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AU2003239183A1 - Partially patterned lead frames and methods of making and using the same in semiconductor packaging - Google Patents

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Info

Publication number
AU2003239183A1
AU2003239183A1 AU2003239183A AU2003239183A AU2003239183A1 AU 2003239183 A1 AU2003239183 A1 AU 2003239183A1 AU 2003239183 A AU2003239183 A AU 2003239183A AU 2003239183 A AU2003239183 A AU 2003239183A AU 2003239183 A1 AU2003239183 A1 AU 2003239183A1
Authority
AU
Australia
Prior art keywords
making
methods
same
lead frames
semiconductor packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003239183A
Inventor
Shafidul Islam
Romarico S. San Antonio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Interconnect Technologies Ltd
Original Assignee
Advanced Interconnect Technology Ltd
Advanced Interconnect Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/134,882 external-priority patent/US6812552B2/en
Priority claimed from US10/342,732 external-priority patent/US6777265B2/en
Application filed by Advanced Interconnect Technology Ltd, Advanced Interconnect Technologies Ltd filed Critical Advanced Interconnect Technology Ltd
Publication of AU2003239183A1 publication Critical patent/AU2003239183A1/en
Abandoned legal-status Critical Current

Links

Classifications

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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
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    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4828—Etching
    • H01L21/4832—Etching a temporary substrate after encapsulation process to form leads
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    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
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    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/183—Connection portion, e.g. seal
    • H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
AU2003239183A 2002-04-29 2003-04-28 Partially patterned lead frames and methods of making and using the same in semiconductor packaging Abandoned AU2003239183A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US10/134,882 2002-04-29
US10/134,882 US6812552B2 (en) 2002-04-29 2002-04-29 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US10/342,732 2003-01-15
US10/342,732 US6777265B2 (en) 2002-04-29 2003-01-15 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
PCT/US2003/013046 WO2003103038A1 (en) 2002-04-29 2003-04-28 Partially patterned lead frames and methods of making and using the same in semiconductor packaging

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AU2003239183A1 true AU2003239183A1 (en) 2003-12-19

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EP (1) EP1500130A1 (en)
JP (1) JP2005531137A (en)
KR (1) KR100789348B1 (en)
CN (1) CN100380614C (en)
AU (1) AU2003239183A1 (en)
TW (1) TWI239054B (en)
WO (1) WO2003103038A1 (en)

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US6812552B2 (en) 2002-04-29 2004-11-02 Advanced Interconnect Technologies Limited Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US7799611B2 (en) 2002-04-29 2010-09-21 Unisem (Mauritius) Holdings Limited Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US8236612B2 (en) 2002-04-29 2012-08-07 Unisem (Mauritius) Holdings Limited Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US20040058478A1 (en) 2002-09-25 2004-03-25 Shafidul Islam Taped lead frames and methods of making and using the same in semiconductor packaging
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WO2008057770A2 (en) 2006-10-27 2008-05-15 Unisem (Mauritius) Holdings Limited Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US8097945B2 (en) * 2007-11-21 2012-01-17 Lynda Harnden, legal representative Bi-directional, reverse blocking battery switch
JP5224845B2 (en) * 2008-02-18 2013-07-03 新光電気工業株式会社 Semiconductor device manufacturing method and semiconductor device
US10199311B2 (en) 2009-01-29 2019-02-05 Semiconductor Components Industries, Llc Leadless semiconductor packages, leadframes therefor, and methods of making
US9899349B2 (en) 2009-01-29 2018-02-20 Semiconductor Components Industries, Llc Semiconductor packages and related methods
US10163766B2 (en) 2016-11-21 2018-12-25 Semiconductor Components Industries, Llc Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks
US8071427B2 (en) * 2009-01-29 2011-12-06 Semiconductor Components Industries, Llc Method for manufacturing a semiconductor component and structure therefor
JP5215980B2 (en) * 2009-10-30 2013-06-19 株式会社三井ハイテック Manufacturing method of semiconductor device
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US9287191B2 (en) 2011-10-12 2016-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device package and method
US8866274B2 (en) * 2012-03-27 2014-10-21 Infineon Technologies Ag Semiconductor packages and methods of formation thereof
JP5990438B2 (en) * 2012-09-13 2016-09-14 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor device
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CN103745957A (en) * 2013-11-06 2014-04-23 华天科技（西安）有限公司 AAQFN packaging part capable of enhancing heat radiation and technology for manufacture same AAQFN packaging part
US9287238B2 (en) * 2013-12-02 2016-03-15 Infineon Technologies Ag Leadless semiconductor package with optical inspection feature
US9449876B2 (en) * 2014-01-17 2016-09-20 Infineon Technologies Ag Singulation of semiconductor dies with contact metallization by electrical discharge machining
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US9252063B2 (en) * 2014-07-07 2016-02-02 Infineon Technologies Ag Extended contact area for leadframe strip testing
US9219025B1 (en) * 2014-08-15 2015-12-22 Infineon Technologies Ag Molded flip-clip semiconductor package
CN105118787A (en) * 2015-04-22 2015-12-02 丽智电子(昆山)有限公司 Product processing technology employing laser copper baking
CN109586680B (en) * 2017-09-29 2021-09-03 安华高科技股份有限公司 Anchored polymer encapsulation for acoustic resonator structures
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CN100380614C (en) 2008-04-09
WO2003103038A1 (en) 2003-12-11
KR100789348B1 (en) 2007-12-28
TW200405480A (en) 2004-04-01
TWI239054B (en) 2005-09-01
JP2005531137A (en) 2005-10-13
KR20050007350A (en) 2005-01-17
CN1650410A (en) 2005-08-03
EP1500130A1 (en) 2005-01-26

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