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BR8103773A - Processo de producao de um semicondutor por bombardeio com feixe ionico - Google Patents

Processo de producao de um semicondutor por bombardeio com feixe ionico

Info

Publication number
BR8103773A
BR8103773A BR8103773A BR8103773A BR8103773A BR 8103773 A BR8103773 A BR 8103773A BR 8103773 A BR8103773 A BR 8103773A BR 8103773 A BR8103773 A BR 8103773A BR 8103773 A BR8103773 A BR 8103773A
Authority
BR
Brazil
Prior art keywords
semiconductor
production process
beam pump
ionic beam
ionic
Prior art date
Application number
BR8103773A
Other languages
English (en)
Inventor
J Bartko
Original Assignee
Wec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wec Corp filed Critical Wec Corp
Publication of BR8103773A publication Critical patent/BR8103773A/pt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21KTECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K1/00Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
    • G21K1/10Scattering devices; Absorbing devices; Ionising radiation filters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/302Controlling tubes by external information, e.g. programme control
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/26506Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
    • H01L21/26513Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/2658Bombardment with radiation with high-energy radiation producing ion implantation of a molecular ion, e.g. decaborane
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/266Bombardment with radiation with high-energy radiation producing ion implantation using masks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04Means for controlling the discharge
    • H01J2237/047Changing particle velocity
    • H01J2237/0475Changing particle velocity decelerating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/05Arrangements for energy or mass analysis
    • H01J2237/057Energy or mass filtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/304Controlling tubes
    • H01J2237/30455Correction during exposure
    • H01J2237/30461Correction during exposure pre-calculated
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/317Processing objects on a microscale
    • H01J2237/31701Ion implantation
    • H01J2237/31706Ion implantation characterised by the area treated
    • H01J2237/3171Ion implantation characterised by the area treated patterned
    • H01J2237/31711Ion implantation characterised by the area treated patterned using mask

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)
BR8103773A 1980-06-17 1981-06-15 Processo de producao de um semicondutor por bombardeio com feixe ionico BR8103773A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16024480A 1980-06-17 1980-06-17

Publications (1)

Publication Number Publication Date
BR8103773A true BR8103773A (pt) 1982-03-09

Family

ID=22576117

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8103773A BR8103773A (pt) 1980-06-17 1981-06-15 Processo de producao de um semicondutor por bombardeio com feixe ionico

Country Status (7)

Country Link
JP (1) JPS586301B2 (pt)
BE (1) BE889247A (pt)
BR (1) BR8103773A (pt)
CA (1) CA1162326A (pt)
DE (1) DE3123949A1 (pt)
FR (1) FR2484701A1 (pt)
GB (1) GB2078441A (pt)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6039686U (ja) * 1983-08-24 1985-03-19 株式会社 大喜 盆灯篭
DE3402653A1 (de) * 1984-01-26 1985-08-01 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung speziell dotierter bereiche in halbleitermaterial
GB2156383A (en) * 1984-02-06 1985-10-09 Plessey Co Plc Infra-red material structures
DE3404834A1 (de) * 1984-02-08 1985-08-08 Hahn-Meitner-Institut für Kernforschung Berlin GmbH, 1000 Berlin Halbleiter-leistungsbauelement, insbesondere thyristor und gridistor, sowie verfahren zu dessen herstellung
JPS623776A (ja) * 1985-06-29 1987-01-09 Zojirushi Vacuum Bottle Co 冷凍食品の解凍方法及びその制御装置
JPH0334488Y2 (pt) * 1985-09-19 1991-07-22
SE454309B (sv) * 1986-08-29 1988-04-18 Stiftelsen Inst Mikrovags Forfarande att framstella tunna ledande eller halvledande skikt inbeddade i kisel medelst implantering av metallatomer
US4816421A (en) * 1986-11-24 1989-03-28 American Telephone And Telegraph Company, At&T Bell Laboratories Method of making a heteroepitaxial structure by mesotaxy induced by buried implantation
JPH05198666A (ja) * 1991-11-20 1993-08-06 Mitsubishi Electric Corp 半導体装置およびその製造方法
EP0584436A1 (en) * 1992-08-26 1994-03-02 Co.Ri.M.Me. Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Process for forming buried regions, having different doping concentration, in monolitic semiconductor devices
US5317787B1 (en) * 1992-10-01 1995-11-28 Thomas & Betts Corp Cable tie having improved tail gripping and holding feature
US5364800A (en) * 1993-06-24 1994-11-15 Texas Instruments Incorporated Varying the thickness of the surface silicon layer in a silicon-on-insulator substrate
DE10006523A1 (de) * 2000-02-15 2001-08-23 Infineon Technologies Ag Implantationsmaske für Hochenergieionenimplantation
JP2007287973A (ja) * 2006-04-18 2007-11-01 Toyota Motor Corp ステンシルマスクとその利用方法とそれを利用する荷電粒子注入装置
DE102015202121B4 (de) * 2015-02-06 2017-09-14 Infineon Technologies Ag SiC-basierte Supersperrschicht-Halbleitervorrichtungen und Verfahren zur Herstellung dieser
DE102015114429B4 (de) 2015-08-28 2017-05-11 Infineon Technologies Ag Partikelbestrahlungsgerät, Strahlmodifikatorvorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung mit einer Junctionabschlussextensionszone
DE102016106119B4 (de) * 2016-04-04 2019-03-07 mi2-factory GmbH Energiefilterelement für Ionenimplantationsanlagen für den Einsatz in der Produktion von Wafern
DE102016110429A1 (de) * 2016-06-06 2017-12-07 Infineon Technologies Ag Energiefilter zum Verarbeiten einer Leistungshalbleitervorrichtung
CN111599504B (zh) * 2020-05-29 2022-05-17 中国科学院近代物理研究所 一种重离子辐照系统及辐照方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4968660A (pt) * 1972-11-04 1974-07-03
US4035226A (en) * 1975-04-14 1977-07-12 Rca Corporation Method of preparing portions of a semiconductor wafer surface for further processing
US4257825A (en) * 1978-08-30 1981-03-24 U.S. Philips Corporation Method of manufacturing semiconductor devices having improvements in device reliability by thermally treating selectively implanted test figures in wafers

Also Published As

Publication number Publication date
GB2078441A (en) 1982-01-06
CA1162326A (en) 1984-02-14
BE889247A (fr) 1981-12-16
JPS586301B2 (ja) 1983-02-03
DE3123949A1 (de) 1982-02-04
JPS5727027A (en) 1982-02-13
FR2484701A1 (fr) 1981-12-18

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