BRPI0606337A2 - formulação adesiva de epóxi de uma parte - Google Patents
formulação adesiva de epóxi de uma parteInfo
- Publication number
- BRPI0606337A2 BRPI0606337A2 BRPI0606337-3A BRPI0606337A BRPI0606337A2 BR PI0606337 A2 BRPI0606337 A2 BR PI0606337A2 BR PI0606337 A BRPI0606337 A BR PI0606337A BR PI0606337 A2 BRPI0606337 A2 BR PI0606337A2
- Authority
- BR
- Brazil
- Prior art keywords
- epoxy adhesive
- formulations
- adhesive formulation
- part epoxy
- things
- Prior art date
Links
- 238000009472 formulation Methods 0.000 title abstract 6
- 239000000203 mixture Substances 0.000 title abstract 6
- 229920006332 epoxy adhesive Polymers 0.000 title abstract 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 abstract 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 abstract 1
- 239000004760 aramid Substances 0.000 abstract 1
- 229920003235 aromatic polyamide Polymers 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
FORMULAçãO ADESIVA DE EPóXI DE UMA PARTE. Descrevem-se formulações adesivas de epóxi de uma parte e métodos para usa-las. As formulações incluem entre outras coisas metacrilato butadieno estireno em pó e polpa de aramida para, entre outras coisas, melhorar as características de resistência à remoção por lavagem, de resistência pelicular T, e de resistência ao impacto das mesmas. Adicionalmente, as formulações exibem desejáveis características de expansão. As formulações são especialmente apropriadas para usar na ligação de componentes automotivos.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US64823705P | 2005-01-28 | 2005-01-28 | |
| PCT/US2006/002800 WO2006083677A1 (en) | 2005-01-28 | 2006-01-27 | Use of aramid fiber conjunction with thermoplastics to improve wash-off resistance and physical properties such as impact and expansion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0606337A2 true BRPI0606337A2 (pt) | 2009-06-16 |
Family
ID=36441004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0606337-3A BRPI0606337A2 (pt) | 2005-01-28 | 2006-01-27 | formulação adesiva de epóxi de uma parte |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20060189722A1 (pt) |
| EP (1) | EP1846501A1 (pt) |
| JP (1) | JP2008528760A (pt) |
| KR (1) | KR20070095375A (pt) |
| CN (1) | CN101107315B (pt) |
| BR (1) | BRPI0606337A2 (pt) |
| CA (1) | CA2593675A1 (pt) |
| RU (1) | RU2007132455A (pt) |
| WO (1) | WO2006083677A1 (pt) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2205692B1 (en) * | 2007-10-30 | 2020-02-19 | Henkel AG & Co. KGaA | Epoxy paste adhesives resistant to wash-off |
| BR112017000856A2 (pt) | 2014-07-23 | 2017-12-05 | Dow Global Technologies Llc | adesivos estruturais tendo resistência à lavagem melhorada e método para distribuir os mesmos |
| JP7376473B2 (ja) * | 2017-10-18 | 2023-11-08 | ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス,エルエルシー | 接着剤組成物 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4656095A (en) * | 1984-05-31 | 1987-04-07 | Fiber Materials, Inc. | Ablative composition |
| US4707231A (en) * | 1984-09-26 | 1987-11-17 | Pradom Limited | Process for preparing composite materials and products obtained with said process |
| DE69026461T2 (de) * | 1989-10-26 | 1996-11-28 | Idemitsu Petrochemical Co | Polyarylensulfid-Mischungen |
| DE4122450A1 (de) * | 1991-06-12 | 1992-12-17 | Beiersdorf Ag | Reaktiver warmschmelzklebstoff |
| US5877229A (en) * | 1995-07-26 | 1999-03-02 | Lockheed Martin Energy Systems, Inc. | High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators |
| EP0982364A1 (fr) * | 1998-08-25 | 2000-03-01 | Nicolas Bitar | Mastic époxy renforcé aux fibres d'aramide contenant du "gel coat" |
| AU2043601A (en) * | 1999-12-20 | 2001-07-03 | 3M Innovative Properties Company | Ambient-temperature-stable, one-part curable epoxy adhesive |
| CA2351963A1 (en) * | 2000-07-18 | 2002-01-18 | Illinois Tool Works Inc. | One-part, heat cured epoxy adhesive |
| US6630221B1 (en) * | 2000-07-21 | 2003-10-07 | Dexter Corporation | Monolithic expandable structures, methods of manufacture and composite structures |
| US20040191523A1 (en) * | 2003-03-24 | 2004-09-30 | Jihong Kye | Reactive hot melt adhesive formulation for joining stamped metal and plastic parts |
| CN1454956A (zh) * | 2003-05-19 | 2003-11-12 | 上海小糸车灯有限公司 | 单组份高弹性环氧粘合剂 |
-
2006
- 2006-01-27 WO PCT/US2006/002800 patent/WO2006083677A1/en not_active Ceased
- 2006-01-27 KR KR1020077017442A patent/KR20070095375A/ko not_active Ceased
- 2006-01-27 EP EP06733926A patent/EP1846501A1/en not_active Withdrawn
- 2006-01-27 CN CN2006800032275A patent/CN101107315B/zh not_active Expired - Fee Related
- 2006-01-27 CA CA002593675A patent/CA2593675A1/en not_active Abandoned
- 2006-01-27 BR BRPI0606337-3A patent/BRPI0606337A2/pt not_active IP Right Cessation
- 2006-01-27 RU RU2007132455/04A patent/RU2007132455A/ru not_active Application Discontinuation
- 2006-01-27 JP JP2007553230A patent/JP2008528760A/ja active Pending
- 2006-01-27 US US11/341,773 patent/US20060189722A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN101107315B (zh) | 2010-08-25 |
| EP1846501A1 (en) | 2007-10-24 |
| WO2006083677A1 (en) | 2006-08-10 |
| KR20070095375A (ko) | 2007-09-28 |
| CA2593675A1 (en) | 2006-08-10 |
| RU2007132455A (ru) | 2009-03-10 |
| JP2008528760A (ja) | 2008-07-31 |
| US20060189722A1 (en) | 2006-08-24 |
| CN101107315A (zh) | 2008-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B08F | Application fees: application dismissed [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 6A ANUIDADE. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2161 DE 05/06/2012. |