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BR9709299A - Método e aparelho para medir a espessura de um artigo em uma pluralidade de pontos - Google Patents

Método e aparelho para medir a espessura de um artigo em uma pluralidade de pontos

Info

Publication number
BR9709299A
BR9709299A BR9709299A BR9709299A BR9709299A BR 9709299 A BR9709299 A BR 9709299A BR 9709299 A BR9709299 A BR 9709299A BR 9709299 A BR9709299 A BR 9709299A BR 9709299 A BR9709299 A BR 9709299A
Authority
BR
Brazil
Prior art keywords
article
points
measuring
thickness
Prior art date
Application number
BR9709299A
Other languages
English (en)
Inventor
David E Hochbein
Craig J Kerney
Original Assignee
Aluminum Co Of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aluminum Co Of America filed Critical Aluminum Co Of America
Publication of BR9709299A publication Critical patent/BR9709299A/pt

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/02—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
    • G01B5/06—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
BR9709299A 1996-04-23 1997-04-23 Método e aparelho para medir a espessura de um artigo em uma pluralidade de pontos BR9709299A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/636,433 US5735055A (en) 1996-04-23 1996-04-23 Method and apparatus for measuring the thickness of an article at a plurality of points
PCT/US1997/006681 WO1997040337A1 (en) 1996-04-23 1997-04-23 Method and apparatus for measuring the thickness of an article at a plurality of points

Publications (1)

Publication Number Publication Date
BR9709299A true BR9709299A (pt) 1999-08-10

Family

ID=24551883

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9709299A BR9709299A (pt) 1996-04-23 1997-04-23 Método e aparelho para medir a espessura de um artigo em uma pluralidade de pontos

Country Status (8)

Country Link
US (1) US5735055A (pt)
EP (1) EP0895575A1 (pt)
JP (1) JP2000510583A (pt)
KR (1) KR20000010628A (pt)
AU (1) AU3055097A (pt)
BR (1) BR9709299A (pt)
CA (1) CA2252530A1 (pt)
WO (1) WO1997040337A1 (pt)

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US7069101B1 (en) * 1999-07-29 2006-06-27 Applied Materials, Inc. Computer integrated manufacturing techniques
US6640151B1 (en) 1999-12-22 2003-10-28 Applied Materials, Inc. Multi-tool control system, method and medium
US6473987B1 (en) * 1999-12-28 2002-11-05 Accretech Usa, Inc. Method for measuring wafer thickness
US6708074B1 (en) 2000-08-11 2004-03-16 Applied Materials, Inc. Generic interface builder
US7188142B2 (en) * 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US20020128735A1 (en) * 2001-03-08 2002-09-12 Hawkins Parris C.M. Dynamic and extensible task guide
US20020138321A1 (en) * 2001-03-20 2002-09-26 Applied Materials, Inc. Fault tolerant and automated computer software workflow
US6678634B1 (en) 2001-04-27 2004-01-13 Automation And Control Technology, Inc. Thickness measurement system and method
US6910947B2 (en) 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7082345B2 (en) 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7101799B2 (en) * 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US7201936B2 (en) * 2001-06-19 2007-04-10 Applied Materials, Inc. Method of feedback control of sub-atmospheric chemical vapor deposition processes
US6913938B2 (en) * 2001-06-19 2005-07-05 Applied Materials, Inc. Feedback control of plasma-enhanced chemical vapor deposition processes
US7047099B2 (en) 2001-06-19 2006-05-16 Applied Materials Inc. Integrating tool, module, and fab level control
US7337019B2 (en) 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6984198B2 (en) 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
KR100424916B1 (ko) * 2001-09-21 2004-03-27 미래산업 주식회사 부품의 높이측정장치
US7225047B2 (en) * 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
US20030199112A1 (en) * 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
US6672716B2 (en) * 2002-04-29 2004-01-06 Xerox Corporation Multiple portion solid ink stick
JP2005535130A (ja) 2002-08-01 2005-11-17 アプライド マテリアルズ インコーポレイテッド 最新のプロセス制御システム内で誤って表された計測データを取り扱う方法、システム、および媒体
US20040063224A1 (en) * 2002-09-18 2004-04-01 Applied Materials, Inc. Feedback control of a chemical mechanical polishing process for multi-layered films
CN1720490B (zh) * 2002-11-15 2010-12-08 应用材料有限公司 用于控制具有多变量输入参数的制造工艺的方法和系统
US7333871B2 (en) * 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US7205228B2 (en) * 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
US20050014299A1 (en) * 2003-07-15 2005-01-20 Applied Materials, Inc. Control of metal resistance in semiconductor products via integrated metrology
US7354332B2 (en) * 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
US7131211B2 (en) * 2003-08-18 2006-11-07 Micron Technology, Inc. Method and apparatus for measurement of thickness and warpage of substrates
US7356377B2 (en) * 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US7096085B2 (en) * 2004-05-28 2006-08-22 Applied Materials Process control by distinguishing a white noise component of a process variance
US6961626B1 (en) * 2004-05-28 2005-11-01 Applied Materials, Inc Dynamic offset and feedback threshold
ES2281223B1 (es) * 2004-09-30 2008-08-16 Universidad De Sevilla Dispositivo para medir diferencia de espesores de chapas.
JP5089371B2 (ja) * 2007-12-25 2012-12-05 キヤノン株式会社 画像形成装置
US9395180B2 (en) 2010-02-08 2016-07-19 Fpinnovations Measurement of the surface shape map of flat and curvy objects, independent of relative motions
US10281318B1 (en) 2017-03-31 2019-05-07 SolveTech, lnc. In line web process measurement apparatus and method
CN108288593B (zh) * 2018-04-11 2023-09-05 无锡星微科技有限公司 一种多尺寸兼容的led厚度检测的自动化设备及其检测方法
CN108931221A (zh) * 2018-05-19 2018-12-04 郭文英 一种钣金件厚度测试设备
CN118463767B (zh) * 2024-07-11 2024-09-27 山东华鹏石岛玻璃制品有限公司 一种玻璃器皿厚度检测装置及方法

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US4897925A (en) * 1987-12-15 1990-02-06 Allegheny Ludlum Corporation Apparatus for determining surface profiles of metallic workpieces
JPH01321302A (ja) * 1988-06-24 1989-12-27 Matsushita Electric Works Ltd 板厚測定方法
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US5272443A (en) * 1992-04-22 1993-12-21 Aluminum Company Of America Chatter and profile measuring using capacitor sensors

Also Published As

Publication number Publication date
KR20000010628A (ko) 2000-02-25
US5735055A (en) 1998-04-07
EP0895575A1 (en) 1999-02-10
JP2000510583A (ja) 2000-08-15
CA2252530A1 (en) 1997-10-30
WO1997040337A1 (en) 1997-10-30
AU3055097A (en) 1997-11-12

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Legal Events

Date Code Title Description
B08F Application fees: application dismissed [chapter 8.6 patent gazette]