BR8103773A - Processo de producao de um semicondutor por bombardeio com feixe ionico - Google Patents
Processo de producao de um semicondutor por bombardeio com feixe ionicoInfo
- Publication number
- BR8103773A BR8103773A BR8103773A BR8103773A BR8103773A BR 8103773 A BR8103773 A BR 8103773A BR 8103773 A BR8103773 A BR 8103773A BR 8103773 A BR8103773 A BR 8103773A BR 8103773 A BR8103773 A BR 8103773A
- Authority
- BR
- Brazil
- Prior art keywords
- semiconductor
- production process
- beam pump
- ionic beam
- ionic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
- G21K1/10—Scattering devices; Absorbing devices; Ionising radiation filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/302—Controlling tubes by external information, e.g. programme control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/2658—Bombardment with radiation with high-energy radiation producing ion implantation of a molecular ion, e.g. decaborane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/266—Bombardment with radiation with high-energy radiation producing ion implantation using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/047—Changing particle velocity
- H01J2237/0475—Changing particle velocity decelerating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/05—Arrangements for energy or mass analysis
- H01J2237/057—Energy or mass filtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/304—Controlling tubes
- H01J2237/30455—Correction during exposure
- H01J2237/30461—Correction during exposure pre-calculated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
- H01J2237/31706—Ion implantation characterised by the area treated
- H01J2237/3171—Ion implantation characterised by the area treated patterned
- H01J2237/31711—Ion implantation characterised by the area treated patterned using mask
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16024480A | 1980-06-17 | 1980-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR8103773A true BR8103773A (pt) | 1982-03-09 |
Family
ID=22576117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR8103773A BR8103773A (pt) | 1980-06-17 | 1981-06-15 | Processo de producao de um semicondutor por bombardeio com feixe ionico |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS586301B2 (pt) |
| BE (1) | BE889247A (pt) |
| BR (1) | BR8103773A (pt) |
| CA (1) | CA1162326A (pt) |
| DE (1) | DE3123949A1 (pt) |
| FR (1) | FR2484701A1 (pt) |
| GB (1) | GB2078441A (pt) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6039686U (ja) * | 1983-08-24 | 1985-03-19 | 株式会社 大喜 | 盆灯篭 |
| DE3402653A1 (de) * | 1984-01-26 | 1985-08-01 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung speziell dotierter bereiche in halbleitermaterial |
| GB2156383A (en) * | 1984-02-06 | 1985-10-09 | Plessey Co Plc | Infra-red material structures |
| DE3404834A1 (de) * | 1984-02-08 | 1985-08-08 | Hahn-Meitner-Institut für Kernforschung Berlin GmbH, 1000 Berlin | Halbleiter-leistungsbauelement, insbesondere thyristor und gridistor, sowie verfahren zu dessen herstellung |
| JPS623776A (ja) * | 1985-06-29 | 1987-01-09 | Zojirushi Vacuum Bottle Co | 冷凍食品の解凍方法及びその制御装置 |
| JPH0334488Y2 (pt) * | 1985-09-19 | 1991-07-22 | ||
| SE454309B (sv) * | 1986-08-29 | 1988-04-18 | Stiftelsen Inst Mikrovags | Forfarande att framstella tunna ledande eller halvledande skikt inbeddade i kisel medelst implantering av metallatomer |
| US4816421A (en) * | 1986-11-24 | 1989-03-28 | American Telephone And Telegraph Company, At&T Bell Laboratories | Method of making a heteroepitaxial structure by mesotaxy induced by buried implantation |
| JPH05198666A (ja) * | 1991-11-20 | 1993-08-06 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| EP0584436A1 (en) * | 1992-08-26 | 1994-03-02 | Co.Ri.M.Me. Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno | Process for forming buried regions, having different doping concentration, in monolitic semiconductor devices |
| US5317787B1 (en) * | 1992-10-01 | 1995-11-28 | Thomas & Betts Corp | Cable tie having improved tail gripping and holding feature |
| US5364800A (en) * | 1993-06-24 | 1994-11-15 | Texas Instruments Incorporated | Varying the thickness of the surface silicon layer in a silicon-on-insulator substrate |
| DE10006523A1 (de) * | 2000-02-15 | 2001-08-23 | Infineon Technologies Ag | Implantationsmaske für Hochenergieionenimplantation |
| JP2007287973A (ja) * | 2006-04-18 | 2007-11-01 | Toyota Motor Corp | ステンシルマスクとその利用方法とそれを利用する荷電粒子注入装置 |
| DE102015202121B4 (de) * | 2015-02-06 | 2017-09-14 | Infineon Technologies Ag | SiC-basierte Supersperrschicht-Halbleitervorrichtungen und Verfahren zur Herstellung dieser |
| DE102015114429B4 (de) | 2015-08-28 | 2017-05-11 | Infineon Technologies Ag | Partikelbestrahlungsgerät, Strahlmodifikatorvorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung mit einer Junctionabschlussextensionszone |
| DE102016106119B4 (de) * | 2016-04-04 | 2019-03-07 | mi2-factory GmbH | Energiefilterelement für Ionenimplantationsanlagen für den Einsatz in der Produktion von Wafern |
| DE102016110429A1 (de) * | 2016-06-06 | 2017-12-07 | Infineon Technologies Ag | Energiefilter zum Verarbeiten einer Leistungshalbleitervorrichtung |
| CN111599504B (zh) * | 2020-05-29 | 2022-05-17 | 中国科学院近代物理研究所 | 一种重离子辐照系统及辐照方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4968660A (pt) * | 1972-11-04 | 1974-07-03 | ||
| US4035226A (en) * | 1975-04-14 | 1977-07-12 | Rca Corporation | Method of preparing portions of a semiconductor wafer surface for further processing |
| US4257825A (en) * | 1978-08-30 | 1981-03-24 | U.S. Philips Corporation | Method of manufacturing semiconductor devices having improvements in device reliability by thermally treating selectively implanted test figures in wafers |
-
1981
- 1981-06-01 GB GB8116666A patent/GB2078441A/en not_active Withdrawn
- 1981-06-15 BR BR8103773A patent/BR8103773A/pt unknown
- 1981-06-16 CA CA000379841A patent/CA1162326A/en not_active Expired
- 1981-06-16 DE DE19813123949 patent/DE3123949A1/de not_active Withdrawn
- 1981-06-16 FR FR8111869A patent/FR2484701A1/fr not_active Withdrawn
- 1981-06-16 BE BE0/205118A patent/BE889247A/fr not_active IP Right Cessation
- 1981-06-17 JP JP56092406A patent/JPS586301B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB2078441A (en) | 1982-01-06 |
| CA1162326A (en) | 1984-02-14 |
| BE889247A (fr) | 1981-12-16 |
| JPS586301B2 (ja) | 1983-02-03 |
| DE3123949A1 (de) | 1982-02-04 |
| JPS5727027A (en) | 1982-02-13 |
| FR2484701A1 (fr) | 1981-12-18 |
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