[go: up one dir, main page]

AU2004258530A1 - System and method for thermal management using distributed synthetic jet actuators - Google Patents

System and method for thermal management using distributed synthetic jet actuators Download PDF

Info

Publication number
AU2004258530A1
AU2004258530A1 AU2004258530A AU2004258530A AU2004258530A1 AU 2004258530 A1 AU2004258530 A1 AU 2004258530A1 AU 2004258530 A AU2004258530 A AU 2004258530A AU 2004258530 A AU2004258530 A AU 2004258530A AU 2004258530 A1 AU2004258530 A1 AU 2004258530A1
Authority
AU
Australia
Prior art keywords
synthetic jet
actuator
tube
chamber
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2004258530A
Other languages
English (en)
Inventor
Ari Glezer
Raghavendran Mahalingam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Georgia Tech Research Corp
Original Assignee
Georgia Tech Research Institute
Georgia Tech Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Georgia Tech Research Institute, Georgia Tech Research Corp filed Critical Georgia Tech Research Institute
Publication of AU2004258530A1 publication Critical patent/AU2004258530A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00—Machines, pumps, or pumping installations having flexible working members
    • F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00—Machines, pumps, or pumping installations having flexible working members
    • F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • F04B43/04—Pumps having electric drive
    • F04B43/043—Micropumps
    • F04B43/046—Micropumps with piezoelectric drive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B45/00—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids
    • F04B45/04—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
    • F04B45/047—Pumps having electric drive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Reciprocating Pumps (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Jet Pumps And Other Pumps (AREA)
  • Spray Control Apparatus (AREA)
AU2004258530A 2003-07-07 2004-07-07 System and method for thermal management using distributed synthetic jet actuators Abandoned AU2004258530A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US48517703P 2003-07-07 2003-07-07
US60/485,177 2003-07-07
US53278503P 2003-12-23 2003-12-23
US60/532,785 2003-12-23
PCT/US2004/021706 WO2005008348A2 (fr) 2003-07-07 2004-07-07 Systeme et procede de gestion thermique effectuee au moyen d'organes de commande de jets synthetiques

Publications (1)

Publication Number Publication Date
AU2004258530A1 true AU2004258530A1 (en) 2005-01-27

Family

ID=34083331

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2004258530A Abandoned AU2004258530A1 (en) 2003-07-07 2004-07-07 System and method for thermal management using distributed synthetic jet actuators

Country Status (4)

Country Link
JP (2) JP2007527618A (fr)
AU (1) AU2004258530A1 (fr)
GB (1) GB2419644B (fr)
WO (1) WO2005008348A2 (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4677744B2 (ja) 2003-11-04 2011-04-27 ソニー株式会社 噴流発生装置、電子機器及び噴流発生方法
JP4572548B2 (ja) 2004-03-18 2010-11-04 ソニー株式会社 気体噴出装置
JP4887652B2 (ja) 2005-04-21 2012-02-29 ソニー株式会社 噴流発生装置及び電子機器
JP4747657B2 (ja) 2005-04-21 2011-08-17 ソニー株式会社 噴流発生装置及び電子機器
JP2006310586A (ja) 2005-04-28 2006-11-09 Sony Corp 気流発生装置及び電子機器
US7932535B2 (en) * 2005-11-02 2011-04-26 Nuventix, Inc. Synthetic jet cooling system for LED module
US7607470B2 (en) 2005-11-14 2009-10-27 Nuventix, Inc. Synthetic jet heat pipe thermal management system
EP1989051B1 (fr) * 2006-02-23 2012-01-25 Nuventix Inc. Ensemble electronique pour des ejecteurs a jet
US20090168343A1 (en) * 2006-03-21 2009-07-02 Koninklijke Philips Electronics N.V. Cooling device and electronic device comprising such a cooling device
JP5320298B2 (ja) * 2006-12-15 2013-10-23 コーニンクレッカ フィリップス エヌ ヴェ 周波数制御を有する脈動流体冷却
EP1975505A1 (fr) 2007-03-26 2008-10-01 Koninklijke Philips Electronics N.V. Dispositif d'éclairage
RU2525826C2 (ru) * 2007-12-07 2014-08-20 Конинклейке Филипс Электроникс Н.В. Охлаждающее устройство, использующее внутренние искусственные струи
US8218318B2 (en) 2007-12-07 2012-07-10 Koninklijke Philips Electronics N.V. Low noise cooling device
DE602008002412D1 (de) * 2008-05-06 2010-10-14 Fiat Ricerche Luftdiffusor oder Verteilungsvorrichtung mit synthetischen Düsen
JP5110159B2 (ja) 2008-06-05 2012-12-26 株式会社村田製作所 圧電マイクロブロア
CN102089581B (zh) * 2008-07-10 2014-04-30 皇家飞利浦电子股份有限公司 通过组合热管和谐振器用于合成喷射冷却来进行远程冷却
WO2010029485A1 (fr) 2008-09-12 2010-03-18 Koninklijke Philips Electronics N.V. Dispositif pourvu d'un espace en forme d'interstice et générateur de jet synthétique raccordé audit dispositif
DE112011100524T5 (de) 2010-02-13 2012-11-29 Nuventix, Inc. Synthesestrahl-Ausstoßvorrichtung und deren konstruktiver Aufbau zur Förderung der Serienproduktion
CH703357A1 (de) * 2010-06-25 2011-12-30 Alstom Technology Ltd Wärmebelastetes, gekühltes bauteil.
US20120170216A1 (en) * 2011-01-04 2012-07-05 General Electric Company Synthetic jet packaging

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55101800A (en) * 1979-01-25 1980-08-04 Pioneer Electronic Corp Air pump
JPS63234594A (ja) * 1987-03-23 1988-09-29 古野電気株式会社 流体換流装置
US4938742A (en) * 1988-02-04 1990-07-03 Smits Johannes G Piezoelectric micropump with microvalves
JPH04501449A (ja) * 1989-06-14 1992-03-12 ウエストンブリッジ　インターナショナル　リミティド マイクロポンプ
JPH03116961A (ja) * 1989-09-29 1991-05-17 Victor Co Of Japan Ltd 放熱装置
JPH06147104A (ja) * 1992-10-30 1994-05-27 Hitachi Ltd 圧電多チャンネルポンプ及び駆動制御方法
US5876187A (en) * 1995-03-09 1999-03-02 University Of Washington Micropumps with fixed valves
US6457654B1 (en) * 1995-06-12 2002-10-01 Georgia Tech Research Corporation Micromachined synthetic jet actuators and applications thereof
US6123145A (en) * 1995-06-12 2000-09-26 Georgia Tech Research Corporation Synthetic jet actuators for cooling heated bodies and environments
DE19802367C1 (de) * 1997-02-19 1999-09-23 Hahn Schickard Ges Mikrodosiervorrichtungsarray und Verfahren zum Betreiben desselben
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
JPH11145661A (ja) * 1997-11-10 1999-05-28 Sony Corp 空冷装置
JPH11145659A (ja) * 1997-11-10 1999-05-28 Sony Corp 空冷装置
JP3154329B2 (ja) * 1998-07-21 2001-04-09 川崎重工業株式会社 アキシャルピストンポンプ
SE514735C2 (sv) * 1998-12-11 2001-04-09 Ericsson Telefon Ab L M Anordning för ökande av värmeavgivning
JP3814132B2 (ja) * 1999-10-27 2006-08-23 セイコーインスツル株式会社 ポンプ及びその駆動方法
JP2002134975A (ja) * 2000-10-23 2002-05-10 Nippon Keiki Works Ltd 冷却ファン
US20020098097A1 (en) * 2001-01-22 2002-07-25 Angad Singh Magnetically-actuated micropump
US6631077B2 (en) * 2002-02-11 2003-10-07 Thermal Corp. Heat spreader with oscillating flow
US6869275B2 (en) * 2002-02-14 2005-03-22 Philip Morris Usa Inc. Piezoelectrically driven fluids pump and piezoelectric fluid valve

Also Published As

Publication number Publication date
WO2005008348A2 (fr) 2005-01-27
JP2007527618A (ja) 2007-09-27
GB0600751D0 (en) 2006-02-22
GB2419644A (en) 2006-05-03
JP2010101325A (ja) 2010-05-06
WO2005008348A3 (fr) 2005-07-14
GB2419644B (en) 2008-04-09

Similar Documents

Publication Publication Date Title
US20060185822A1 (en) System and method for thermal management using distributed synthetic jet actuators
JP2010101325A (ja) 分配された合成ジェットアクチュエータを使用する熱管理のためのシステムおよび方法
EP1040736B1 (fr) Organes de commande de jets synthetiques permettant de refroidir des corps et des environnements chauffes
JP7333417B2 (ja) 閉じたデバイスおよび開いたデバイスのためのｍｅｍｓベース冷却システム
US6588497B1 (en) System and method for thermal management by synthetic jet ejector channel cooling techniques
US8308078B2 (en) Method and apparatus for reducing acoustic noise in a synthetic jet
US9556889B2 (en) Method and apparatus for reducing acoustic noise in a synthetic jet
US7688583B1 (en) Synthetic jet and method of making same
CN1906416B (zh) 气体喷射器、电子设备和气体喷射方法
JP6555845B2 (ja) 多機能シンセティックジェットおよび同製作の方法
WO2006028992A2 (fr) Appareil et procede permettant un transfert de chaleur ameliore
TWI492492B (zh) 冷卻裝置、電子裝置及照明裝置
US20120199667A1 (en) Systems and Methodologies for Preventing Dust and Particle Contamination of Synthetic Jet Ejectors
CN1846060A (zh) 利用分布式合成喷流致动器进行热管理的系统和方法
JP4844236B2 (ja) ノズル、噴流発生装置、冷却装置及び電子機器
JP2007162525A (ja) 噴流発生装置、放熱装置及び電子機器
JP2006063900A (ja) 噴流発生装置及び電子機器
CN119486032A (zh) 压电散热装置及散热系统
KR100468840B1 (ko) 냉각장치

Legal Events

Date Code Title Description
MK4 Application lapsed section 142(2)(d) - no continuation fee paid for the application