ : , . . .
: ; : . ,
Free-flowing single component powder mixtures or single component granular forrnula-tions obtained fro~ curable epoxy resin granular forrnulations can be prepared in known manner by the dry blending or melt fusion process. In the dry blending process the individual components are either first ground separately and then - after they have the appropriate granular size - homogenised by a blending process, or they are immediately mixed together and jointly comminuted and homogenised during the grinding procedure.
In a powder mixture obtained in this manner, the individual cornponents such as resin, curing agent or curing catalyst, filler, dye and other additives, are present in the form of discrete particles, so that this mixture may be terrned heterogeneous. In the melt fusion process the substantially solid components are premixed dry in a mixing apparatus, for example in a Henschel mixer, and the blend is subsequently fused, for example in an extruder or on a two-roll mill, such that the solid and infusible mixture components are wetted very thoroughly with the melting mixture components which are dissolved in this melt. The cooled melt is then ground and sieved. The individual grains of this powder formulation contain in the core as well as on the surface a completely homogeneous mixture in the original concentration.
A free-flowing resinous product having a high concentration of inorganic ~lllers is prepared in European patent 38 292 by suspending and stirring the finely particulate ~lller together with a crystallised synthetic calcium silicate of specific size in the liquid resin or hardener. The free-flowing resin mixture obtained in Example 12 of this patent by using a liquid curable epoxy resin mixture is prepared in two steps and has a storage stability of only about one month.
. " ~
, :- . . . ~ . . ~ .
;~()()..a~
It has now been found that a granular formulation with a high concentration of filler and having enhanced processing properties, especially enhanced flow properties, is obtained by flu;dising, in a fluidised bed, a finely particulate inorganic or organic filler and spray coating the particles with a curable mixture in the form of a single component system. In addition, formulations having a particularly low content of fine dust are obtained.
Accordingly, the present invention relates to a free-flowing granular formulation comprising an agglomerate of finely divided inorganic or organic particles on to which a curable mixture is spray coated in the form of a single component system, in which curable mixture at least one mixture component is liquid at temperatures below 150C, and the mixture components are homogeneously coated on the filler particles.
The individual grains of the single component system are homogeneously coated only on the surface with the individual components of the single component system. The core of the individual grains of the agglomerate consists essentially of the filler.
The fillers which may be coated in the fluidised bed are finely particulate fillers, for example fibrous, granular or powdered fillers. Suitable finely particulate fillers are all those which can be fluidised in the fluidised bed.
Examples of organic fillers suitable for the granular formulation of this invention are natural or synthetic polymeric materials such as cellulose, preferably cotton fibres or wood flour, saturated polyesters, polyamides or melamine ureas.
Eligible inorganic fillers are, for example, quartz powder, mica, talcum, asbestos, powdered slate, kaolin, wollastonite, chalk powder, dolomite, magnesium carbonate, gypsum, barites, alumina, bentonite, silica aerosol, lithopone, titanium dioxide, carbon black, carbon fibres, graphite, metal powders, especially aluminium powder, metal oxides, glass powder, glass beads, glass ~lbres, zinc sulfide, silicon carbide, cristoballite, or a mixture of fillers. Preferred fillers for the granular formulation are inorganic fillers, especially mineral fillers such as, preferably, quartz powder, especially fused silica powder, mica, powdered slate, kaolin, wollastvnite, gypsum, barites, alumina, aluminium hydroxide, magnesium hydroxide, talcum, silica or bèntonite.
The fillers can further be treated with primers which promote the adhesion of the polymer to the filler particles. It is furthermore preferred to use those finely particulate fillers . .. . . . .
: . . . -,: , . . . ..
.. . . . ..
.
- . ,. - . ~. . .
... ~ . . . .. .
: , , . :~ ,, 3~97~3 which have a high surface activity, fo} example the finely pa~ticulate cured melamine/forrnaldehyde condensates disclosed in GB patent specification 1 043 ~37.
Curable mixtures present in ~he formulations of this invention may suitably be in general those which, under the influence of ligh~, heat, hardeners, catalyst or curing accelerators, can be cured during the processing to thermosetting final products. Such mixtures are essentially self-crosslinking synthetic resins which are normally precondensates, preadducts, or a mixture of curable, i.e. crosslinkable, monomers. At least one component of the curable rnixtures will be liquid at temperatures below 150C, so that the mixture is in the forrn of a liquid or ernulsion when sprayed into the fluidised bed compartment. The curable rnixture prefereably contains at least one component which is liquid at temperatures below 150C, preferably at room temperature. The liquid component can be, for example, the resin itself or a part thereof, the hardener, the catalyst or the accelerator, as well as a reactive diluent or a processing auxiliary such as a flow control agent or mould release agent.
The following self-crosslinking plastics may be used as single component system for the preparation of the granular formulations of this invention-Phenolic plastics from aldehydes and phenols or alkylated phenols which are prepared in basic medium, aminoplasts such as urea/formaldehyde resins or melamine/forrnaldehyde resins, alkyd resins and oil-modified alkyd resins, unsaturated polyesters, preferably maleic acid derivatives, epoxy resins, preferably derivatives of bisphenol A, polyurethanes and unsaturated polyimides, preferably derivatives of C-alkylated bismaleimides.curable epoxy resin mixture will preferably be used as single component system.
Particularly suitable epoxy resins are those containing on average more than one glycidyl, ~B-methylglycidyl or 2,3-epoxycyclopentyl group attached to a hetero atom (for example sulfur, preferably oxygen or nitrogen). Such epoxy resins are preferably bis(2,3-epoxy^
cyclopentyl) ethers; diglycidyl and polyglycidyl ethers of polyhydric aliphatic alcohols such as 1,4-butanediol, or polyalkylene glycols such as polypropylene gylcols; diglycidyl or polyglycidyl ethers of cycloaliphatic polyols such as 2,2-bis(4-hydroxycyclohexyl)-propane; diglycidyl or polyglycidyl ethers of polyhydric phenols such as resorcinol, bis(p-hydroxyphenyl)methane, 2,2-bis(p-hydroxyphenyl)propane (diomethane), 2,2-bis-(4'-hydroxy-3 ' ,5 '-dibromophenyl)propane, 1,1 ,2,2-tetrakis(p-hydroxyphenyl)ethane, or condensates of phenol with ~ormaldehyde obtained under acid conditions, for example . -', ~
3~ 3'i'B
phenol novolaks and cresol novolaks; bis- and poly~,~-methylglycidyl) ethers of the above listed polyhydric alcohols or polyhydric phenols; polyglycidyl esters of polybasic carbo-xylic acids such as phthalic acid, terephthalic acid, ~'I-tetrahydrophthalic acid and hexa-hydrophthalic acid; N-glycidyl derivatives of amines, amides and heterocyclic nitrogen bases such as N,N-diglycidylaniline, N,N-diglycidyltoluidine, N,N,N',N'-tetraglycidylbis-(p-aminophenyl)methane; triglycidylisocyanurate; N,N'-diglycidylethyleneurea; N,N-di-glycidyl-5,5-dimethylhydantoin, N,N'-diglycidyl-S-isopropylhydantoin; N,N'-diglycidyl-5 ,5-dimethyl-6-isopropyl-5 ,6-dihydrouracil.
Further suitable epoxy resins are prereacted adducts of such epoxy resins with hardeners, which adducts are liquid or are fusible at temperatures below 15()C. It is prefeIred to use prereacted adducts which are liquid or fusible at temperatures below 50C, most preferably the prereacted adducts which are liquid at room temperature.
The functional group containing synthetic resins may also be components of a plastics material and may be crosslinked with suitable hardeners or modified with suitable comonomers. The liquid reaction components may also be monomers for the preparation of polymers, and are for example polyepoxide compounds, polyisocyanates and ethylenically unsaturated compounds.
Suitable hardeners for epoxy resins are acid or basic compounds. Examples of suitable hardeners are typically: amines or amides such as aliphatic, cycloaliphatic or aromatic primary, secondary and tertiary amines, for example monoethanolamine, diethylenetri-amine, triethylenetetramine, trimethylhexamethylenediamine, diethylenetriamine, tri-ethylenetetramine, tetraethylenepentamine, N,N-dimethylpropylene-1,3-diamine, N,N-di-ethylene-1,3-propylenediamine, 2,2-bis(4'-aminocyclohexyl)propane, 3,5,5-trimethyl-3-(aminomethyl)cyclohexylamine (isophoronediamine), Mannich bases such as 2,4,6-tris(di-methylaminomethyl)phenol; m-phenylenediamine, p-phenylenediamine, bis(4-amino-phenyl)methane, bis(4-aminophenyl)sulfone, m-xylylenediamine; adducts of acrylonitrile or monoepoxides, such as ethylene oxide or propylene oxide, with polyalkylenepoly-amines such as diethylenetriamine or triethylenetetramine; adducts of polyamines such as diethylenetriamine or triethyltetramine, in excess, and polyepoxides such as diomethane polyglycidyl ethers; ketimines, for example from acetone or methyl ketone and bis(p-aminophenyl)methane; adducts of monophenols or polyphenols and polyamides; poly-amides, especially those from aliphatic polyamines such as diethylenetriamine or tri-ethylenetetramine, and dimerised or trimerised unsaturated fatty acids, such as dimerised . .. . ............................. .
- ' ; .
3~7a linseed oil fatty acid (VERSAMID(~); polymeric polysulfides (1 HIOKOL~); dicyandi-amide (1-cyanoguanidine), aniline/formaldehyde resins; polyhydric phenols, for example resorcinol, 2,2-bis(4-hydroxyphenyl)propane or phenol/formaldehyde resins; boron tri-fluoride and its complexes with organic compounds such as BF3 ether complexes and BF3 amine complexes, for example BF3 monoethylamine complex; acetoacetanilide BF3 com-plex; phosphoric acid; tr~phenylphosphite; polybasic carboxylic acids and their an-hydrides, for example phthalic anhydride, A4-tetrahydrophthalic anhydride, hexahydro-phthalic anhydride, 4-methylhexahydrophthalic anhydride, 3,6-endomethylene-~4-tetra-hydrophthalic anhydride, 4-methyl-3,6-endomethylene-~4-tetrahydrophthalic anhydride (methylnadic anhydride), 3,4,5,6,7-hexachloro-3,6-endomethylene-~4-tetrahydrophthalic anhydride, succinic anhydride, adipic anhydride, trimethyladipic anhydride, azelaic an-hydride, sebacic anhydride, maleic anhydride, decenylsuccinic anhydride, pyromellitic di-anhydride or mixtures of such anhydrides.
Compounds which are known per se may also be used as accelerators, for example:
complexes of amines, preferably tertiary amines such as monoethylamine, trimethylamine and octyldimethylene, with boron trifiuoride or boron trichloride, tertiary amines such as benzyldimethylamine, tris(dimethylaminomethyl)phenol, hexamethylenetetramine or 1,6-bis(dimethylamino)hexane; urea derivatives such as N-4-chlorophenyl-N',N'-di-methylurea(monuron), N-3-chloro-4-methylphenyl-N',N'-dimethylurea (chlorotoluron), N-(2-hydroxyphenyl)-N',N'-dimethylurea and N-(2-hydroxy-4-nitrophenyl)-N',N'-di-methylurea, unsubstituted or substituted imidazoles such as imidazole, benzimidazole, 1-methylirnidazole, 3-methylimidazole, 2-ethyl-4-methylimidazole, 2-vinylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-(2,6-dichlorobenzoyl)-2-phenyl-imidazole and 1-2,4,6-trimethylbenzoyl)-2-phenylimidazole, as well as phosphines.
Examples of suitable hardeners for polyisocyanates are liquid branched polyesters, linear polyesters, polyacetals, polyethers and polythioethers.
Examples of suitable comonomers for unsaturated polyimides are ethylenically unsaturated compounds such as styrene, acrylates or methacrylates.
The curable mixtures may further contain the customary rnodifiers such as pigments, flame retardants, antioxidants, fluorescent whitening agents, plasticisers or stabilisers against light- or heat-induced degradation.
~ , . ..
)5~3~
The granular formulation of this invention can be prepared by fluidising, in a fluidised bed, a finely particulate inorganic or inorganic filler by itself or together with a solid component of a curable rnixture or a part thereof, and then spray coating the particles with a curable mixture, the remaining components or the remaining portion of the curable mixture, as single component system, in the form of a liquid or suspension.
Hence the present invention also relates to the above described process for the prepara~ion of the granular formulation of this invention.
The curable mixture can be spray coated on to the organic or inorganic filler in any fluidised bed apparatus, for example in a fluidised bed granulator or in a spray fluidised bed granulator. The mode of operation of such apparatus is known. Fluidised beds are used, for example, for drying solutions, for recovering solids from solutions, for drying and agglomerating solids as well as for coating objects or solid parti~les with other materials (q.v. "~nlagen-Technik", CAV January, 1973).
The preparation of the granular formulation of this invention can normally be carried out at room temperature as well as at elevated temperature, i.e. in the temperature range up to ca. 100C, and is contingent, on the one hand, on the reactivity of the curable mixture and, on the other, on the condition from which temperature below 50C at least one of the mixture components is liquid. It is preferred to carry out the process of the invention in the temperature range from 25-70C.
The process of this invention thus affords the advantage that, aside from using mixture components which are liquid at room temperature, it is also possible to use low melting components, i.e. those that melt at temperatures below 50C, for the curable mixture.
The amount of the curable mixture which can be sprayed into the fluidised bed over a specific period of time - the so-called feed concentration - may vary within wide limits and depends, inter alia, on the mechanical parameters and on the process temperature. For example, in pilot batches of up to ca. 5 kg the feed concentration is usually from 10 to 100 g per minute. In production batches, the feed concentration is higher.
In accordance with the preferred composition of the granular forrnulation, organic fillers will preferably be used in the process of this invention, especially mineral fillers, and a curable epoxy resin mixture will preferably be used as curable single component system.
. . . . . . ... . .
'~:
The granular formulation of this invention has the advantage that it is virtually free from impurities, as its preparation in a fluidised bed granulator is substantially able to prevent abrasion of metal, ceramics or other materials.
The granular formuiation of this invention mainly finds utility as moulding, impregnating and coating powder as well as free-flowing adhesive, and is used in particular ~or coating electrical or electronic components. The granular formulation can be compressed to block material, i.e. to material which can be processed mechanically as moulding compound.
Example 1: 2025 g of quartz powder (50:50 mixture of "W 12" and "M 500" ex Quartz-Werke, D-5020 Frechen) and 37.5 g of wax (OP Wachs, ex Hoechst AG) are charged to a fluidised bed granulator (type "WSG 5" supplied by Glatt, ~-7859 Haltingen) and fluidised. Into this fluidised bed is sprayed a homogeneous mixture itl the form of a prewarmed (T = 30C) liquid reaction resin product consisting of 173 g of bisphenol A
di~lycidyl ether having an epoxide equivalent weight of 178 and a viscosity of 6 500 mPa-s, 263 g of dodecenylsuccinic anhydride and 2.6 g of a BCI3/N,N-dimethyl-N-octyl-amine adduct. The average feed concentration is 25 g/min, such that after ca. 18 minutes a dry, free-flowing granular formulation with the following properties is obtained in 99%
yield:
filler content: 78 - 83 % by weight gel time at T = 175C
(measured with a gelling time plate) 110 sec.
spiral flow length at T = 175C:1300 mm ASTM Test Method D 312/72) Example 2: 2000 g of quartz powder ("M 500", ex Quartz-Werke) and 42 g of wax (OP
Wachs, ex Hoechst AG) are charged to a fluidised bed granulator ("Type WSG 5") and fluidised. Into this fluidised bed is sprayed a liquid suspension which has been preheated to 65C. This suspension has been premixed from 836.5 g of bisphenol A diglycidyl ether having an epoxide equivalent weight of 178 and a viscosity of 6 500 rnPa-s, 54.5 g of dicyandiamide (1-cyanoguanidine) and 15.() g of chlorotoluron [3-(3-chloro-4-methyl-phenyl)-1,1-dimethylurea]. The average feed concentration is 28 g/min, such that after ca.
33 minutes a dry, free-flowing granular forrnulation with the following properties is ob-.
.. .
- : , .
tained in 99% yield:
ller content: 6~ - 70 % by weight gel time at T = 175C
(measured with a gelling time plate)110 sec.
spiral flow length at T = 175C: 1900 mm ASTM Test Method D 312/72) Example 3: 2500 g of a dry mixture consisting of 1617.65 g of barites powder ("Type 115", ex Bassermann & Co., D-6800 Mannheim) and 882.35 g of a solid epoxyresin based on bisphenol A having an epoxide equivalent weight of 740 and a softening point of T = 90-100C are charged to a fluidised bed granulator ("Type WSG S") and fluidised. Into this fluidised bed is sprayed a liquid suspension which has been preheated to 43C. This suspension is premixed from 381.2 g of bisphenol A diglycidyl ether having an epoxide equivalent weight of 178 and a viscosity of 6500 mPa s, 44.1 g of dicyandi-amide and lS.9 g of chlorotoluron. The average feed concentration is 45 g/min, such that after ca. 10 minutes a dry, free-flowing granular formulation with the following properties is obtained in 97% yield:
filler content: 53-55% by weight gelling time at T = 175C
(measured with a gelling time plate) 142 sec.
':
. ~ ~ : , . . .
: ; : . ,
Claims (11)
1. A free-flowing granular formulation comprising an agglomerate of finely divided inorganic or organic particles on to which a curable mixture is spray coated in the form of a single component system, in which curable mixture at least one mixture component is liquid at temperatures below 150°C, and the mixture components are homogeneously coated on the filler particles.
2. A granular formulation according to claim 1, wherein the filler is an inorganic filler.
3. A granular formulation according to claim 1, wherein the filler is a mineral filler.
4. A granular formulation according to claim 3, wherein the mineral filler is selected from the group consisting of quartz powder, mica, powdered slate, kaolin, wollastonite, gypsum, barites, alumina, aluminium hydroxide, magnesium hydroxide, talcum, silica or bentonite.
5. A granular formulation according to claim 1, wherein the single component system is a mixture which can be cured to a thermosetting final product.
6. A granular formulation according to claim 1, wherein the single component system is a curable epoxy resin mixture.
7. A process for the preparation of a free-flowing granular formulation as claimed in claim 1, which comprises fluidising, in a fluidised bed, a finely particulate inorganic or inorganic filler by itself or together with a solid component of a curable mixture or a part thereof, and then spray coating the particles with a curable mixture, the remaining components or the remaining portion of the curable mixture, as single component system, in the form of a liquid or suspension.
8. A process according to claim 7, wherein the filler is an inorganic filler.
9. A process according to claim 7, wherein the curable single component system is a curable epoxy resin mixture.
10. A process according to claim 7, which comprises fluidising an inorganic filler and then spraying coating the particles with the curable epoxy resin mixture, as single component system, in the form of a liquid or suspension.
11. A process according to claim 7, which comprises fluidising the inorganic filler together with a solid component of the curable epoxy resin mixture, and then spray coating the particles with the other components of the curable mixture, as single com-ponent system, in the form of a liquid or suspension.
FO 7.3/STA/gb*
FO 7.3/STA/gb*
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH4715/88-1 | 1988-12-21 | ||
| CH471588 | 1988-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2005978A1 true CA2005978A1 (en) | 1990-06-21 |
Family
ID=4281255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2005978 Abandoned CA2005978A1 (en) | 1988-12-21 | 1989-12-19 | Free-flowing granular formulation |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0376884A3 (en) |
| JP (1) | JPH02229863A (en) |
| BR (1) | BR8906597A (en) |
| CA (1) | CA2005978A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140128512A1 (en) * | 2010-02-16 | 2014-05-08 | Sigmund Lindner GmbH | Method for producing glitter |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5666842A (en) * | 1993-07-22 | 1997-09-16 | Kawasaki Steel Corporation | Method of cold rolling grain-oriented silicon steel sheet having excellent and uniform magnetic characteristics along rolling direction of coil and a roll cooling controller for cold rolling mill using the cold rolling method |
| US6093493A (en) * | 1997-07-03 | 2000-07-25 | Ciba Specialty Chemicals Corp. | Method for the coating or encapsulation of fluidizable substrates |
| CN1095491C (en) * | 1999-01-08 | 2002-12-04 | 周兴国 | Preparation method for anti-soaking/leaking heat-insulated solidified-binding gum |
| DE10058860A1 (en) * | 2000-11-27 | 2002-06-06 | Basf Coatings Ag | Curable powder coatings, process for their preparation and mixing system for powder coatings |
| DE10208644A1 (en) * | 2002-02-28 | 2003-09-11 | Bakelite Ag | Process for the production and processing of epoxy resin molding compounds |
| JP2006111670A (en) * | 2004-10-13 | 2006-04-27 | Sanyo Chem Ind Ltd | Epoxy resin fine particle |
| DE102009027364A1 (en) | 2009-06-30 | 2011-01-05 | Hüttenes-Albertus Chemische Werke GmbH | Granules and process for its preparation |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT964886B (en) * | 1971-08-24 | 1974-01-31 | Cabot Corp | POWDER COMPOSITION FOR SOLVENT-FREE COATING TECHNIQUES |
| GB1588047A (en) * | 1977-09-09 | 1981-04-15 | Ciba Geigy Ag | Acid esters of trimellitic acid and their use as hardeners for epoxide resins |
| CH635862A5 (en) * | 1977-10-15 | 1983-04-29 | Ciba Geigy Ag | Process for granulation of pigments. |
| EP0038292B2 (en) * | 1980-02-21 | 1993-07-28 | Ciba-Geigy Ag | Use of synthetic crystalline calcium silicate |
| US4604437A (en) * | 1984-01-31 | 1986-08-05 | Ciba-Geigy Corporation | Polymer from substituted, unsaturated, bicyclic imide |
| FR2572986B1 (en) * | 1984-11-09 | 1986-12-19 | Poudres & Explosifs Ste Nale | METHOD FOR MANUFACTURING LOW-DENSITY SPHERES, AND RESISTANT TO HIGH EXTERNAL PRESSURE; SPHERES OBTAINED THEREBY AND LOW DENSITY MATERIAL THEREOF COMPRISING SUCH SPHERES |
-
1989
- 1989-12-12 EP EP19890810946 patent/EP0376884A3/en not_active Withdrawn
- 1989-12-19 CA CA 2005978 patent/CA2005978A1/en not_active Abandoned
- 1989-12-20 BR BR898906597A patent/BR8906597A/en not_active Application Discontinuation
- 1989-12-21 JP JP33249289A patent/JPH02229863A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140128512A1 (en) * | 2010-02-16 | 2014-05-08 | Sigmund Lindner GmbH | Method for producing glitter |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02229863A (en) | 1990-09-12 |
| EP0376884A2 (en) | 1990-07-04 |
| EP0376884A3 (en) | 1991-06-05 |
| BR8906597A (en) | 1990-09-04 |
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