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BR9910827A - Adhesive composition and precursor to it - Google Patents

Adhesive composition and precursor to it

Info

Publication number
BR9910827A
BR9910827A BR9910827-5A BR9910827A BR9910827A BR 9910827 A BR9910827 A BR 9910827A BR 9910827 A BR9910827 A BR 9910827A BR 9910827 A BR9910827 A BR 9910827A
Authority
BR
Brazil
Prior art keywords
adhesive composition
epoxy resin
precursor
resin
adhesive
Prior art date
Application number
BR9910827-5A
Other languages
Portuguese (pt)
Inventor
Kohichiro Kawate
Hitoshi Yamaguchi
Yuji Hiroshige
Akito Muramatsu
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of BR9910827A publication Critical patent/BR9910827A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K3/2279—Oxides; Hydroxides of metals of antimony
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

"COMPOSIçãO ADESIVA, E, PRECURSOR DA MESMA". Fornecer uma composição adesiva contendo um componente de resina que compreende uma resina fenóxi, uma resina epóxi, e uma diciandiamida, a qual não possui combustibilidade, satisfazendo os requisitos VO, e além disso, tem desempenho excelente (como propriedades adesivas e estabilidade dimensional) como uma película adesiva para uma película de proteção de FPC. A resina epóxi compreende uma resina epóxi bromada, o componente de resina contém partículas coloidais de pentóxido de antimónio dispersas na mesma, e o teor total de resina epóxi bromada e das partículas coloidais de pentóxido de antimónio está na faixa de 13 a 60% em peso baseado na quantidade total da composição adesiva."ADHESIVE COMPOSITION, AND, PRECURSOR OF THE SAME". Providing an adhesive composition containing a resin component comprising a phenoxy resin, an epoxy resin, and a diciandiamide, which is non-combustible, satisfying VO requirements, and in addition, has excellent performance (such as adhesive properties and dimensional stability) as an adhesive film for an FPC protection film. The epoxy resin comprises a brominated epoxy resin, the resin component contains colloidal antimony pentoxide particles dispersed therein, and the total content of brominated epoxy resin and colloidal antimony pentoxide particles is in the range of 13 to 60% by weight based on the total amount of the adhesive composition.

BR9910827-5A 1998-02-05 1999-01-13 Adhesive composition and precursor to it BR9910827A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10024414A JPH11217553A (en) 1998-02-05 1998-02-05 Adhesive composition and its precursor
PCT/US1999/000158 WO1999040150A1 (en) 1998-02-05 1999-01-13 Adhesive composition and precursor thereof

Publications (1)

Publication Number Publication Date
BR9910827A true BR9910827A (en) 2001-03-20

Family

ID=12137509

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9910827-5A BR9910827A (en) 1998-02-05 1999-01-13 Adhesive composition and precursor to it

Country Status (6)

Country Link
EP (1) EP1053280A1 (en)
JP (1) JPH11217553A (en)
KR (1) KR20010040644A (en)
CN (1) CN1289352A (en)
BR (1) BR9910827A (en)
WO (1) WO1999040150A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003268337A (en) * 2002-03-15 2003-09-25 Denki Kagaku Kogyo Kk Adhesive composition and adhesive sheet
CN100432170C (en) * 2003-05-20 2008-11-12 长兴化学工业股份有限公司 Resin composition and adhesive-backed ultrathin copper foil dielectric layer material containing same
JP5253315B2 (en) * 2009-07-27 2013-07-31 大成プラス株式会社 Solvent type epoxy adhesive and bonding method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4282136A (en) * 1979-04-09 1981-08-04 Hunt Earl R Flame retardant epoxy molding compound method and encapsulated device
JPS59136319A (en) * 1983-01-25 1984-08-04 Nissan Chem Ind Ltd Epoxy resin composition for flame retardant board
US4756954A (en) * 1986-01-22 1988-07-12 The Dow Chemical Company Epoxy resin laminating varnish and laminates prepared therefrom
JPH0692572B2 (en) * 1988-11-28 1994-11-16 日立化成工業株式会社 Copper foil adhesive for copper clad laminates
JPH061961A (en) * 1992-06-22 1994-01-11 Yokohama Rubber Co Ltd:The Adhesive composition

Also Published As

Publication number Publication date
KR20010040644A (en) 2001-05-15
EP1053280A1 (en) 2000-11-22
WO1999040150A1 (en) 1999-08-12
CN1289352A (en) 2001-03-28
JPH11217553A (en) 1999-08-10

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Legal Events

Date Code Title Description
FA10 Dismissal: dismissal - article 33 of industrial property law
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]