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AU7068791A - A method for manufacturing of mineature impedance matched interconnection patterns - Google Patents

A method for manufacturing of mineature impedance matched interconnection patterns

Info

Publication number
AU7068791A
AU7068791A AU70687/91A AU7068791A AU7068791A AU 7068791 A AU7068791 A AU 7068791A AU 70687/91 A AU70687/91 A AU 70687/91A AU 7068791 A AU7068791 A AU 7068791A AU 7068791 A AU7068791 A AU 7068791A
Authority
AU
Australia
Prior art keywords
mineature
manufacturing
impedance matched
interconnection patterns
matched interconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU70687/91A
Inventor
Hans Bernhard Gronli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AS Micro Electronics
Original Assignee
MICRO ELECTRONICS AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MICRO ELECTRONICS AS filed Critical MICRO ELECTRONICS AS
Publication of AU7068791A publication Critical patent/AU7068791A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
AU70687/91A 1990-01-16 1991-01-16 A method for manufacturing of mineature impedance matched interconnection patterns Abandoned AU7068791A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NO900229A NO900229D0 (en) 1990-01-16 1990-01-16 PROCEDURE FOR MANUFACTURING MINIATURIZED IMPEDAN CUSTOMIZED WIRING NETWORK.
NO900229 1990-01-16

Publications (1)

Publication Number Publication Date
AU7068791A true AU7068791A (en) 1991-08-05

Family

ID=19892800

Family Applications (1)

Application Number Title Priority Date Filing Date
AU70687/91A Abandoned AU7068791A (en) 1990-01-16 1991-01-16 A method for manufacturing of mineature impedance matched interconnection patterns

Country Status (5)

Country Link
EP (1) EP0510049A1 (en)
JP (1) JPH06503680A (en)
AU (1) AU7068791A (en)
NO (1) NO900229D0 (en)
WO (1) WO1991011025A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3461204B2 (en) * 1993-09-14 2003-10-27 株式会社東芝 Multi-chip module
US6347037B2 (en) 1994-04-28 2002-02-12 Fujitsu Limited Semiconductor device and method of forming the same
JP3034180B2 (en) 1994-04-28 2000-04-17 富士通株式会社 Semiconductor device, method of manufacturing the same, and substrate
US5874770A (en) * 1996-10-10 1999-02-23 General Electric Company Flexible interconnect film including resistor and capacitor layers
JP2003332749A (en) * 2002-01-11 2003-11-21 Denso Corp Substrate with built-in passive element, method for manufacturing the same, and base plate for forming substrate with built-in passive element
JP4793014B2 (en) * 2006-02-17 2011-10-12 大日本印刷株式会社 Passive element built-in wiring board and manufacturing method thereof
US9848498B2 (en) 2014-08-13 2017-12-19 Finisar Corporation Optoelectronic subassembly with components mounted on top and bottom of substrate
US9854687B2 (en) 2014-08-13 2017-12-26 Finisar Corporation Multi-layer substrates including thin film signal lines
CN107111082B (en) * 2014-10-28 2019-08-02 菲尼萨公司 multilayer substrate
CN109686721A (en) * 2019-01-31 2019-04-26 中国电子科技集团公司第四十三研究所 A kind of Thick film multilayer wire structures of low thermal resistance and preparation method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2526553C3 (en) * 1975-06-13 1978-06-01 Siemens Ag, 1000 Berlin Und 8000 Muenchen Multilayer electronic circuit and method for its manufacture
DE3121131C2 (en) * 1981-05-27 1984-02-16 ANT Nachrichtentechnik GmbH, 7150 Backnang Process for the production of circuit boards provided with conductor tracks with metallic vias
JPS6366993A (en) * 1986-09-08 1988-03-25 日本電気株式会社 Multilayer interconnection board
EP0266210B1 (en) * 1986-10-29 1993-02-17 Kabushiki Kaisha Toshiba Electronic apparatus comprising a ceramic substrate

Also Published As

Publication number Publication date
WO1991011025A1 (en) 1991-07-25
NO900229D0 (en) 1990-01-16
EP0510049A1 (en) 1992-10-28
JPH06503680A (en) 1994-04-21

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