AU2003236271A1 - Resin composition for light emitting diode reflectors - Google Patents
Resin composition for light emitting diode reflectorsInfo
- Publication number
- AU2003236271A1 AU2003236271A1 AU2003236271A AU2003236271A AU2003236271A1 AU 2003236271 A1 AU2003236271 A1 AU 2003236271A1 AU 2003236271 A AU2003236271 A AU 2003236271A AU 2003236271 A AU2003236271 A AU 2003236271A AU 2003236271 A1 AU2003236271 A1 AU 2003236271A1
- Authority
- AU
- Australia
- Prior art keywords
- light emitting
- resin composition
- emitting diode
- reflectors
- diode reflectors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyamides (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002104063 | 2002-04-05 | ||
| JP2002-104063 | 2002-04-05 | ||
| PCT/JP2003/004361 WO2003085029A1 (en) | 2002-04-05 | 2003-04-04 | Resin composition for light emitting diode reflectors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2003236271A1 true AU2003236271A1 (en) | 2003-10-20 |
Family
ID=28786327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003236271A Abandoned AU2003236271A1 (en) | 2002-04-05 | 2003-04-04 | Resin composition for light emitting diode reflectors |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2003085029A1 (en) |
| CN (1) | CN1585796A (en) |
| AU (1) | AU2003236271A1 (en) |
| WO (1) | WO2003085029A1 (en) |
Families Citing this family (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005194513A (en) * | 2003-12-09 | 2005-07-21 | Mitsui Chemicals Inc | Resin composition for reflector, and reflector |
| US8426549B2 (en) | 2005-04-15 | 2013-04-23 | Mitsui Chemicals, Inc. | Resin composition for reflector, and reflector |
| US20060293497A1 (en) * | 2005-06-10 | 2006-12-28 | Martens Marvin M | Articles of manufacture made from polyamide resins and suitable for incorporation into LED reflector applications |
| US20060293427A1 (en) * | 2005-06-10 | 2006-12-28 | Martens Marvin M | Thermally conductive polyamide-based components used in light emitting diode reflector applications |
| US20060293435A1 (en) * | 2005-06-10 | 2006-12-28 | Marens Marvin M | Light-emitting diode assembly housing comprising high temperature polyamide compositions |
| US8007885B2 (en) | 2005-09-14 | 2011-08-30 | Georgios Topoulos | Light-emitting diode assembly housing comprising poly(cyclohexanedimethanol terephthalate) compositions |
| CN101278416B (en) * | 2005-09-30 | 2011-01-12 | 日亚化学工业株式会社 | Light emitting device and backlight light source unit using the light emitting device |
| JP2007161863A (en) * | 2005-12-13 | 2007-06-28 | Mitsui Chemicals Inc | Photocurable coating material for polyamide |
| KR101183393B1 (en) | 2008-07-11 | 2012-09-14 | 상하이 킹파 사이언스 앤 테크놀로지 컴퍼니 리미티드 | A semi-aromatic polyamide and the process with low amount of waste water discharge for preparing the same |
| KR101282706B1 (en) | 2010-09-28 | 2013-07-05 | 제일모직주식회사 | Polyamide resin composition having improved surface reflectance and heat resistance |
| KR101333579B1 (en) | 2010-12-15 | 2013-11-28 | 제일모직주식회사 | Polyamide Resin Composition Having Good Reflectance, Heat resistance, and Humidity resistance |
| KR101436081B1 (en) | 2010-12-28 | 2014-08-29 | 제일모직주식회사 | Polyamide resin composition having improved surface gloss and surface reflectance |
| US20120165448A1 (en) | 2010-12-28 | 2012-06-28 | Cheil Industries Inc. | Polyamide Resin Composition |
| JP2012140619A (en) * | 2010-12-28 | 2012-07-26 | Cheil Industries Inc | Polyamide resin composition for reflector excellent in surface glossiness and reflectance and molded product thereof |
| WO2012101997A1 (en) * | 2011-01-28 | 2012-08-02 | 株式会社クラレ | Polyamide composition for reflective plate, reflective plate, light-emitting device comprising said reflective plate, and illumination device and image display device comprising said light-emitting device |
| US9062198B2 (en) | 2011-04-14 | 2015-06-23 | Ticona Llc | Reflectors for light-emitting diode assemblies containing a white pigment |
| US8480254B2 (en) | 2011-04-14 | 2013-07-09 | Ticona, Llc | Molded reflective structures for light-emitting diodes |
| US9453119B2 (en) | 2011-04-14 | 2016-09-27 | Ticona Llc | Polymer composition for producing articles with light reflective properties |
| US9284448B2 (en) | 2011-04-14 | 2016-03-15 | Ticona Llc | Molded reflectors for light-emitting diode assemblies |
| CN103890040B (en) * | 2011-08-19 | 2018-01-02 | 索尔维特殊聚合物美国有限责任公司 | Improved daiamid composition for LED applications |
| CN102372921B (en) | 2011-10-10 | 2013-05-08 | 金发科技股份有限公司 | Heat resistant polyamide composite and applications thereof |
| US8865807B2 (en) | 2011-12-29 | 2014-10-21 | Cheil Industries Inc. | Polyamide resin composition having improved physical properties including thin-wall moldability |
| CN104204055B (en) | 2011-12-30 | 2016-05-25 | 提克纳有限责任公司 | For the reflector of light-emitting device |
| WO2014073219A1 (en) | 2012-11-12 | 2014-05-15 | 三井化学株式会社 | Semiaromatic polyamide, semiaromatic polyamide resin composition, and molded article |
| CN104903399B (en) | 2012-12-18 | 2017-05-31 | 提克纳有限责任公司 | For the molded reflective device of light-emitting diode component |
| KR101566063B1 (en) | 2012-12-31 | 2015-11-04 | 제일모직주식회사 | Thermoplastic Resin Composition Having Excellent Surface Gloss, Reflectance, Anti-yellowing property and Moldability |
| KR20140099138A (en) | 2013-02-01 | 2014-08-11 | 제일모직주식회사 | Polyamide Resin Composition Having Excellent Photostability and Discoloration Resistance |
| US9732223B2 (en) | 2013-07-26 | 2017-08-15 | Mitsui Chemicals, Inc. | Semi-aromatic polyamide resin composition and molded article containing same |
| US10301449B2 (en) | 2013-11-29 | 2019-05-28 | Lotte Advanced Materials Co., Ltd. | Thermoplastic resin composition having excellent light stability at high temperature |
| US10253182B2 (en) | 2013-12-20 | 2019-04-09 | Mitsui Chemicals, Inc. | Semi-aromatic polyamide resin composition and molded article of same |
| KR101690829B1 (en) | 2013-12-30 | 2016-12-28 | 롯데첨단소재(주) | Thermoplastic resin composition having excellent Impact resistance and light stability |
| US10636951B2 (en) | 2014-06-27 | 2020-04-28 | Lotte Advanced Materials Co., Ltd. | Thermoplastic resin composition having excellent reflectivity |
| US9840610B2 (en) | 2014-09-30 | 2017-12-12 | Lotte Advanced Materials Co., Ltd. | Thermoplastic resin composition and molded article using the same |
| KR101793319B1 (en) | 2014-12-17 | 2017-11-03 | 롯데첨단소재(주) | Polyester resin composition and molded part using the same |
| KR101849830B1 (en) | 2015-06-30 | 2018-04-18 | 롯데첨단소재(주) | Polyester resin composition with excellent impact resistance and light reliability and molded article using the same |
| CN105367785B (en) * | 2015-11-26 | 2017-12-22 | 东华大学 | A kind of transparent nylon and preparation method thereof |
| KR20200104411A (en) | 2018-02-16 | 2020-09-03 | 미쯔이가가꾸가부시끼가이샤 | Polyamide resin composition and its molded article, method for producing a laser welded article |
| WO2022014390A1 (en) | 2020-07-16 | 2022-01-20 | 三井化学株式会社 | Crystalline polyamide resin, resin composition, and molded article |
| EP4309866A4 (en) | 2021-03-16 | 2025-03-26 | Mitsui Chemicals, Inc. | POLYAMIDE RESIN COMPOSITION AND POLYAMIDE MOLDED ARTICLE |
| EP4310147A4 (en) | 2021-03-18 | 2025-04-16 | Mitsui Chemicals, Inc. | Polyamide resin composition and polyamide molded article |
| US20240158633A1 (en) | 2021-03-30 | 2024-05-16 | Mitsui Chemicals, Inc. | Polyamide resin composition and polyamide molded body |
| US20250092220A1 (en) | 2022-01-12 | 2025-03-20 | Mitsui Chemicals, Inc. | Polyamide resin composition and polyamide molded article |
| EP4464747A1 (en) | 2022-01-12 | 2024-11-20 | Mitsui Chemicals, Inc. | Polyamide resin composition and polyamide molded body |
| JPWO2024004933A1 (en) * | 2022-06-30 | 2024-01-04 | ||
| EP4582484A1 (en) | 2022-09-02 | 2025-07-09 | Mitsui Chemicals, Inc. | Polyamide resin composition, metal/resin joined body and method for producing same, bus bar unit, drive unit, and mobile object |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3400133B2 (en) * | 1994-09-16 | 2003-04-28 | 株式会社クラレ | Molded body |
| JP2001335708A (en) * | 2000-05-26 | 2001-12-04 | Matsushita Electric Works Ltd | Thermoplastic resin composition, manufacturing method thereof, and package for housing semiconductor element |
| JP4892140B2 (en) * | 2001-03-30 | 2012-03-07 | 大塚化学株式会社 | Resin composition for LED reflector |
-
2003
- 2003-04-04 AU AU2003236271A patent/AU2003236271A1/en not_active Abandoned
- 2003-04-04 CN CNA03801470XA patent/CN1585796A/en active Pending
- 2003-04-04 JP JP2003582215A patent/JPWO2003085029A1/en active Pending
- 2003-04-04 WO PCT/JP2003/004361 patent/WO2003085029A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2003085029A1 (en) | 2005-08-11 |
| CN1585796A (en) | 2005-02-23 |
| WO2003085029A1 (en) | 2003-10-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |